Cooling system for electronic equipment

Abstract

The present invention provides a cooling system for an electronic device, comprising: a heat dissipation portion comprising a plurality of fins arranged adjacent to each other, and a phase change material filled in a gap area between two adjacent fins; and the jet flow impact part is arranged above the heat dissipation part and is jointed to the heat dissipation part, and the jet flow impact part is filled with a liquid coolant. The cooling system can prolong the heat dissipation time to the maximum extent, and is suitable for heat dissipation of high-power-density electronic equipment.

Description

Technical Field

[0001] The invention belongs to the field of heat dissipation and relates to a cooling system for electronic equipment. Background Art

[0002] With the development of the electronics industry, the integration and functionality of electronic products have increased rapidly. The miniaturization and advanced multifunctionality of electronic devices have led to overheating of electronic components and caused the operating temperature to increase sharply and unreliably. About 55% of electronic equipment operation failures are caused by the increase in device temperature. Therefore, the heat dissipation requirements of electronic devices, especially high-power electronic devices, have also increased accordingly.

[0003] In order to overcome the overheating of electronic equipment and ensure that the electronic equipment works for a long time without reducing the system efficiency, it is necessary to develop a cooling system for electronic equipment. Summary of the invention

[0004] The invention provides a cooling system for electronic equipment, which is helpful to improve the cooling efficiency of high-power electronic equipment.

[0005] To achieve the above object, the present invention provides a cooling system for electronic equipment, comprising:

[0006] A heat dissipation portion, the heat dissipation portion comprising a plurality of fins arranged adjacent to each other, and a gap area between two adjacent fins is filled with a phase change material;

[0007] A jet impact portion is arranged above the heat dissipation portion and connected to the heat dissipation portion, and is filled with liquid coolant.

[0008] In one embodiment, the jet impact portion comprises a shell,

[0009] A plurality of isolating members are arranged in the inner cavity of the shell, and a spray cooling channel is formed between two adjacent isolating members.

[0010] In one embodiment, the partition is engaged with the inner cavity wall of the housing.

[0011] In one embodiment, the plurality of isolation members are arranged in parallel and are evenly spaced apart.

[0012] In one embodiment, an inlet is disposed on one side of the shell, and an outlet is disposed on the other side of the shell, and the size of the outlet is larger than the size of the inlet.

[0013] In one embodiment, a cover is provided on the top of the heat dissipation portion, a hot section plate is provided on the bottom of the heat dissipation portion, and the cover is engaged with the jet impact portion;

[0014] At least one electronic component is arranged on the hot section plate, and the heat dissipation portion and the jet impact portion are combined to dissipate heat for the at least one electronic component.

[0015] In one embodiment, a first direction is substantially parallel to the plurality of fins, and a second direction is substantially perpendicular to the plurality of fins;

[0016] Each of the fins has a first size in the first direction and a second size in the second direction;

[0017] There is a third dimension between two adjacent fins in the first direction;

[0018] A fourth dimension is defined between the cover and the hot section plate in the second direction, and the second dimension is smaller than the fourth dimension.

[0019] In one embodiment, the gap area between two adjacent fins is further filled with a micron or nanometer-sized high thermal conductivity non-phase change material.

[0020] In one embodiment, the phase change material includes one of a metal phase change material, paraffin, and salt.

[0021] In one embodiment, the fin is in a rectangular, circular or conical shape.

[0022] Compared with the related art, the advantages of the present invention are:

[0023] The cooling system provided by the present invention is suitable for heat dissipation of high power density electronic equipment. The cooling system is composed of a heat dissipation part and a jet impact part, which continuously dissipates heat for the electronic equipment. The heat dissipation part includes a plurality of fins arranged adjacent to each other, and the gap area between two adjacent fins is filled with phase change material; and the jet impact part is filled with liquid coolant. The system dissipates and transfers the heat generated by the electronic equipment through the fins and the phase change material, and then the entire heat dissipation part and the phase change material are cooled by cold jet impact in cooperation with the jet impact part. The cooperation between the heat dissipation part and the jet impact part can maximize the heat dissipation time, allowing the cooling system to cool the electronic equipment that works continuously for a long time and protect it from damage, which helps to extend the life of the electronic equipment.

[0024] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the cooling system structure disclosed in one embodiment of the present invention;

[0026] Figure 2 Schematic diagram of the flow principle of jet impact.

[0027] Wherein, the reference numerals are:

[0028] 10: Cooling system

[0029] 110: Heat dissipation unit

[0030] 111: Fin

[0031] 112: Phase change material

[0032] 113: Shell of heat dissipation unit

[0033] 114: Cover

[0034] 115:Hot section plate

[0035] 120: jet impact part

[0036] 121: Liquid coolant

[0037] 122: Shell of jet impact part

[0038] 123: Isolation

[0039] 124: Jet cooling channel

[0040] 125A: Entrance

[0041] 125B:Export

[0042] F1: First direction

[0043] F2: Second direction

[0044] t2: first size

[0045] f h : Second size

[0046] t1: The third dimension

[0047] H1: The fourth size. DETAILED DESCRIPTION

[0048] Certain words are used in the specification and subsequent claims to refer to specific components or parts. It should be understood by those of ordinary skill in the art that technical users or manufacturers may refer to the same component or part by different nouns or terms. This specification and subsequent claims do not use differences in names as a way to distinguish components or parts, but use differences in the functions of components or parts as the criteria for distinction. "Including" and "comprising" mentioned throughout the specification and subsequent claims are open-ended terms and should be interpreted as "including but not limited to". In addition, the word "connect" here includes any direct and indirect electrical connection means. Indirect electrical connection means include connection through other devices.

[0049] It should be noted that, in the description of the present invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and "about", or "approximately", "substantially", "left and right" and the like indicating directions or positional relationships or parameters are all based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description content, and do not indicate or imply that the referred device or element must have a specific direction, specific size, or be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0050] Figure 1 A schematic diagram of the cooling system structure disclosed in one embodiment of the present invention; Figure 2 Schematic diagram of the flow principle of jet impact.

[0051] Please refer to Figure 1 The cooling system 10 includes a heat dissipation portion 110 and a jet impact portion 120 disposed above the heat dissipation portion 110. The heat dissipation portion 110 includes a plurality of fins 111 disposed adjacent to each other, the plurality of fins 111 are separated from each other in structure, and the gap between two adjacent fins is filled with a phase change material 112. The jet impact portion 120 is disposed above the heat dissipation portion 110 and is connected to the heat dissipation portion 110, and is filled with a liquid coolant 121.

[0052] In this embodiment, fins 111 for internal heat dissipation are added through the heat dissipation part 110, and phase change materials 112 with high thermal conductivity are added between the fins 111. The phase change materials 112 are kept in the gap area between adjacent fins 111 and between the fins 111 and the housing 113 of the heat dissipation part. Through the sealing of the housing 113 of the heat dissipation part, the phase change material has good heat absorption capacity. The phase change material can absorb or release a large amount of latent heat during its melting and solidification process, while keeping its temperature constant at the melting point. When the cooling system is working, the phase change material will absorb a large amount of heat and then melt, and continuously release the heat absorbed by the heat dissipation part housing 113 and the fins 111 to the top of the heat dissipation part, so as to further improve the thermal conductivity of the heat dissipation part, thereby enhancing the heat transfer performance, thereby preventing the electronic equipment from overheating.

[0053] In addition, when the phase change material 112 is completely melted in the cavity, it will not be able to take away excess heat. Therefore, in order to keep the phase change material below its melting point and continuously dissipate heat from the fin area, in this embodiment, a jet impact part 120 is provided above the heat dissipation part, and the jet impact part 120 is filled with liquid coolant 121. The jet impact part 120 cools the heat dissipation part 110 by multiple cold jet impacts, so as to keep the phase change material below its melting point at all times, thereby achieving continuous and stable heat dissipation of electronic equipment that works for a long time.

[0054] Therefore, in this embodiment, in order to solve the problem of high heat generation rate in electronic equipment that works / runs for a long time, the cooling system cooperates with the jet impact part 120 through the heat dissipation part 110. The heat dissipation part 110 dissipates and transfers the heat generated by the electronic equipment through the fins and the phase change material, and then the entire heat dissipation part and the phase change material are cooled by the cold jet impact by the jet impact part 120. The heat dissipation time can be maximized by cooperating with the jet impact part 120, which will allow the cooling system to cool the electronic equipment that works continuously for a long time and protect it from damage. The cooling system is suitable for high-power density electronic equipment that works for a long time, such as intermittent high-power chips of kilowatts, which helps to extend the life of electronic equipment by reducing the risk of heat-induced failures; at the same time, the cooling system is also suitable for uniform heat dissipation between different electronic components to maximize cooling performance.

[0055] Furthermore, in one embodiment, in addition to being filled with phase change material, the gap area between two adjacent fins is also filled with different types of high thermal conductivity non-phase change materials with added micron or nano sizes to assist the phase change material, which can greatly help enhance heat transfer inside the phase change material.

[0056] Further reading Figure 1 As shown in , the jet impact part 120 specifically includes a shell 122, a plurality of isolating members 123 are arranged in the inner cavity of the shell, and a jet cooling channel 124 is formed between two adjacent isolating members 123. The liquid coolant 121 filled in the jet impact part 120 can form a multi-channel jet impact through the jet cooling channels 124, thereby accelerating the cooling speed of the heat dissipation part and improving the cooling effect of the heat dissipation part.

[0057] Furthermore, in one embodiment, in order to facilitate the installation and fixation of the isolation member, the isolation member 123 can be directly coupled to the inner cavity wall of the shell 122 .

[0058] In addition, in one embodiment, in order to ensure the uniformity of the flow rate and flow velocity of each injection cooling channel 124, the multiple isolation members 123 are arranged in parallel and evenly spaced so that the width, length, etc. of each injection cooling channel 124 are set the same, thereby ensuring the uniformity of the flow rate and flow velocity of each injection cooling channel 124.

[0059] In addition, see Figure 1 As shown in , in one embodiment, one side of the shell 122 of the jet impact portion 120 is further provided with an inlet 125A, and the other side of the shell is provided with an outlet 125B, the inlet 125A is used to add liquid coolant, and the outlet 125B is used to release the liquid coolant. In general, the outlet 125B is larger than the inlet 125A to speed up the release of the coolant.

[0060] In addition, see Figure 1 As shown in , in one embodiment, for the heat dissipation portion 110, a cover 114 is provided on the top of the heat dissipation portion 110, and a hot section plate 115 is provided on the bottom of the heat dissipation portion, and the cover 114 is engaged with the jet impact portion 120, that is, specifically engaged with the shell 122 of the jet impact portion 120.

[0061] In a specific application, at least one electronic component (not shown in the figure) is arranged on the hot section plate 115, and the heat generated by the electronic component is conducted to the multiple fins 111 of the heat dissipation part 110 through the conduction of the hot section plate 115, and then removed by natural convection by the phase change material 112 filled between the fins. In practice, natural convection is also called free convection, which is a mass and heat transfer mechanism or type in which the fluid movement is only generated by the density difference related to the temperature gradient, rather than by any external source. At the same time, the top cover 114 of the heat dissipation part 110 is connected to the jet impact part 120, and the jet impact part 120 sprays multi-channel cold jets to cool the heat dissipation part 110. Multiple cold jets are sprayed by the jet impact part 120 to directly impact and disperse on the cover 114 of the heat dissipation part 110, while the non-cold jets do not directly impact the hot electronic components, and the heat dissipation part 110 and the jet impact part 120 are combined to dissipate the heat of the at least one electronic component. Specifically, in jet impingement flow dynamics, the flow region of a single jet impingement is divided into different regions: stagnation region, acceleration region, and wall jet region, e.g. Figure 2 As shown. Among them, the stagnation zone is located in the area directly below the jet, and its flow velocity is similar to that of the stagnant flow. Due to the static pressure difference between the stagnation zone and the external area, the airflow will accelerate after passing through the stagnation zone to maintain the continuity of the flow, forming an acceleration zone. As the fluid advances parallel to the surface through the acceleration zone, the viscosity effect and momentum loss cause the flow velocity to gradually decrease. Due to surface friction and the resulting momentum loss, the velocity in the wall jet zone is lower than that in the acceleration zone. In the case of multiple jet impacts, the flow area is the same, and the multiple jet impacts form a stagnant flow with a uniform heat transfer coefficient and provide a thin thermal boundary layer to increase the heat transfer rate with the heat sink, thereby achieving uniform cooling of the heat sink.

[0062] In addition, see Figure 1 As shown in FIG. 1 , in one embodiment, there is a first direction F1 substantially parallel to the plurality of fins 111, there is a second direction F2 substantially perpendicular to the plurality of fins 111, each of the fins 111 has a first dimension t2 in the first direction F1, and a second dimension f2 in the second direction F2. h , that is, the second dimension f his the length of the fin, and the first dimension t2 is the width of the fin. There is a third dimension t1 between two adjacent fins 111 in the first direction F1, that is, the first dimension is the spacing between two adjacent fins 111. In addition, there is a fourth dimension H1 between the cover 114 and the hot section plate 115 in the second direction F2, that is, the fourth dimension H1 is the vertical spacing between the cover 114 and the hot section plate 115, and in actual applications, the second dimension f h Smaller than the fourth dimension H1.

[0063] In practice, for the design of the heat dissipation part, different configurations of the fins will affect the thermal performance of the heat sink. To this end, the shape, size, number, fin spacing, etc. of the appropriate fins can be selected according to the number of electronic components and the specific heat generation. For example, the first size t2 and the second size f h , a third dimension t1, and a fourth dimension H1, so as to maximize the heat dissipation efficiency. In some embodiments, each fin 111 can selectively adopt a rectangular, circular, conical, or other applicable shape structure, however, the present invention is not limited thereto.

[0064] In addition, phase change material is a substance that undergoes phase change when absorbing heat, usually from solid to liquid. Phase change materials are selected based on the phase change temperature and the latent heat of phase change. At present, the typical material of phase change material "paraffin" has been widely studied and used for cooling electronic equipment, which is suitable for situations where the heat flux is relatively low, such as a few watts per square centimeter or less. However, for electronic devices with relatively high integration and heat dissipation requirements, low melting point metal phase change materials can be used as phase change materials, which have inherent advantages such as high thermal conductivity and high volume latent heat. However, the phase change material of the present invention is not limited to this, and other applicable phase change materials are also applicable to the present invention.

[0065] Furthermore, in one embodiment, the liquid coolant 121 filled in the jet impact portion 120 may be water, ethylene glycol, synthetic oil, or other applicable liquid coolants, however, the present invention is not limited thereto.

[0066] In summary, the cooling system provided in the present invention is suitable for heat dissipation of high power density electronic equipment. The cooling system is composed of a heat dissipation part and a jet impact part, which continuously dissipates heat for the electronic equipment. The heat dissipation part includes a plurality of fins arranged adjacent to each other, and the gap area between two adjacent fins is filled with phase change material; and the jet impact part is filled with liquid coolant. The system dissipates and transfers the heat generated by the electronic equipment through the fins and the phase change material, and then the entire heat dissipation part and the phase change material are cooled by cold jet impact in cooperation with the jet impact part. The cooperation between the heat dissipation part and the jet impact part can maximize the heat dissipation time, allowing the cooling system to cool the electronic equipment that works continuously for a long time and protect it from damage, which helps to extend the life of the electronic equipment.

[0067] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. A person skilled in the art in the art to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope of the attached patent application.

Claims

1. A cooling system for electronic equipment, characterized in that: Include: A heat dissipation portion, the heat dissipation portion comprising a plurality of fins arranged adjacent to each other, and a gap area between two adjacent fins is filled with a phase change material; A jet impact portion is arranged above the heat dissipation portion and connected to the heat dissipation portion, and is filled with liquid coolant.

2. The cooling system according to claim 1, characterized in that: The jet impact part comprises a shell, A plurality of isolating members are arranged in the inner cavity of the shell, and a spray cooling channel is formed between two adjacent isolating members.

3. The cooling system according to claim 2, characterized in that: The partition is engaged with the inner cavity wall of the housing.

4. The cooling system according to claim 2, characterized in that: The multiple isolation members are arranged in parallel and are evenly spaced.

5. The cooling system according to claim 2, characterized in that: An inlet is arranged on one side of the shell, and an outlet is arranged on the other side of the shell, and the size of the outlet is larger than the size of the inlet.

6. The cooling system according to claim 1, characterized in that: A cover is provided on the top of the heat dissipation part, a hot section plate is provided on the bottom of the heat dissipation part, and the cover is connected to the jet impact part; At least one electronic component is arranged on the hot section plate, and the heat dissipation portion is combined with the jet impact portion to dissipate heat for the at least one electronic component.

7. The cooling system according to claim 6, characterized in that: A first direction is substantially parallel to the plurality of fins, and a second direction is substantially perpendicular to the plurality of fins; Each of the fins has a first size in the first direction and a second size in the second direction; There is a third dimension between two adjacent fins in the first direction; A fourth dimension is defined between the cover and the hot section plate in the second direction, and the second dimension is smaller than the fourth dimension.

8. The cooling system according to claim 1, characterized in that The gap area between two adjacent fins is also filled with a micron or nanometer-sized high thermal conductivity non-phase change material.

9. The cooling system according to claim 1, characterized in that: The phase change material includes one of a metal phase change material, paraffin, and salt.

10. The cooling system according to claim 1, characterized in that The shape of the fin is rectangular, circular or conical.

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