Rapid testing equipment for packaged semiconductor chip

Abstract

The utility model belongs to the technical field of chip testing, and particularly relates to a rapid testing device for a packaged semiconductor chip, which comprises a testing table, a clamping mechanism and a driving mechanism, a placing table is fixedly arranged at the top of the testing table, and a plurality of placing grooves for placing chips are arranged at the top of the placing table in an array manner. According to the utility model, chips to be tested are placed in the inner cavity of the placing groove one by one, the chips can be clamped in the middle between the front and rear clamping plates along arc transition, the springs push the clamping plates to clamp the front and rear sides of the chips, the spline rod moves along the front and rear directions of the spline groove, and the height of the detection plate is adjusted to detect one side of each chip. After detection is finished, the detection plate is reset, the servo gear motor is started to drive the driving rod to rotate, all the rear rotating rods are driven to rotate through the worm and the worm gear, all the chips are driven to rotate in sequence, accordingly, the chips are turned over, and finally the other faces of the chips are detected by adjusting the height of the detection plate.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a fast testing device for a packaged semiconductor chip. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Not only silicon chips, but also common ones include gallium arsenide (gallium arsenide is toxic, so don't be curious to disassemble some inferior circuit boards), germanium and other semiconductor materials. Semiconductors are also trendy like cars. In order to meet the needs of mass production, the electrical properties of semiconductors must be predictable and stable, so the purity of dopants and the quality of the semiconductor lattice structure must be strictly required. Common quality problems include lattice dislocations, twin planes or stacking faults, which will affect the characteristics of semiconductor materials. For a semiconductor device, defects in the material lattice are usually the main factor affecting the performance of the component. Semiconductor chips need to be tested and processed by special testing equipment after production.

[0003] When a chip needs double-sided inspection, traditional devices cannot quickly flip multiple chips over and can only flip them over one by one for inspection, which is relatively inefficient. Therefore, it is necessary to develop a fast testing device for packaged semiconductor chips. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0006] A fast testing device for semiconductor chips after packaging, comprising a testing platform, a clamping mechanism and a driving mechanism, wherein a placing platform is fixedly arranged on the top of the testing platform, and a plurality of placing slots for placing chips are arranged in an array on the top of the placing platform;

[0007] The clamping mechanism is arranged in the placement groove and is used to clamp the front and rear sides of the chip. The clamping mechanism includes a front rotating rod rotatably arranged on the front side wall of the inner cavity of each placement groove in the first horizontal row through a bearing. A front side clamping plate is fixedly arranged at the rear end of the front rotating rod. The rear side wall of the inner cavity of each placement groove in the last horizontal row is rotatably penetrated through by a rear rotating rod through a bearing. A first spline groove is concavely opened at the front end of the rear rotating rod. A first spline rod is slidably arranged in the groove of the first spline groove in a fitting manner. An annular first limiting plate is convexly arranged on the outer side of the rod body of the rear rotating rod. A first spring parallel to the first spline rod is fixedly arranged on the front side wall of the first limiting plate. A rear side clamping plate is fixedly arranged at the rear end of the first spring. The side wall of the rear side clamping plate is fixedly connected to the end of the first spline rod. The front and rear side walls of the inner cavity of each placement groove in the remaining horizontal rows are rotatably penetrated through by a middle rotating rod through a bearing. A first middle clamping plate is fixedly arranged at the rear end of the rear rotating rod. A second spline groove is concavely opened at the front end of the middle rotating rod. A second spline rod is slidably arranged in the groove of the second spline groove in a fitting manner. An annular second limiting plate is convexly arranged on the outer side of the rod body of the middle rotating rod. A second spring parallel to the second spline rod is fixedly arranged on the front side wall of the second limiting plate. A second middle clamping plate is fixedly arranged at the rear end of the second spring. The side wall of the second middle clamping plate is fixedly connected to the end of the second spline rod.

[0008] The driving mechanism is arranged on the rear side wall of the placement table and is used to drive all the clamped chips to flip by 90 degrees.

[0009] As a preferred scheme of a post-packaging semiconductor chip rapid testing device according to the present invention, wherein: a connecting plate is fixedly arranged at the rear of the placement table on the top of the testing table. A detection plate is arranged to be lifted on the front side of the connecting plate. The detection plate is located above the placement table.

[0010] As a preferred scheme of a post-packaging semiconductor chip rapid testing device according to the present invention, wherein: the front side clamping plate, the second middle clamping plate, the first middle clamping plate and the rear side clamping plate have the same shape. The side view cross-section is in the shape of a "匚" character and a mirror-image "匚" character, and the upper and lower edges are arranged with arc transitions.

[0011] As a preferred scheme of a post-packaging semiconductor chip rapid testing device according to the present invention, wherein: the driving mechanism includes a worm gear fixed to the rear end of each rear rotating rod. All the worm gears are in the same vertical plane. A plurality of brackets are fixedly arranged on the top of the testing table. A driving rod is rotatably penetrated through the side wall of the bracket. A worm meshing with the worm gear is fixedly arranged on the rod body of the driving rod. A servo reduction motor is fixedly arranged on the top of the testing table. The output shaft of the servo reduction motor is fixedly connected to the end of the driving rod through a coupling.

[0012] As a preferred solution of a post-packaged semiconductor chip rapid testing device described in the utility model, wherein: the top of the test table is located on the rear side wall of the placement table and a storage shell is fixedly provided, and the inner cavity of the storage shell accommodates the worm gear, bracket, drive rod, worm and servo reduction motor.

[0013] The beneficial effect of the utility model is as follows: the chips to be tested are placed one by one in the inner cavity of the placement groove, and the chip can be clamped in the middle between the front and rear clamping plates along the arc transition. The spring pushes the clamping plates to clamp the front and rear sides of the chip, and the spline rod moves along the front and rear directions of the spline groove. The height of the detection plate is adjusted to detect one side of the chip. After the detection is completed, the detection plate is reset, and the servo reduction motor is started to drive the drive rod to rotate, and all the rear rotating rods are driven to rotate through the worm and worm gear, and the first spline groove can drive the first spline rod and the rear clamping plate to rotate. At this time, the rear clamping plate can drive the first middle clamping plate and the middle transfer rod to rotate through the chip, and drive all the chips to rotate in turn, thereby realizing the turning over of the chip. Finally, the other side of the chip is detected by adjusting the height of the detection plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 For this utility model Figure 1 A schematic diagram of the structure in a side view direction;

[0017] Figure 3 It is a structural schematic diagram of the utility model placing table and other components;

[0018] Figure 4 For this utility model Figure 3 Schematic diagram of the structure from a top-down perspective;

[0019] Figure 5 It is a structural schematic diagram of the clamping mechanism and the driving mechanism of the utility model;

[0020] Figure 6 It is an exploded view of the first spline groove, the first spline rod, the first spring and the rear side clamping plate of the utility model;

[0021] Figure 7It is an exploded view of the second spline groove, the first and second spline rods, the second spring and the second middle clamping plate of the utility model.

[0022] In the figure: test bench 100, placement table 101, placement slot 102, connecting plate 103, detection plate 104, clamping mechanism 200, front rotating rod 201, front side clamping plate 202, rear rotating rod 203, first spline groove 204, first spline rod 205, rear side clamping plate 206, first limit plate 207, first spring 208, transfer rod 209, first middle clamping plate 210, second spline groove 211, second spline rod 212, second middle clamping plate 213, second limit plate 214, second spring 215, driving mechanism 300, worm gear 301, bracket 302, driving rod 303, worm 304, servo reduction motor 305, storage shell 306. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0024] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0025] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0026] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0027] See also Figure 1-Figure 7 , which shows a schematic diagram of the structure of a packaged semiconductor chip rapid testing device implementation method of the utility model, please refer to Figure 1-Figure 7 , a fast testing equipment for packaged semiconductor chips is introduced in detail.

[0028] A fast testing device for semiconductor chips after packaging, comprising a testing platform 100, a clamping mechanism 200 and a driving mechanism 300, wherein a placing platform 101 is fixedly arranged on the top of the testing platform 100, and a plurality of placing slots 102 for placing chips are arranged in an array on the top of the placing platform 101;

[0029] The clamping mechanism 200 is arranged in the placement slot 102 for clamping the front and rear sides of the chip. The clamping mechanism 200 includes a front rotating rod 201 which is rotatably arranged on the front side wall of the inner cavity of each placement slot 102 in the first horizontal row through a bearing, and a front side clamping plate 202 is fixedly arranged at the rear end of the front rotating rod 201;

[0030] A rear rotating rod 203 is provided on the rear side wall of the inner cavity of each placement slot 102 of the last horizontal row through a bearing for rotation. A first spline groove 204 is provided in the front end of the rear rotating rod 203. A first spline rod 205 is provided in the groove of the first spline groove 204 for sliding fit. A first annular limiting plate 207 is provided on the outer side of the rod body of the rear rotating rod 203. A first spring 208 parallel to the first spline rod 205 is fixedly provided on the front side wall of the first limiting plate 207. A rear side clamping plate 206 is fixedly provided on the rear end of the first spring 208. The side wall of the rear side clamping plate 206 is fixedly connected to the end of the first spline rod 205.

[0031] A transfer rod 209 is provided on the front and rear side walls of the inner cavity of each of the placement slots 102 in the remaining horizontal rows so as to be rotatably penetrated by a bearing, a first middle clamping plate 210 is fixedly provided on the rear end of the rear rotating rod 203, a second spline groove 211 is provided inwardly at the front end of the transfer rod 209, a second spline rod 212 is provided in the groove of the second spline groove 211 to fit and slide, a second annular limiting plate 214 is provided protrudingly on the outer side of the rod body of the transfer rod 209, a second spring 215 parallel to the second spline rod 212 is fixedly provided on the front side wall of the second limiting plate 214, a second middle clamping plate 213 is fixedly provided on the rear end of the second spring 215, and a side wall of the second middle clamping plate 213 is fixedly connected to the end of the second spline rod 212;

[0032] The driving mechanism 300 is disposed on the rear side wall of the placement platform 101 to drive all the clamped chips to flip 90 degrees.

[0033] Furthermore, a connecting plate 103 is fixedly installed on the top of the test bench 100 behind the placement table 101, and a detection plate 104 is lifted and lowered on the front side of the connecting plate 103. The detection plate 104 is located above the placement table 101, and a detection block is provided at the bottom of the detection plate 104 corresponding to the placement groove 102. The lifting method of the detection plate 104 can refer to the relevant content in the existing public patent authorization announcement number CN221281158U, which discloses a post-package semiconductor chip rapid testing device, and will not be elaborated here.

[0034] Furthermore, the front clamping plate 202, the second middle clamping plate 213, the first middle clamping plate 210 and the rear clamping plate 206 have the same shape. The cross-section in side view is in the shape of a "匚" and its mirror image "匚", and the upper and lower edges are provided with arc transitions, so that the chip can be clamped in the middle of the clamping plates along the arc transition.

[0035] Furthermore, the driving mechanism 300 includes worm wheels 301 fixed to the rear ends of each rear rotating rod 203. All the worm wheels 301 are in the same vertical plane. A plurality of brackets 302 are fixedly arranged on the top of the test bench 100. A driving rod 303 is rotatably penetrated through the side wall of the bracket 302 through a bearing. A worm 304 meshing with the worm wheel 301 is fixedly arranged on the rod body of the driving rod 303. A servo reduction motor 305 is fixedly arranged on the top of the test bench 100. The output shaft of the servo reduction motor 305 is fixedly connected to the end of the driving rod 303 through a coupling. Starting the servo reduction motor 305 drives the driving rod 303 to rotate, and drives all the rear rotating rods 203 to rotate through the worm 304 and the worm wheel 301.

[0036] Furthermore, a storage case 306 is fixedly arranged on the top of the test bench 100 at the rear side wall of the placement table 101. The inner cavity of the storage case 306 stores the worm wheels 301, the brackets 302, the driving rods 303, the worms 304 and the servo reduction motor 305. The storage case 306 only serves as a storage component and will not affect any moving components.

[0037] In the specific use process, the chips to be tested are placed into the inner cavity of the placement grooves 102 one by one. The chips can be clamped in the middle between the front and rear clamping plates along the arc transition. The springs push the clamping plates to clamp the front and rear sides of the chips. The spline rod moves back and forth along the spline groove to adjust the height of the detection plate 104 to detect one side of the chip. After the detection is completed, the detection plate 104 resets. Then, the servo reduction motor 305 is started to drive the driving rod 303 to rotate, and drives all the rear rotating rods 203 to rotate through the worm 304 and the worm wheel 301. The first spline groove 204 can drive the first spline rod 205 and the rear clamping plate 206 to rotate. At this time, the rear clamping plate 206 can drive the first middle clamping plate 210 and the middle rotating rod 209 to rotate through the chip, and drive all the chips to rotate in turn, so as to realize turning over the chips. Finally, the height of the detection plate 104 is adjusted again to detect the other side of the chips.

[0038] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A packaged semiconductor chip rapid testing device, comprising a testing platform (100), a clamping mechanism (200) and a driving mechanism (300), characterized in that: A placement table (101) is fixedly arranged on the top of the test bench (100), and a plurality of placement grooves (102) for placing chips are arranged in an array on the top of the placement table (101); The clamping mechanism (200) is arranged in the placement groove (102) for clamping the front and rear sides of the chip. The clamping mechanism (200) includes a front rotating rod (201) rotatably arranged on the front side wall of the inner cavity of each placement groove (102) in the first horizontal row through a bearing. A front side clamping plate (202) is fixedly arranged at the rear end of the front rotating rod (201); A rear rotating rod (203) is rotatably arranged through the rear side wall of the inner cavity of each placement groove (102) in the last horizontal row through a bearing. A first spline groove (204) is concavely arranged at the front end of the rear rotating rod (203). A first spline rod (205) is slidably arranged in the groove of the first spline groove (204) in a fitting manner. An annular first limiting plate (207) is convexly arranged on the outer side of the rod body of the rear rotating rod (203). A first spring (208) parallel to the first spline rod (205) is fixedly arranged on the front side wall of the first limiting plate (207). A rear side clamping plate (206) is fixedly arranged at the rear end of the first spring (208). The side wall of the rear side clamping plate (206) is fixedly connected to the end of the first spline rod (205); Intermediate rotating rods (209) are rotatably arranged through the front and rear side walls of the inner cavity of each placement groove (102) in the remaining horizontal rows through bearings. A first middle clamping plate (210) is fixedly arranged at the rear end of the rear rotating rod (203). A second spline groove (211) is concavely arranged at the front end of the intermediate rotating rod (209). A second spline rod (212) is slidably arranged in the groove of the second spline groove (211) in a fitting manner. An annular second limiting plate (214) is convexly arranged on the outer side of the rod body of the intermediate rotating rod (209). A second spring (215) parallel to the second spline rod (212) is fixedly arranged on the front side wall of the second limiting plate (214). A second middle clamping plate (213) is fixedly arranged at the rear end of the second spring (215). The side wall of the second middle clamping plate (213) is fixedly connected to the end of the second spline rod (212); The driving mechanism (300) is arranged on the rear side wall of the placement table (101) for driving all the clamped chips to be flipped by 90 degrees.

2. The fast testing device for packaged semiconductor chips according to claim 1, characterized in that: A connecting plate (103) is fixedly arranged on the top of the test bench (100) behind the placement table (101). A detection plate (104) is arranged to be lifted on the front side of the connecting plate (103). The detection plate (104) is located above the placement table (101).

3. The fast testing device for packaged semiconductor chips according to claim 1, characterized in that: The front side clamping plate (202), the second middle clamping plate (213), the first middle clamping plate (210) and the rear side clamping plate (206) have the same shape, and the side view cross-section is in the shape of a "匚" and a mirrored "匚", and the upper and lower edges are arranged with arc transitions.

4. The fast testing device for packaged semiconductor chips according to claim 1, characterized in that: The driving mechanism (300) comprises a worm wheel (301) fixed to the rear end of each rear rotating rod (203), all of the worm wheels (301) are located on the same vertical plane, a plurality of brackets (302) are fixedly arranged on the top of the test bench (100), a driving rod (303) is rotatably penetrated through the side wall of the bracket (302) via a bearing, a worm (304) meshing with the worm wheel (301) is fixedly arranged on the rod body of the driving rod (303), and a servo reduction motor (305) is fixedly arranged on the top of the test bench (100), and an output shaft of the servo reduction motor (305) is fixedly connected to the end of the driving rod (303) via a coupling.

5. The fast testing device for packaged semiconductor chips according to claim 4, characterized in that: A storage shell (306) is fixedly provided on the top of the test bench (100) and located on the rear side wall of the placement table (101); the inner cavity of the storage shell (306) stores the worm wheel (301), the bracket (302), the driving rod (303), the worm (304) and the servo reduction motor (305).

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