Main shaft debugging tool
By designing a spindle adjustment fixture, precise coaxial positioning and position adjustment of the spindle and rotary table were achieved, solving the problems of poor accuracy and repeatability in traditional adjustment methods, and improving the processing accuracy and product quality of the wafer thinning machine.
Patent Information
- Application Number
- CN202520162229.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Traditional spindle adjustment methods rely on manual experience, resulting in poor adjustment accuracy and repeatability, which affects processing accuracy and production efficiency, and makes it difficult to guarantee wafer thickness uniformity and surface quality.
A spindle adjustment fixture was designed, including a spindle positioning component, a table positioning component, a positioning connector, and a measuring component. Through coaxial assembly and detachable connection, the spindle is ensured to be parallel to the axis of the rotary table, and precise position adjustment is achieved by using a telescopic measuring needle and a zero-position component.
It improves the precise positional relationship between the spindle and the rotary table, ensures uniform grinding depth of the grinding wheel on the wafer surface, improves processing accuracy and product quality, simplifies the debugging process, and enhances operability.
Smart Images
Figure CN223820304U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of testing technology, and in particular to a spindle debugging fixture. Background Technology
[0002] With the rapid development of modern industry, high-precision and high-efficiency processing equipment plays an important role in manufacturing. Wafer thinning machines are key equipment in the semiconductor manufacturing process. Their main function is to perform back-side thinning on wafers. The wafer is fixed on a rotating worktable, and a high-speed rotating spindle drives a grinding wheel to contact the back side of the wafer to achieve the purpose of thinning.
[0003] In the wafer manufacturing process, the uniformity of wafer thickness is extremely important, and the surface flatness of the wafer is a key quality indicator. Therefore, the position of the spindle needs to be adjusted to ensure that the spindle is in the best working condition. Traditional adjustment methods often rely on the experience of technicians and manual operation, which is not only time-consuming and labor-intensive, but also difficult to guarantee the accuracy and repeatability of the adjustment, affecting the processing precision, surface quality and production efficiency, and making it difficult to ensure the high precision and consistency of the adjustment results. Utility Model Content
[0004] This application discloses a spindle adjustment fixture that can improve the accuracy and operability of adjustment, ensure the precise positional relationship between the spindle and the rotary table of the wafer thinning machine, improve the processing accuracy and product quality of the equipment, and help produce high-quality wafer products.
[0005] To achieve the above objectives, this application discloses a spindle adjustment fixture for adjusting the position of the spindle of a wafer thinning machine relative to a rotary table. The spindle adjustment fixture includes:
[0006] A spindle positioning component, which can be coaxially assembled to the spindle, has a first positioning part, and includes a first outer peripheral surface, the size of which is used to match the outer peripheral size of the grinding wheel on the spindle.
[0007] A tabletop positioning component, which can be coaxially assembled to the rotary table, and the tabletop positioning component has a second positioning part;
[0008] A positioning connector, which can cooperate with the first positioning part and the second positioning part respectively, so that the axis of the main shaft is parallel to the axis of the rotary table;
[0009] A measuring component including a retractable measuring probe, the measuring component being detachably connected to the platform positioning member via a first connecting structure configured such that the tip of the measuring probe coincides with the axis of the platform positioning member.
[0010] In one possible implementation, the spindle adjustment fixture further includes a zero-positioning component, which includes a first positioning surface. The zero-positioning component is detachably connected to the table positioning component via a second connecting structure configured such that the first positioning surface passes through the axis of the table positioning component and that the measuring needle abuts against the first positioning surface.
[0011] In one possible implementation, the first positioning part includes a first positioning groove, the bottom of which is perpendicular to the axis of the main shaft; the second positioning part includes a second positioning groove, the bottom of which is perpendicular to the axis of the rotary table; the positioning connector includes a positioning plate, the positioning plate including a first positioning edge and a second positioning edge that are parallel to each other; the thickness of the positioning plate matches the width of the first positioning groove and the width of the second positioning groove; the first positioning edge is used to abut against the bottom of the first positioning groove, and the second positioning edge is used to abut against the bottom of the second positioning groove.
[0012] In one possible implementation, the bottom of the first positioning groove is used to intersect the axis of the spindle, the bottom of the second positioning groove is used to intersect the axis of the rotary table, at least one end of the first positioning groove penetrates the side wall of the table positioning member, and at least one end of the second positioning groove penetrates the side wall of the spindle positioning member.
[0013] In one possible implementation, the extension and retraction direction of the measuring needle is perpendicular to the axis of the platform positioning element.
[0014] In one possible implementation, the measuring component includes a bracket with a first positioning hole, in which the measuring needle passes. The first connecting structure includes a first threaded hole on the platform positioning member and a first mounting hole on the bracket. The first threaded hole and the first mounting hole are connected by a first fastener so that the extension and retraction direction of the measuring needle is perpendicular to the axis of the platform positioning member.
[0015] In one possible implementation, the zero-positioning component includes a zero-positioning plate, the first sidewall of which forms the first positioning surface. The second connecting structure includes a second threaded hole on the platform positioning component and a second mounting hole on the zero-positioning plate. The second threaded hole and the second mounting hole are connected by a second fastener so that the first positioning surface passes through the axis of the platform positioning component.
[0016] In one possible implementation, the bottom of the first positioning groove is perpendicular to the axis of the spindle, the thickness of the zero-position plate matches the width of the first positioning groove, the first threaded hole is disposed in the first positioning groove, the zero-position plate is installed in the first positioning groove, the table positioning component is further provided with a third positioning groove, the third positioning groove is perpendicular to the first positioning groove, the first threaded hole is disposed in the third positioning groove, the bracket includes a support plate, the thickness of the support plate matches the width of the third positioning groove, and the support plate is installed in the third positioning groove.
[0017] In one possible implementation, the spindle adjustment fixture further includes a positioning seat, which includes a base plate and a side plate that are perpendicular to each other. The table positioning element is detachably connected to the base plate. The zero-position plate also includes a second side wall opposite to the first side wall, which abuts against the side plate so that the second assembly hole corresponds to the second threaded hole.
[0018] In one possible implementation, both the spindle positioning element and the table positioning element are columnar structures.
[0019] Compared with the prior art, the beneficial effects of this application are as follows:
[0020] In the spindle adjustment fixture provided in this application, the spindle positioning component is coaxially assembled with the spindle, ensuring its consistency with the spindle in the axial direction. The table positioning component is coaxially assembled with the rotary table, ensuring its consistency with the rotary table in the axial direction. The size of the first outer circumferential surface of the spindle positioning component matches the outer circumferential size of the grinding wheel on the spindle, making the spindle positioning component more accurate when simulating the outer circumference of the grinding wheel, which facilitates accurate judgment of the relative positional relationship between the grinding wheel and the rotary table. The positioning connector can cooperate with the first positioning part of the spindle positioning component and the second positioning part of the table positioning component respectively, playing a bridging role, thereby adjusting the relative positional relationship between the spindle and the rotary table, so that the axis of the spindle and the axis of the rotary table are parallel. In a wafer thinning machine, a grinding wheel is mounted on a spindle, and the wafer is placed on a rotary table. When the axis of the spindle and the axis of the rotary table are parallel, the grinding wheel can maintain a relatively stable grinding depth on the entire surface of the wafer during the grinding process. This ensures that the grinding depth of the grinding wheel is uniform in both the circumferential and radial directions of the wafer, so that the thickness uniformity of the wafer after grinding meets the high precision requirements.
[0021] Remove the platform positioning component from the rotary table. Detach the measuring component from the platform positioning component via the first connecting structure, so that the tip of the retractable measuring needle of the measuring component coincides with the axis of the platform positioning component. This makes the tip of the measuring needle located at the center of the platform positioning component, i.e., the center of the rotary table. At this time, the position of the measuring needle can represent the center position of the rotary table. Adjust the measuring component to the zero position. Coaxially assemble the platform positioning component and the measuring component mounted on the platform positioning component onto the rotary table. Move the spindle so that the first outer peripheral surface of the spindle positioning component abuts against the measuring needle. Rotate the spindle to observe whether the retractable measuring needle is always at the zero position during the rotation of the spindle. During the debugging process, if the measuring needle remains in the initial state, it indicates that the spindle position remains stable during rotation, meaning that the parallelism between the spindle and the rotary table axis, as well as the positional accuracy of the grinding wheel relative to the rotary table, meet the requirements. If the measuring needle deviates, the spindle position needs to be further adjusted until the measurement requirements are met. This application helps improve the accuracy and operability of debugging, ensures the precise positional relationship between the spindle and the rotary table of the wafer thinning machine, improves the processing accuracy and product quality of the equipment, and helps produce high-quality wafer products. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 One of the structural schematic diagrams of a positioning connector for a spindle debugging fixture provided in this embodiment of the present invention during positioning;
[0024] Figure 2 A second schematic diagram of the positioning connector of a spindle debugging fixture provided in this embodiment of the present invention during positioning;
[0025] Figure 3 A front view of the table positioning component and measuring assembly of a spindle debugging fixture provided in this embodiment of the present invention;
[0026] Figure 4 An isometric drawing of the table positioning component and measuring assembly of a spindle debugging fixture provided in this embodiment of the present invention;
[0027] Figure 5 This is a schematic diagram of the structure of a spindle debugging fixture, in which the table positioning component and the measuring component are assembled on a rotary table for testing, according to an embodiment of the present invention.
[0028] Explanation of reference numerals in the attached figures:
[0029] 10-Spindle positioning component; 11-First outer peripheral surface;
[0030] 20 - Tabletop positioning component; 21 - Second positioning part; 211 - Second positioning groove; 22 - Third positioning groove;
[0031] 30 - Positioning connector; 31 - Positioning plate; 311 - First positioning edge; 312 - Second positioning edge;
[0032] 40 - Measuring component; 41 - Measuring probe; 42 - Support;
[0033] 50 - Zero position component; 51 - Zero position plate;
[0034] 60 - Positioning seat; 61 - Base plate; 62 - Side plate;
[0035] 70 - Main spindle; 80 - Rotary table. Detailed Implementation
[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0037] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0038] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.
[0039] With the rapid development of modern industry, high-precision and high-efficiency processing equipment plays an important role in manufacturing. Wafer thinning machines are key equipment in the semiconductor manufacturing process. Their main function is to perform back-side thinning on wafers. The wafer is fixed on a rotating worktable, and a high-speed rotating spindle drives a grinding wheel to contact the back side of the wafer to achieve the purpose of thinning.
[0040] In the wafer manufacturing process, the uniformity of wafer thickness is extremely important, and the surface flatness of the wafer is a key quality indicator. Therefore, the position of the spindle needs to be adjusted to ensure that the spindle is in the best working condition. Traditional adjustment methods often rely on the experience of technicians and manual operation, which is not only time-consuming and labor-intensive, but also difficult to guarantee the accuracy and repeatability of the adjustment, affecting the processing precision, surface quality and production efficiency, and making it difficult to ensure the high precision and consistency of the adjustment results.
[0041] In view of this, some embodiments of this application provide a spindle debugging fixture that can improve the debugging accuracy and operability, ensure the precise positional relationship between the wafer thinning machine spindle and the rotary table, improve the processing accuracy of the equipment and the product quality, and help produce high-quality wafer products.
[0042] The present application will be described in detail below through specific embodiments:
[0043] The spindle adjustment fixture in the embodiments of this application, such as Figures 1-5 As shown, a spindle adjustment fixture is used to adjust the position of the spindle 70 of a wafer thinning machine relative to the rotary table 80. The spindle adjustment fixture includes:
[0044] The spindle positioning component 10 can be coaxially assembled on the spindle 70. The spindle positioning component 10 has a first positioning part and includes a first outer peripheral surface 11. The size of the first outer peripheral surface 11 is used to match the outer peripheral size of the grinding wheel on the spindle 70.
[0045] Tabletop positioning component 20, which can be coaxially assembled to the rotary table 80, and has a second positioning part 21;
[0046] The positioning connector 30 can cooperate with the first positioning part and the second positioning part 21 respectively to make the axis of the main shaft 70 parallel to the axis of the rotary table 80.
[0047] The measuring component 40 includes a retractable measuring needle 41 and is detachably connected to the table positioning member 20 via a first connecting structure configured to make the tip of the measuring needle 41 coincide with the axis of the table positioning member 20.
[0048] The spindle adjustment fixture provided in this embodiment has a spindle positioning component 10 coaxially mounted on the spindle 70, ensuring its consistency with the spindle 70 in the axial direction. A table positioning component 20 is coaxially mounted on the rotary table 80, ensuring its consistency with the rotary table 80 in the axial direction. The size of the first outer peripheral surface 11 of the spindle positioning component 10 matches the outer peripheral size of the grinding wheel on the spindle 70, making the spindle positioning component 10 more accurate when simulating the outer peripheral condition of the grinding wheel, and facilitating accurate judgment of the relative positional relationship between the grinding wheel and the rotary table 80. The positioning connector 30 can cooperate with the first positioning part of the spindle positioning component 10 and the second positioning part 21 of the table positioning component 20 respectively, playing a bridging role, thereby adjusting the relative positional relationship between the spindle 70 and the rotary table 80, so that the axis of the spindle 70 and the axis of the rotary table 80 are parallel. In a wafer thinning machine, a grinding wheel is mounted on a spindle 70, and a wafer is placed on a rotary table 80. When the axis of the spindle 70 and the axis of the rotary table 80 are parallel, the grinding wheel can maintain a relatively stable grinding depth on the entire surface of the wafer during the grinding process. This ensures that the grinding depth of the grinding wheel is uniform in both the circumferential and radial directions of the wafer, so that the thickness uniformity of the wafer after grinding meets high precision requirements.
[0049] Remove the platform positioning component 20 from the rotary table 80. detachably connect the measuring component 40 to the platform positioning component 20 via the first connecting structure, ensuring that the top of the retractable measuring needle 41 of the measuring component 40 coincides with the axis of the platform positioning component 20. This places the top of the measuring needle 41 at the center of the platform positioning component 20, which is also the center of the rotary table 80. The position of the measuring needle 41 at this point represents the center position of the rotary table 80. Adjust the measuring component 40 to the zero position. Coaxially assemble the platform positioning component 20 and the measuring component 40 mounted on the platform positioning component 20 onto the rotary table 80. Move the main shaft 70 so that the first outer peripheral surface 11 of the main shaft positioning component 10 abuts against the measuring needle 41. Rotate the main shaft 70 to observe whether the retractable measuring needle 41 remains at the zero position throughout the rotation of the main shaft 70. During the debugging process, if the measuring needle 41 remains in the initial state, it indicates that the position of the spindle 70 remains stable during rotation. This means that the parallelism between the axes of the spindle 70 and the rotary table 80, as well as the positional accuracy of the grinding wheel relative to the rotary table 80, meet the requirements. If the measuring needle 41 deviates, the position of the spindle 70 needs to be further adjusted until the measurement requirements are met. This application helps to improve the accuracy and operability of debugging, ensures the precise positional relationship between the spindle 70 and the rotary table 80 of the wafer thinning machine, improves the processing accuracy and product quality of the equipment, and helps to produce high-quality wafer products.
[0050] In the diagram, a is the axis of the main spindle 70, b is the axis of the rotary table 80, the axis direction of the main spindle 70 and the axis direction of the rotary table 80 are the X direction, and the extension and retraction direction of the measuring needle 41 is the Y direction.
[0051] It should be explained that the axis of the spindle positioning component 10 and the axis of the table positioning component 20 can be understood as a virtual straight line passing through their geometric centers. For example, if the positioning component is a columnar structure, the geometric center is the axis; if the positioning component is a cube, cuboid, or other object, its geometric center is the intersection of its diagonals, and the straight line passing through this intersection can be regarded as the axis.
[0052] Furthermore, the spindle adjustment fixture also includes a zero-position component 50, which includes a first positioning surface. The zero-position component 50 can be detachably connected to the table positioning component 20 via a second connecting structure. The second connecting structure is configured such that the first positioning surface passes through the axis of the table positioning component 20, and the measuring needle 41 can abut against the first positioning surface.
[0053] The zero-position component 50 is detachably connected to the table positioning component 20 via the second connecting structure. The first positioning surface of the zero-position component 50 serves as a reference datum. The first positioning surface can pass through the axis of the table positioning component 20, and the measuring needle 41 abuts against the first positioning surface. This method of adjustment with the assistance of the zero-position component 50 makes it easier to adjust and set the position of the measuring needle 41. The position of the measuring needle 41 is more accurate with the center position of the rotary table 80, and the debugging is more reliable.
[0054] Specifically, such as Figures 1-2 As shown, the first positioning part includes a first positioning groove, the bottom of which is perpendicular to the axis of the main shaft 70. The second positioning part 21 includes a second positioning groove 211, the bottom of which is perpendicular to the axis of the rotary table 80. The positioning connector 30 includes a positioning plate 31, which includes a first positioning edge 311 and a second positioning edge 312 that are parallel to each other. The thickness of the positioning plate 31 matches the width of the first positioning groove and the width of the second positioning groove 211. The first positioning edge 311 is used to abut against the bottom of the first positioning groove, and the second positioning edge 312 is used to abut against the bottom of the second positioning groove 211.
[0055] By designing the bottom of the first positioning groove perpendicular to the axis of the spindle 70 and the bottom of the second positioning groove 211 perpendicular to the axis of the rotary table 80, and then abutting the bottoms of the first positioning groove 311 and the second positioning groove 211, which are parallel to each other, on the positioning plate 31, the relative positional relationship between the spindle 70 and the rotary table 80 is kept consistent in the direction perpendicular to the axis, thus enabling the axis of the spindle 70 and the axis of the rotary table 80 to be parallel. Through the cooperation of the first positioning groove, the second positioning groove 211 and the positioning plate 31, the parallelism of the axes of the spindle 70 and the rotary table 80 can be controlled within a very small tolerance range. The positioning structure design based on the positioning groove and the positioning plate 31 is relatively simple and intuitive, and the operator can easily understand and master its debugging method. During the debugging process, the relative positional relationship between the spindle 70 and the rotary table 80 can be quickly determined and necessary adjustments can be made.
[0056] Furthermore, the bottom of the first positioning groove is used to intersect with the axis of the main shaft 70, and the bottom of the second positioning groove 211 is used to intersect with the axis of the rotary table 80.
[0057] The bottom of the first positioning groove intersects the axis of the spindle 70, thus passing through the center of the spindle positioning member 10, forming a symmetrical structure on the spindle positioning member 10. Similarly, the bottom of the second positioning groove 211 intersects the axis of the rotary table 80, thus passing through the center of the table positioning member 20, forming a symmetrical structure with the axis of the rotary table 80 as the axis of symmetry. During installation and debugging, using the centrally positioned positioning groove as a reference ensures that the two positioning members are subjected to uniform force in the circumferential direction around their corresponding axes. During debugging, position adjustments made with these centers as references can control the relative positional error between the spindle 70 and the rotary table 80 within a smaller range.
[0058] In other possible implementations, the first positioning groove may also be located off-center from the spindle positioning member 10, and the second positioning groove 211 may be located off-center from the table positioning member 20.
[0059] In some embodiments, at least one end of the first positioning groove penetrates the side wall of the table positioning member 20, and at least one end of the second positioning groove 211 penetrates the side wall of the spindle positioning member 10.
[0060] For example, such as Figure 2 As shown, both ends of the first positioning groove penetrate the side wall of the table positioning component 20, and both ends of the second positioning groove 211 penetrate the side wall of the spindle positioning component 10.
[0061] When at least one end of the first positioning groove penetrates the side wall of the table positioning member 20, and at least one end of the second positioning groove 211 penetrates the side wall of the spindle positioning member 10, since the positioning plate 31 is inserted into the first positioning groove and the second positioning groove 211 at the same time, the structure of the positioning plate 31 can be designed to be relatively complete. When installing components related to the first positioning groove, such as the zero-position plate 51, the operator can easily put the component into the positioning groove from the penetrating end without having to perform complex operations in a closed space, so that the component can be installed in a more direct way, reducing the installation difficulty.
[0062] In this embodiment, as Figure 3 As shown, the extension and retraction direction of the measuring needle 41 is perpendicular to the axis of the table positioning member 20.
[0063] Since the extension and retraction direction of the measuring needle 41 is perpendicular to the axis of the table positioning component 20, this perpendicular measurement method avoids displacement interference in other directions when the spindle 70 rotates for measurement. It focuses on the radial changes of the spindle 70, which enables the measurement accuracy to reach a higher level, reduces the complexity and time cost of debugging, and improves debugging efficiency.
[0064] Specifically, such as Figure 4 As shown, the measuring component 40 includes a bracket 42, on which a first positioning hole is provided. The measuring needle 41 is inserted into the first positioning hole. The first connecting structure includes a first threaded hole provided on the table positioning member 20 and a first mounting hole provided on the bracket 42. The first threaded hole and the first mounting hole are connected by a first fastener so that the extension and retraction direction of the measuring needle 41 is perpendicular to the axis of the table positioning member 20.
[0065] The bracket 42 is provided with a first positioning hole, and the measuring needle 41 is inserted into the first positioning hole, which plays a role in positioning and guiding the measuring needle 41. When the first fastener connects the bracket 42 and the table positioning component 20 together, the relative position of the first threaded hole and the first mounting hole is fixed, so the position of the bracket 42 relative to the table positioning component 20 is accurately determined. The bracket 42 can be fixed to avoid measurement errors caused by the shaking or offset of the measuring needle 41, so as to meet the needs of accurate measurement. At the same time, this structural design makes the installation of the measuring component 40 relatively simple.
[0066] The first fastener can be any fastener such as a bolt, screw, or locating pin, and there are no restrictions on its use.
[0067] Furthermore, in some embodiments, such as Figure 4As shown, the zero-position component 50 includes a zero-position plate 51, the first sidewall of the zero-position plate 51 forms a first positioning surface, and the second connection structure includes a second threaded hole provided on the table positioning component 20 and a second assembly hole provided on the zero-position plate 51. The second threaded hole and the second assembly hole are connected by a second fastener so that the first positioning surface passes through the axis of the table positioning component 20.
[0068] During the connection process, through precise machining and assembly, when the second fastener connects the zero-position plate 51 and the table positioning component 20 together, it can ensure that the first positioning surface of the zero-position plate 51 passes through the axis of the table positioning component 20, providing a precise reference related to the center of the rotary table 80 for the zero point. The second connection structure adopts the method of connecting the second threaded hole and the second mounting hole through the second fastener, which makes the installation process of the zero-position plate 51 relatively simple and facilitates the inspection and adjustment of the position of the zero-position plate 51. If it is suspected that the position of the zero-position plate 51 has shifted during use, the position of the zero-position plate 51 can be checked relatively easily by loosening the second fastener.
[0069] In this embodiment, the measuring instrument of the measuring component 40 can be a dial indicator, a micrometer, or a ten-thousand-meter indicator. When the measuring needle 41 of the measuring instrument abuts against the first positioning surface, the measuring needle is adjusted to zero. The second fastener can be any fastener such as a bolt, screw, or positioning pin, and is not limited here.
[0070] In this embodiment, as Figure 4 As shown, the bottom of the first positioning groove is perpendicular to the axis of the spindle 70. The thickness of the zero-position plate 51 matches the width of the first positioning groove. The first threaded hole is located in the first positioning groove. The zero-position plate 51 is installed in the first positioning groove. The table positioning component 20 is also provided with a third positioning groove 22. The third positioning groove 22 is perpendicular to the first positioning groove. The first threaded hole is located in the third positioning groove 22. The bracket 42 includes a support plate. The thickness of the support plate matches the width of the third positioning groove 22. The support plate is installed in the third positioning groove 22.
[0071] The zero-position plate 51 is installed in the first positioning groove, and its thickness matches the groove width, ensuring the positional accuracy of the zero-position plate 51 in the direction perpendicular to the axis of the main spindle 70. The third positioning groove 22 is perpendicular to the first positioning groove, and the support plate of the bracket 42 is installed in the third positioning groove, with its thickness matching the groove width. This vertical positioning groove structure determines that the extension and retraction direction of the measuring needle 41 is perpendicular to the plane of the first positioning surface of the zero-position plate 51, thereby ensuring that the measuring needle 41 can accurately measure the vertical positional deviation between the main spindle 70 and the rotary table 80 based on precise calibration with the zero-position plate 51. At the same time, the matching installation of the zero-position plate 51 and the bracket 42 with the positioning groove makes the installation process simpler and more intuitive.
[0072] Furthermore, such as Figures 3-4 As shown, the spindle adjustment fixture also includes a positioning seat 60, which includes a base plate 61 and a side plate 62 that are perpendicular to each other. The table positioning component 20 is detachably connected to the base plate 61. The zero-position plate 51 also includes a second side wall that is opposite to the first side wall. The second side wall abuts against the side plate 62 so that the second assembly hole corresponds to the second threaded hole.
[0073] The contact between the second sidewall of the zero-position plate 51 and the side plate 62 of the positioning seat 60 provides a precise positioning method, which helps to install the zero-position plate 51 in the correct position. In the debugging fixture, the positional accuracy of the zero-position plate 51 is crucial for zero-position calibration. The accurate position ensures that the first positioning surface passes through the axis of the table positioning member 20, thereby providing a precise zero-position reference for the measuring assembly 40. With the auxiliary positioning of the positioning seat 60, the second mounting hole and the second threaded hole are accurately aligned, avoiding the hole position deviation problem that may occur when connecting the zero-position plate 51 and the table positioning member 20.
[0074] Furthermore, both the spindle positioning component 10 and the table positioning component 20 are columnar structures.
[0075] The columnar spindle positioning component 10 and the table positioning component 20 are symmetrical about their central axis. This symmetry makes it easier to achieve high-precision positioning when they are coaxially assembled with the spindle 70 and the rotary table 80. When subjected to axial and radial forces, the columnar structure can distribute the force evenly in its circumferential direction. This uniform force distribution makes the positioning components more stable during use.
[0076] The specific steps for using the spindle debugging fixture of this application to debug the spindle 70 of the wafer thinning machine are as follows:
[0077] S1: The spindle positioning component 10 is coaxially assembled onto the spindle 70. The spindle positioning component 10 has a first positioning part and includes a first outer peripheral surface 11.
[0078] Specifically, the spindle positioning component 10, which is compatible with the spindle 70 of the wafer thinning machine, is coaxially assembled on the spindle 70. By adopting a coaxial sleeve method, the first outer peripheral surface 11 matches the grinding wheel on the spindle 70, which facilitates accurate determination of the relative positional relationship between the grinding wheel and the rotary table 80. After assembly, the coaxiality can be measured using an indicator or monitored using measuring instruments such as a laser interferometer to ensure that the central axis of the spindle positioning component 10 is completely coincident with the rotation axis of the spindle 70, providing a basis for subsequent precise debugging.
[0079] S2: The table positioning component 20 is coaxially assembled onto the rotary table 80, and the table positioning component 20 has a second positioning part 21.
[0080] Specifically, the table positioning component 20, which matches the rotary table 80, is coaxially installed on the rotary table 80. During the installation process, a dial indicator or other indicator can be used to measure the circumference of the table positioning component 20 at multiple points and adjust its position to ensure the coaxiality of the table positioning component 20 and the rotary table 80, laying the foundation for subsequent connection and debugging.
[0081] S3: Adjust the position and angle of the spindle 70, connect the positioning connector 30 to the first positioning part and the second positioning part 21, so that the axis of the spindle 70 is parallel to the axis of the rotary table 80.
[0082] Specifically, during the adjustment process, the spindle 70 is brought close to the rotary table 80, and the first positioning part of the spindle positioning part 10 and the second positioning part 21 of the table positioning part 20 are connected by the positioning connector 30. The position of the spindle 70 relative to the rotary table 80 is adjusted by the positioning connector 30, so that the axis of the spindle 70 and the axis of the rotary table 80 are parallel, ensuring that the grinding depth of the grinding wheel on the wafer is uniform, so that the thickness uniformity of the wafer after grinding meets the high precision requirements. At the same time, the adjusted positions of the spindle 70 and the rotary table 80 are locked.
[0083] S4: Remove the table positioning component 20 from the rotary table 80, and assemble the zero-position component 50 onto the table positioning component 20. The zero-position component 50 includes a first positioning surface.
[0084] Specifically, the table positioning component 20 is removed from the rotary table 80 and placed on a flat mounting base or workbench. The zero-position component 50 is taken out and assembled onto the table positioning component 20 using bolts or other fasteners, so that the first positioning surface can pass through the axis of the table positioning component 20. The first positioning surface of the zero-position component 50 serves as a reference datum for subsequent operations.
[0085] S5: Assemble the measuring component 40 on the table positioning component 20. The measuring component 40 includes a retractable measuring needle 41. Place the measuring needle 41 against the first positioning surface and adjust the measuring component 40 to the zero position.
[0086] Specifically, a measuring component 40 with the required accuracy is selected. Its measuring needle 41 has a telescopic function, which can move flexibly within a certain range and accurately measure minute displacement changes. The measuring component 40 is installed at a designated position on the table positioning member 20. The straight line of the telescopic measuring needle 41 after installation intersects the axis of the table positioning member 20. The position of the measuring needle 41 is adjusted so that it abuts against the first positioning surface of the zero position member 50, and the position of the measuring component 40 at this moment is adjusted to zero.
[0087] S6: The table positioning component 20 and the measuring component 40 mounted on the table positioning component 20 are coaxially mounted on the rotary table 80.
[0088] Specifically, using the previous assembly methods and tools, the table positioning component 20 with the measuring component 40 and the zero position already adjusted is coaxially assembled back onto the rotary table 80. During the assembly process, the measurement and adjustment methods in step S2 are repeated to ensure that the coaxiality of the table positioning component 20 and the rotary table 80 meets the requirements. At the same time, the connection of the measuring component 40 is checked to ensure that it is secure and to prevent loosening or displacement in subsequent operations.
[0089] S7: Move the spindle 70 so that the first outer peripheral surface 11 of the spindle positioning component 10 abuts against the measuring needle 41. Rotate the spindle 70 and observe whether the measuring needle 41 of the measuring component 40 is always at zero position during the rotation of the spindle 70.
[0090] Specifically, the spindle 70 is moved along a direction perpendicular to its axis, so that the first outer peripheral surface 11 of the spindle positioning component 10 gradually approaches the measuring needle 41. When the measuring needle 41 gently contacts the first outer peripheral surface 11, the movement of the spindle 70 is stopped, and the spindle 70 is rotated slowly and smoothly. During one revolution of the spindle 70, the measuring needle 41 of the measuring component 40 is continuously observed to ensure that it remains near the zero position. If it does, it indicates that the positional accuracy and rotational stability of the spindle 70 are good. If the reading of the measuring needle 41 deviates, it needs to be readjusted until the measuring needle 41 remains at the zero position during the rotation of the spindle 70, thus meeting the processing accuracy requirements of the wafer thinning machine.
[0091] Furthermore, the first positioning part includes a first positioning groove, the second positioning part 21 includes a second positioning groove 211, and the positioning connector 30 includes a positioning plate 31. The positioning plate 31 includes a first positioning edge 311 and a second positioning edge 312 that are parallel to each other. The first positioning edge 311 abuts against the bottom of the first positioning groove, and the second positioning edge 312 abuts against the bottom of the second positioning groove 211.
[0092] The first positioning edge 311 and the second positioning edge 312 on the positioning plate 31, which are parallel to each other, abut against the bottom of the first positioning groove and the bottom of the second positioning groove 211, respectively. Since the positioning edges are parallel, they can ensure that the relative positional relationship between the spindle 70 and the rotary table 80 remains consistent in the direction perpendicular to the axis, thereby making the axis of the spindle 70 and the axis of the rotary table 80 parallel. Through the cooperation of the first positioning groove, the second positioning groove 211 and the positioning plate 31, the parallelism of the axes of the spindle 70 and the rotary table 80 can be controlled within a very small tolerance range. The positioning structure design based on the positioning groove and the positioning plate 31 is relatively simple and intuitive, and the operator can easily understand and master its debugging method. During the debugging process, the relative positional relationship between the spindle 70 and the rotary table 80 can be quickly determined and necessary adjustments can be made.
[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A spindle adjustment fixture for adjusting the position of the spindle of a wafer thinning machine relative to a rotary table, characterized in that, The spindle debugging fixture includes: A spindle positioning component, which can be coaxially assembled to the spindle, has a first positioning part, and includes a first outer peripheral surface, the size of which is used to match the outer peripheral size of the grinding wheel on the spindle. A tabletop positioning component, which can be coaxially assembled to the rotary table, and the tabletop positioning component has a second positioning part; A positioning connector, which can cooperate with the first positioning part and the second positioning part respectively, so that the axis of the main shaft is parallel to the axis of the rotary table; A measuring component including a retractable measuring probe, the measuring component being detachably connected to the platform positioning member via a first connecting structure configured such that the tip of the measuring probe coincides with the axis of the platform positioning member.
2. The spindle adjustment fixture according to claim 1, characterized in that, The spindle adjustment fixture also includes a zero-position component, which includes a first positioning surface. The zero-position component can be detachably connected to the table positioning component via a second connecting structure. The second connecting structure is configured such that the first positioning surface passes through the axis of the table positioning component, and the tip of the measuring needle can abut against the first positioning surface.
3. The spindle adjustment fixture according to claim 2, characterized in that, The first positioning part includes a first positioning groove, the bottom of which is perpendicular to the axis of the main shaft. The second positioning part includes a second positioning groove, the bottom of which is perpendicular to the axis of the rotary table. The positioning connector includes a positioning plate, the positioning plate including a first positioning edge and a second positioning edge that are parallel to each other. The thickness of the positioning plate matches the width of the first positioning groove and the width of the second positioning groove. The first positioning edge is used to abut against the bottom of the first positioning groove, and the second positioning edge is used to abut against the bottom of the second positioning groove.
4. The spindle adjustment fixture according to claim 3, characterized in that, The bottom of the first positioning groove is used to intersect with the axis of the main shaft, and the bottom of the second positioning groove is used to intersect with the axis of the rotary table. At least one end of the first positioning groove passes through the side wall of the table positioning member, and at least one end of the second positioning groove passes through the side wall of the main shaft positioning member.
5. The spindle adjustment fixture according to claim 3 or 4, characterized in that, The extension and retraction direction of the measuring needle is perpendicular to the axis of the platform positioning component.
6. The spindle adjustment fixture according to claim 5, characterized in that, The measuring component includes a bracket with a first positioning hole. The measuring needle is inserted into the first positioning hole. The first connecting structure includes a first threaded hole on the platform positioning member and a first mounting hole on the bracket. The first threaded hole and the first mounting hole are connected by a first fastener so that the extension and retraction direction of the measuring needle is perpendicular to the axis of the platform positioning member.
7. The spindle adjustment fixture according to claim 6, characterized in that, The zero-position component includes a zero-position plate, the first sidewall of which forms the first positioning surface. The second connection structure includes a second threaded hole on the table positioning component and a second assembly hole on the zero-position plate. The second threaded hole and the second assembly hole are connected by a second fastener so that the first positioning surface passes through the axis of the table positioning component.
8. The spindle adjustment fixture according to claim 7, characterized in that, The bottom of the first positioning groove is perpendicular to the axis of the main shaft. The thickness of the zero-position plate matches the width of the first positioning groove. The second threaded hole is located in the first positioning groove. The zero-position plate is installed in the first positioning groove. The table positioning component is also provided with a third positioning groove. The third positioning groove is perpendicular to the first positioning groove. The first threaded hole is located in the third positioning groove. The bracket includes a support plate. The thickness of the support plate matches the width of the third positioning groove. The support plate is installed in the third positioning groove.
9. The spindle adjustment fixture according to claim 7, characterized in that, The spindle adjustment fixture also includes a positioning seat, which includes a base plate and a side plate that are perpendicular to each other. The table positioning component is detachably connected to the base plate. The zero-position plate also includes a second side wall opposite to the first side wall. The second side wall abuts against the side plate so that the second assembly hole corresponds to the second threaded hole.
10. The spindle adjustment fixture according to claim 1, characterized in that, Both the spindle positioning component and the table positioning component are columnar structures.