Adsorption device for wafer processing, wafer grinding device and wafer thinning equipment

Abstract

The utility model provides an adsorption device for wafer processing, a wafer grinding device and wafer thinning equipment. The adsorption device comprises an adsorption plate, a suction cup, a through-flow shaft with an axial through hole and a mounting seat, and the adsorption plate is arranged in a containing cavity of the suction cup; the through-flow shaft passes through the binding surface between the mounting seat and the suction cup and extends into the suction cup, so as to avoid the binding surface between the suction cup and the mounting seat to suck fluid from the suction cup for wafer adsorption or input fluid into the suction cup for wafer release; the suction cup is provided with a fluid channel in fluid communication with the containing cavity, and the axial through hole is in fluid communication with the adsorption plate through the fluid channel. According to the technical scheme, the fluid path for vacuum adsorption or release of the wafer avoids the binding face between the suction cup and the mounting base, small particles are prevented from entering the binding face along with the fluid, the clean and tight binding state between the suction cup and the mounting base is guaranteed, the wafer grinding accuracy is guaranteed, and the wafer grinding quality is improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer grinding, and in particular, to an adsorption device, a wafer grinding device and a wafer thinning device for wafer processing. Background Art

[0002] At present, the semiconductor industry uses electronic circuits formed on the surface of semiconductor wafers to manufacture semiconductor chips. Before the wafer is divided into semiconductor chips, the back side opposite to the device side with electronic circuits is ground by a grinding device to thin the wafer to a predetermined thickness. Grinding the back side of the wafer can reduce the chip package volume, reduce the package mounting height, improve the chip's thermal diffusion efficiency, electrical performance and mechanical properties, thereby reducing the chip processing volume.

[0003] At present, a suction cup is generally used to hold and carry the wafer on the workbench, and a rotating grinding wheel is used to grind the wafer. The suction cup is usually a ceramic suction cup, and water, air, and vacuum enter the upper surface of the suction cup through the flow groove set at the bonding surface between the suction cup mounting flange and the ceramic suction cup to achieve the adsorption and release of the wafer. However, tiny particles will enter the bonding surface with water and air, which will cause the bonding state between the suction cup mounting flange and the ceramic suction cup bonding surface to deteriorate over time, causing the grinding wafer TTV (Total Thickness Variation) to gradually deteriorate. In addition, the wafer is not vacuum adsorbed when the ceramic suction cup is self-grinding, but it is vacuum adsorbed when the wafer is ground. Therefore, the bonding state between the suction cup mounting flange and the ceramic suction cup is loose during self-grinding, and the bonding state between the suction cup mounting flange and the ceramic suction cup is in a compressed state when the wafer is ground. The bonding state in the two cases is inconsistent, resulting in grinding errors and affecting the wafer grinding quality. Summary of the invention

[0004] The present application provides an adsorption device, a wafer grinding device and a wafer thinning equipment for wafer processing to solve or alleviate at least some of the problems mentioned above.

[0005] According to one aspect of the present application, there is provided an adsorption device for wafer processing, the adsorption device comprising an adsorption plate, a suction cup, a flow shaft having an axial through hole and a mounting seat, the adsorption plate being arranged in an accommodating cavity of the suction cup; the flow shaft extending into the suction cup through a fitting surface between the mounting seat and the suction cup so as to avoid the fitting surface to extract fluid from the suction cup for wafer adsorption or input fluid into the suction cup for wafer release; the suction cup is constructed with a fluid channel connected to the fluid of the accommodating cavity, and the axial through hole is connected to the fluid of the adsorption plate via the fluid channel.

[0006] Optionally or alternatively, the mounting seat is constructed with an axially through seat hole, the suction cup is constructed with a suction cup hole located on the side thereof facing the mounting seat and coaxially connected to the seat hole, the suction cup hole is connected to the fluid of the accommodating chamber via the fluid channel, and the flow shaft extends through the seat hole and the suction cup hole into the suction cup.

[0007] Optionally or alternatively, the fluid channel includes a radial channel extending radially outward from the suction cup hole, and an axial channel extending axially from the radial channel to the accommodating cavity.

[0008] Optionally or alternatively, the fluid channel further comprises a circumferential channel extending in the circumferential direction and arranged at the bottom of the accommodating cavity, wherein the circumferential channel is respectively in fluid communication with the accommodating cavity and the axial channel.

[0009] Optionally or alternatively, the fluid channel comprises one or more radial channels, and one or more axial channels are arranged along each radial channel.

[0010] Optionally or alternatively, the fluid channel includes a plurality of radial channels, and the angles between two adjacent radial channels in the plurality of radial channels are the same, so that the fluid is uniformly input to the adsorption plate or uniformly sucked from the adsorption plate.

[0011] Optionally or alternatively, the fluid channel comprises 6 radial channels.

[0012] Optionally or alternatively, a plurality of said axial channels are arranged at equal intervals along each radial channel.

[0013] Optionally or alternatively, a plurality of the axial channels are arranged at uneven intervals along each radial channel, wherein the radial intervals between the plurality of the axial channels gradually decrease from the center of the suction cup outward, so that the vacuum suction force of the suction plate on the wafer remains consistent from the center of the suction cup outward.

[0014] Optionally or alternatively, axial channels that are equidistant from the center of the suction cup form a circular array, and the number of axial channels arranged along each radial channel is unequal, so that the number of axial channels in each circle of the circular array gradually increases radially outward from the center of the suction cup, so that the vacuum suction force of the suction plate on the wafer remains consistent from the center of the suction cup outward.

[0015] Optionally or alternatively, the circumferential channel is arranged in a circular shape, and the radius of the circumferential channel is equal to the radial distance from the axial channel in fluid communication with the circumferential channel to the center of the suction cup.

[0016] Optionally or alternatively, the width of the circumferential channel is not less than the diameter of the axial channel.

[0017] Optionally or alternatively, the fluid channel includes a plurality of circumferential channels, and the width of the circumferential channels gradually increases from the center of the suction cup to the outside, so that the vacuum suction force of the adsorption plate on the wafer remains consistent from the center of the suction cup to the outside.

[0018] Optionally or alternatively, a sealing member is provided between the suction cup hole and the flow shaft to form a seal.

[0019] Optionally or alternatively, the mounting base includes a suction cup mounting flange connected to the suction cup and a rotating body fixedly connected to the suction cup mounting flange on a side of the suction cup mounting flange facing away from the suction cup, and the rotating body is configured to drive the suction cup mounting flange and the suction cup to rotate.

[0020] Optionally or alternatively, the seat hole comprises a flange hole and a rotating body hole which are coaxially connected and are respectively arranged in the suction cup mounting flange and in the rotating body.

[0021] Optionally or alternatively, the suction cup and the suction cup mounting flange are both made of ceramic.

[0022] Optionally or alternatively, the fluid is a liquid or a gas.

[0023] According to another aspect of the present application, a wafer grinding device is provided, which includes the adsorption device according to the aforementioned aspect and a grinding wheel arranged opposite to the adsorption device, the adsorption device is configured to adsorb the wafer, and the grinding wheel is configured to grind the side of the wafer facing away from the adsorption device.

[0024] According to another aspect of the present application, a wafer thinning device is provided, wherein the wafer thinning device comprises the wafer grinding apparatus according to the aforementioned aspect.

[0025] According to the adsorption device, wafer grinding device and wafer thinning equipment for wafer processing of the present application, the fluid path used for vacuum adsorption or release of the wafer avoids the fitting surface between the suction cup and the mounting seat, so that the fluid in the fluid path will not flow through the fitting surface, avoiding tiny particles from entering the fitting surface with the fluid, and ensuring a clean and tight fitting state between the suction cup and the mounting seat. On the other hand, because the fluid path between the fluid source and the adsorption plate avoids the fitting surface between the suction cup and the mounting seat, the fitting state between the suction cup and the mounting seat is consistent in both the case of the suction cup performing self-grinding and the suction cup adsorbing the wafer, thereby ensuring the accuracy of wafer grinding and improving the quality of wafer grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0027] Figure 1 is a three-dimensional schematic diagram of a wafer thinning device according to an embodiment of the present application;

[0028] Figure 2 A schematic cross-sectional view of an adsorption device is shown;

[0029] Figure 3 Shows Figure 2 A schematic cross-sectional view of the circular adsorption device in another state;

[0030] Figure 4 A schematic cross-sectional view of an adsorption device according to an embodiment of the present application is shown;

[0031] Figure 5 Shows Figure 4 A top view of a suction cup of the adsorption device;

[0032] Figure 6 Shows Figure 4 A bottom view of the suction cup of the adsorption device;

[0033] Figure 7 Shows Figure 4 A top view of a suction cup mounting seat of the adsorption device in FIG. 1 ; and

[0034] Figure 8 A flow chart of a wafer processing method according to an embodiment of the present application is shown.

[0035] Reference numerals :

[0036] Wafer thinning equipment 1, grinding device 10, measuring unit 20, cleaning unit 30, simple manipulator 40;

[0037] Workbench 100, adsorption device 200, grinding wheel 300, rough grinding wheel 310, fine grinding wheel 320;

[0038] Adsorption plate 210, suction cup 220, accommodating chamber 221, axial flow path 2211, suction cup hole 222, fluid channel 223, radial channel 223a, axial channel 223b, circumferential channel 223c, first mounting hole 224, flow shaft 230, axial through hole 231, mounting seat 240, suction cup mounting flange 241, flange hole 2411, radial flow path 2412, second mounting hole 2413, third mounting hole 2414, rotating body 242, rotating body hole 2421, sealing member 250. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0040] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0042] Figure 1A schematic three-dimensional diagram shows a wafer thinning device 1 according to an embodiment of the present application. The wafer thinning device 1 mainly includes: a grinding device 10, which may include a workbench 100, one or more adsorption devices 200 rotatably supported by the workbench 100, and a grinding wheel 300 arranged opposite to the adsorption device 200. The adsorption device 200 holds the wafer by adsorption and can drive the wafer to rotate. The grinding wheel 300 abuts the wafer and grinds the side of the wafer facing away from the adsorption device 200 to grind and thin the wafer. Specifically, the workbench 100 can rotate around its central axis so that the workbench 100 drives one or more adsorption devices 200 to rotate and move as a whole, thereby realizing the position conversion of the adsorption device 200 between different workstations. Each adsorption device 200 can also rotate individually. Figure 1 As shown, as an implementable embodiment, three independently rotatable adsorption devices 200 are evenly distributed on the workbench 100, and include a rough grinding part and a fine grinding part. The rough grinding part and the fine grinding part are both provided with grinding wheels 300, specifically a rough grinding wheel 310 and a fine grinding wheel 320. The three adsorption devices 200 can correspond to three stations, namely a rough grinding station, a fine grinding station and a loading and unloading station, wherein the two stations corresponding to the rough grinding wheel 310 and the fine grinding wheel 320 are used for rough grinding and fine grinding, respectively, and the remaining station is used for loading and unloading and cleaning of wafers. The rotation of the workbench 100 can drive the three adsorption devices 200 to switch between the three stations, so that the adsorption devices 200 carry the wafers and move in a cycle in the order of "loading and unloading station - rough grinding station - fine grinding station - loading and unloading station", thereby realizing fully automatic loading and unloading and continuous grinding and cleaning of the wafers. The wafer thinning device 1 may further include a measuring unit 20, which may include, for example, a contact measuring instrument and a non-contact optical measuring instrument, so as to enable online monitoring of wafer thickness. The wafer thinning device 1 also includes a cleaning unit 30 for cleaning the suction cup 220 or the wafer. In a further embodiment, the wafer thinning device 1 may further include a simple manipulator 40, which is used to place the wafer on the adsorption device 200 for grinding, and to remove the wafer from the adsorption device 200 for subsequent transmission after grinding and cleaning. As an optional embodiment, a pipeline for vacuuming may be provided inside the simple manipulator 40 to achieve vacuum adsorption of the wafer.

[0043] Figure 2A schematic cross-sectional view of an adsorption device 200 for wafer processing is shown. The adsorption device 200 includes an adsorption plate 210, a suction cup 220, a flow shaft 230 having an axial through hole 231, and a mounting seat 240 for mounting the suction cup 220. The suction cup 220 is provided with a receiving cavity 221 that is recessed from the surface of the suction cup 220 toward the mounting seat 240 on the side facing away from the mounting seat 240. The adsorption plate 210 is arranged in the receiving cavity 221. The adsorption plate 210 can be, for example, a porous ceramic plate or other forms of plates capable of adsorption. The mounting seat 240 includes a suction cup mounting flange 241 and a rotating body 242, and is configured with an axially through seat hole. The seat hole specifically includes a flange hole 2411 and a rotating body hole 2421 that are coaxially connected and are respectively arranged in the suction cup mounting flange 241 and the rotating body 242. The flow shaft 230 extends through the seat hole into the flange hole 2411. The side of the suction cup mounting flange 241 facing away from the rotating body 242 is provided with a radial flow path 2412 in fluid communication with the flange hole 2411, and the suction cup 220 is configured with an axial flow path 2211 extending axially from the radial flow path to the accommodating cavity 221 (only one point is marked in the figure for the purpose of clarity). The end of the through-flow shaft 230 facing away from the suction cup 220 may be provided with a fluid source. Figure 2 As shown by the arrows in , the axial through hole 231 of the flow shaft 230, the flange hole 2411, the radial flow path 2412 in the suction cup mounting flange 241, the axial flow path 2211 in the suction cup 220, and the accommodating cavity 221 of the suction cup 220 constitute a fluid path between the fluid source and the adsorption plate 210. The axial through hole 231 of the fluid source draws fluid so that when the adsorption plate 210 is attached to the wafer, the fluid between the adsorption plate 210 and the wafer is sucked through the micropores in the adsorption plate 210, so that the adsorption plate 210 vacuum adsorbs the wafer; the fluid source can also input fluid into the axial through hole 231 to input fluid into the space between the adsorption plate 210 and the wafer, destroying the vacuum adsorption effect between the adsorption plate 210 and the wafer, so that the adsorption plate 210 releases the wafer.

[0044] However, for Figure 2 The adsorption device 200, such as Figure 3As shown, since a radial flow path 2412 is provided at the bonding surface of the suction cup mounting flange 241 and the suction cup 220, tiny particles may enter the bonding surface with the fluid when the fluid passes through, which may cause gaps to form in the bonding surface between the suction cup mounting flange 241 and the ceramic suction cup 220 over time, and the bonding state becomes worse, causing the TTV of the ground wafer to gradually deteriorate, affecting the grinding quality of the wafer. In addition, the suction cup 220 will not vacuum absorb the wafer during the initial self-grinding for plane calibration, and there is no vacuum absorption at the fitting surface between the suction cup mounting flange 241 and the suction cup 220. The fitting state between the suction cup mounting flange 241 and the suction cup 220 is relatively loose. When the suction cup 220 vacuum absorbs the wafer during wafer grinding, the fluid path used to form a vacuum passes through the fitting surface between the suction cup mounting flange 241 and the suction cup 220, so that the fitting state of the two is a compressed state. Therefore, the fitting state of the suction cup mounting flange 241 and the suction cup 220 is inconsistent during self-grinding and wafer grinding, resulting in inconsistent surface states of the suction cup 220 under the two working conditions of self-grinding and wafer grinding, which in turn leads to poor TTV of the ground wafer, affecting the wafer grinding quality and subsequent process.

[0045] To this end, the present application proposes an adsorption device 200, such as Figure 4A schematic cross-sectional view of an adsorption device 200 according to an embodiment of the present application is shown. The adsorption device 200 mainly includes an adsorption plate 210, a suction cup 220, a flow shaft 230 having an axial through hole 231, and a mounting seat 240 for mounting the suction cup 220. The suction cup 220 is provided with a receiving cavity 221 recessed from its surface toward the mounting seat 240 on the side facing away from the mounting seat 240, and the adsorption plate 210 is arranged in the receiving cavity 221. The mounting seat 240 may specifically include a suction cup mounting flange 241 connected to the suction cup 220 (which may have a radial size matching the suction cup 220), and a rotating body 242 fixedly connected to the suction cup mounting flange 241 on the side of the suction cup mounting flange 241 facing away from the suction cup 220, and the rotating body 242 is configured to drive the suction cup mounting flange 241 and the suction cup 220 to rotate. The mounting seat 240 is configured with an axially through-hole, and the hole may include a flange hole 2411 and a rotating body hole 2421 which are coaxially connected and respectively arranged in the suction cup mounting flange 241 and the rotating body 242, and the aperture of the flange hole 2411 may be smaller than the aperture of the rotating body hole 2421. The suction cup 220 is configured with a suction cup hole 222 which is located on the side thereof facing the mounting seat 240 and is coaxially connected with the seat hole, and a fluid channel 223 which connects the suction cup hole 222 with the accommodating chamber 221. The flow shaft 230 passes through the seat hole (i.e., passes through the flange hole 2411 and the rotating body hole 2421) and the suction cup hole 222 and extends into the suction cup 220, i.e., the flow shaft 230 directly passes through the fitting surface between the mounting seat and the suction cup, and thus can avoid the fitting surface to suck fluid from the suction cup for wafer vacuum adsorption or input fluid into the suction cup for wafer release. Specifically, the axial through hole 231 of the flow shaft 230 is in fluid communication with the adsorption plate 210 via the fluid channel 223 of the suction cup 220. Figure 3As shown by the arrow in the figure, a fluid path is formed between the fluid source and the adsorption plate 210, namely: fluid source (not shown) - axial through hole 231 of flow shaft 230 - suction cup hole 222 - fluid channel 223 of suction cup 220 - adsorption plate 210. It should be understood that the direction of the arrow in the figure only illustrates one flow direction of the fluid (for example, the flow direction when releasing the wafer). In other embodiments, such as when performing vacuum adsorption, the fluid can flow in the opposite direction of the arrow. The end of the flow shaft 230 facing away from the suction cup 220 can be connected to the fluid source, and the fluid source can be configured to draw fluid from the axial through hole 231 and then through the fluid channel 233, so that when the adsorption plate 210 is attached to the wafer, the fluid between the adsorption plate 210 and the wafer is sucked through the micropores in the adsorption plate 210, so that the adsorption plate 210 vacuum adsorbs the wafer; the fluid source can also be configured to input fluid into the axial through hole 231, so as to input fluid between the adsorption plate 210 and the wafer through the fluid channel 233, destroy the vacuum adsorption effect between the adsorption plate 210 and the wafer, so that the adsorption plate 210 releases the wafer. The fluid can be a liquid (such as water), a gas, or a gas-liquid mixture, such as a mixed fluid of nitrogen and water.

[0046] According to the adsorption device 200 of the present application, the fluid path between the fluid source and the adsorption plate 210 avoids the fitting surface between the suction cup 220 and the mounting seat 240 (specifically, the suction cup mounting flange 241), so that the fluid in the fluid path will not flow through the fitting surface, and it is avoided that tiny particles enter the fitting surface with the fluid and damage the structures on both sides of the fitting surface and cause the suction cup to tilt, thereby ensuring a clean and tight fitting state between the suction cup 220 and the mounting seat 240. On the other hand, because the fluid path between the fluid source and the adsorption plate 210 avoids the fitting surface between the suction cup 220 and the mounting seat 240, the fitting state between the suction cup 220 and the mounting seat 240 is consistent when the suction cup 220 is self-grinding and when the suction cup 220 adsorbs the wafer, thereby ensuring the accuracy of wafer grinding and obtaining a better wafer TTV, thereby improving the wafer grinding quality.

[0047] like Figure 4 As shown, a sealing member 250 , such as a sealing ring, may be provided between the suction cup hole 222 and the flow shaft 230 to form a seal.

[0048] Figure 5 Shows Figure 4 A top view of the suction cup 220 of the adsorption device 200; Figure 6 Shows Figure 4 A bottom view of the suction cup 220 of the adsorption device 200. Figure 4 It can be seen that the fluid channel 223 in the suction cup 220 may include a radial channel 223a extending radially outward from the suction cup hole 222 (at Figure 5Each radial channel 223a is represented by two parallel straight dashed lines) and an axial channel 223b extending axially from the radial channel 223a to the accommodating chamber 221 (in Figure 5 For clarity purposes, Figure 4 and Figure 5 Only one radial channel 223a and one axial channel 223b are marked. In the axial direction, the fluid channel 223 is located between the surface of the suction cup 220 and the mounting seat 240 that are in contact with the accommodating cavity 221. The fluid channel 223 may include one or more radial channels 223a, such as Figure 5 As shown in the figure, the six radial channels 223a are preferably arranged at equal angles, for example, at intervals of 60 degrees. One or more axial channels 223b (a plurality includes two or more) may be arranged at intervals along each radial channel 223a, thereby connecting the suction cup hole 222 or the axial through hole 231 of the flow shaft 230 to the accommodating chamber 221 via the radial channel 223a and the axial channel 223b. In an optional embodiment, the multiple axial channels 223b at each radial channel 223a can be arranged at equal intervals; or, the multiple axial channels 223b at each radial channel 223a can be arranged at uneven intervals, for example, gradually changing from a larger interval to a smaller interval from the center of the suction cup 220 outward, that is, the axial channels 223b are arranged from sparse to dense in the radial direction, thereby cooperating with the trend of the axial channels 223b gradually expanding in the circumferential direction as they gradually move away from the center of the suction cup 220, so that all the axial channels 223b are distributed more evenly along the suction cup 220 as a whole, and the fluid is sucked more evenly along the suction cup 220, ensuring that the suction force of the adsorbed wafer is balanced, so that the wafer will not be deformed due to adsorption. Alternatively, in an optional embodiment, the number of axial channels 223b provided along each radial channel 223a is not equal, that is, the axial channels 223b at equal distances from the center of the suction cup 220 can be regarded as forming a circular array, and the number of axial channels 223b in the circular array radially outward from the center of the suction cup 220 can gradually increase, for example, the axial channels 223b in the circular array close to the center of the suction cup 220 can be provided less, and the number of axial channels 223b in each circle increases as it is farther away from the center of the suction cup 220 (for example, two axial channels 223b are provided in the circular array closest to the center of the suction cup 220, four are provided in the outer circle of the circular array, and six are provided in the outer circle). In a specific embodiment, the axial channel 223b can be configured as a cylindrical microporous channel, and the diameter of the microporous channel can be consistent with the width of the radial channel 223a.

[0049] like Figure 5 As shown by the multiple circular dotted lines in FIG. 1 , the fluid channel 223 in the suction cup 220 may also include a bottom portion of the accommodating cavity 221 (eg, Figure 4The circumferential channel 223c extending circumferentially from the bottom of the accommodating cavity 221 (the lower part of the circumferential channel 223c) is, for example, a groove recessed from the bottom surface of the accommodating cavity 221 away from the adsorption plate 210, and the circumferential channel 223c is in fluid communication with the accommodating cavity 221 and the axial channel 223b. Specifically, the circumferential channel 223c can be as follows: Figure 5 As shown, the circumferential channel 223c is arranged in a circular shape, and the radius of the circumferential channel 223c is equal to the radial distance from the center of the suction cup 220 to the axial channel 223b connected with the fluid. A plurality of circumferential channels 223c may be arranged, and each circumferential channel 223c passes through the axial channel 223b at the corresponding radial position on each radial channel 223a, thereby forming a plurality of annular circumferential channels 223c extending radially outward from the center of the suction cup 220. The width of the circumferential channel 223c may be greater than or equal to (i.e. not less than) the diameter of the axial channel 223b connected with the circumferential channel 223c. In an optional embodiment, the width of the circumferential channel 223c may gradually increase from the center of the suction cup 220 to the outside, so that the horizontal cross-sectional area of ​​the outer circumferential channel 223c is more evenly distributed from the center of the suction cup 220 to the outside, ensuring uniform suction of the fluid on the suction cup, thereby more uniformly adsorbing the wafer. The provision of the circumferential channel 223c expands the contact between the fluid in the fluid path and the adsorption plate 210 from the point contact provided by the axial channel 223b to the line contact provided by the circumferential channel 223c. The plurality of circumferential channels 223c form a concentric ring structure covering the surface of the adsorption plate 210, which facilitates the diffusion of the fluid in the adsorption plate 210 and facilitates the extraction of the fluid from the adsorption plate 210, thereby improving the efficiency of vacuum adsorption and release. In an optional embodiment, the circumferential channel 223c may be provided as a spiral channel extending continuously from the radial inside to the radial outside in a spiral shape, and the spiral channel passes through part or all of the axial channel 223b. In other embodiments, the circumferential channel 223c may also be provided not as a complete circle, but as a plurality of arcs.

[0050] In a specific embodiment, Figure 5 and Figure 6 As shown, a plurality of evenly spaced first mounting holes 224 may be provided at the outer edge of the suction cup 220. Figure 7 As shown, a plurality of second mounting holes 2413 matching the first mounting holes 224 may be provided at the outer edge of the suction cup mounting flange 241, and the suction cup 220 may be fixedly connected to the suction cup mounting flange 241 via a connecting member (e.g., bolt) passing through the first mounting holes 224 and the second mounting holes 2413. The suction cup mounting flange 241 may also be fixedly connected to the rotating body 242 via a connecting member (e.g., bolt), such as Figure 7 2 shows a plurality of third mounting holes 2414 disposed on the suction cup mounting flange 241 , wherein the plurality of third mounting holes 2414 are used for connecting the suction cup mounting flange 241 to the rotating body 242 .

[0051] In one embodiment, the suction cup 220 and the suction cup mounting flange 241 may be made of a material such as ceramic.

[0052] Figure 8 A flowchart of a wafer processing method according to an embodiment of the present application is shown. The method is performed using a wafer thinning device according to an embodiment of the present application, and the wafer processing method may specifically include:

[0053] S1: placing the wafer to be processed on the adsorption device 200;

[0054] S2: Controlling the wafer and the adsorption device 200 to form a vacuum adsorption; and

[0055] S3: Grinding the side of the wafer facing away from the suction device 200 using the grinding wheel 300 .

[0056] In a more specific embodiment, the method may further include a step of using a simple robot 40 to adsorb the wafer and transfer it to the adsorption device 200 before step S1. The method may further include step S4: after grinding the wafer to a preset thickness, grinding is stopped, and the fluid source is controlled to input fluid into the axial through hole 231 so that the adsorption device 200 releases the wafer. In addition, the method may further include other processing steps such as transferring the wafer to a cleaning device for cleaning the wafer after step S4.

[0057] The above describes the adsorption device, wafer grinding device and wafer thinning equipment according to the present application by way of example. It should be understood that the embodiments herein are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A suction device for wafer processing, characterized in that: The adsorption device includes an adsorption plate, a suction cup, a flow shaft with an axial through hole and a mounting seat, wherein the adsorption plate is arranged in the accommodating cavity of the suction cup; the flow shaft extends into the suction cup through the fitting surface between the mounting seat and the suction cup to avoid the fitting surface to draw fluid from the suction cup for wafer adsorption or input fluid into the suction cup for wafer release; the suction cup is constructed with a fluid channel connected to the fluid of the accommodating cavity, and the axial through hole is connected to the fluid of the adsorption plate via the fluid channel.

2. The adsorption device according to claim 1, characterized in that: The mounting seat is configured with an axially through-going seat hole, the suction cup is configured with a suction cup hole located on a side thereof facing the mounting seat and coaxially connected to the seat hole, the suction cup hole is connected to the fluid of the accommodating chamber via the fluid channel, and the flow shaft extends through the seat hole and the suction cup hole into the suction cup.

3. The adsorption device according to claim 2, characterized in that: The fluid channel includes a radial channel extending radially outward from the suction cup hole, and an axial channel extending axially from the radial channel to the accommodating cavity.

4. The adsorption device according to claim 3, characterized in that: The fluid channel further includes a circumferential channel extending in the circumferential direction and arranged at the bottom of the accommodating cavity, wherein the circumferential channel is in fluid communication with the accommodating cavity and the axial channel respectively.

5. The adsorption device according to claim 4, characterized in that: The fluid channel includes one or more radial channels, and one or more axial channels are arranged along each radial channel.

6. The adsorption device according to claim 4, characterized in that: The fluid channel includes a plurality of radial channels, and the angles between two adjacent radial channels in the plurality of radial channels are the same, so that the fluid is uniformly input to the adsorption plate or uniformly sucked from the adsorption plate.

7. The adsorption device according to claim 6, characterized in that: The fluid channel includes six radial channels.

8. The adsorption device according to claim 5, characterized in that: A plurality of the axial channels are arranged at equal intervals along each radial channel.

9. The adsorption device according to claim 5, characterized in that: A plurality of the axial channels are arranged at uneven intervals along each radial channel, wherein the radial intervals between the plurality of the axial channels gradually decrease from the center of the suction cup outward, so that the vacuum suction force of the adsorption plate on the wafer remains consistent from the center of the suction cup outward.

10. The adsorption device according to claim 5, characterized in that: Axial channels that are equidistant from the center of the suction cup form a circular array, and the number of axial channels arranged along each radial channel is unequal, so that the number of axial channels in each circle of the circular array gradually increases radially outward from the center of the suction cup, so that the vacuum suction force of the adsorption plate on the wafer remains consistent from the center of the suction cup to the outside.

11. The adsorption device according to any one of claims 4 to 10, characterized in that: The circumferential channel is arranged in a circular shape, and the radius of the circumferential channel is equal to the radial distance between the axial channel connected with the fluid and the center of the suction cup.

12. The adsorption device according to claim 11, characterized in that: The width of the circumferential channel is not less than the diameter of the axial channel.

13. The adsorption device according to claim 11, characterized in that: The fluid channel includes a plurality of circumferential channels, and the width of the circumferential channels gradually increases from the center of the suction cup to the outside, so that the vacuum suction force of the adsorption plate on the wafer remains consistent from the center of the suction cup to the outside.

14. The adsorption device according to any one of claims 4 to 10, characterized in that: The circumferential channel is configured as a spiral channel that continuously extends in a spiral shape from the radial inner part to the radial outer part of the suction cup, and the spiral channel passes through part or all of the axial channel.

15. The adsorption device according to any one of claims 1 to 10, characterized in that: A sealing member is arranged between the suction cup hole and the flow-through shaft to form a seal.

16. The adsorption device according to any one of claims 2 to 10, characterized in that: The mounting base includes a suction cup mounting flange connected to the suction cup and a rotating body fixedly connected to the suction cup mounting flange on a side of the suction cup mounting flange facing away from the suction cup, and the rotating body is configured to drive the suction cup mounting flange and the suction cup to rotate.

17. The adsorption device according to claim 16, characterized in that: The seat hole comprises a flange hole and a rotating body hole which are coaxially connected and are respectively arranged in the suction cup mounting flange and the rotating body.

18. The adsorption device according to claim 16, characterized in that: The suction cup and the suction cup mounting flange are both made of ceramic.

19. The adsorption device according to any one of claims 1 to 10, characterized in that: The fluid is liquid or gas.

20. A wafer grinding device, characterized in that: The grinding device comprises an adsorption device according to any one of claims 1 to 19 and a grinding wheel arranged opposite to the adsorption device, the adsorption device is configured to adsorb a wafer, and the grinding wheel is configured to grind a side of the wafer facing away from the adsorption device.

21. A wafer thinning device, characterized in that: The wafer thinning equipment comprises the wafer grinding device according to claim 20.

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