Color-adjusting LED lamp bead and LED equipment

Abstract

The utility model provides a toning LED lamp bead and LED equipment, the toning LED lamp bead comprises a first chip, a second chip, a third chip and a support, a first plate body and a second plate body are arranged in the support, the side wall of the support and the first plate body enclose to form a first containing cavity, the side wall of the support, the first plate body and the second plate body enclose to form a second containing cavity, and the first plate body and the second plate body enclose to form a second containing cavity. A third containing cavity is defined by the side wall of the support and the second plate body, the first chip is located in the first containing cavity, the second chip is located in the second containing cavity, the third chip is located in the third containing cavity, a first colloid is arranged on the first chip, a second colloid is arranged on the second chip, a third colloid is arranged on the third chip, and a fourth colloid is arranged in the support. According to the LED lamp bead, the LED chips are arranged and matched with the colloids with different color temperatures, the color mixing effect can be achieved by controlling the different chips to emit light, the overall color temperature of the lamp bead is changed, and consumed materials are greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a color-adjusting LED lamp bead and an LED device. Background Art

[0002] With the development of LED technology, the market has more and more requirements for the diversified performance of LED lamp beads. Different fields and venues need to use lamps with different effects for lighting.

[0003] In the prior art, LED products capable of dimming and color adjustment all use a light bar with lamp beads of different color temperatures attached thereto, which are adjusted through different circuits in combination with a controller to emit light of different colors.

[0004] However, in the prior art, a lamp bead is packaged with a fluorescent glue of a color temperature to emit light of a color temperature, and lamp beads of different color temperatures are arranged side by side on the light bar. If the whole lamp requires a large number of light colors, a large number of lamp beads of different color temperatures need to be pasted, which consumes a lot of materials and requires the design of complex and crowded light bar circuits, resulting in low production efficiency and high cost. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a color-adjusting LED lamp bead and LED equipment, aiming to solve the problem in the prior art that a lamp bead is only packaged with one kind of fluorescent glue, which consumes a large amount of materials to achieve the purpose of color adjustment.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] A color-adjusting LED lamp bead comprises a first chip, a second chip, a third chip and a bracket, wherein a first plate body and a second plate body are arranged in the bracket, a side wall of the bracket and the first plate body are enclosed to form a first accommodating cavity, a side wall of the bracket, the first plate body and the second plate body are enclosed to form a second accommodating cavity, a side wall of the bracket and the second plate body are enclosed to form a third accommodating cavity, the first chip is located in the first accommodating cavity, the second chip is located in the second accommodating cavity, the third chip is located in the third accommodating cavity, and a first glue having a first color temperature is arranged on the first chip The first colloid is in a ball head shape and covers the first chip; the second colloid with a second color temperature is arranged on the second chip, the second colloid is in a ball head shape and covers the second chip; the third colloid with a third color temperature is arranged on the third chip, the third colloid is in a ball head shape and covers the third chip; a fourth colloid with a fourth color temperature is arranged in the bracket, the fourth colloid covers the first colloid, the second colloid and the third colloid, and the fourth colloid is in a ball head shape, and the first color temperature, the second color temperature and the third color temperature are all lower than the fourth color temperature.

[0008] Compared with the prior art, the beneficial effect of the utility model lies in: by arranging multiple LED chips in the bracket and matching them with colloids of different color temperatures, the effect of color mixing can be achieved by controlling the light emission of different chips, and the overall color temperature of the lamp bead can be changed, wherein the color temperature of the fourth colloid is the highest, and when it is necessary to lower the color temperature of the color-adjusting LED lamp, more chips in one lamp bead can be made to emit light, so that one LED lamp bead can emit light of different color temperatures. After integrating it into the light strip, more lighting effects can be combined, and the material consumption is greatly reduced; by setting the colloid to a spherical head shape, the light-emitting angle is expanded, the lighting effect is better, and the multi-layer colloid packaging has better airtightness.

[0009] Furthermore, a negative electrode pad group and a positive electrode pad group are arranged at the bottom of the bracket, and the negative electrode pad group and the positive electrode pad group both pass through the bracket, the negative electrode pad group includes a first pad, a third pad and a fifth pad, and the positive electrode pad group includes a second pad, a fourth pad and a sixth pad, the first pad and the second pad both correspond to the first chip position, the third pad and the fourth pad both correspond to the second chip position, and the fifth pad and the sixth pad both correspond to the third chip position.

[0010] Furthermore, the first color temperature, the second color temperature and the third color temperature are all in the range of 2700K to 6500K.

[0011] Furthermore, the first chip, the second chip and the third chip are all connected to a first lead and a second lead, the first lead is used to connect to the positive electrode pad group, and the second lead is used to connect to the negative electrode pad group.

[0012] Furthermore, a first insulation groove, a second insulation groove and a third insulation groove are opened at the bottom of the bracket, the first insulation groove is located between the first welding pad and the second welding pad, the second insulation groove is located between the third welding pad and the fourth welding pad, and the third insulation groove is located between the fifth welding pad and the sixth welding pad.

[0013] Furthermore, insulating strips are disposed in the first insulating groove, the second insulating groove and the third insulating groove.

[0014] Furthermore, the first plate body and the second plate body are both at the same height as the side wall of the bracket.

[0015] An LED device comprises the color-adjusting LED lamp bead as described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the side structure of the color-adjusting LED lamp bead in the embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the top view of the color-adjusting LED lamp bead in the embodiment of the utility model;

[0018] Figure 3 This is a partial structural diagram of the color-adjusting LED lamp bead in the embodiment of the utility model;

[0019] Description of main component symbols:

[0020] Bracket 100 The first plate 110 The second plate 120 Slope 130 First pad 141 Second pad 142 The first insulation groove 143 The third pad 151 Fourth pad 152 Second insulation groove 153 Fifth pad 161 Sixth pad 162 The third insulation groove 163 First Chip 210 First lead 211 Second lead 212 Second chip 220 The third chip 230 The fourth colloid 300 First colloid 310 Second colloid 320 The third colloid 330

[0021] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] See also Figures 1 to 3The color-adjusting LED lamp bead in the embodiment of the utility model includes a first chip 210, a second chip 220, a third chip 230 and a bracket 100. A first plate 110 and a second plate 120 are arranged in the bracket 100. The first plate 110 and the second plate 120 are both equal in height to the side wall of the bracket 100. The side wall of the bracket 100 and the first plate 110 are enclosed to form a first accommodating cavity. The side wall of the bracket 100, the first plate 110 and the second plate 120 are enclosed to form a second accommodating cavity. The side wall of the bracket 100 and the second plate 120 are enclosed to form a third accommodating cavity. The first chip 210 is located in the first accommodating cavity. A first colloid 310 with a first color temperature is arranged on the first chip 210. The first colloid 310 is in a ball head shape and covers the first chip 210. Preferably, the bracket 100 is in a bowl-cup shape, and the inner side wall of the bracket 100 includes a slope portion 130. The slope portion 130 is beneficial for the colloid to flow to the bottom of the bowl when encapsulating with fluorescent glue, avoiding leaving gaps and improving air tightness. The material of the first plate body 110 and the second plate body 120 is consistent with that of the bracket 100, and are connected to the bottom and side walls of the bracket 100, and the shape is adapted to the slope portion 130. The first chip 210 is located at the bottom of the first accommodating cavity, and the first colloid 310 uses fluorescent glue. It can be understood that the ball head shape can increase the light-emitting angle.

[0026] The second chip 220 is located in the second accommodating cavity, and a second colloid 320 with a second color temperature is disposed on the second chip 220. The second colloid 320 is in a ball head shape and covers the second chip 220. Preferably, the second chip 220 is located at the bottom of the second accommodating cavity, and the second colloid 320 is fluorescent glue.

[0027] The third chip 230 is located in the third accommodating cavity, and a third colloid 330 with a third color temperature is arranged on the third chip 230. The third colloid 330 is in a ball head shape and covers the third chip 230. Preferably, the third chip 230 is located at the bottom of the third accommodating cavity, and the third colloid 330 is fluorescent glue.

[0028] A negative electrode pad group and a positive electrode pad group are arranged at the bottom of the bracket 100, and the negative electrode pad group and the positive electrode pad group both penetrate the bracket 100, the negative electrode pad group includes a first pad 141, a third pad 151 and a fifth pad 161, and the positive electrode pad group includes a second pad 142, a fourth pad 152 and a sixth pad 162, the first pad 141 and the second pad 142 both correspond to the position of the first chip 210, the third pad 151 and the fourth pad 152 both correspond to the position of the second chip 220, the fifth pad 161 and the sixth pad 162 both correspond to the position of the third chip 230, and the first chip 210, the second chip 220 and the third The chips 230 are connected to the first lead 211 and the second lead 212, the first lead 211 is used to connect the positive electrode pad group, the second lead 212 is used to connect the negative electrode pad group, the bottom of the bracket 100 is opened with a first insulation groove 143, a second insulation groove 153 and a third insulation groove 163, the first insulation groove 143 is located between the first pad 141 and the second pad 142, the second insulation groove 153 is located between the third pad 151 and the fourth pad 152, the third insulation groove 163 is located between the fifth pad 161 and the sixth pad 162, and insulation strips are set in the first insulation groove 143, the second insulation groove 153 and the third insulation groove 163. Preferably, the first lead 211 and the second lead 212 are connected to the top of the chip, and are used to electrically connect the chip to the pad. The first lead 211 and the second lead 212 are partially placed in the fluorescent glue, that is, the first colloid 310, the second colloid 320 and the third colloid 330 not only cover the LED chip, but also cover one end of the first lead 211 and the second lead 212. The first lead 211 of the first chip 210, the second chip 220 and the third chip 230 are respectively connected to the positive electrode of the chip and the positive electrode pad corresponding to the chip, and the second lead 212 of the first chip 210, the second chip 220 and the third chip 230 are respectively connected to the negative electrode of the chip and the negative electrode pad corresponding to the chip. It can be understood that the fluorescent glue has good sealing performance and stabilizes the connection of the leads. The first insulating groove 143, the second insulating groove 153 and the third insulating groove 163 are all used to separate the two pads corresponding to the same chip to prevent conduction between the pads.

[0029] A fourth colloid 300 having a fourth color temperature is disposed in the bracket 100. The fourth colloid 300 covers the first colloid 310, the second colloid 320 and the third colloid 330, and the fourth colloid 300 is in a ball head shape. The first color temperature, the second color temperature and the third color temperature are all lower than the fourth color temperature. The first color temperature, the second color temperature and the third color temperature are all in the range of 2700K to 6500K. Preferably, the first color temperature is 2800K, the second color temperature is 4000K, and the third color temperature is 6000K. The first chip 210 and the outside air are provided with the sealed first colloid 310 and the fourth colloid 300. The second chip 220 and the third chip 230 are similar. The color-adjusting LED lamp bead has extremely strong airtightness and high reliability. By arranging multiple LED chips in one lamp bead, and respectively arranging fluorescent glue with a certain color temperature for the multiple LED chips, and then arranging high color temperature fluorescent glue for the entire lamp bead, a variety of different color temperature mixing schemes can be achieved in one lamp bead, so as to greatly improve the color adjustment performance and reduce the use of materials at the same time. By using a plurality of the color-adjusting LED lamp beads on a light strip, more delicate color adjustment can be achieved, and the color adjustment effect can be achieved with a smaller number of lamp beads, reducing the complexity of the route and the number of controllers. All colloids in the color-adjusting LED lamp beads are arranged in a ball head shape, which is beneficial to expanding the light-emitting angle and improving the light effect of the lamp bead.

[0030] The utility model also provides an LED device, which includes the color-adjusting LED lamp beads as described in the above embodiments.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A color-adjusting LED lamp bead, characterized in that: The invention comprises a first chip, a second chip, a third chip and a bracket, wherein a first plate body and a second plate body are arranged in the bracket, a side wall of the bracket and the first plate body are combined to form a first accommodating cavity, a side wall of the bracket and the second plate body are combined to form a second accommodating cavity, and a side wall of the bracket and the second plate body are combined to form a third accommodating cavity, the first chip is located in the first accommodating cavity, the second chip is located in the second accommodating cavity, and the third chip is located in the third accommodating cavity, a first colloid with a first color temperature is arranged on the first chip, the first colloid is in a ball head shape and covers the first chip, a second colloid with a second color temperature is arranged on the second chip, the second colloid is in a ball head shape and covers the second chip, a third colloid with a third color temperature is arranged on the third chip, the third colloid is in a ball head shape and covers the third chip, a fourth colloid with a fourth color temperature is arranged in the bracket, the fourth colloid covers the first colloid, the second colloid and the third colloid, and the fourth colloid is in a ball head shape, and the first color temperature, the second color temperature and the third color temperature are all lower than the fourth color temperature.

2. The color-adjusting LED lamp bead according to claim 1, characterized in that: A negative electrode pad group and a positive electrode pad group are arranged at the bottom of the bracket, and both the negative electrode pad group and the positive electrode pad group pass through the bracket. The negative electrode pad group includes a first pad, a third pad and a fifth pad, and the positive electrode pad group includes a second pad, a fourth pad and a sixth pad. The first pad and the second pad both correspond to the position of the first chip, the third pad and the fourth pad both correspond to the position of the second chip, and the fifth pad and the sixth pad both correspond to the position of the third chip.

3. The color-adjusting LED lamp bead according to claim 1, characterized in that: The first color temperature, the second color temperature and the third color temperature are all in the range of 2700K to 6500K.

4. The color-adjusting LED lamp bead according to claim 2, characterized in that: The first chip, the second chip and the third chip are all connected to a first lead and a second lead, the first lead is used to connect the positive electrode pad group, and the second lead is used to connect the negative electrode pad group.

5. The color-adjusting LED lamp bead according to claim 2, characterized in that: The bottom of the bracket is provided with a first insulation groove, a second insulation groove and a third insulation groove, the first insulation groove is located between the first welding pad and the second welding pad, the second insulation groove is located between the third welding pad and the fourth welding pad, and the third insulation groove is located between the fifth welding pad and the sixth welding pad.

6. The color-adjusting LED lamp bead according to claim 5, characterized in that: Insulating strips are arranged in the first insulating groove, the second insulating groove and the third insulating groove.

7. The color-adjusting LED lamp bead according to claim 1, characterized in that: The first plate body and the second plate body are both at the same height as the side wall of the bracket.

8. An LED device, characterized in that: It comprises the color-adjusting LED lamp bead as described in any one of claims 1 to 7.

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