Ink box
By designing a detachable and installed ink cartridge that is formed integrally with the adapter, the problems of chip fixation and glue contamination in the existing ink cartridges are solved, and stable fixation and efficient production are achieved.
Patent Information
- Application Number
- CN202421597417.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-05
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-05
AI Technical Summary
When the existing ink cartridges are fixed with the chip, the amount of glue in the hot melt positioning column is insufficient, resulting in the chip being unable to be fixed, and the glue in the molten state will contaminate other components.
A ink cartridge is designed, the chip can be detachably installed in the chip holder, and the chip holder and the adapter are integrally formed, and fixed by the structure of the insertion and limiting parts, avoiding heating process and glue contamination.
The chip is stable and fixed, avoiding glue pollution and electrical connection interference, improving yield rate and reducing costs.
Smart Images

Figure CN222875586U_ABST
Abstract
Description
[0001] This utility model claims a Chinese prior application with an application date of July 5, 2023, an invention name of “Ink Cartridge” and an application number of 202321760274.1, and all contents of the prior application are fully cited in this application. Technical Field
[0002] The utility model relates to the field of inkjet imaging, in particular to an ink box which can be detachably installed in an inkjet imaging device. Background Art
[0003] An ink cartridge is a container for supplying ink to an inkjet imaging device (hereinafter referred to as the "device") such as an inkjet printer. The ink cartridge is provided with a chip for electrically connecting to the device-side terminal to establish a communication connection. The chip is generally fixed to the adapter by hot-melt welding, and the chip is fixed by the positioning posts on the hot-melt adapter. However, there is a problem of insufficient glue at the end of the hot-melt positioning posts, and when the hot-melt positioning posts are used, the glue in a molten state will flow away from the chip, making it impossible to fix the chip. In addition, the glue in a molten state will also contaminate other components. Utility Model Content
[0004] In view of the problems existing in the prior art, the main purpose of the utility model is to provide an ink cartridge, which is not suitable for the situation that the molten glue contaminates other parts when fixing the chip.
[0005] The utility model provides an ink cartridge, so that the chip can be fixedly installed, and the specific scheme is:
[0006] The ink cartridge is arranged in an inkjet imaging device having a device-side terminal, and comprises an ink bag for containing ink, an adapter arranged at one end of the ink bag, and a chip assembly arranged on the adapter.
[0007] At least a part of the chip assembly is detachably combined with the adapter, the chip assembly comprises a chip and a chip holder, the chip is used to be electrically connected to the device-side terminal, the chip holder is integrally formed with the adapter; the chip is detachably mounted on the chip holder;
[0008] The chip seat includes a plurality of plates arranged on the adapter to enclose a mounting space. The mounting space is provided with a first opening on a side away from the ink outlet and a second opening facing the chip. The first opening is used to allow the chip to enter the mounting space, and the second opening is used to expose the contact terminals on the chip to be electrically connected to the terminals on the device side.
[0009] The above arrangement, by setting the chip holder to be integrally formed with the adapter, allows the chip to be installed simply by inserting it into the chip holder, without the need to heat and fix the chip, thereby preventing the molten glue from contaminating other components, especially preventing the molten glue from covering the chip contacts and affecting the electrical connection. This can improve the yield rate and reduce costs.
[0010] Furthermore, a limiting member is provided on one side of the first opening to prevent the chip from escaping from the first opening.
[0011] Furthermore, the limiting member is configured as a cantilever. Thus, the limiting member of the cantilever structure can provide a feel of being in place when the chip is installed in place.
[0012] Furthermore, a limiting protrusion is provided on the limiting member. During assembly, the chip presses the limiting protrusion provided on the limiting member to cause elastic deformation of the limiting member until the chip as a whole passes over the limiting protrusion.
[0013] Further, the first opening is located in the -X axis direction of the installation space.
[0014] Furthermore, the installation space also includes a guide groove for guiding the chip into the installation space, and the width of the guide groove matches the thickness of the chip. Thus, during assembly, the guide groove can guide the chip to avoid chip misalignment and jamming.
[0015] Furthermore, two guide grooves are provided. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1A It is a schematic diagram of some components of the mounting part of the imaging device involved in the utility model.
[0017] Figure 1B and Figure 1C It is a stereoscopic diagram of the device side terminal involved in the utility model.
[0018] Figure 2 It is a schematic diagram of the ink cartridge involved in the utility model.
[0019] Figure 3A and Figure 3B It is a three-dimensional diagram of the adapter involved in the first embodiment of the utility model.
[0020] Figure 4 It is a side view of the adapter and the chip involved in the first embodiment of the present invention when combined and observed along the X direction.
[0021] Figure 5 It is a three-dimensional diagram of the chip assembly involved in the second embodiment of the present utility model.
[0022] Fig. 6A and Figure 6BIt is a three-dimensional diagram of the chip holder involved in the second embodiment of the present utility model.
[0023] Fig. 7A and Figure 7B It is a three-dimensional diagram of the adapter involved in the second embodiment of the present utility model.
[0024] Figure 8 It is a schematic diagram of the adapter and the chip holder involved in the second embodiment of the present utility model when combined.
[0025] Fig. 9A and Fig. 9B This is a modified embodiment of the second embodiment of the present utility model.
[0026] Fig.10 It is a three-dimensional diagram of the chip assembly involved in the third embodiment of the present utility model.
[0027] Fig.11A It is a three-dimensional diagram of the chip holder involved in the third embodiment of the present utility model.
[0028] Fig. 11B It is a side view of the chip holder involved in the third embodiment of the present invention when viewed along the X direction.
[0029] Fig.12 It is a three-dimensional diagram of the adapter involved in the third embodiment of the present utility model.
[0030] Fig.13 It is a three-dimensional diagram of the chip assembly involved in the fourth embodiment of the present utility model.
[0031] Fig.14A and Fig. 14B It is a three-dimensional diagram of the adapter involved in the fourth embodiment of the present utility model.
[0032] Fig.15A and Fig. 15B This is a modified embodiment of the fourth embodiment of the present utility model. DETAILED DESCRIPTION
[0033] Figure 1A It is a schematic diagram of some components of the mounting part of the imaging device involved in the utility model; Figure 1B and Figure 1C It is a three-dimensional diagram of the equipment side terminal involved in the utility model; Figure 2 It is a schematic diagram of the ink cartridge involved in the utility model.
[0034] like Figure 2As shown, the ink cartridge 10 includes an ink bag (not shown) for containing ink, an adapter 11 arranged at one end of the ink bag, and a supply component 12. The adapter 11 is used to combine with the device so that the ink cartridge 10 can be installed. One end of the supply component 12 is connected to the adapter 11 and is provided with an ink outlet 121 to supply ink to the device. The other end is arranged in the ink bag. The supply component 12 is used to support the ink bag to prevent the inner walls of the ink bag from sticking to each other when the ink amount is reduced, thereby affecting the supply of ink from the ink outlet 121 to the device.
[0035] The adapter 11 has a first surface 11a, a second surface (not shown), a third surface 11c, a fourth surface 11d, a fifth surface (not shown) and a sixth surface 11f. The first surface 11a and the second surface are arranged opposite to each other, the third surface 11c and the fourth surface 11d are arranged opposite to each other, and the fifth surface and the sixth surface 11f are arranged opposite to each other. For a more accurate description, it is defined that the first surface 11a is located on the +Y axis direction side, the second surface is located on the -Y axis direction side, the third surface 11c is located on the +X direction side, the fourth surface 11d is located on the -X direction side, the fifth surface is located on the +Z direction side, and the sixth surface 11f is located on the -Z direction side. That is to say, the first surface 11a and the second surface are opposite to each other in the Y axis direction, the third surface 11c and the fourth surface 11d are opposite to each other in the X axis direction, the fifth surface and the sixth surface 11f are opposite to each other in the Z axis direction, and the X axis, Y axis and Z axis intersect with each other. Further, the three are perpendicular to each other.
[0036] like Figure 1A , Figure 1B and Figure 1C As shown, the device side terminal 52 is used to combine with at least a part of the chip assembly 3 in the ink cartridge 10 described later, and the ink cartridge 10 is detachably installed in the mounting portion 50 in the device. Specifically, the device side terminal 52 is used to electrically connect with a part of the chip assembly 3 to establish a communication connection. The device side terminal 52 is movably arranged in the groove portion provided in the mounting portion 50. The device side terminal 52 includes a body 52e and an electrical connection portion 520. One end of the body 52e is movably accommodated in the groove portion, and the electrical connection portion 520 is arranged at the other end of the body 52e. The body 52e is in the groove portion, and there is a gap between the body 52e and the inner wall of the groove portion in the X-axis direction and the Z-axis direction. Therefore, the body 52e can have a certain movable space in the X-axis direction and the Z-axis direction.
[0037] Further, the body 52e includes a first surface 52a and a second surface 52b, the first surface 52a and the second surface 52b are two surfaces opposite to each other in the X-axis direction, and the first surface 52a is located on the +X-axis direction side, and the second surface 52b is located on the -X-axis direction side; the protrusion 570 is provided on the first surface 52a and / or the second surface 52b, and the protrusion 570 can be provided on one side of one of the surfaces; a first wing 521 is also convexly provided on the first surface 52a, the first wing 521 is provided on the -Z-axis direction side of the second protrusion 570, the first wing 521 is gap-received in the first guide groove 501 provided in the groove portion, and the first wing 521 is movable in the first guide groove 501 in both the +X-axis direction and the +Y-axis direction; the second surface A second wing 522 is also protruding from the surface 52b, and the second wing 522 and the first wing 521 are symmetrically arranged. The gap of the second wing 522 is accommodated in the second guide groove 502 arranged in the groove portion, and the second wing 522 is movable in the second guide groove 502 in the -X axis direction and the -Y axis direction; when the main body 52e moves to the extreme position, the first wing 521 is in close contact with the inner wall surface of the first guide groove 501, and similarly, the second wing 522 is also in close contact with the inner wall surface of the second guide groove 502; at this time, the movement of the main body 52e in the X-axis and Z-axis directions is restricted, so that the main body 52e cannot produce displacement in the Y-axis and Z-axis directions, thereby avoiding the disconnection of the communication connection between the device-side terminal 52 and the chip component 3, thereby ensuring the stability of the communication connection.
[0038] Further, the body 52e is provided with a protrusion 570, and the protrusion 570 is formed with a restricted portion 57, and the restricted portion 57 includes a first restricted portion 57a and a second restricted portion 57b, the first restricted portion 57a is a surface of the protrusion 570 in the +Z axis direction, the first restricted portion 57a includes a first guided surface 57a1 and a first retained surface 57a2, the first guided surface 57a1 is located on the -Y axis direction side and is inclined toward the -Z axis direction along the -Y axis direction, and the first retained surface 57a2 is parallel to the XY plane. The second restricted portion 57b is a surface of the protrusion 570 in the -Y axis direction, the second restricted portion 57b includes a second guided surface 57b1 and a second retained surface 57b2, the second guided surface 57b1 is located in the -Y axis direction and is inclined toward the -X axis direction along the -Y axis direction.
[0039] Furthermore, the adapter 11 has an ink outlet 111 arranged on the first surface 11a, and the ink outlet 111 is used to combine the ink outlet part 121 with the device. In addition, the adapter 11 is also provided with an inclined surface 112, a side wall 113a and a side wall 113b. Specifically, the inclined surface 112 is used to abut against the device side terminal 52, and the side wall 113a and the side wall 113b are used to limit the two sides of the device side terminal 52 described later, so that the device side terminal 52 is fixed to prevent the device side terminal 52 from moving and being unable to communicate with the chip 30 described later.
[0040] The ink cartridge 10 also includes a chip assembly 3 arranged on the adapter 11, the chip assembly 3 includes a chip 30 and a chip seat 31, the chip 30 is configured to be inclined toward the +Y axis direction and the -Z axis direction to communicate with the device side terminal 52, and the adapter 11 is provided with an installation space 114 for accommodating the chip 30. In the X-axis direction, the installation space 114 is located in the -X axis direction of the ink outlet 111, and in the Y-axis direction, the installation space 114 is located in the +Y axis direction of the ink outlet 111, so that the ink in the ink outlet 111 will not contaminate the chip 30.
[0041] [Example 1]
[0042] Figure 3A and Figure 3B It is a three-dimensional diagram of the adapter involved in the first embodiment of the utility model; Figure 4 It is a side view of the adapter and the chip involved in the first embodiment of the present invention when combined and observed along the X direction.
[0043] like Figure 3A , Figure 3B and Figure 4 As shown, the adapter 11 is provided with a plurality of plates enclosing and forming an installation space 114, including a first plate 1141, a second plate 1142, a third plate 1143 and a fourth plate 11d1 (a plate where the fourth surface 11d is located, as shown in FIG. Figure 7B As shown), further, the installation space 114 is provided with a first opening 114a and a second opening 114b facing the chip 30 on a side away from the ink outlet 111, the first opening 114a is used to allow the chip 30 to enter the installation space 114, and the second opening 114b is used to allow the contact terminal 301 on the chip 30 (as shown Figure 5 The installation space 114 further includes a guide groove 1144. In this embodiment, two guide grooves 1144 are provided, which are respectively located in the +Z axis direction of the first plate 1141 and the +Z axis direction of the second plate 1142. The width of the guide groove 1144 matches the thickness of the chip 30, or in other words, the width of the guide groove 1144 is slightly larger than the thickness of the chip 30. Further, a limit member 11421 is provided on one side of the first opening 114a. Preferably, the limit member 11421 is provided as a cantilever connected to the second plate 1142.
[0044] During assembly, the chip 30 is inserted into the installation space 114 from the first opening 114a along the guide groove 1144. The chip 30 presses the limiting protrusion 11421a set on the limiting member 11421 to make the limiting member 11421 elastically deformed until the chip 30 as a whole passes over the limiting protrusion 11421a. The assembly is completed. The limiting protrusion 11421a can prevent the chip 30 from detaching from the first opening 114a to limit the movement of the chip 30 in the -X axis direction. The third plate 1143 can limit the movement of the chip 30 in the +X axis direction. The first plate 1141 and the second plate 1142 can limit the movement of the chip 30 in the -Z axis direction. Further, in this embodiment, the chip seat 31 is formed integrally with the adapter 11, so the multiple plates forming the installation space 114 can be regarded as the chip seat 31.
[0045] In this way, the chip can be directly installed without the need for heating and other processes, thereby simplifying the process and structure. Not only can the process problems of hot-melt welding to fix the chip in the background technology be avoided, but also the complexity of installing the chip can be reduced, making the installation and removal of the chip more convenient and simple. In addition, no molten glue will be generated, thereby keeping the components clean and preventing the re-solidified glue from hindering the combination of related components.
[0046] [Example 2]
[0047] Figure 5 is a three-dimensional diagram of a chip assembly involved in the second embodiment of the present utility model; Fig. 6A and Figure 6B It is a three-dimensional diagram of a chip holder involved in the second embodiment of the present utility model; Fig. 7A and Figure 7B It is a three-dimensional diagram of the adapter involved in the second embodiment of the utility model; Figure 8 It is a schematic diagram of the adapter and the chip holder involved in the second embodiment of the present utility model when combined.
[0048] The difference between this embodiment and the first embodiment is that the chip holder 31 and the adapter 11 in this embodiment are formed separately, as described below.
[0049] like Figure 5 , Fig. 6A and Figure 6B As shown, the chip holder 31 is provided with a receiving cavity 311 for receiving the chip 30. The receiving cavity 311 is formed with a cavity opening 311a facing the chip 30. The chip 30 is installed in the receiving cavity 311 from the cavity opening 311a, and the contact terminal 301 is exposed through the cavity opening 311a. Further, a fixing portion 312 is provided on the side where the cavity opening 311a is located. The fixing portion 312 is used to fix the chip 30. Further, the fixing portion 312 can be a local protrusion (such as a protrusion) provided on the cavity opening 311a. Fig. 6AAs shown), it can also be an integral protrusion surrounding the cavity opening 311a. In this embodiment, the fixing portion 312 is set as two local protrusions opposite to each other in the X-axis direction or the Y-axis direction. At this time, in the X-axis or Y-axis direction, the distance between the two local protrusions is slightly smaller than the distance of the cavity opening 311a, so that the two local protrusions can play a role in fixing the chip 30. Further, the chip holder 31 is also provided with a blocking portion 314, and the blocking portion 314 is used to abut against the adapter 11 so that the chip holder 31 is fixed. Specifically, in the Z-axis direction, the blocking portion 314 is set on the side away from the cavity opening 311a, that is, the blocking portion 314 is located in the +Z-axis direction of the cavity opening 311a. Further, the blocking portion 314 is set as a cantilever, including a blocking protrusion 314a at the end, and the blocking protrusion 314a is used to abut against the adapter 11. Further, the blocking protrusion 314a has a blocking surface 314a1 on the side facing -X.
[0050] like Fig. 7A , Figure 7B and Figure 8 As shown, an installation space 114 for installing the chip assembly 3 is provided on the adapter 11. Different from the first embodiment, the guide groove 1144 is not provided in this embodiment. At the same time, a fifth plate 1145 connected to the fourth plate 11d1 is also provided in this embodiment. The fifth plate 1145 is used to support the chip assembly 3.
[0051] During assembly, the chip 30 is pressed along the direction of the cavity opening 311a of the chip seat 31, so that the chip 30 enters the accommodating cavity 311, and the chip 30 is fixed by the fixing portion 312 on one side of the cavity opening 311a; then the chip assembly 3 assembled as one is inserted into the installation space 114 from the first opening 114a, and the fourth plate 11d1 squeezes the blocking protrusion 314a on the blocking portion 314 to cause the blocking portion 314 to undergo elastic deformation until the fourth plate 11d1 passes over the blocking protrusion 314a, at which time the blocking surface 314a1 abuts against the fourth plate 11d1, and further, the plane 11d11 of the fourth plate 11d1 arranged on the +X axis direction side abuts against the blocking surface 314d1 to prevent the chip assembly 3 from detaching from the first opening 114a, thereby fixing the chip assembly 3.
[0052] Fig. 9A and Fig. 9B This is a modified embodiment of the second embodiment of the present utility model.
[0053] like Fig. 9A and Fig. 9B As shown, a chip seat opening 311 b is provided on one side of the chip seat 31 , and the chip 30 can slide into the accommodating cavity 311 along the chip seat opening 311 b , so that the installation is more convenient.
[0054] [Example 3]
[0055] Fig.10 is a three-dimensional diagram of a chip assembly involved in Embodiment 3 of the present utility model; Fig.11A It is a three-dimensional diagram of a chip holder involved in the third embodiment of the present utility model; Fig. 11B It is a side view of the chip holder involved in the third embodiment of the present utility model when viewed along the X direction; Fig.12 It is a three-dimensional diagram of the adapter involved in the third embodiment of the present utility model.
[0056] The difference between this embodiment and the second embodiment is that a guiding portion is provided in the installation space 114 of this embodiment, and a guided portion is correspondingly provided on the installation seat 31, as described in detail as follows.
[0057] like Fig.10 , Fig.11A , Fig. 11B and Fig.12 As shown, the chip holder 31 includes a main body 311, a limiting column 312 arranged on the main body 311, and a guided portion 315. Further, the chip 30 is supported by the main body 311. At the same time, the limiting column 312 cooperates with the hole arranged on the chip 30 to fix the chip 30. Preferably, along the tilting direction of the chip 30, two limiting columns 312 are provided; along the tilting direction of the chip 30, the guided portion 315 includes two respectively located at both ends of the main body 311, which are used to combine with the adapter 11. Further, the chip holder 31 also includes a blocking portion 314 connected to the main body 311, and the blocking portion 314 is used to abut against the adapter 11 so that the chip holder 31 is fixed. Specifically, the blocking portion 314 is set as a cantilever, including a blocking protrusion 314a at the end, and the blocking protrusion 314a is used to abut against the adapter 11. Further, the blocking protrusion 314a has a blocking surface 314a1 on the side facing -X.
[0058] like Fig.12 As shown, the installation space 114 is provided with a guiding portion 1146, and the guiding portion 1146 is used to cooperate with the guided portion 315 of the chip holder 31 to guide the installation of the chip holder 31. Preferably, the guiding portion 1146 is a guiding protrusion and the guided portion 315 is a guiding groove. In other embodiments, the guiding portion 1146 can be set as a guiding groove and the guided portion 315 can be set as a guiding protrusion.
[0059] During assembly, the chip 30 is first installed on the chip seat 31, and then the integrated chip assembly 3 is inserted into the installation space 114 through the first opening 114a along the guide portion 1146. Similar to the second embodiment, the chip seat 31 and the adapter 11 are fixed by the abutment of the fourth plate 11d1 of the blocking protrusion 314a.
[0060] [Example 4]
[0061] Fig.13is a three-dimensional diagram of a chip assembly involved in the fourth embodiment of the present utility model; Fig.14A and Fig. 14B It is a three-dimensional diagram of the adapter involved in the fourth embodiment of the present utility model.
[0062] The difference between this embodiment and the second embodiment is that the chip holder 31 is combined with the adapter 11 by snap-fitting, as described below.
[0063] like Fig.13 , Fig.14A and Fig. 14B As shown, the chip seat 31 includes a fixing portion 312 arranged in the cavity opening 311a. Along the tilting direction of the chip 30, the fixing portions 312 are two located at both ends of the cavity opening 311a to limit the chip 30; the chip seat 31 also includes a positioning portion 317 for combining with the adapter 11. Further, the positioning portion 317 includes a first positioning member 3171 and a second positioning member 3172 opposite to each other along the X-axis direction. The first positioning member 3171 is provided with a first positioning protrusion 31711, and the second positioning member 3172 is provided with a second positioning protrusion 31721.
[0064] Further, the adapter 11 includes a mounting plate 115, the mounting plate 115 is used to support the chip assembly 3, specifically, the mounting plate 115 is provided with a mounting protrusion 1151, preferably, the mounting protrusion 1151 is provided with two, so as to position the chip assembly 3, and in the X-axis direction, the mounting plate 115 and the fourth plate 11d are not parallel; further, the mounting plate 115 is also provided with a first mounting hole 1153, and the fourth plate 11d is provided with a second mounting hole 1152, specifically, the first mounting hole 1153 is used to be with The first positioning piece 3171 is combined, and the second mounting hole 1152 is used to be combined with the second positioning piece 3172. Furthermore, the second positioning protrusion 31721 is clamped with the second mounting hole 1152. A clamping plate 1154 is also provided on the side of the mounting plate 115 facing away from the chip 30. The first positioning protrusion 31711 is used to be clamped with the clamping plate 1154. Preferably, the clamping plate 1154 is provided with a clamping groove 11541. The first positioning protrusion 31711 is combined with the clamping groove 11541, thereby fixing the chip assembly 3.
[0065] Fig.15A and Fig. 15B This is a modified embodiment of the fourth embodiment of the present utility model.
[0066] like Fig.15A and Fig. 15BAs shown, on the basis of the fourth embodiment, the chip seat 31 is further provided with a plurality of protrusions with a height difference with the fixing portion 312, such as a first protrusion 318 and a second protrusion 319, the first protrusion 318 can be used to support the chip 30 so that the chip 30 can be installed, and the second protrusion 319 can be used to position the chip 30 for installation; during assembly, the chip 30 is positioned from the positioning portion 317 toward the cavity opening 311a, and the chip 30 is pressed so that the chip 30 is inserted into the cavity 311, at this time, the chip 30 passes over the first protrusion 318 and is supported by the first protrusion 318, and is fixed by the fixing portion 312. The installation method of the chip assembly 3 is the same as that of the fourth embodiment, so it is not repeated.
[0067] As described above, the chip 30 / chip holder 31 and the adapter 11 are combined in a detachable manner, so that the chip 30 can be directly installed without the need for heating and other processes, thereby simplifying the process and structure, not only avoiding the process problems of hot-melt welding to fix the chip 30 in the background technology, but also reducing the complexity of installing the chip 30, making the installation and removal of the chip 30 more convenient and simple. In addition, no molten glue will be generated, so that the components can be kept clean and the re-solidified glue can be prevented from hindering the combination of related components. In addition, the chip assembly is combined with the adapter in a detachable manner, which is convenient for recycling the chip assembly.
Claims
1. An ink cartridge, arranged in an inkjet imaging device having a device-side terminal, comprising an ink bag for containing ink, an adapter arranged at one end of the ink bag, and a chip assembly arranged on the adapter, wherein: At least a part of the chip assembly is detachably combined with the adapter, the chip assembly comprises a chip and a chip holder, the chip is used to be electrically connected to the device-side terminal, the chip holder is integrally formed with the adapter; the chip is detachably mounted on the chip holder; The chip seat includes a plurality of plates arranged on the adapter to enclose a mounting space. The mounting space is provided with a first opening on a side away from the ink outlet and a second opening facing the chip. The first opening is used to allow the chip to enter the mounting space, and the second opening is used to expose the contact terminals on the chip to be electrically connected to the terminals on the device side.
2. The ink cartridge according to claim 1, wherein: A limiting member is arranged on one side of the first opening to prevent the chip from being separated from the first opening.
3. The ink cartridge according to claim 2, wherein: The limiting member is arranged as a cantilever.
4. The ink cartridge according to claim 2, wherein: The limiting member is provided with a limiting protrusion. During assembly, the chip presses the limiting protrusion provided on the limiting member to cause the limiting member to undergo elastic deformation until the chip as a whole passes over the limiting protrusion.
5. The ink cartridge according to claim 1, wherein: The first opening is located in the -X axis direction of the installation space.
6. The ink cartridge according to claim 1, wherein: The installation space further includes a guide groove for guiding the chip into the installation space, and the width of the guide groove matches the thickness of the chip.
7. The ink cartridge according to claim 1, wherein: Two guide grooves are provided.