Semiconductor silicon wafer grinding waste liquid filtering equipment
By designing a semiconductor silicon wafer grinding waste liquid filtration equipment including a primary filter structure, agitating structure and liquid discharge structure, the problems of poor filtration effects and easy blockage of impurities in existing equipment are solved, and more efficient filtration effects and better abrasive liquid recycling are achieved.
Patent Information
- Application Number
- CN202420615600.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-03-28
AI Technical Summary
The filtration effect of existing semiconductor silicon wafer grinding waste liquid filtration equipment is poor, and impurities are prone to block the filter structure.
A semiconductor silicon wafer grinding waste liquid filtration device including a treatment box, a primary filter structure, an agitation structure and a liquid discharge structure is designed. The primary filter structure filters large particles of impurities through the primary filter box and the filter plate. The agitating structure fully stirs and filters the abrasive liquid through the agitating shaft and the stirring rod. The liquid discharge structure further improves the filtration effect through the liquid discharge cylinder and the adsorption layer.
It improves the filtration effect of the grinding waste liquid, reduces the risk of impurities blocking the filter structure, facilitates the recycling and utilization of the grinding liquid, and enhances the grinding quality of semiconductor silicon wafers.
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Figure CN222871579U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor silicon wafer grinding waste liquid treatment, in particular to a semiconductor silicon wafer grinding waste liquid filtering device. Background Art
[0002] As the demand for intelligent equipment continues to increase, the demand for chips, which are the core components of intelligent equipment, has also risen, which has directly led to a continuous increase in the demand for semiconductor silicon wafers, the raw materials of chips. In the production process of semiconductor silicon wafers, the grinding accuracy affects the processing quality of semiconductor silicon wafers. In the grinding process of semiconductor silicon wafers, in order to reduce the grinding difficulty of semiconductor silicon wafers and improve the grinding accuracy of semiconductor silicon wafers, a large amount of grinding liquid needs to be sprayed. The grinding liquid carries the debris generated during the grinding process of semiconductor silicon wafers and flows out, generating a large amount of grinding waste liquid. In order to reduce costs, the grinding waste liquid will be processed and reused. However, the existing grinding waste liquid recovery and treatment process has the disadvantages of poor filtering effect and impurities that easily clog the filtering structure. Based on this, the applicant proposes a semiconductor silicon wafer grinding waste liquid filtering device. Utility Model Content
[0003] The purpose of the utility model is to provide a semiconductor silicon wafer grinding waste liquid filtering device with reasonable structural design, high working efficiency, good filtering effect and impurities not easy to clog the filtering structure, in order to solve the problems of poor filtering effect and impurities easily clogging the filtering structure in the existing semiconductor silicon wafer grinding waste liquid filtering device.
[0004] The technical solution adopted by the utility model to solve the technical problem is:
[0005] A semiconductor silicon wafer grinding waste liquid filtering device comprises a processing box, wherein the processing box is arranged on a base frame, bearings are arranged at the upper and lower ends of the processing box, a supporting frame is arranged on the top of the processing box, a primary filtering structure and a driving structure are arranged on the supporting frame, and the primary filtering structure is connected to the processing box, a stirring structure and a drainage structure are arranged in the processing box, and the stirring structure and the drainage structure are connected to the driving structure.
[0006] Preferably, the primary filter structure includes a primary filter box and a filter plate. A bracket is provided at the bottom of the primary filter box, liquid inlet pipes are provided on both sides of the bottom end of the primary filter box, and a fixed block is provided on the inner wall of the primary filter box to connect the bracket with the supporting frame, and the liquid inlet pipe is connected with the stirring structure. The filter plate is movably placed on the fixed frame to transport the used semiconductor silicon wafer grinding waste liquid to the primary filter box. The primary filter box filters the large particles of impurities in the grinding waste liquid, which can not only filter the grinding waste liquid multiple times, but also reduce the difficulty of one filtering treatment, thereby improving the filtering effect of the grinding waste liquid and facilitating the recycling of the grinding liquid.
[0007] Preferably, the filter plate is provided with a conical structure, and a hanging ring is provided at the top of the filter plate. The filter plate is set to a conical structure to facilitate the grinding waste liquid to flow along the surface of the filter plate, so that the grinding slurry can be fully filtered and treated, and the impurities flow downward along the surface of the filter plate. The baffle can prevent the impurities from falling from the filter plate, so that the impurities are fully separated from the grinding liquid, thereby improving the filtering effect of the grinding waste liquid.
[0008] Preferably, the stirring structure includes a stirring shaft, which is configured as a hollow structure, and the upper and lower ends of the stirring shaft are both passed through the bearing, and a liquid outlet groove and a stirring rod are arranged on the stirring shaft in the processing box, and a sealing structure is movably arranged at the bottom end of the stirring shaft, and a driven wheel is arranged on the top of the stirring shaft, and the driven wheel is connected to the driving structure, and the liquid inlet pipe extends into the stirring shaft from the top end of the stirring shaft, and the grinding liquid after the primary filtration in the primary filter box flows into the hollow stirring shaft through the liquid inlet pipe, and is discharged into the processing box from the liquid outlet groove on the stirring shaft. The stirring shaft drives the stirring rod to rotate under the action of the driving mechanism, stirs the grinding liquid in the processing box, and fully filters the grinding liquid. The bottom end of the hollow stirring shaft can be sealed through the sealing structure to prevent the grinding liquid from flowing out from the bottom end of the stirring shaft without being filtered, and the grinding waste liquid is fully filtered, thereby improving the filtering effect of the grinding liquid.
[0009] Preferably, the driving structure includes a motor, which is arranged on the back of the carrier frame. A transmission shaft is arranged on the motor. The transmission shaft is vertically passed through the bearing and enters the processing box and is connected to the drainage structure. A driving wheel is arranged on the transmission shaft outside the processing box. The driving wheel is connected to the driven wheel through a belt. The motor drives the transmission shaft and the driving wheel on the transmission shaft to rotate. The driving wheel drives the driven wheel to rotate through the belt. The driven wheel drives the stirring shaft and the stirring rod on the stirring shaft to rotate, so as to fully stir the grinding liquid in the processing box and fully filter the grinding liquid to facilitate the reuse of the grinding liquid.
[0010] Preferably, the sealing structure includes a sealing column, which is movably arranged at the bottom end of the stirring shaft, and a rotating block is arranged on the sealing column. The rotating block facilitates the installation of the sealing column in the stirring shaft or the removal of the sealing column from the sealing column. When impurities need to be discharged, the sealing column is removed, and the impurities are quickly discharged from the bottom end of the hollow stirring shaft, which facilitates the classification and processing of impurities and filtered grinding liquid, and facilitates the reuse of filtered grinding liquid.
[0011] Preferably, a filter cartridge is provided on the sealing column, and the filter cartridge is extended into the hollow stirring shaft, and the liquid inlet pipe is extended into the filter cartridge. The grinding liquid filtered by the primary filter box enters the filter cartridge for further filtration, and the filtered grinding liquid is discharged through the liquid outlet trough, thereby improving the filtering effect of the grinding liquid. When it is necessary to discharge impurities, the sealing column is removed, and the filter cartridge and the impurities in the filter cartridge can be taken out from the hollow stirring shaft, thereby further improving the separation effect of the grinding liquid and impurities.
[0012] Preferably, the drainage structure includes a drainage cylinder, which is arranged in the processing box, and the top of the drainage cylinder is connected to the transmission shaft. The bottom of the drainage cylinder is provided with a drainage bin through a thread after passing through the bearing, and a drainage hole is provided on the drainage cylinder in the processing box. The grinding liquid filtered by the filter cylinder is discharged through the liquid outlet groove, and the stirring rod stirs the grinding liquid in the processing box. The grinding liquid flows into the drainage cylinder through the drainage hole and is discharged from the drainage bin. In order to improve the recovery efficiency of the grinding liquid, a valve can also be installed on the drainage bin to facilitate the staff to receive the processed grinding liquid according to needs.
[0013] Preferably, an adsorption layer is provided in the drainage cylinder, and the grinding liquid flows into the drainage cylinder through the drainage hole. The adsorption layer can adsorb fine impurities in the grinding liquid, further improving the filtering effect and purity of the grinding liquid, thereby enhancing the grinding quality of semiconductor silicon wafers.
[0014] Beneficial effects:
[0015] 1. The used semiconductor silicon wafer grinding waste liquid is transported to the primary filter box, which filters the large particles of impurities in the grinding waste liquid. It can filter the grinding waste liquid multiple times, reduce the difficulty of one-time filtering, improve the filtering effect of the grinding waste liquid, and facilitate the recycling of the grinding liquid;
[0016] 2. The stirring shaft drives the stirring rod to rotate under the action of the driving mechanism, stirring the grinding liquid in the treatment box, and fully filtering the grinding liquid. The sealing structure can seal the bottom end of the hollow stirring shaft to prevent the grinding liquid from flowing out from the bottom end of the stirring shaft without filtering, and fully filter the grinding waste liquid, thereby improving the filtering effect of the grinding liquid;
[0017] 3. An adsorption layer is arranged in the discharge cylinder. The grinding liquid flows into the discharge cylinder through the discharge hole. The adsorption layer can absorb the tiny impurities in the grinding liquid, further improving the filtering effect and purity of the grinding liquid, thereby enhancing the grinding quality of semiconductor silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of the utility model.
[0019] Figure 2It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the primary filter box and the filter plate.
[0020] Figure 3 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the stirring shaft and the filter cartridge.
[0021] Figure 4 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the transmission shaft and the stirring shaft.
[0022] Figure 5 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the liquid discharge cylinder and the adsorption layer.
[0023] Figure 6 It is another schematic diagram of the implementation structure of the utility model.
[0024] Figure 7 This utility model Figure 6 A partial structural schematic diagram shows the connection structure between the processing box and the brush layer.
[0025] In the figure: 1. treatment box, 2. base frame, 3. support frame, 4. bearing, 5. primary filter box, 6. filter plate, 7. bracket, 8. liquid inlet pipe, 9. fixed block, 10. lifting ring, 11. motor, 12. transmission shaft, 13. driving wheel, 14. stirring shaft, 15. liquid outlet tank, 16. stirring rod, 17. driven wheel, 18. belt, 19. sealing column, 20. rotating block, 21. filter cartridge, 22. drainage cartridge, 23. drainage bin, 24. drainage hole, 25. adsorption layer, 26. brush layer. DETAILED DESCRIPTION
[0026] The present invention will be described in more detail below with reference to the accompanying drawings.
[0027] Embodiment 1:
[0028] As attached Figure 1-5 As shown: a semiconductor silicon wafer grinding waste liquid filtering device, including a processing box 1, the processing box 1 is arranged on a base frame 2, bearings 4 are arranged at the upper and lower ends of the processing box 1, a supporting frame 3 is arranged on the top of the processing box 1, a primary filtering structure and a driving structure are arranged on the supporting frame 3, and the primary filtering structure is connected to the processing box 1, a stirring structure and a drainage structure are arranged in the processing box 1, and the stirring structure and the drainage structure are connected to the driving structure.
[0029] Among them, the primary filter structure includes a primary filter box 5 and a filter plate 6. A bracket 7 is arranged at the bottom of the primary filter box 5, a liquid inlet pipe 8 is arranged on both sides of the bottom end of the primary filter box 5, and a fixing block 9 is arranged on the inner wall of the primary filter box 5. The bracket 7 is connected to the supporting frame 3, and the liquid inlet pipe 8 is connected to the stirring structure. The filter plate 6 is movably placed on the fixed frame, the filter plate 6 is provided with a conical structure, and a hanging ring 10 is arranged at the top of the filter plate 6.
[0030] Among them, the stirring structure includes a stirring shaft 14, which is set to a hollow structure, and the upper and lower ends of the stirring shaft 14 are passed through the bearing 4. A liquid outlet trough 15 and a stirring rod 16 are set on the stirring shaft 14 in the processing box 1, and a sealing structure is movably set at the bottom end of the stirring shaft 14. A driven wheel 17 is set at the top of the stirring shaft 14, and the driven wheel 17 is connected to the driving structure. The liquid inlet pipe 8 extends into the stirring shaft 14 from the top of the stirring shaft 14. The sealing structure includes a sealing column 19, which is movably set at the bottom end of the stirring shaft 14, and a rotating block 20 is set on the sealing column 19. A filter cartridge 21 is set on the sealing column 19, and the filter cartridge 21 is extended into the hollow stirring shaft 14, and the liquid inlet pipe 8 is extended into the filter cartridge 21.
[0031] Among them, the driving structure includes a motor 11, which is arranged on the back of the carrier frame 3. A transmission shaft 12 is arranged on the motor 11. The transmission shaft 12 vertically passes through the bearing 4 and enters the processing box 1 to be connected with the drainage structure. A driving wheel 13 is arranged on the transmission shaft 12 outside the processing box 1. The driving wheel 13 is connected to the driven wheel 17 through a belt 18. The motor 11 drives the transmission shaft 12 and the driving wheel 13 on the transmission shaft 12 to rotate, and the driving wheel 13 drives the driven wheel 17 to rotate through the belt 18.
[0032] Among them, the drainage structure includes a drainage cylinder 22, which is arranged in the processing box 1, and the top of the drainage cylinder 22 is connected to the transmission shaft 12. The bottom of the drainage cylinder 22 passes through the bearing 4 and is provided with a drainage bin 23 through a thread. A drainage hole 24 is provided on the drainage cylinder 22 in the processing box 1, and an adsorption layer 25 is provided in the drainage cylinder 22.
[0033] Embodiment 2:
[0034] This embodiment is further described on the basis of the first embodiment. Figure 6-7 As shown: a brush layer 26 is provided on the inner wall of the processing box 1, and the drain cylinder 22 rotates under the action of the motor 11. The brush layer 26 cleans the outer surface of the drain cylinder 22 to prevent impurities from accumulating on the outer surface of the drain cylinder 22, making it easier for the grinding liquid to quickly pass through the adsorption layer 25 and flow into the drain cylinder 22, thereby improving the filtration efficiency and filtration effect of the grinding liquid.
[0035] Working principle: The used semiconductor silicon wafer grinding waste liquid is transported to the primary filter box 5, the primary filter box 5 filters the large particles of impurities in the grinding waste liquid, and the grinding waste liquid flows along the surface of the filter plate 6, so that the grinding slurry can be fully filtered, and the impurities flow downward along the surface of the filter plate 6. The baffle can prevent the impurities from falling from the filter plate 6, so that the impurities and the grinding liquid are fully separated. The grinding liquid after the primary filtration in the primary filter box 5 flows into the hollow stirring shaft 14 through the liquid inlet pipe 8, and is discharged from the liquid outlet 15 on the stirring shaft 14 to the treatment box 1. The stirring shaft 14 drives the stirring rod 16 to rotate under the action of the driving mechanism, stirs the grinding liquid in the treatment box 1, and fully filters the grinding liquid. The grinding liquid flows into the drainage tube 22 through the drainage hole 24. The adsorption layer 25 can adsorb the fine impurities in the grinding liquid, improve the filtering effect and purity of the grinding liquid, and the filtered grinding liquid is discharged from the drainage bin 23.
[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
[0037] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0038] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.
Claims
1. A semiconductor silicon wafer grinding waste liquid filtering device, comprising a processing box, characterized in that: The processing box is arranged on a base frame, bearings are arranged at both ends of the processing box, a supporting frame is arranged on the top of the processing box, a primary filtration structure and a driving structure are arranged on the supporting frame, and the primary filtration structure is connected to the processing box, a stirring structure and a drainage structure are arranged in the processing box, and the stirring structure and the drainage structure are connected to the driving structure.
2. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 1, characterized in that: The primary filter structure includes a primary filter box and a filter plate. A bracket is provided at the bottom of the primary filter box, and liquid inlet pipes are provided on both sides of the bottom end of the primary filter box. A fixed block is provided on the inner wall of the primary filter box to connect the bracket with the supporting frame, and the liquid inlet pipe is connected with the stirring structure. The filter plate is movably placed on the fixed frame.
3. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 2, characterized in that: The filter plate is provided with a conical structure, and a hanging ring is provided on the top of the filter plate.
4. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 2, characterized in that: The stirring structure includes a stirring shaft, which is set as a hollow structure, and the upper and lower ends of the stirring shaft are passed through the bearings. A liquid outlet trough and a stirring rod are set on the stirring shaft in the processing box, a sealing structure is movably set at the bottom end of the stirring shaft, a driven wheel is set at the top of the stirring shaft, and the driven wheel is connected to the driving structure, and the liquid inlet pipe extends into the stirring shaft from the top of the stirring shaft.
5. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 4, characterized in that: The driving structure includes a motor, which is arranged on the back of the carrier frame. A transmission shaft is arranged on the motor. The transmission shaft vertically passes through the bearing and enters the processing box to be connected with the drainage structure. A driving wheel is arranged on the transmission shaft outside the processing box, and the driving wheel is connected to the driven wheel through a belt.
6. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 4, characterized in that: The sealing structure comprises a sealing column, which is movably arranged at the bottom end of the stirring shaft and on which a rotating block is arranged.
7. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 6, characterized in that: The sealing column is provided with a filter cartridge, the filter cartridge is extended into the hollow stirring shaft, and the liquid inlet pipe is extended into the filter cartridge.
8. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 5, characterized in that: The drainage structure includes a drainage cylinder, which is arranged in the processing box. The top of the drainage cylinder is connected to the transmission shaft. The bottom of the drainage cylinder is threadedly provided with a drainage bin after passing through the bearing, and a drainage hole is arranged on the drainage cylinder in the processing box.
9. The semiconductor silicon wafer grinding waste liquid filtering device according to claim 8, characterized in that: An adsorption layer is arranged in the liquid discharge cylinder.
Citation Information
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