Thermal management device and energy storage equipment

Abstract

The utility model provides a heat management device and energy storage equipment. The heat management device comprises a cabinet body and a heat exchange assembly, the heat exchange assembly is contained in the cabinet body and used for exchanging heat with a heat exchange medium, the heat exchange assembly comprises a condenser and a heat exchanger which are connected, the condenser is arranged along the side wall of the cabinet body, a surrounding space is formed on the side, opposite to the side wall, of the condenser, and the heat exchanger is arranged in the surrounding space. According to the thermal management device, the thermal management efficiency of the thermal management device can be improved, and meanwhile, the size of the thermal management device is miniaturized.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a thermal management device and an energy storage device. Background Art

[0002] With the promotion and application of new energy sources such as solar energy and wind energy, energy storage technology has also developed. Batteries have gradually become the mainstream product of energy storage because of their high energy density, long service life, high rated voltage, high power tolerance, very low self-discharge rate, light weight, green environmental protection, and almost no water consumption in production.

[0003] In order to ensure the performance and reliability of the battery, energy storage equipment needs to be equipped with a thermal management device to keep the operating temperature of the battery within a reasonable range. However, the current thermal management device itself has a complex structure and layout, low space utilization, and cannot take into account both high thermal management efficiency and miniaturization, which seriously affects the economic benefits of energy storage equipment. Therefore, how to improve the thermal management efficiency of the thermal management device while taking into account the miniaturization of the thermal management device is an urgent problem to be solved in battery technology. Utility Model Content

[0004] In view of the above problems, the present application provides a thermal management device and an energy storage device, which can improve the thermal management efficiency of the thermal management device while taking into account the miniaturization of the thermal management device.

[0005] In a first aspect, an embodiment of the present application provides a thermal management device, which includes a cabinet and a heat exchange component. The heat exchange component is accommodated in the cabinet and is used to exchange heat with a heat exchange medium. The heat exchange component includes a connected condenser and a heat exchanger. The condenser is arranged along the side wall of the cabinet and forms an enclosed space on the side facing away from the side wall. The heat exchanger is arranged in the enclosed space.

[0006] In this way, the condenser in the embodiment of the present application is arranged along the side wall of the cabinet. When the thermal management efficiency requirement of the thermal management device increases, the condenser can be expanded along the side wall of the cabinet to increase the structural size, and the heat exchanger is arranged in the enclosed space formed by the condenser on the side facing away from the side wall, and the heat exchanger will not block the expansion of the condenser along the side wall. Thus, the cooling efficiency of the condenser can be improved without changing the volume of the thermal management device, and the thermal management efficiency of the thermal management device can be improved while miniaturizing the volume of the thermal management device.

[0007] In addition, the heat exchanger is arranged in the enclosed space formed by the condenser on the side facing away from the side wall. When the heat exchanger and the condenser need maintenance, it is only necessary to open a maintenance port on the side wall of the cabinet on the side of the heat exchanger facing away from the condenser to carry out the maintenance work. There is no need to open maintenance ports on multiple side walls of the cabinet, which can effectively improve the maintenance convenience of the thermal management device.

[0008] In some embodiments of the first aspect, the side wall includes a first wall and two second walls, the two second walls are arranged opposite to each other along a first direction, and the first wall connects the two second walls. The condenser includes a first portion and at least one second portion connected to each other, the first portion is located between the heat exchanger and the first wall, and the second portion is located between the heat exchanger and at least one of the two second walls.

[0009] The above technical solution, by configuring the condenser to be a segmented first part and a segmented second part, can not only further increase the structural size of the condenser, but also can differentiate the design of the first part and the second part according to the needs of the actual application environment, which is conducive to improving the design flexibility of the thermal management device.

[0010] In some embodiments of the first aspect, the side wall further includes a third wall, the third wall is arranged opposite to the first wall along the second direction, the third wall connects the two second walls, and the first direction intersects the second direction. The thermal management device further includes a fan, and the fan is arranged on the third wall.

[0011] The above technical solution releases the heat inside the thermal management device to the external surrounding environment by setting a fan, thereby reducing the temperature inside the thermal management device and improving the thermal management efficiency of the thermal management device. In addition, most of the heat released to the outside of the condenser is concentrated in the enclosed space formed by the condenser on the side facing away from the side wall. The fan is set on the third wall so that the fan is opposite to the enclosed space formed by the condenser on the side facing away from the side wall. This layout space can optimize the internal air flow and heat transfer, thereby improving the heat release efficiency inside the thermal management device.

[0012] In some embodiments of the first aspect, the third wall is movably disposed relative to the second wall.

[0013] The above technical solution enables the thermal management device to adjust the layout configuration inside the cabinet or maintain the heat exchange components according to thermal management needs or maintenance needs without disassembling the entire thermal management device, thereby greatly simplifying the adjustment and maintenance process, thereby effectively improving the ease of use of the thermal management device.

[0014] In some embodiments of the first aspect, there are multiple fans, and the multiple fans are arranged at intervals along the third direction, and the first direction, the second direction and the third direction intersect each other.

[0015] By providing a plurality of fans, the heat release efficiency inside the heat management device can be further improved.

[0016] In some embodiments of the first aspect, the thermal management device further includes a heat dissipation component, which is used to dissipate heat from the heat exchange medium, and the heat dissipation component is disposed between the fan and the condenser.

[0017] The above technical solution, by introducing a heat dissipation component, can flexibly adopt a heat dissipation component and / or a heat exchange component to cool the heat exchange medium according to different environmental requirements, thereby effectively improving the flexibility of use of the thermal management device.

[0018] In some embodiments of the first aspect, the thermal management device also includes a distribution component, the heat exchange component and the heat dissipation component are connected in parallel to the distribution component, the distribution component is used to receive the heat exchange medium after thermal management of the heat management component, and output the heat exchange medium to the heat exchange component and / or the heat dissipation component.

[0019] The above technical solution can accurately regulate the flow rate of the heat exchange medium output to the heat exchange component or the heat dissipation component by setting a distribution component, thereby effectively improving the accuracy of the use of the thermal management device.

[0020] In some embodiments of the first aspect, the first wall, the two second walls and the third wall together enclose a first accommodation space. The thermal management device further includes an electrical component, the electrical component and the heat exchange component are both located in the first accommodation space, and the electrical component is disposed in the enclosed space.

[0021] In the above technical solution, the structural dimensions of the condenser can be further expanded, so that the cooling efficiency of the condenser can be further improved without changing the volume of the thermal management device, thereby further improving the thermal management efficiency of the thermal management device. In addition, the electrical components are arranged in the enclosed space formed by the condenser on the side facing away from the side wall, and only a maintenance port needs to be opened on the side wall of the cabinet away from the condenser to perform maintenance work on the heat exchanger, condenser, electrical components and other structures located inside the cabinet, without the need to open maintenance ports on multiple side walls of the cabinet, which can effectively improve the convenience of maintenance of the thermal management device.

[0022] In some embodiments of the first aspect, the cabinet further includes a second accommodating space, the second accommodating space and the first accommodating space are arranged along a third direction, and the first direction, the second direction and the third direction intersect each other. The thermal management device further includes a pipeline assembly, the pipeline assembly is arranged in the second accommodating space, and the pipeline assembly is used to connect the heat exchange assembly and the component to be thermally managed.

[0023] Providing a second accommodating space on the cabinet specifically for accommodating pipeline components with relatively complex structures is beneficial to simplifying the overall structural complexity and setting difficulty of the thermal management device, thereby facilitating maintenance convenience of the thermal management device.

[0024] In some embodiments of the first aspect, the heat exchange assembly further includes a compressor, which is connected between the heat exchanger and the condenser and is located upstream of the condenser, and the compressor is disposed in the enclosed space.

[0025] The above technical solution can effectively improve the cooling efficiency of the condenser by introducing a compressor, thereby further improving the thermal management efficiency of the thermal management device. In addition, the compressor is arranged in the enclosed space formed by the condenser on the side facing away from the side wall, and only a maintenance port needs to be opened on the side wall of the cabinet away from the condenser to perform maintenance work on the heat exchanger, condenser, compressor and other structures located inside the cabinet, without the need to open maintenance ports on multiple side walls of the cabinet, which can effectively improve the convenience of maintenance of the thermal management device.

[0026] In some embodiments of the first aspect, the heat exchange assembly further includes a liquid storage component, which is connected between the condenser and the heat exchanger and is located downstream of the condenser, and the liquid storage component is disposed in the enclosed space.

[0027] The above technical solution introduces a liquid storage component that can store cooling medium, which is beneficial to increase the storage capacity of the cooling medium in the entire heat exchange assembly, and further beneficial to further improve the cooling efficiency of the condenser. In addition, the liquid storage component is arranged in the enclosed space formed by the condenser on the side facing away from the side wall, and only a maintenance port needs to be opened on the side wall of the cabinet away from the condenser to perform maintenance work on the heat exchanger, condenser, liquid storage component and other structures located inside the cabinet, without the need to open maintenance ports on multiple side walls of the cabinet, which can effectively improve the convenience of maintenance of the thermal management device.

[0028] In some embodiments of the first aspect, the thermal management device further includes a heating component, wherein the heating component is used to heat the heat exchange medium.

[0029] By introducing a heating component, the above technical solution can flexibly use a heating component or a heat exchange component to heat or cool the heat exchange medium according to different environmental requirements, thereby effectively improving the applicability of the thermal management device.

[0030] In a second aspect, the present application provides an energy storage device, which includes a battery and a thermal management device provided by any embodiment of the first aspect, the battery includes a heat exchange channel, and the thermal management device is connected to the heat exchange channel.

[0031] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0033] Figure 1 A schematic diagram of a circuit connection of an energy storage device provided in some embodiments of the present application;

[0034] Figure 2 A schematic diagram of a side structural block diagram of a thermal management device provided in some embodiments of the present application;

[0035] Figure 3 A schematic diagram of a front structural block diagram of a thermal management device provided in some embodiments of the present application;

[0036] Figure 4 A schematic diagram of a top view structural block diagram of a thermal management device provided in some embodiments of the present application;

[0037] Figure 5 A schematic diagram of a top view structural block diagram of another thermal management device provided in some embodiments of the present application;

[0038] Figure 6 for Figure 5 The schematic diagram of the top structural block diagram of the thermal management device shown is in an open state with the third wall thereof.

[0039] The reference numerals in the specific implementation manner are as follows:

[0040] 100. Thermal management components to be provided;

[0041] 10. cabinet; 11. first wall; 12. second wall; 13. third wall; 14. first accommodation space; 15. second accommodation space; 20. heat exchange component; 21. condenser; 211. first part; 212. second part; 22. heat exchanger; 23. compressor; 24. liquid storage component; 25. expansion valve; 30. fan; 40. heat dissipation component; 50. distribution component; 60. electrical component; 70. pipeline component; 80. heating component;

[0042] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by technicians in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0045] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0046] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0048] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.

[0049] The term "plurality" used in the present application refers to two or more (including two).

[0050] In the present application, the term "parallel" includes not only the absolutely parallel situation, but also the roughly parallel situation conventionally recognized in engineering; meanwhile, "vertical" includes not only the absolutely vertical situation, but also the roughly vertical situation conventionally recognized in engineering.

[0051] With the promotion and application of new energy sources such as solar energy and wind energy, energy storage technology has also developed. Batteries have gradually become the mainstream product of energy storage because of their high energy density, long service life, high rated voltage, high power tolerance, very low self-discharge rate, light weight, green environmental protection, and almost no water consumption in production.

[0052] In order to ensure the performance and reliability of the battery, energy storage equipment needs to be equipped with a thermal management device to keep the battery's operating temperature within a reasonable range. However, the current thermal management device itself has a complex structure and layout, low space utilization, and cannot take into account both high thermal management efficiency and miniaturization, which seriously affects the economic benefits of energy storage equipment.

[0053] Based on the above considerations, an embodiment of the present application provides a thermal management device, which includes a cabinet and a heat exchange component. The heat exchange component is accommodated in the cabinet and is used to exchange heat with a heat exchange medium. The heat exchange component includes a connected condenser and a heat exchanger. The condenser is arranged along the side wall of the cabinet and forms an enclosed space on the side facing away from the side wall. The heat exchanger is arranged in the enclosed space.

[0054] The main function of the condenser is to cool the gaseous refrigerant and condense it into liquid, releasing heat to the surrounding environment or a specific medium through this process. It is understandable that the larger the structural size of the condenser, the better its condensation efficiency, thereby improving the thermal management efficiency of the thermal management device. At the same time, the larger the structural size of the condenser, the easier it is to increase the volume of the thermal management device.

[0055] In this way, the condenser in the embodiment of the present application is arranged along the side wall of the cabinet. When the thermal management efficiency requirement of the thermal management device increases, the condenser can be expanded along the side wall of the cabinet to increase the structural size, and the heat exchanger is arranged in the enclosed space formed by the condenser on the side facing away from the side wall, and the heat exchanger will not block the expansion of the condenser along the side wall. Thus, the cooling efficiency of the condenser can be improved without changing the volume of the thermal management device, and the thermal management efficiency of the thermal management device can be improved while miniaturizing the volume of the thermal management device.

[0056] In addition, the heat exchanger is arranged in the enclosed space formed by the condenser on the side facing away from the side wall. When the heat exchanger and the condenser need maintenance, it is only necessary to open a maintenance port on the side wall of the cabinet on the side of the heat exchanger facing away from the condenser to carry out the maintenance work. There is no need to open maintenance ports on multiple side walls of the cabinet, which can effectively improve the maintenance convenience of the thermal management device.

[0057] Figure 1 A schematic diagram of a circuit connection of an energy storage device provided in some embodiments of the present application, Figure 2 A schematic diagram of a side structural block diagram of a thermal management device provided in some embodiments of the present application,

[0058] Figure 3 This is a schematic diagram of a front view structural block diagram of a thermal management device provided in some embodiments of the present application.

[0059] Figure 4 A schematic diagram of a top view structural block diagram of a thermal management device provided in some embodiments of the present application is shown in FIG. Figure 5 A schematic diagram of a top view structural block diagram of another thermal management device provided in some embodiments of the present application, Figure 6 for Figure 5 The schematic diagram of the top structural block diagram of the thermal management device shown is in an open state with the third wall thereof.

[0060] refer to Figures 1 to 6 An embodiment of the present application provides a thermal management device, which includes a cabinet 10 and a heat exchange component 20. The heat exchange component 20 is accommodated in the cabinet 10 and is used to exchange heat with a heat exchange medium. The heat exchange component 20 includes a condenser 21 and a heat exchanger 22 that are connected. The condenser 21 is arranged along the side wall of the cabinet 10 and forms an enclosed space on the side facing away from the side wall. The heat exchanger 22 is arranged in the enclosed space.

[0061] The thermal management in the embodiment of the present application refers to cooling or heating the heat management component 100 through a heat exchange medium. The heat exchange medium may be, but is not limited to, a liquid or a gas, and the heat management component 100 may be, but is not limited to, a battery or a capacitor. In order to facilitate the description of the embodiment of the present application, the following description is based on the example that the heat exchange medium is a liquid and the heat management component 100 is a battery.

[0062] The cabinet 10 is a component used to form an internal environment of the thermal management device. The formed internal environment can be used to accommodate the heat exchange component 20 and other components. Optionally, the cabinet 10 can be made of, but not limited to, metal or non-metal materials. For example, the metal material can be copper, aluminum or stainless steel, etc.; the non-metal material can be polyethylene, polypropylene or polyvinyl chloride, etc.

[0063] The heat exchange assembly 20 is used to exchange heat with the heat exchange medium after thermal management of the battery. Exemplarily, the low-temperature heat exchange medium enters the battery to cool the battery, and the heat of the battery is taken out by the heat exchange medium. The temperature of the heat exchange medium flowing out of the battery increases to form a high-temperature heat exchange medium, and the high-temperature heat exchange medium enters the heat exchange assembly 20 for heat exchange. A cooling medium, such as a refrigerant, is provided in the heat exchange assembly 20. The heat exchange medium and the cooling medium exchange heat in the heat exchanger 22 of the heat exchange assembly 20. The temperature of the heat exchange medium decreases to form a low-temperature heat exchange medium. The low-temperature heat exchange medium flows out of the heat exchange assembly 20 and enters the battery again to cool the battery, and this cycle is repeated. Among them, the cooling medium is a low-temperature liquid medium before exchanging heat with the heat exchange medium. After the heat exchange medium and the cooling medium exchange heat in the heat exchanger 22 of the heat exchange component 20, the low-temperature liquid medium absorbs heat and evaporates to form a high-temperature gaseous medium. The high-temperature gaseous medium enters the condenser 21 for condensation and cooling. The heat in the high-temperature gaseous medium is released to the outside of the condenser 21 to form a low-temperature liquid medium. The low-temperature liquid medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and this cycle is repeated.

[0064] The heat exchanger 22 may be, but is not limited to, a plate heat exchanger, a tube heat exchanger, or a microchannel heat exchanger. Optionally, the heat exchanger 22 is a plate heat exchanger, which is a heat exchanger formed by pressing a thin metal plate into a heat exchange plate with a certain corrugated shape, then stacking it, and fastening it with a clamp and bolts. Thin rectangular channels are formed between various plates, and heat exchange is performed through half a plate. The working fluid flows through the narrow and tortuous channel formed between the two plates. The cold and hot fluids pass through the flow channel in turn, and there is an interlayer plate in the middle to separate the fluids, and heat is exchanged through this plate.

[0065] The main function of the condenser 21 is to cool the gaseous cooling medium and condense it into liquid, and release heat to the surrounding environment or a specific medium through this process. The condenser 21 can be, but is not limited to, an air condenser or a water condenser. Optionally, the condenser 21 is an air condenser, which uses air as a medium and reduces the temperature of the cooling medium through natural convection or forced convection (for example, through a fan).

[0066] It is understandable that the larger the structural size of the condenser 21, the better its condensing performance, thereby improving the thermal management efficiency of the thermal management device. At the same time, the larger the structural size of the condenser 21, the larger the volume of the thermal management device.

[0067] In this way, the condenser 21 in the embodiment of the present application is arranged along the side wall of the cabinet 10. When the thermal management efficiency requirement of the thermal management device increases, the condenser 21 can be expanded along the side wall of the cabinet 10 to increase the structural size, and the heat exchanger 22 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall, and the heat exchanger 22 will not block the expansion of the condenser 21 along the side wall. Thus, the cooling efficiency of the condenser 21 can be improved without changing the volume of the thermal management device, and the volume of the thermal management device can be miniaturized while improving the thermal management efficiency of the thermal management device.

[0068] In addition, the heat exchanger 22 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall. When the heat exchanger 22 and the condenser 21 need maintenance, it is only necessary to open a maintenance port on the side wall of the cabinet 10 located on the side of the heat exchanger 22 facing away from the condenser 21 to carry out the maintenance work. There is no need to open maintenance ports on multiple side walls of the cabinet 10, which can effectively improve the maintenance convenience of the thermal management device.

[0069] In some embodiments, the side wall includes a first wall 11 and two second walls 12, the two second walls 12 are arranged opposite to each other along the first direction X, and the first wall 11 connects the two second walls 12. The condenser 21 includes a connected first portion 211 and at least one second portion 212, the first portion 211 is located between the heat exchanger 22 and the first wall 11, and the second portion 212 is located between the heat exchanger 22 and at least one of the two second walls 12.

[0070] Exemplarily, the second wall 12 may be detachably connected to the first wall 11, or may be integrally provided on the first wall 11. The second wall 12 may be directly connected to the first wall 11, or may be restricted to the first wall 11 by other components. As an example, the connection method between the second wall 12 and the first wall 11 may be, but is not limited to, bolt connection, welding, riveting, or clamping.

[0071] Optionally, the condenser 21 may include one second part 212 , or may include two second parts 212 .

[0072] As an example, in the case where the condenser 21 includes a second part 212, the second part 212 is arranged along one of the two second walls 12 and is located between the heat exchanger 22 and this second wall 12, and the second part 212 is connected to one side of the first part 211 along the first direction X so that the entire condenser 21 forms a structure similar to an "L" shape.

[0073] As another example, in the case where the condenser 21 includes two second parts 212, the two second parts 212 are respectively arranged along the two second walls 12, one of the two second parts 212 is located between the heat exchanger 22 and one of the two second walls 12, the other of the two second parts 212 is located between the heat exchanger 22 and the other of the two second walls 12, and the two second parts 212 are respectively connected to both sides of the first part 211 along the first direction X, so that the entire condenser 21 forms a "U"-shaped structure.

[0074] Optionally, the specific structures of the first part 211 and the second part 212 can also be designed differently according to the needs of the actual application environment. For example, the second part 212 can be designed as a plurality of miniaturized units, which have higher layout flexibility to further optimize the space utilization of the condenser 21.

[0075] The second part 212 can be detachably connected to the first part 211, or can be integrally provided on the first part 211. The second part 212 can be directly connected to the first part 211, or can be restricted to the first part 211 by other components. As an example, the connection method between the second part 212 and the first part 211 can be, but is not limited to, bolt connection, welding, riveting, or clamping.

[0076] Optionally, the connection method between the first part 211 and the second part 212 can also be adjusted according to actual needs, such as using a detachable connection or a flexible interface to facilitate maintenance and upgrading.

[0077] The above technical solution, by configuring the condenser 21 to be a segmented first part 211 and a second part 212, can not only further increase the structural size of the condenser 21, but also can perform differentiated design of the first part 211 and the second part 212 according to the needs of the actual application environment, which is beneficial to improving the design flexibility of the thermal management device.

[0078] In some embodiments, the side wall further includes a third wall 13 , which is disposed opposite to the first wall 11 along the second direction Y, and which connects the two second walls 12 , and the first direction X intersects the second direction Y. The thermal management device further includes a fan 30 , which is disposed on the third wall 13 .

[0079] Exemplarily, the second wall 12 may be detachably connected to the third wall 13, or may be integrally provided on the third wall 13. The second wall 12 may be directly connected to the third wall 13, or may be restricted to the third wall 13 by other components. As an example, the connection method between the second wall 12 and the third wall 13 may be, but is not limited to, bolt connection, welding, riveting, or clamping.

[0080] The fan 30 is used to form forced convection to release the heat inside the thermal management device to the external environment. For example, after the heat exchange medium and the cooling medium exchange heat in the heat exchanger 22 of the heat exchange component 20, the low-temperature liquid medium absorbs heat and evaporates to form a high-temperature gaseous medium, which enters the condenser 21 for condensation and cooling, and the heat in the high-temperature gaseous medium is released to the outside of the condenser 21 to form a low-temperature liquid medium, and the fan 30 then releases the above heat to the surrounding environment outside the thermal management device.

[0081] It is understandable that the heat released to the outside of the condenser 21 will increase the temperature inside the thermal management device. The higher the temperature inside the thermal management device, the lower the overall heat exchange efficiency of the heat exchange component 20, thereby reducing the thermal management efficiency of the thermal management device.

[0082] In this way, the above technical solution releases the heat inside the thermal management device to the external surrounding environment by setting the fan 30, thereby reducing the temperature inside the thermal management device and improving the thermal management efficiency of the thermal management device. In addition, most of the heat released to the outside of the condenser 21 is concentrated in the enclosed space formed by the condenser 21 on the side facing away from the side wall. The fan 30 is set on the third wall 13 so that the fan 30 is opposite to the enclosed space formed by the condenser 21 on the side facing away from the side wall. This layout space can optimize the internal air flow and heat transfer, thereby improving the heat release efficiency inside the thermal management device.

[0083] In some embodiments, the third wall 13 is movably disposed relative to the second wall 12 .

[0084] Exemplarily, the third wall 13 is movably arranged relative to the second wall 12, which means that the third wall 13 can be moved or adjusted relative to the fixed second wall 12. The third wall 13 includes an open state and a closed state. When the third wall 13 is in the open state, the heat exchange component 20 and other structures inside the cabinet 10 can be exposed to the external environment; when the third wall 13 is in the closed state, the heat exchange component 20 and other structures inside the cabinet 10 can be sealed.

[0085] This design can provide additional flexibility for the thermal management device, so that according to thermal management needs or maintenance needs, the layout configuration inside the cabinet 10 can be adjusted or the heat exchange assembly 20 can be maintained without disassembling the entire thermal management device.

[0086] Optionally, the specific activity mechanism of the third wall 13 can be, but is not limited to, sliding, rotating or folding, etc., and can be selected according to different application scenarios and specific needs. Among them, the sliding design is easy to operate and occupies little space, the rotating design can provide more flexible adjustment angles, and the folding design can save space to the maximum extent when needed.

[0087] The above technical solution enables the thermal management device to adjust the layout configuration inside the cabinet 10 or maintain the heat exchange component 20 according to thermal management requirements or maintenance needs without disassembling the entire thermal management device, thereby greatly simplifying the adjustment and maintenance process, thereby effectively improving the ease of use of the thermal management device.

[0088] In some embodiments, there are multiple fans 30 , and the multiple fans 30 are arranged at intervals along the third direction Z. The first direction X, the second direction Y, and the third direction Z intersect with each other.

[0089] For example, the number of fans 30 may be one, two, three or more, which may be selected according to the actual application environment. Optionally, the number of fans 30 is three.

[0090] By providing a plurality of fans 30 , the heat release efficiency inside the heat management device can be further improved.

[0091] In some embodiments, the air outlet area of ​​the fan 30 is between 700 cm 2 -2500cm 2 between.

[0092] For example, the air outlet area of ​​the fan 30 may be 700 cm 2 、800cm 2 、900cm 2 , 1000cm 2 、1200cm 2 、1400cm 2 、1600cm 2 、1800cm 2 , 2000cm 2 , 2100cm 2 、2200cm 2 、2300cm 2 、2400cm 2 、2500cm 2 wait.

[0093] It can be understood that the smaller the air outlet area of ​​the fan 30, the greater the speed required to meet the air volume requirement, the higher the overall noise, and at the same time, the fan 30 with a smaller air outlet area has a lower cost; the larger the air outlet area of ​​the fan 30, the smaller the speed required to meet the air volume requirement, the lower the overall noise, and at the same time, the fan 30 with a larger air outlet area has a higher cost.

[0094] In this way, the above technical solution can reduce the noise during the operation of the thermal management device while taking into account lower costs and improving the economic benefits of the thermal management device by adopting a fan 30 with an air outlet area within the above range.

[0095] Furthermore, the air outlet area of ​​the fan 30 is between 1500cm 2 -2500cm 2 The noise during the operation of the thermal management device can be further reduced.

[0096] For example, the air outlet area of ​​the fan 30 may be 1500 cm 2 、1600cm 2 、1700cm 2 、1800cm 2 、1900cm 2 , 2000cm 2 , 2100cm 2 、2200cm 2 、2300cm 2 、2400cm 2 、2500cm 2 wait.

[0097] In some embodiments, the thermal management device further includes a heat dissipation component 40 , which is used to dissipate heat from the heat exchange medium. The heat dissipation component 40 is disposed between the fan 30 and the condenser 21 .

[0098] The heat dissipation component 40 is used to dissipate heat with the heat exchange medium after thermal management of the battery. Exemplarily, a low-temperature heat exchange medium enters the battery to cool the battery, and the heat of the battery is taken out by the heat exchange medium. The temperature of the heat exchange medium flowing out of the battery increases to form a high-temperature heat exchange medium. The high-temperature heat exchange medium then enters the heat dissipation component 40 to dissipate heat, and the temperature of the heat exchange medium decreases to form a low-temperature heat exchange medium. The low-temperature heat exchange medium flows out of the heat exchange component 20 and enters the battery again to cool the battery, thus forming a cycle. Among them, the heat dissipation component 40 is provided with a storage space for accommodating the heat exchange medium. The high-temperature heat exchange medium enters the storage space of the heat dissipation component 40, and the heat of the high-temperature heat exchange medium in the heat dissipation component 40 is released to the external environment through forced convection of the fan 30 to reduce the temperature of the heat exchange medium.

[0099] Optionally, the heat dissipation component 40 may be, but is not limited to, a box structure, a tank structure, or a tube-fin structure. As an example, the heat dissipation component 40 adopts a tube-fin structure, and the tube-fin structure achieves the purpose of enhancing heat transfer by adding fins to the tube body. The tube body may be made of steel tubes, stainless steel tubes, copper tubes, etc., and the fins may also be made of steel strips, copper strips, aluminum strips, stainless steel strips, etc.

[0100] In some examples, the heat dissipation component 40 and the heat exchange component 20 cooperate with each other, and the heat dissipation component 40 or the heat exchange component 20 is used to cool the heat exchange medium according to different environmental requirements.

[0101] For example, when the ambient temperature is lower than the first threshold, the cooling requirement of the heat exchange medium is correspondingly lower, and the heat dissipation component 40 is used to dissipate heat and cool the heat exchange medium; when the ambient temperature is higher than the first threshold, the cooling requirement of the heat exchange medium is correspondingly higher, and the heat exchange component 20 is used to dissipate heat and cool the heat exchange medium. The first threshold may be, but is not limited to, 15°C, 20°C, or 25°C, etc., and may be selected according to the actual application environment.

[0102] It is understandable that the heat exchange component 20 cools the heat exchange medium by using a cooling medium to exchange heat with the heat exchange medium, and has a high cooling efficiency. At the same time, the circulation process of the cooling medium is relatively complex, and the power consumption is correspondingly high. The heat dissipation component 40 cools the heat exchange medium by forced convection of the fan 30, and has a low cooling efficiency. At the same time, the structure and heat exchange process are relatively simple, and the power consumption is correspondingly low.

[0103] In this way, the heat dissipation component 40 or the heat exchange component 20 is flexibly adopted to cool the heat exchange medium according to different environmental requirements, which is beneficial to reducing the overall power consumption of the thermal management device.

[0104] In other examples, the heat dissipation component 40 works together with the heat exchange component 20 as an auxiliary method to cool the heat exchange medium, thereby improving the thermal management efficiency of the thermal management device.

[0105] By introducing the heat dissipation component 40, the above technical solution can flexibly use the heat dissipation component 40 and / or the heat exchange component 20 to cool the heat exchange medium according to different environmental requirements, thereby effectively improving the flexibility of use of the thermal management device.

[0106] In some embodiments, the thermal management device also includes a distribution component 50, and the heat exchange component 20 and the heat dissipation component 40 are connected in parallel to the distribution component 50. The distribution component 50 is used to receive the heat exchange medium after thermal management of the thermal management component 100, and output the heat exchange medium to the heat exchange component 20 and / or the heat dissipation component 40.

[0107] Exemplarily, the distribution component 50 has a diversion function, and the distribution component 50 includes a diversion end and a collecting end. The collecting end is used to receive the heat exchange medium after thermal management of the heat management component 100, and the diversion end is used to distribute the heat exchange medium received by the collecting end to the heat exchange component 20 and / or the heat dissipation component 40.

[0108] For example, when the heat dissipation component 40 and the heat exchange component 20 cooperate with each other and the heat dissipation component 40 or the heat exchange component 20 is used to cool the heat exchange medium according to different environmental requirements, when the ambient temperature is lower than the first threshold value, the heat exchange medium after thermal management of the thermal management component 100 is output to the heat dissipation component 40 through the distribution component 50; when the ambient temperature is higher than the first threshold value, the heat exchange medium after thermal management of the thermal management component 100 is output to the heat exchange component 20 through the distribution component 50.

[0109] The above technical solution can accurately regulate the flow rate of the heat exchange medium distributed and output to the heat exchange component 20 or the heat dissipation component 40 by providing the distribution component 50, thereby effectively improving the accuracy of the use of the thermal management device.

[0110] In some embodiments, the thermal management device also includes a control component, which is connected to the distribution component 50. The control component can obtain the ambient temperature and control the diversion function of the distribution component 50 according to the ambient temperature, thereby improving the degree of automation of the thermal management device and improving the convenience of use.

[0111] In some embodiments, the first wall 11, the two second walls 12 and the third wall 13 together enclose a first accommodation space 14. The thermal management device further includes an electrical component 60. The electrical component 60 and the heat exchange component 20 are both located in the first accommodation space 14. The electrical component 60 is disposed in the enclosed space.

[0112] The electrical component 60 is used to control and adjust the operation of the entire thermal management device, and includes but is not limited to a controller, a communicator, and related sensors. Since the electrical component 60 itself has a certain structural size, the first accommodation space 14 needs to be set larger so that the electrical component 60 and the heat exchange component 20 can be set in the first accommodation space 14. In addition, the electrical component 60 is set in the enclosed space formed by the condenser 21 on the side facing away from the side wall, and the electrical component 60 will not block the expansion of the condenser 21 along the side wall.

[0113] In this way, as the first accommodating space 14 increases, the structural size of the condenser 21 can be further expanded, so that the cooling performance of the condenser 21 can be further improved without changing the volume of the thermal management device, thereby further improving the thermal management efficiency of the thermal management device.

[0114] In addition, the electrical component 60 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall. It is only necessary to open a maintenance port on the side wall of the cabinet 10 away from the condenser 21, so that maintenance work can be carried out on structures such as the heat exchanger 22, condenser 21 and electrical component 60 located inside the cabinet 10, without opening maintenance ports on multiple side walls of the cabinet 10, which can effectively improve the maintenance convenience of the thermal management device.

[0115] In some embodiments, the cabinet 10 further includes a second accommodating space 15, the second accommodating space 15 and the first accommodating space 14 are arranged along a third direction Z, and the first direction X, the second direction Y and the third direction Z intersect each other. The thermal management device further includes a pipe assembly 70, which is disposed in the second accommodating space 15, and the pipe assembly 70 is used to connect the heat exchange assembly 20 and the heat management component 100.

[0116] Exemplarily, the main function of the management component is to achieve pipeline communication between the heat exchange component 20 and the heat management component 100, so that the heat exchange medium can flow smoothly between the heat management component 100 and the heat exchange component 20. It should be noted that the pipeline component 70 includes but is not limited to pipeline components, pump bodies, valve structures and connectors, and the structure is relatively complex.

[0117] Thus, the second accommodating space 15 is provided on the cabinet 10 specifically for accommodating the pipeline assembly 70 with a relatively complex structure, which is beneficial to simplifying the overall structural complexity and setting difficulty of the thermal management device, thereby facilitating the maintenance convenience of the thermal management device.

[0118] In some optional embodiments, the thermal management device further includes a heat dissipation assembly 40 , and the pipe assembly 70 is further used to connect the heat dissipation assembly 40 and the component to be thermally managed 100 .

[0119] In some optional embodiments, the thermal management device further includes a distribution component 50 , which is disposed on the pipe assembly 70 and located in the second accommodating space 15 .

[0120] In some embodiments, the heat exchange assembly 20 further includes a compressor 23 , which is connected between the heat exchanger 22 and the condenser 21 and is located upstream of the condenser 21 , and the compressor 23 is disposed in the enclosed space.

[0121] The compressor 23 is used to compress the low-pressure gas into a high-pressure gas. For example, the cooling medium is a low-temperature liquid medium before exchanging heat with the heat exchange medium. After the heat exchange medium and the cooling medium exchange heat in the heat exchanger 22 of the heat exchange component 20, the low-temperature liquid medium absorbs heat and evaporates to form a high-temperature, low-pressure gaseous medium. The high-temperature, low-pressure gaseous medium enters the compressor 23 for compression to form a high-temperature, high-pressure gaseous medium. The high-temperature, high-pressure gaseous medium enters the condenser 21 for condensation and cooling. The heat in the high-temperature, high-pressure gaseous medium is released to the outside of the condenser 21 to form a low-temperature liquid medium. The low-temperature liquid medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and the cycle continues.

[0122] The above technical solution can effectively improve the cooling efficiency of the condenser 21 by introducing the compressor 23, thereby further improving the thermal management efficiency of the thermal management device. In addition, the compressor 23 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall, and only a maintenance port needs to be opened on the side wall of the cabinet 10 away from the condenser 21 to perform maintenance work on the heat exchanger 22, condenser 21, compressor 23 and other structures located inside the cabinet 10, without the need to open maintenance ports on multiple side walls of the cabinet 10, which can effectively improve the convenience of maintenance of the thermal management device.

[0123] In some embodiments, the heat exchange assembly 20 further includes a liquid storage component 24 , which is connected between the condenser 21 and the heat exchanger 22 and is located downstream of the condenser 21 , and the liquid storage component 24 is disposed in the surrounding space.

[0124] The liquid storage component 24 is used to store the low-temperature liquid working medium after condensation by the condenser 21. Exemplarily, the cooling working medium is a low-temperature liquid working medium before exchanging heat with the heat exchange medium. After the heat exchange medium and the cooling working medium exchange heat in the heat exchanger 22 of the heat exchange component 20, the low-temperature liquid working medium absorbs heat and evaporates to form a high-temperature, low-pressure gaseous working medium. The high-temperature, low-pressure gaseous working medium enters the compressor 23 for compression to form a high-temperature, high-pressure gaseous working medium. The high-temperature, high-pressure gaseous working medium enters the condenser 21 for condensation and cooling. The heat in the high-temperature, high-pressure gaseous working medium is released to the outside of the condenser 21 to form a low-temperature liquid working medium. The low-temperature liquid working medium enters the liquid storage component 24 for storage. When the cooling working medium needs to enter the heat exchanger 22 for heat exchange with the heat exchange medium, the low-temperature liquid working medium is output from the liquid storage component 24.

[0125] The above technical solution introduces a liquid storage component 24, which can store cooling medium, so as to increase the storage capacity of cooling medium in the entire heat exchange assembly 20, and further improve the cooling efficiency of the condenser 21. In addition, the liquid storage component 24 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall, and only a maintenance port needs to be opened on the side wall of the cabinet 10 away from the condenser 21 to perform maintenance work on the heat exchanger 22, condenser 21 and liquid storage component 24 and other structures located inside the cabinet 10, without the need to open maintenance ports on multiple side walls of the cabinet 10, which can effectively improve the convenience of maintenance of the thermal management device.

[0126] In some optional embodiments, the heat exchange component 20 also includes an expansion valve 25, which is connected between the condenser 21 and the heat exchanger 22 and is located downstream of the condenser 21. The expansion valve 25 is used to convert the high-pressure liquid working medium into a low-pressure liquid working medium. The expansion valve 25 is arranged in the enclosed space.

[0127] Exemplarily, the cooling medium is a low-temperature liquid working medium before exchanging heat with the heat exchange medium. After the heat exchange medium and the cooling medium exchange heat in the heat exchanger 22 of the heat exchange component 20, the low-temperature liquid working medium absorbs heat and evaporates to form a high-temperature, low-pressure gaseous working medium. The high-temperature, low-pressure gaseous working medium enters the compressor 23 for compression to form a high-temperature, high-pressure gaseous working medium. The high-temperature, high-pressure gaseous working medium enters the condenser 21 for condensation and cooling. The heat in the high-temperature, high-pressure gaseous working medium is released to the outside of the condenser 21 to form a low-temperature, high-pressure liquid working medium. The low-temperature, high-pressure liquid working medium enters the expansion valve 25 for expansion to form a low-temperature, low-pressure liquid working medium. The low-temperature, low-pressure liquid working medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and the cycle continues.

[0128] In some embodiments, the thermal management device further includes a heating component 80, and the heating component 80 is used to heat the heat exchange medium.

[0129] For example, when the temperature of the battery is too low, the battery needs to be heated to enable the battery to work normally. In this case, the heating assembly 80 is used to heat the heat exchange medium, and the heated heat exchange medium enters the battery to heat the battery so that the battery is within a temperature range where it can work normally.

[0130] Optionally, the number of the heating components 80 may be one or more, which may be selected according to the actual application environment.

[0131] By introducing the heating component 80, the above technical solution can flexibly use the heating component 80 or the heat exchange component 20 to heat or cool the heat exchange medium according to different environmental requirements, thereby effectively improving the applicability of the thermal management device.

[0132] In some optional embodiments, the thermal management device further includes a pipe assembly 70 , and the heating assembly 80 and the pipe assembly 70 are both disposed in the second accommodating space 15 .

[0133] An embodiment of the present application also provides an energy storage device, which includes a battery and a thermal management device provided by any of the aforementioned embodiments, the battery includes a heat exchange channel, the thermal management device is connected to the heat exchange channel, the thermal management device can output heat exchange medium from the heat exchange channel, and receive heat exchange medium flowing out of the heat exchange channel.

[0134] In order to better understand the thermal management device provided in the embodiment of the present application, based on the same inventive concept, an embodiment of the above-mentioned thermal management device in actual application is provided here for illustration.

[0135] An embodiment of the present application provides a thermal management device, which includes a cabinet 10, a heat exchange component 20, a plurality of fans 30, a heat dissipation component 40, an electrical component 60, a pipeline component 70 and a heating component 80.

[0136] The heat exchange component 20 is accommodated in the cabinet 10 and is used to exchange heat with the heat exchange medium. The heat exchange component 20 includes a condenser 21, a heat exchanger 22, a compressor 23 and a liquid storage component 24. The condenser 21 is arranged along the side wall of the cabinet 10 and forms an enclosed space on the side opposite to the side wall. The compressor 23 is connected between the heat exchanger 22 and the condenser 21 and is located upstream of the condenser 21. The liquid storage component 24 is connected between the condenser 21 and the heat exchanger 22 and is located downstream of the condenser 21. The heat exchanger 22, the compressor 23 and the liquid storage component 24 are all arranged in the enclosed space.

[0137] The side wall includes a first wall 11, two second walls 12 and a third wall 13. The two second walls 12 are arranged opposite to each other along a first direction X. The first wall 11 connects the two second walls 12. The third wall 13 is arranged opposite to the first wall 11 along a second direction Y. The third wall 13 connects the two second walls 12. The third wall 13 is arranged to be movable relative to the second walls 12. A plurality of fans 30 are arranged on the third wall 13 and are arranged at intervals along a third direction Z. The first direction X, the second direction Y and the third direction Z intersect each other.

[0138] The condenser 21 includes a first portion 211 and at least one second portion 212 connected to each other. The first portion 211 is located between the heat exchanger 22 and the first wall 11 , and the second portion 212 is located between the heat exchanger 22 and at least one of the two second walls 12 .

[0139] The cabinet 10 includes a first accommodating space 14 and a second accommodating space 15 . The first wall 11 , two second walls 12 and a third wall 13 together enclose the first accommodating space 14 . The second accommodating space 15 and the first accommodating space 14 are arranged along a third direction Z.

[0140] The heat dissipation component 40 is used to dissipate heat from the heat exchange medium, and the heat dissipation component 40 is arranged between the fan 30 and the condenser 21. The electrical component 60 and the heat exchange component 20 are both located in the first accommodation space 14, and the electrical component 60 is arranged in the surrounding space. The pipe component 70 is arranged in the second accommodation space 15, and the pipe component 70 is used to connect the heat exchange component 20 and the heat management component 100. The heating component 80 is used to heat the heat exchange medium.

[0141] The condenser 21 in the embodiment of the present application is arranged along the side wall of the cabinet 10. When the thermal management efficiency requirement of the thermal management device increases, the condenser 21 can be expanded along the side wall of the cabinet 10 to increase the structural size, and the heat exchanger 22 is arranged in the enclosed space formed by the condenser 21 on the side facing away from the side wall. The heat exchanger 22, the compressor 23 and the liquid storage component 24 will not block the expansion of the condenser 21 along the side wall. Thus, the cooling efficiency of the condenser 21 can be improved without changing the volume of the thermal management device, and the thermal management efficiency of the thermal management device can be improved while miniaturizing the volume of the thermal management device.

[0142] In addition, the heat exchanger 22 is arranged in the enclosed space formed by the condenser 21 on the side away from the side wall. When the heat exchanger 22, the compressor 23, the liquid storage component 24 and the condenser 21 need maintenance, it is only necessary to open a maintenance port on the side wall of the cabinet 10 away from the condenser 21. The heat exchanger 22, the compressor 23, the liquid storage component 24 and the condenser 21 can be maintained without opening maintenance ports on multiple side walls of the cabinet 10, which can effectively improve the maintenance convenience of the thermal management device.

[0143] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A thermal management device, characterized in that: include: Cabinet; A heat exchange component is accommodated in the cabinet and is used to exchange heat with a heat exchange medium. The heat exchange component includes a condenser and a heat exchanger connected to each other. The condenser is arranged along the side wall of the cabinet and forms an enclosed space on the side facing away from the side wall. The heat exchanger is arranged in the enclosed space.

2. The thermal management device according to claim 1, characterized in that: The side wall includes a first wall and two second walls, the two second walls are arranged opposite to each other along a first direction, and the first wall connects the two second walls; The condenser includes a first portion and at least one second portion connected, the first portion being located between the heat exchanger and the first wall, and the second portion being located between the heat exchanger and at least one of the two second walls.

3. The thermal management device according to claim 2, characterized in that: The side wall further includes a third wall, the third wall is arranged opposite to the first wall along a second direction, the third wall connects two of the second walls, and the first direction intersects with the second direction; The thermal management device further includes a fan, and the fan is disposed on the third wall.

4. The thermal management device according to claim 3, characterized in that: The third wall is movably disposed relative to the second wall.

5. The thermal management device according to claim 3, characterized in that: There are multiple fans, and the multiple fans are arranged at intervals along the third direction. The first direction, the second direction and the third direction intersect each other.

6. The thermal management device according to claim 3, characterized in that: The thermal management device further comprises a heat dissipation component, which is used to dissipate heat from the heat exchange medium, and the heat dissipation component is arranged between the fan and the condenser.

7. The thermal management device according to claim 6, characterized in that: The thermal management device also includes a distribution component, the heat exchange component and the heat dissipation component are connected in parallel to the distribution component, and the distribution component is used to receive the heat exchange medium after thermal management of the heat management component, and output the heat exchange medium to the heat exchange component and / or the heat dissipation component.

8. The thermal management device according to claim 3, characterized in that: The first wall, the two second walls and the third wall together enclose a first accommodating space; The thermal management device further includes an electrical component. The electrical component and the heat exchange component are both located in the first accommodating space, and the electrical component is disposed in the surrounding space.

9. The thermal management device according to claim 8, characterized in that: The cabinet further includes a second accommodating space, wherein the second accommodating space and the first accommodating space are arranged along a third direction, and the first direction, the second direction and the third direction intersect each other; The heat management device further includes a pipeline assembly, which is disposed in the second accommodating space and is used to connect the heat exchange assembly and the component to be heat managed.

10. The thermal management device according to claim 1, characterized in that: The heat exchange assembly further includes a compressor, which is connected between the heat exchanger and the condenser and is located upstream of the condenser. The compressor is disposed in the enclosed space.

11. The thermal management device according to claim 1, characterized in that: The heat exchange assembly further includes a liquid storage component, which is connected between the condenser and the heat exchanger and is located downstream of the condenser. The liquid storage component is disposed in the enclosed space.

12. The thermal management device according to any one of claims 1 to 11, characterized in that: The thermal management device further comprises a heating component, and the heating component is used to heat the heat exchange medium.

13. An energy storage device, characterized in that: include: The thermal management device according to any one of claims 1 to 12; The battery comprises a heat exchange channel, and the thermal management device is connected to the heat exchange channel.

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