Optical assembly, optical module, optical module group and optical communication equipment

Abstract

The embodiment of the utility model provides an optical assembly, an optical module, an optical module group and optical communication equipment, and the electric connector of the optical assembly is directly used for realizing continuous link impedance, thereby improving the signal rate supported by the optical assembly, reducing the complexity of a manufacturing process, and improving the integration level of the optical assembly. The optical assembly comprises a mounting base, a first grounding piece, a first electric connecting piece and an optical chip, the mounting base fixes the first grounding piece, the first electric connecting piece and the optical chip, a gap is formed between the first grounding piece and the first electric connecting piece, and the first grounding piece is used for grounding; the first electric connecting piece comprises a first sub-piece and a second sub-piece which are connected in sequence, the first sub-piece is electrically connected with the optical chip, a first transition section is arranged between the first sub-piece and the second sub-piece, and the outer side wall of the first transition section is smoothly connected between the outer side wall of the first sub-piece and the outer side wall of the second sub-piece.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical component, an optical module, an optical module and an optical communication device. Background Art

[0002] Broadband access technology has developed rapidly in recent years, and passive optical networks (PON) have been widely popularized and rapidly expanded. As user data demand continues to increase dramatically, 10 Gigabit (G) PON has entered the large-scale deployment stage, and the next generation of PON system standards (such as 50G PON and higher speed PON standards) are also being gradually formulated and improved.

[0003] PON includes optical modules for implementing photoelectric conversion. Figure 1 The following is an example diagram of an existing optical module structure. Figure 1 The optical module shown includes an optical component and a circuit board 110. The optical component is packaged in a box (BOX). The optical component includes a box body 101, and an optical chip 102 is packaged inside the box body 101. Specifically, the optical chip 102 is packaged on a substrate 103 through a chip on carrier (COC). The box body 101 also includes a high-frequency substrate 104, and a plurality of pin (PIN) needles 105 are connected to the high-frequency substrate 104. The plurality of PIN needles 105 pass through the box body 101 and are electrically connected to the circuit board 110. The high-frequency substrate 104 is plated with a conductive pattern. The change in the shape of the conductive pattern can improve the continuity of the link impedance between the optical chip 102 and the circuit board 110, thereby improving the rate supported by the optical module.

[0004] However, the manufacturing process of the high-frequency substrate 104 is complicated, which reduces the manufacturing efficiency of the optical module. In addition, the optical module includes an additional high-frequency substrate 104, which reduces the integration of the optical module. Summary of the invention

[0005] The embodiments of the present application provide an optical component, an optical module, an optical module and an optical communication device. The electrical connector included in the optical component is directly used to achieve link impedance continuity, thereby improving the signal rate supported by the optical component, reducing the complexity of the manufacturing process, and improving the integration of the optical component.

[0006] In a first aspect, an embodiment of the present application provides an optical component, including a mounting seat, a first grounding member, a first electrical connector, and an optical chip. The mounting seat fixes the first grounding member, the first electrical connector, and the optical chip. There is a gap between the first grounding member and the first electrical connector, so as to achieve mutual insulation. The first grounding member is used for grounding. For example, the first grounding member is integrally formed with the mounting seat. For another example, the first grounding member is processed by welding, bonding, mechanical connection, etc. for the mounting seat. The first electrical connector includes a first sub-member and a second sub-member connected in sequence. The first sub-member is electrically connected to the optical chip. There is a first transition section between the first sub-member and the second sub-member. The outer side wall of the first transition section is smoothly connected between the outer side wall of the first sub-member and the outer side wall of the second sub-member, so that the outer side wall of the first transition section is in a smooth and continuous structure without sharp corners, sudden protrusions, etc. For example, the outer wall of the first transition section between the first sub-component and the second sub-component is in a straight line, an arc or a curved structure along the extension direction of the first electrical connector, so as to achieve smooth transition between the outer wall of the first sub-component and the outer wall of the second sub-component.

[0007] According to the present aspect, the first electrical connector includes the first transition section outer wall which is smoothly connected between the first sub-component outer wall and the second sub-component outer wall, so that the structural continuity between the first sub-component and the second sub-component is ensured, and the mutation between the outer wall of the first sub-component and the outer wall of the second sub-component is avoided, thereby ensuring that the first electrical connector can achieve link impedance continuity. When the signal is transmitted through the first electrical connector, the impedance value encountered by the signal remains relatively stable without a sharp change, effectively reducing signal reflection and loss, maintaining the amplitude and intensity of the signal, thereby improving the efficiency and accuracy of signal transmission, improving the communication quality and the reliability of the optical component. Moreover, when the first electrical connector transmits a high-speed signal, the stable impedance value helps to reduce the fluctuation caused by impedance change and improve the stability of signal transmission. Then, the retransmission and delay caused by transmission errors are effectively reduced, so that the optical component can support the transmission of high-speed signals and meet the requirements of the increasing data transmission rate. Moreover, the optical component does not need to use a high-frequency substrate for achieving link impedance continuity, which effectively reduces the complexity of the manufacturing process of the optical component, reduces the manufacturing efficiency, and improves the integration of the optical component.

[0008] Based on the first aspect, in an optional implementation, along the extension direction of the first electrical connector, the first transition section includes N sub-segments arranged in sequence, where N is any integer greater than 1, the first end of the first sub-component has a first length, and the first end of the first sub-component is connected to the first transition section, the second end of the second sub-component has a second length, and the second end of the second sub-component is connected to the first transition section, and if the first length is greater than the second length, the lengths of the N sub-segments decrease in sequence.

[0009] With this implementation, the outer wall of the first transition section included in the first electrical connector is smoothly connected between the outer wall of the first sub-component and the outer wall of the second sub-component. Thus, structural continuity between the first sub-component and the second sub-component is ensured, and mutations between the outer wall of the first sub-component and the outer wall of the second sub-component are avoided, thereby ensuring that the first electrical connector can achieve link impedance continuity.

[0010] Based on the first aspect, in an optional implementation, along the extension direction of the first electrical connector, the first transition section includes N sub-segments arranged in sequence, where N is any integer greater than 1, the first end of the first sub-component has a first length, and the first end of the first sub-component is connected to the first transition section, the second end of the second sub-component has a second length, and the second end of the second sub-component is connected to the first transition section, and if the first length is less than the second length, the lengths of the N sub-segments increase in sequence.

[0011] With this implementation, the outer wall of the first transition section included in the first electrical connector is smoothly connected between the outer wall of the first sub-component and the outer wall of the second sub-component. Thus, structural continuity between the first sub-component and the second sub-component is ensured, and mutations between the outer wall of the first sub-component and the outer wall of the second sub-component are avoided, thereby ensuring that the first electrical connector can achieve link impedance continuity.

[0012] Based on the first aspect, in an optional implementation, the first electrical connector also includes a third sub-component, the second sub-component is connected between the first sub-component and the third sub-component, the size of the third sub-component is reduced relative to the size of the second sub-component, and the third sub-component passes through the mounting seat.

[0013] By adopting this implementation method, the first electrical connector can be successfully electrically connected to the circuit board of the optical module, and link impedance continuity can be achieved. Therefore, the optical component does not need to adopt a high-frequency substrate for achieving link impedance continuity, which effectively reduces the complexity of the manufacturing process of the optical component, reduces manufacturing efficiency, and improves the integration of the optical component.

[0014] Based on the first aspect, in an optional implementation, the second sub-component is coaxial with the third sub-component, a second transition section is provided between the second sub-component and the third sub-component, and an outer side wall of the second transition section is smoothly connected between the outer side wall of the second sub-component and the outer side wall of the third sub-component.

[0015] By adopting this implementation method, the first electrical connector can achieve link impedance continuity. Therefore, the optical component does not need to use a high-frequency substrate for achieving link impedance continuity, which effectively reduces the manufacturing process complexity of the optical component, reduces manufacturing efficiency, and improves the integration of the optical component.

[0016] Based on the first aspect, in an optional implementation manner, the first sub-component extends in a direction approaching the first grounding component to form a conductive protrusion.

[0017] By adopting this implementation method, the conductive protrusion can shorten the distance between the first electrical connector and the first grounding member, thereby shortening the distance between the first electrical connector and the first grounding member. Then, the length of the ground return path is shortened, which can effectively reduce the impedance discontinuity during signal transmission, thereby improving the transmission quality of the signal, improving the transmission efficiency, and helping to eliminate the electromagnetic field radiation between signals, thereby reducing the impact of external interference on signal transmission.

[0018] Based on the first aspect, in an optional implementation, the first end of the first grounding member passes through the mounting seat, and the second end of the first grounding member extends in a direction close to the first electrical connector to form a first grounding protrusion.

[0019] By adopting this implementation method, the first grounding protrusion can shorten the distance between the first electrical connector and the first grounding member, thereby shortening the distance between the first electrical connector and the first grounding member. Then, the length of the ground return path is shortened, which can effectively reduce the impedance discontinuity during signal transmission, thereby improving the transmission quality of the signal, improving the transmission efficiency, and helping to eliminate the electromagnetic field radiation between signals, thereby reducing the impact of external interference on signal transmission.

[0020] Based on the first aspect, in an optional implementation, the optical module also includes a second grounding member, the first end of the second grounding member passes through the mounting seat, a first accommodating space is provided between the second end of the first grounding member and the second end of the second grounding member, and the first electrical connector is located inside the first accommodating space.

[0021] With this implementation, the first electrical connector, the second grounding member, and the first electrical connector form a ground-signal-ground GSG pad. The first grounding member and the second grounding member are used for grounding, so a stable reference potential is provided for the first electrical connector. The GSG pad helps to suppress interference and loss of the signal transmitted by the first electrical connector. Moreover, the GSG pad has high reliability, improves the stability of the electrical connection of the first grounding member, the first electrical connector, and the second grounding member, and improves the signal return capability to reduce electromagnetic radiation and improve signal integrity.

[0022] Based on the first aspect, in an optional implementation, the second end of the first grounding member extends to form a first connecting arm, the second end of the second grounding member extends to form a second connecting arm, and the first connecting arm and the second connecting arm are connected to each other.

[0023] By adopting this implementation, the first grounding member and the second grounding member that are in a state of being connected to each other can effectively shorten the ground return path.

[0024] Based on the first aspect, in an optional implementation, the mounting seat also fixes a second electrical connector, and the first electrical connector and the second electrical connector are a pair of differential electrodes; wherein, there is a gap between the first grounding member and the second electrical connector, and the second electrical connector includes a fourth sub-member and a fifth sub-member connected in sequence, the fourth sub-member is electrically connected to the optical chip, and there is a third transition section between the fourth sub-member and the fifth sub-member, and the outer wall of the third transition section is smoothly connected between the outer wall of the fourth sub-member and the outer wall of the fifth sub-member.

[0025] With this implementation, the first electrical connector and the second electrical connector are a pair of differential electrodes, which can reduce the driving voltage of the optical chip in the driving optical component and improve the driving efficiency.

[0026] Based on the first aspect, in an optional implementation, the cross-section of the first sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular, the cross-section of the first sub-component intersects with the mounting surface of the mounting seat, and the first electrical connector passes through the mounting surface.

[0027] By adopting this implementation method, the optical component does not need to use a high-frequency substrate for achieving link impedance continuity, which effectively reduces the complexity of the manufacturing process of the optical component, reduces the manufacturing efficiency, and improves the integration of the optical component.

[0028] Based on the first aspect, in an optional implementation, the cross-section of the second sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular, and the cross-section of the second sub-component is parallel to the radial direction of the second sub-component; the cross-section of the third sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular, and the cross-section of the third sub-component is parallel to the radial direction of the third sub-component.

[0029] By adopting this implementation method, the optical component does not need to use a high-frequency substrate for achieving link impedance continuity, which effectively reduces the complexity of the manufacturing process of the optical component, reduces the manufacturing efficiency, and improves the integration of the optical component.

[0030] Based on the first aspect, in an optional implementation, the mounting seat includes a mounting surface, the mounting surface is the first grounding member, and the first electrical connector passes through the mounting surface.

[0031] By adopting this implementation, the mounting surface is used as the first grounding member, which effectively reduces the number of components included in the optical component and improves the integration of the optical component.

[0032] In a second aspect, an embodiment of the present application provides an optical module, comprising a circuit board and an optical component as described in any one of the first aspects above, wherein the optical component comprises the first grounding member and the first electrical connector, which are electrically connected to the circuit board respectively.

[0033] In the third aspect, an embodiment of the present application provides an optical module, comprising a module body, a routing module and a plurality of optical components, wherein the optical components are as described in any one of the first aspect above; the plurality of optical components are respectively connected at different positions of the module body, the module body has an optical interface, and the routing module located in the module body is used to conduct the optical path between each of the optical components and the optical interface.

[0034] In a fourth aspect, an embodiment of the present application provides an optical communication device, comprising a device board and the optical module as described in the second aspect, wherein the first electrical connector of the optical module is electrically connected to the device board.

[0035] In a fifth aspect, an embodiment of the present application provides an optical module, comprising a plurality of optical communication devices, wherein the optical communication devices are as described in the fourth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is an example diagram of the existing optical module structure;

[0037] Figure 2 A structural example diagram of an optical network;

[0038] Figure 3An example diagram of the overall structure of the first embodiment of the optical assembly provided in this application;

[0039] Figure 4 for Figure 3 An example diagram of the internal structure of an optical component shown;

[0040] Figure 5 for Figure 3 An example diagram of a partial structure of an optical component shown;

[0041] Figure 6 for Figure 5 The side view structure example diagram shown;

[0042] Figure 7 An example diagram of the overall structure of the first electrical connector provided in this application;

[0043] Figure 8a for Figure 7 A side view of the structure of the first electrical connector is shown;

[0044] Figure 8b for Figure 7 The front structural example diagram of the first electrical connector shown;

[0045] Fig. 9 A first exemplary diagram of the first electrical connector provided in the present application electrically connecting an optical chip;

[0046] Fig.10 A partial structural example diagram of the first embodiment of the optical component provided in the present application;

[0047] Fig.11 An example diagram of the internal structure of an optical component provided in this application;

[0048] Fig.12 for Fig.11 An example diagram of the structure of the first grounding member and the second grounding member shown;

[0049] Fig.13 A partial structural example diagram of a second embodiment of the optical assembly provided in the present application;

[0050] Fig.14 A partial structural example diagram of a third embodiment of the optical assembly provided in the present application;

[0051] Fig.15 A second exemplary diagram of the first electrical connector provided in the present application being electrically connected to an optical chip;

[0052] Fig.16 A structural example diagram of a circuit board of an optical module electrically connected to a first electrical connector provided in the present application;

[0053] Fig.17A partial structural example diagram of a fourth embodiment of the optical assembly provided in the present application;

[0054] Fig.18 This is an example diagram of an existing TO package structure;

[0055] Fig.19 A partial structural example diagram of a fifth embodiment of the optical component provided in the present application;

[0056] Fig. 20 This is an example diagram of the structure of an embodiment of the optical module provided in this application. DETAILED DESCRIPTION

[0057] The following will describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0058] Figure 2 This is a structural example diagram of an optical network. For example, the type of the optical network 200 shown in this example is PON. Then, the optical network 200 includes a first optical communication device 201, an optical distribution network (ODN) 210, and at least one second optical communication device 202. The first optical communication device 201 is connected to at least one second optical communication device 202 through ODN210. This example does not limit the number of second optical communication devices 202 included in the optical network. ODN210 includes a passive optical splitter (Splitter), a trunk optical fiber (Feeder) connected between the first optical communication device 201 and the passive optical splitter, and a branch optical fiber (Drop) connected between the second optical communication device 202 and the passive optical splitter.

[0059] The first optical communication device 201 shown in this example is an optical line terminal (OLT), and the second optical communication device 202 can be an optical network unit (ONU) or an optical network terminal (ONT). The first optical communication device 201 is connected to the upper layer network side equipment (such as switches, routers, etc.). The second optical communication device 202 can be connected to the user side equipment. For example, the second optical communication device 202 provides an Ethernet user port or a plain old telephone service (POTS) user port to connect to the user side equipment. It should be clear that Figure 2The description of the optical network type shown is an optional example and is not limited. For example, the optical network can also be applied to an optical transport network (OTN), and the first optical communication device 201 and the second optical communication device 202 are both OTN devices. If the optical network 200 is applied to a wireless mesh network (Mesh), it is also called a multi-hop network. The Mesh includes multiple transmission devices with Mesh functions. The first optical communication device 201 and the second optical communication device 202 are any two connected among multiple transmission devices. The optical network 200 shown in this example can also be applied to data center network (DCN), metropolitan area network, optical access network (OAN), metropolitan area network (MAN), synchronous digital hierarchy (SDH), Gigabit-cpable PON (GPON), Ethernet passive optical network (EPON), evolved GPON (10-Gigabit-capable symmetric passive optical network, XGS-PON), Ethernet, or flexible Ethernet (FlexE), wavelength division multiplexing (WDM) network, etc., any one or more combinations thereof, without specific limitation.

[0060] Taking the first optical communication device 201 as an example, as the optical network application scenario is different, the device type of the first optical communication device 201 may also be different. For example, the first optical communication device 201 may be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., or a computing server (usually referred to as a server), a high performance computer (HPC), a storage server, or a memory resource pool, etc. This example does not limit the type of the first optical communication device 201, as long as the first optical communication device 201 has an electrical-to-optical conversion function and an optical interface that can be connected to an optical fiber. For the description of the type of the second optical communication device 202, please refer to the description of the first optical communication device 201, and the details will not be repeated.

[0061] Taking the first optical communication device 201 as an example, the first optical communication device 201 includes a device board and one or more optical modules. Among them, the optical module can also be referred to as an optoelectronic conversion module, an optical transceiver, an optical transceiver module, etc., which are not specifically limited. This example does not limit the packaging form of the optical module. The packaging form of the optical module can be an optical transceiver board (OTB), a near package optical module (NPO), an on board optical module (OBO) based on optical input and output interface (OIO) technology, a co-package optical module (CPO), a small form-factor pluggable package (SFP), etc. This example does not limit the number of device boards included in the first optical communication device 201. The device board is integrated with the first optical communication device 201, or the device board is an independent pluggable board. This example does not limit the number of optical modules included in the first optical communication device 201. The optical module can be integrated with the device board or pluggable on the device board, etc., and the specific details are not limited. Specifically, the device board has packaged a processor and a connector, and the connector is used to connect the processor and the optical module. Among them, the processor can be one or more chips, or one or more integrated circuits. For example, the processor can be one or more neural network processors (neural processing unit, NPU), optical digital signal processor (optical digital signal processor, oDSP), field programmable gate array (field-programmable gate array, FPGA), application specific integrated circuit (application specific integrated circuit, ASIC), system on chip (system on chip, SoC), central processor unit (central processor unit, CPU), network processor (network processor, NP), microcontroller (microcontroller unit, MCU), programmable logic device (programmable logic device, PLD), network card chip, storage interface chip or other integrated chips. One or more, the specific details are not repeated. The processor has a sending interface and / or a receiving interface, and the sending interface and the receiving interface are respectively connected to the connector. The connector is used to provide an electrical interface, which realizes a pluggable electrical connection with the optical module.The second optical communication device 202 includes a device board and one or more optical modules. For detailed description, please refer to the description of the first optical communication device 201, and detailed description is omitted here.

[0062] Understandably, Figure 2 This is just a schematic diagram. The optical network may also include other devices, such as wavelength division equipment, optical amplifier equipment, more first optical communication equipment, more second optical communication equipment, etc. Figure 2 Not drawn in.

[0063] The embodiment of the present application provides an optical module, which includes a circuit board and an optical component electrically connected to the circuit board, wherein the circuit board may be a printed circuit board (PCB). The PCB has packaged a processor, which is used to perform digital signal processing on the electrical signal to be sent to the optical component, for example, compensation, digital-to-analog conversion, clock recovery, channel compensation, multiple-in multipleout (MIMO) equalization, etc. based on a forward feedback equalizer (FFE) or a continuous time linear equalizer (CTLE). The processor is also used to perform digital signal processing on the optical signal from the optical component, for example, analog-to-digital conversion, timing recovery, signal recovery, polarization, dispersion compensation, etc. It should be clear that this embodiment does not limit the type of digital signal processing performed by the processor. For the description of the type of processor included in the optical module, please refer to the above description of the type of processor included in the device board, and no further details will be given.

[0064] Combination Figure 3 as well as Figure 4 The structure of the optical component provided in this embodiment is described, wherein: Figure 3 This is an example diagram of the overall structure of the first embodiment of the optical component provided in this application. Figure 4 for Figure 3An example diagram of the internal structure of an optical component is shown. Specifically, the optical component shown in this embodiment can be packaged in BOX. It should be clear that the description of the packaging structure of the optical component in this embodiment is an optional example and is not limited. For example, the optical component can also be packaged in transistor outline (TO), surface mounted devices (SMD), dual inline-pin package (DIP), chip scale package (CSP), chip-on-board (COB) and the like. The optical component shown in this embodiment includes a mounting seat 300. It can be understood that since this embodiment takes the BOX packaging of the optical component as an example, the mounting seat 300 is in the shape of a box. The mounting seat 300 includes one or more grounding members, an optical chip and a first electrical connector.

[0065] The present embodiment does not limit the number of grounding members included in the mounting seat 300. For example, the mounting seat 300 extends to form a first grounding member 301. The present embodiment does not limit the formation method of the first grounding member 301. For example, the first grounding member 301 is formed by integral molding of the mounting seat 300. For another example, the first grounding member 301 is formed by welding, bonding, mechanical connection, etc. of the mounting seat 300. The first grounding member 301 is used for grounding. Then, the first grounding member 301 is made of a conductive material, so that the first grounding member 301 forms a good conductive connection with the ground, so that the current can flow back to the ground to ensure the safe use of the optical module. For example, the first grounding member 301 is made of a conductive metal or a conductive alloy. Among them, the conductive metal can be any type of conductive metal such as silver (Ag), copper (Cu), gold (Au), aluminum (Al), iron (Fe), etc., and the conductive alloy can be any type of conductive alloy such as copper alloy, aluminum alloy, nickel-chromium alloy, tungsten alloy, copper-nickel alloy, stainless steel, etc., and is not specifically limited. In this embodiment, the mounting base 300 includes two grounding members as an example. Then, the mounting base 300 includes a first grounding member 301 and a second grounding member 302. For the description of the second grounding member 302, please refer to the description of the first grounding member 301, and the details are not repeated here.

[0066] Combination Figure 5 as well as Figure 6 As shown, the structure of the first electrical connector 303 is described. Figure 5 for Figure 3 An example diagram of a partial structure of an optical component is shown. Figure 6 for Figure 5The side view structure example diagram shown. Among them, the first electrical connector 303 is used to realize the electrical connection between the optical chip included in the optical component and the circuit board included in the optical module. For example, the optical chip can be a laser used to realize the conversion of electrical signals into optical signals. This embodiment does not limit the type of laser. For example, the laser may be a direct modulation laser (DML), an electro-absorption modulated laser (EML), a vertical cavity surface emitting laser (VCSEL), a distributed Bragg reflector (DBR), a Fabry-Perot laser, a distributed feedback laser (distributed feedback laser), a Y-branch modulated laser (modulated grating y-branch, MG-Y laser), a multi-channel interference laser (multi-channel interference, MCI laser), a V-cavity laser, and a chirped sampled grating-distributed feedback laser (chirped sampled grating-distributed reflector laser, CSG-DR laser), etc. For another example, the laser can also adopt the structure of a laser and a modulator, and the modulator can be a Mach-Zehnder modulator (MZM) or a micro-ring modulator (MRM). For another example, the optical chip can be a driver for driving the laser to emit light. For another example, the optical chip can be a monitor photodiode (MPD), a photodiode (positive intrinsic-negative, PIN), an avalanche photo diode (APD) for realizing the conversion of optical signals into electrical signals. For another example, the optical chip can be a trans-impedance amplifier (TIA) for amplifying the power of electrical signals.

[0067] The first electrical connector 303 shown in this embodiment may also be referred to as a PIN needle, etc. As shown above, the first grounding member 301 and the second grounding member 302 included in the optical component are both used for grounding, so there is a gap between the first grounding member 301 and the first electrical connector 303, so as to achieve mutual insulation, and there is a gap between the second grounding member 302 and the first electrical connector 303, so as to achieve mutual insulation. The first end of the first grounding member 301 passes through the mounting surface 400 of the mounting seat 300, and the mounting surface 400 is a surface included in the mounting seat 300. The first end of the second grounding member 302 passes through the mounting surface 400 of the mounting seat 300. In this embodiment, the mounting surface 400 through which the first end of the first grounding member 301 passes and the mounting surface 400 through which the first end of the second grounding member 302 passes are taken as an example, and are the same surface included in the mounting seat 300. In other examples, the mounting surface through which the first end of the first grounding member 301 passes and the mounting surface through which the first end of the second grounding member 302 passes may be different surfaces included in the mounting seat 300. A first accommodation space 500 is provided between the second end of the first grounding member 301 and the second end of the second grounding member 302 shown in this embodiment, and the first electrical connector 303 is located inside the first accommodation space 500. In this embodiment, the relationship between the height of the first electrical connector 303 accommodated in the first accommodation space 500 and the height of the first grounding member 301 is not limited. Among them, the height of the first electrical connector 303 refers to the vertical distance of the first electrical connector 303 relative to the mounting surface 400. The height of the first grounding member 301 refers to the vertical distance of the first grounding member 301 relative to the mounting surface 400. For example, the height of the first electrical connector 303 may be higher than the height of the first grounding member 301. For another example, the height of the first electrical connector 303 may be lower than the height of the first grounding member 301. For another example, the height of the first electrical connector 303 may be equal to the height of the first grounding member 301. This embodiment does not limit the relationship between the height of the first grounding member 301 and the height of the second grounding member 302. For the description of the relationship between the height of the first electrical connector 303 and the height of the second grounding member 302, please refer to the description of the relationship between the height of the first electrical connector 303 and the height of the first grounding member 301, and no further details will be given.

[0068] Combination Figure 7 , Figure 8a as well as Figure 8b The figure illustrates the structure of the first electrical connector, wherein: Figure 7 , Figure 8a as well as Figure 8b 2 is a diagram showing the structure of the first electrical connector from different viewing angles. Figure 7 This is an example diagram of the overall structure of the first electrical connector provided in this application. Figure 8a for Figure 7A side view structural example of the first electrical connector is shown. Figure 8b for Figure 7 The front structure example diagram of the first electrical connector is shown in FIG. The first electrical connector 303 shown in this embodiment includes a first sub-component 701 and a second sub-component 702 connected in sequence, and the first sub-component 701 is electrically connected to the optical chip. This embodiment does not limit the way in which the first sub-component 701 of the first electrical connector 303 is electrically connected to the optical chip. For example, Fig. 9 The first example diagram of the first electrical connector electrically connected to the optical chip provided in the present application. In this example, the optical chip 801 is packaged on the COC substrate 802 through COC. Specifically, the optical chip 801 and the COC substrate 802 can be electrically connected by welding or wire bonding, and the COC substrate 802 and the first sub-component 701 of the first electrical connector 303 can be electrically connected by welding or wire bonding, so as to realize the electrical connection between the optical chip 801 and the first sub-component 701 of the first electrical connector 303. For example, taking the first electrical connector 303 being electrically connected to the COC substrate 802 by wire bonding as an example, then the first electrical connector 303 is electrically connected to the conductive layer 803 of the COC substrate 802 by a bonding wire 812. The bonding wire 812 can be made of gold, copper or other alloys. The first grounding member 301 is electrically connected to the COC substrate 802 through a bonding wire 811 to form a ground return. Similarly, the second grounding member 302 is electrically connected to the COC substrate 802 through a bonding wire 813 to form a ground return. It can be understood that the first electrical connector 303 shown in this embodiment is located between the first grounding member 301 and the second grounding member 302, so the first grounding member 301, the first electrical connector 303 and the second grounding member 302 form a ground-signal-ground (GSG) pad. The first grounding member 301 and the second grounding member 302 are used for grounding, so a stable reference potential is provided for the first electrical connector 303. The electrical connection of the first grounding member 301, the first electrical connector 303 and the second grounding member 302 to the COC substrate 802 based on the GSG pad helps to suppress interference and loss of the signal transmitted by the first electrical connector 303. Moreover, the GSG pad has high reliability, improves the stability of the electrical connection between the first grounding member 301, the first electrical connection member 303, and the second grounding member 302 and the COC substrate 802, and improves the signal reflux capability to reduce electromagnetic radiation and improve signal integrity. For example, if the optical chip is a laser, the laser can receive a driving signal from the circuit board of the optical module through the first electrical connection member 303, thereby emitting an optical signal.

[0069] Combination Figure 1 as well as Fig. 9As shown, it can be seen that the present embodiment does not need to configure a high-frequency substrate electrically connected between the COC substrate 802 and the first electrical connector 303, between the COC substrate 802 and the first grounding member 301, and between the COC substrate 802 and the second grounding member 302 to achieve link impedance continuity, that is, the COC substrate 802 and the first electrical connector 303, between the COC substrate 802 and the first grounding member 301, and between the COC substrate 802 and the second grounding member 302 shown in the present embodiment are all in a state of direct electrical connection. The reason why the present embodiment does not need to configure a high-frequency substrate for achieving link impedance continuity is that the first electrical connector 303 shown in the present embodiment itself can achieve link impedance continuity, as described in detail as follows:

[0070] In the present embodiment, there is a first transition section 721 between the second sub-component 702 and the first sub-component 701, and the outer side wall of the first transition section 721 is smoothly connected between the outer side wall of the first sub-component 701 and the outer side wall of the second sub-component 701. The outer side wall of the first transition section 721 is smoothly connected between the outer side wall of the first sub-component 701 and the outer side wall of the second sub-component 701, so that the outer side wall of the first transition section 721 is in a smooth and continuous structure without sharp corners, sudden protrusions, etc. For example, the outer side wall of the first transition section 721 between the first sub-component 701 and the second sub-component 702 is in a straight line structure, an arc structure or a curved surface structure, etc. along the direction perpendicular to the mounting surface 400. Then, based on the outer side wall of the first transition section 721, the smoothness of the transition between the outer side wall of the first sub-component 701 and the outer side wall of the second sub-component 702 is achieved.

[0071] For example Figure 7 as well as Figure 8b As shown, along the extension direction of the first electrical connector 303 (which may also be a direction perpendicular to the mounting surface 400), the first transition section 721 includes N subsections arranged in sequence, where N is any integer greater than 1. The first end of the first subsection 701 has a first length, and the first end of the first subsection 701 is connected to the first transition section 721. The second end of the second subsection 702 has a second length, and the second end of the second subsection 702 is connected to the first transition section 721. If the first length is greater than the second length, the lengths of the N subsections decrease in sequence.

[0072] Another example Figure 8aAs shown, the first end of the first sub-component 701 has a first length, and the second end of the second sub-component 702 has a second length. If the first length is less than the second length, the lengths of the N sub-segments increase in sequence. It should be clear that this embodiment does not limit the shape of the outer wall of the first transition section 721, as long as the first transition section 721 can achieve a smooth connection between the outer wall of the first sub-component 701 and the outer wall of the second sub-component 701.

[0073] Since the outer wall of the first transition section 721 included in the first electrical connector 303 is smoothly connected between the outer wall of the first sub-component 701 and the outer wall of the second sub-component 701, the structural continuity between the first sub-component 701 and the second sub-component 702 is ensured, and a sudden change between the outer wall of the first sub-component 701 and the outer wall of the second sub-component 702 is avoided, thereby ensuring that the first electrical connector 303 can achieve link impedance continuity.

[0074] The first electrical connector 303 shown in this embodiment also includes a third sub-component 703, and the second sub-component 702 is located between the first sub-component 701 and the third sub-component 703. In this embodiment, the second sub-component 702 and the third sub-component 703 are coaxial as an example, and the second sub-component 702 is a cylindrical structure, and the third sub-component 703 is a cylindrical structure. The second sub-component 702 is coaxial with the third sub-component 703, and the size of the third sub-component 703 is reduced relative to the size of the second sub-component 702. It can be understood that in the case where the second sub-component 702 and the third sub-component 703 are both cylindrical structures, then the cross-section of the second sub-component 702 and the cross-section of the third sub-component 703 are circular structures. The cross-section of the second sub-component 702 is parallel to the radial direction of the second sub-component 702. Among them, the radial direction of the second sub-component 702 refers to the direction starting from the central axis of the second sub-component 702 and pointing to the side of the second sub-component 702 along the radius direction of the second sub-component 702. For the description of the cross section of the third sub-component 703, please refer to the description of the cross section of the second sub-component 702, and no further details are given. In this embodiment, when the size of the third sub-component 703 is reduced relative to the size of the second sub-component 702, it is explained that the radius of the cross section of the second sub-component 702 is greater than the radius of the cross section of the third sub-component 703. It should be clear that the description of the cross-sectional structure of the second sub-component 702 in this embodiment is an optional example, and is not limited. For example, the cross section of the second sub-component 702 may also be rectangular, square, elliptical, diamond, triangular, or irregular. For the description of the cross section of the third sub-component 703, please refer to the description of the cross-sectional structure of the second sub-component 702, and no further details are given. In this embodiment, the shape of the cross section of the second sub-component 701 is the same as the shape of the cross section of the third sub-component 702 (for example, both are circular) as an example. In other examples, the shape of the cross section of the second sub-component 701 may also be different from the shape of the cross section of the third sub-component 702. The third sub-component 703 passes through the mounting surface 400, and the third sub-component 703 can be electrically connected to the PCB included in the optical module. Optionally, there may be a second transition section between the second sub-component 702 and the third sub-component 703 shown in this embodiment, and the outer wall of the second transition section is smoothly connected between the outer wall of the second sub-component 702 and the outer wall of the third sub-component 703. For the description of the second transition section, please refer to the description of the first transition section, and the details are not repeated here.

[0075] As shown above, the first electrical connector 303 shown in this embodiment can achieve the continuity of link impedance. Then, when the signal is transmitted through the first electrical connector 303, the impedance value encountered by the signal remains relatively stable without abrupt changes, effectively reducing signal reflection and loss, maintaining the amplitude and strength of the signal, thereby improving the efficiency and accuracy of signal transmission, and improving the communication quality and reliability of the optical module. Moreover, when the first electrical connector 303 transmits high-speed signals, the stable impedance value helps to reduce the fluctuations caused by impedance changes and improve the stability of signal transmission. Then, the retransmission and delay caused by transmission errors are effectively reduced, so that the optical module can support the transmission of high-speed signals and meet the requirements of the increasing data transmission rate.

[0076] It can be understood that the first electrical connector 303 shown in this embodiment directly has the function of achieving link impedance continuity. Figure 1 As shown, the optical component shown in this embodiment does not need to use a high-frequency substrate for achieving link impedance continuity, which effectively reduces the complexity of the manufacturing process of the optical module, reduces the manufacturing efficiency, and improves the integration of the optical module.

[0077] The first sub-component 701 of the first electrical connector 303 shown in this embodiment extends along the direction close to the first grounding component 301 to form a first conductive protrusion 711, and extends along the direction close to the second grounding component 302 to form a second conductive protrusion 712. The first electrical connector 303 having the first conductive protrusion 711 and the second conductive protrusion 712 can be a rectangular structure as a whole. Then, the cross section of the first sub-component 701 is rectangular. The cross section of the first sub-component 701 intersects with the mounting surface 400. For example, this embodiment takes the cross section of the first sub-component 701 as an example perpendicular to the mounting surface 400. It should be clear that this embodiment does not limit the shape of the cross section of the first sub-component 701. For example, the cross section of the first sub-component 701 can be square, elliptical, circular, rhombus, triangle, irregular shape, etc., and is not specifically limited. The first electrical connector 303 shown in this embodiment extends in a direction close to the first grounding member 301 to form a first conductive protrusion 711, and extends in a direction close to the second grounding member 302 to form a second conductive protrusion 712, so that the distance between the first electrical connector 303 and the first grounding member 301 is effectively shortened, thereby shortening the distance between the first electrical connector 303 and the second grounding member 302, and further shortening the length of the ground return path. Wherein, ground return refers to the current in the first electrical connector 303 flowing through the first grounding member 301 to cause a return phenomenon, and similarly, the current in the first electrical connector 303 flows through the second grounding member 302 to cause a return phenomenon. Because this embodiment effectively shortens the length of the ground return path, it can effectively reduce the impedance discontinuity during signal transmission, thereby improving the transmission quality of the signal, improving the transmission efficiency, and helping to eliminate the electromagnetic field radiation between the signals, thereby reducing the impact of external interference on signal transmission.

[0078] Fig.10 This is a partial structural example diagram of the first embodiment of the optical component provided in this application. Fig.10 The embodiment shown further shortens the return path relative to the above embodiment. The optical component shown in this embodiment includes a mounting base, a first grounding member 1001, a first electrical connection member 1002, a second grounding member 1003 and an optical chip. For the description of the mounting base, the first grounding member 1001, the first electrical connection member 1002, the second grounding member 1003 and the optical chip, please refer to the above embodiment, and the specific description will not be repeated. Fig.10The embodiment shown is different from the above embodiment in that the first end of the first grounding member 1001 shown in this embodiment passes through the mounting surface 1000 of the mounting seat. For the description of the mounting surface, please refer to the above description of the mounting surface 400, and no further details are given. The second end of the first grounding member 1001 extends in a direction close to the first electrical connector 1002 to form a first grounding protrusion 1011. It can be understood that since the first grounding protrusion 1011 is formed by extending in a direction close to the first electrical connector 1002, the first grounding protrusion 1011 can effectively shorten the distance between the first electrical connector 1002 and the first grounding member 1001, thereby shortening the return path between the first electrical connector 1002 and the first grounding member 1001. Similarly, the first end of the second grounding member 1002 passes through the mounting surface 1000 of the mounting seat, and the second end of the second grounding member 1002 extends in a direction close to the first electrical connector 1002 to form a second grounding protrusion 1012. Since the second grounding protrusion 1012 is formed by extending in a direction close to the first electrical connector 1002, the second grounding protrusion 1012 can effectively shorten the distance between the first electrical connector 1002 and the second grounding member 1002, thereby shortening the ground return path between the first electrical connector 1002 and the second grounding member 1002. It should be noted that, in this embodiment, the first grounding member 1001 having the first grounding protrusion and the second grounding member 1002 having the second grounding protrusion are taken as an example. In other examples, only one of the first grounding member 1001 and the second grounding member 1002 may have a grounding protrusion.

[0079] The above embodiment takes the case where the first grounding member and the second grounding member are isolated from each other (ie, there is no connection between the first grounding member and the second grounding member) as an example, and is not limited thereto. Fig.11 as well as Fig.12 As shown, Fig.11 This is an example diagram of the internal structure of the optical component provided in this application. Fig.12 for Fig.11 The optical assembly shown in this embodiment includes a mounting base 1100, a first grounding member 1101, a first electrical connector 1102, a second grounding member 1103 and an optical chip. For the description of the mounting base 1100, the first electrical connector 1102 and the optical chip, please refer to the above embodiment, and the specific description will not be repeated. Fig.11 as well as Fig.12The embodiment shown is different from the above-mentioned embodiment in that the structures of the first grounding member 1101 and the second grounding member 1103 shown in this embodiment are different. Specifically, the first end of the first grounding member 1101 passes through the mounting surface 1200 of the mounting seat 1100. For the description of the mounting surface 1200, please refer to the description of the mounting surface 400 described in the above-mentioned embodiment, and no further details are given. For the specific description of the second grounding member 1103, please refer to the description of the first grounding member 1101 shown in the above-mentioned embodiment, and no further details are given. A first accommodating space 1203 is formed between the second end 1201 of the first grounding member 1101 shown in this embodiment and the second end 1202 of the second grounding member 1103. The first sub-member of the first electrical connector 1102 is located in the first accommodating space 1203. For the description of the first sub-member of the first electrical connector 1102 and the first accommodating space 1203, please refer to the above-mentioned embodiment, and no further details are given. In this embodiment, the second end of the first grounding member 1101 extends to form a first connecting arm 1211, and the second end of the second grounding member 1103 extends to form a second connecting arm 1212, and the first connecting arm 1211 and the second connecting arm 1212 are connected to each other. In this embodiment, the first grounding member 1101 and the second grounding member 1103 in a state of being connected to each other can effectively shorten the ground return path.

[0080] Fig.11 as well as Fig.12 The first connecting arm 1211 and the second connecting arm 1212 are located on the side of the first sub-component of the first electrical connector 1102 as an example. It can be understood that the first accommodating space 1203 is formed between the second end of the first grounding component 1101 and the second end of the second grounding component 1103. This embodiment does not limit the position of the first connecting arm 1211 and the second connecting arm 1212 relative to the first sub-component of the first electrical connector 1102. For example, Fig.13 A partial structural example diagram of the second embodiment of the optical component provided in this application. The optical component shown in this embodiment includes a mounting seat, a first grounding member 1301, a first electrical connector 1302, a second grounding member 1303, and an optical chip. For the description of the mounting seat, the first electrical connector 1302, and the optical chip, please refer to the above embodiment, and no further description will be given. Fig.13The embodiment shown is different from the above embodiment in that the structures of the first grounding member 1301 and the second grounding member 1303 shown in this embodiment are different. Specifically, the first end of the first grounding member 1301 passes through the mounting surface 1300 (not shown in the figure) of the mounting seat. For the description of the mounting surface 1300, please refer to the description of the mounting surface 400 described in the above embodiment, and no further details are given. The first end of the second grounding member 1303 passes through the mounting surface 1300 (not shown in the figure). For the specific description, please refer to the description of the first end of the first grounding member 1101 and the second end of the second grounding member shown in the above embodiment, and no further details are given. The second end 1311 of the first grounding member 1301 shown in this embodiment forms a first connecting arm 1321, and the second end 1312 of the second grounding member 1303 forms a second connecting arm 1322, and the first connecting arm 1321 and the second connecting arm 1322 are connected to each other. Moreover, the first connecting arm 1321 and the second connecting arm 1322 connected to each other shown in this embodiment are located above the first sub-member of the first electrical connector 1302 as an example. Then, a first accommodation space 1330 is formed between the first connecting arm 1321 and the second connecting arm 1322 connected to each other and the mounting surface 1300 as shown in this embodiment, so that the first sub-component of the first electrical connector 1302 is located in the first accommodation space 1330 .

[0081] This embodiment takes the optical component including two grounding members (i.e., the first grounding member and the second grounding member shown above) as an example, without limitation. For example, the optical component may include only one grounding member, and the grounding member is located on one side of the first electrical connector. For the description of the specific structure, please refer to the description of the first grounding member above, and no further elaboration is given. For another example, the optical component shown in this embodiment may include M grounding members, where M is any integer greater than 2. For the description of the structure of each of the M grounding members, please refer to the description of the first grounding member structure above, and no further elaboration is given. Then, the first electrical connector is located between the M grounding members, thereby shortening the electrical return path.

[0082] The above embodiment takes the optical module including a first electrical connector as an example. The optical assembly shown in this embodiment may include two electrical connectors. Fig.14 As shown, Fig.14 This is a partial structural example diagram of the third embodiment of the optical component provided in the present application. The optical component shown in this embodiment includes a mounting seat, a first grounding member 1401, a first electrical connection member 1403, a second electrical connection member 1404, a second grounding member 1402, and an optical chip. For the description of the mounting seat, the first grounding member 1401, the first electrical connection member 1403, the second grounding member 1402, and the optical chip, please refer to the above embodiment, and no further description will be given. Fig.14The embodiment shown in the figure is different from the above embodiment in that the embodiment shown in the figure also includes a second electrical connector 1404 located between the first grounding member 1401 and the second grounding member 1402. It should be clear that the embodiment takes the first electrical connector 1403 and the second electrical connector 1404 located between the first grounding member 1401 and the second grounding member 1402 as an example, and is not limited thereto. As long as the first electrical connector 1403 is located near the first grounding member 1401 and / or the second grounding member 1402, and the second electrical connector 1404 is located near the first grounding member 1401 and / or the second grounding member 1402, the electrical return path can be effectively shortened. There is a gap between the second electrical connector 1404 and the first grounding member 1401, and between the second electrical connector 1404 and the second grounding member 1402 shown in the embodiment, so as to achieve insulation between the second electrical connector 1404 and the first grounding member 1401, and insulation between the second electrical connector 1404 and the second grounding member 1402. The second electrical connector 1404 includes a fourth sub-component and a fifth sub-component connected in sequence, the fourth sub-component is electrically connected to the optical chip, and a third transition section is provided between the fourth sub-component and the fifth sub-component, and the outer side wall of the third transition section is smoothly connected between the outer side wall of the fourth sub-component and the outer side wall of the fifth sub-component. For the description of the third transition section structure, please refer to the above description of the first transition section structure, and no further details are given. For the description of the second electrical connector 1404 structure shown in this embodiment, please refer to the above description of the first electrical connector structure, and no further details are given. The first electrical connector 1403 and the second electrical connector 1404 shown in this embodiment are a pair of differential electrodes, which effectively reduce the driving voltage of the PCB driving the optical chip and improve the efficiency of driving the optical chip. For example, if the optical chip is a laser, the PCB of the optical module applies a first differential electrical signal to the first electrical connector 1403 and applies a second differential electrical signal to the second electrical connector 1404, and the first differential electrical signal and the second differential electrical signal are a pair of differential electrical signals. It can be understood that the PCB reduces the driving voltage for driving the laser to emit light by applying a pair of differential electrical signals to the first electrical connector 1403 and the second electrical connector 1404. For example, if the optical chip is a PD, the PCB of the optical module applies a first differential electrical signal to the first electrical connector 1403 and a second differential electrical signal to the second electrical connector 1404, and the first differential electrical signal and the second differential electrical signal are a pair of differential electrical signals. It can be understood that the PCB applies a pair of differential electrical signals to the first electrical connector 1403 and the second electrical connector 1404, so that the PD can convert the received optical signal into an electrical signal, thereby reducing the driving voltage for driving the PD to perform photoelectric conversion.

[0083] The above embodiment takes the optical chip being electrically connected to the PCB of the optical module through the COC as an example. It should be clear that this embodiment does not limit the manner in which the optical component is electrically connected to the PCB of the optical module. For example, Fig.15 The second example diagram of the first electrical connector electrically connected to the optical chip provided in the present application. The optical assembly shown in this embodiment includes a mounting seat, a first grounding member 1501, a first electrical connector 1502, a second grounding member 1503 and an optical chip. For the description of the mounting seat, the first grounding member 1501, the first electrical connector 1502, the second grounding member 1503 and the optical chip, please refer to the above embodiment, and no further description will be given. Fig.15 The embodiment shown is different from the above-mentioned embodiment in that the optical module shown in this embodiment also includes a substrate 1510. For example, the substrate 1510 can be a ceramic substrate. Specifically, the ceramic substrate is a thin sheet made of ceramic material. The ceramic substrate has a flat surface and is coated with a conductive layer (such as a gold layer, etc.) on the surface to electrically connect the optical chip 1512 and the first electrical connector 1502. The ceramic substrate has excellent insulation properties, high thermal conductivity and high temperature resistance. This embodiment does not limit the type of substrate 1510. For example, the substrate 1510 can also be a plastic packaging substrate, a metal packaging substrate, etc. The conductive layer of the substrate 1510 can be electrically connected to the first electrical connector 1502 by welding, Wire Bonding, etc. This embodiment takes the electrical connection by wire bonding as an example. Then, the first grounding member 1501, the first electrical connector 1502, and the second grounding member 1503 form a GSG pad. For a description of the GSG pad, please refer to Fig. 9 The description of the corresponding GSG pad is not repeated in detail. The optical chip 1510 shown in this embodiment is also electrically connected to the substrate 1510, for example, by welding, wire bonding, etc., which are not specifically limited. Then, the optical chip is electrically connected to the first grounding member 1501, the first electrical connector 1502 and the second grounding member 1503 through the substrate 1510. The optical component shown in this embodiment can include a first electrical connector and a second electrical connector at the same time. For details, please refer to Fig.14 As shown, the details are not repeated here.

[0084] For another example, the first electrical connection member, the first grounding member, and the second grounding member included in the optical component may be directly electrically connected to the optical chip, thereby further improving the integration of the optical module.

[0085] This embodiment does not limit the electrical connection method between the first electrical connector included in the optical component and the PCB of the optical module. For example Fig.16 As shown, Fig.16The structure example diagram of the circuit board of the optical module electrically connected to the first electrical connector provided in the present application. The optical assembly shown in this embodiment includes a mounting seat, a first grounding member 1611, a first electrical connector 1601, a second grounding member 1612 and an optical chip. For the specific description of the mounting seat, the first grounding member 1611, the first electrical connector 1601, the second grounding member 1612 and the optical chip, please refer to any of the above embodiments, and no further description is given. The optical module shown in this embodiment also includes a flexible printed circuit (FPC) 1602. The third sub-component of the first electrical connector 1601 passes through the mounting seat to be electrically connected to the FPC1602, and the FPC1602 is also connected to the PCB of the optical module, so that the electrical connection between the optical module and the PCB is realized. The first grounding member 1611 and the second grounding member 1612 shown in this embodiment can also be electrically connected to the PCB through the FPC1602 to form an electrical return. For the description of the electrical connection, please refer to the description of the first electrical connector 1601 being electrically connected to the PCB through the FPC1602, and no further description is given. The optical assembly shown in this embodiment may include a first electrical connector and a second electrical connector at the same time. For details, see Fig.14 As shown, the details are not repeated here.

[0086] The above embodiment takes the packaging of the optical component as BOX as an example. Fig.17 The package of the optical component is TO package as an example, where: Fig.17 This is a partial structural example diagram of the fourth embodiment of the optical component provided in the present application. Fig.17 The TO package shown includes a mounting base, which specifically includes a TO base 1701 and a TO cap ( Fig.17 The mounting base includes a first grounding member 1702, a first electrical connector 1703, and a second grounding member 1704. For the description of the structures of the first grounding member 1702, the first electrical connector 1703, and the second grounding member 1704, please refer to any of the above embodiments, and no further description is given. The optical assembly shown in this embodiment may include a first electrical connector and a second electrical connector at the same time. For details, please refer to Fig.14 As shown, the details are not repeated here.

[0087] To understand Fig.17 The beneficial effects of the optical module shown, combined with Fig.18 The existing TO package structure shown is described, wherein: Fig.18 This is an example diagram of an existing TO packaging structure. Fig.18The TO package shown includes a TO base 1801, and a PIN pin 1802 is sealed on the TO base 1801 through a glass insulator. The optical chip 1810 is packaged on a substrate 1811 through a COC. In order to increase the signal rate supported by the optical component, the optical component also includes a high-frequency substrate 1803. Both the substrate 1811 and the high-frequency substrate 1803 have a certain height relative to the TO base 1801. The continuity of the link impedance is achieved by the additionally arranged high-frequency substrate 1803. However, the substrate 1811 and the high-frequency substrate 1803 have a certain height, which reduces the integration of the optical component, increases the complexity of the optical component manufacturing process, and reduces the manufacturing efficiency. Fig.17 In the optical module shown, no additional high-frequency substrate is required, and the continuity of link impedance is achieved through the first electrical connector. For the description of how the first electrical connector achieves impedance continuity, please refer to the above embodiment, and the details will not be repeated.

[0088] Fig.19 This is a partial structural example diagram of the fifth embodiment of the optical component provided in the present application. This embodiment takes the optical component as a TO package as an example. Fig.19 The TO package shown includes a mounting seat, which specifically includes a TO base 1901 and a TO cap ( Fig.19 Not shown). The mounting base includes a first electrical connector 1902. For the description of the structure of the first electrical connector 1902, please refer to the above embodiment, and the details will not be repeated here. The TO base 1901 shown in this embodiment serves as a mounting surface, and the third sub-component of the first electrical connector 1902 passes through the TO base 1901. The TO base 1901 shown in this embodiment serves as a first grounding member. For the description of the function of the first grounding member, please refer to the above embodiment, and the details will not be repeated here. The optical chip shown in this embodiment can be mounted on the TO base 1901 in a flat mounting manner. Then, the electrical connection distance between the optical chip and the first sub-component of the first electrical connector is effectively shortened, thereby improving the signal quality. The optical component shown in this embodiment can include a first electrical connector and a second electrical connector at the same time. For details, please refer to Fig.14 As shown, the details are not repeated here.

[0089] The present application also provides an optical module. Fig. 20 This is an example diagram of the structure of an embodiment of the optical module provided in this application. The optical module 2000 shown in this embodiment includes a module body 2001, a routing module (not shown in the figure) and multiple optical components, for example, Fig. 20The example shown includes two optical components, namely, optical component 2011 and optical component 2012. It should be clear that the present embodiment does not limit the number of optical components included in the optical module. The optical component 2011 and the optical component 2012 shown in the present embodiment are respectively connected to different positions of the module body 2001, and the module body has an optical interface 2021, which is used to connect the optical fiber. The routing module located inside the module body 2001 is used to conduct the first optical path between the optical component 2011 and the optical interface 2021, and is also used to conduct the second optical path between the optical component 2012 and the optical interface 2021. For the description of the structure of the optical component 2011 and the optical component 2012 shown in the present embodiment, please refer to the above embodiment, and the specific details will not be repeated. For example, the routing module can be a spectroscopic glass, a filter, etc., so that the optical signal of the first band can be transmitted via the first optical path, and the optical signal of the second band can be transmitted via the second optical path, and the first band is different from the second band.

[0090] The embodiment of the present application also provides an optical module, which includes a circuit board and an optical component electrically connected to the circuit board. For specific details, please refer to the above embodiment and will not be repeated here.

[0091] This embodiment also provides an optical communication device. For a description of the structure of the optical communication device, see Figure 2 The corresponding instructions are not elaborated in detail.

[0092] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical component, characterized in that: It comprises a mounting seat, a first grounding member, a first electrical connection member and an optical chip, wherein the mounting seat fixes the first grounding member, the first electrical connection member and the optical chip, a gap is provided between the first grounding member and the first electrical connection member, and the first grounding member is used for grounding; The first electrical connector includes a first sub-component and a second sub-component connected in sequence, the first sub-component is electrically connected to the optical chip, a first transition section is provided between the first sub-component and the second sub-component, and an outer side wall of the first transition section is smoothly connected between the outer side wall of the first sub-component and the outer side wall of the second sub-component.

2. The optical assembly according to claim 1, characterized in that Along the extension direction of the first electrical connector, the first transition section includes N sub-segments arranged in sequence, where N is any integer greater than 1, the first end of the first sub-component has a first length, and the first end of the first sub-component is connected to the first transition section, the second end of the second sub-component has a second length, and the second end of the second sub-component is connected to the first transition section, and if the first length is greater than the second length, the lengths of the N sub-segments decrease in sequence.

3. The optical assembly according to claim 1, characterized in that: Along the extension direction of the first electrical connector, the first transition section includes N sub-segments arranged in sequence, where N is any integer greater than 1, the first end of the first sub-component has a first length, and the first end of the first sub-component is connected to the first transition section, the second end of the second sub-component has a second length, and the second end of the second sub-component is connected to the first transition section, and if the first length is less than the second length, the lengths of the N sub-segments increase in sequence.

4. The optical assembly according to any one of claims 1 to 3, characterized in that: The first electrical connector also includes a third sub-component. The second sub-component is connected between the first sub-component and the third sub-component. The size of the third sub-component is smaller than that of the second sub-component. The third sub-component passes through the mounting seat.

5. The optical assembly according to claim 4, characterized in that: The second sub-component is coaxial with the third sub-component, a second transition section is provided between the second sub-component and the third sub-component, and an outer side wall of the second transition section is smoothly connected between the outer side wall of the second sub-component and the outer side wall of the third sub-component.

6. The optical assembly according to any one of claims 1 to 3, characterized in that: The first sub-element extends in a direction close to the first grounding element to form a conductive protrusion.

7. The optical assembly according to any one of claims 1 to 3, characterized in that: The first end of the first grounding member passes through the mounting seat, and the second end of the first grounding member extends in a direction close to the first electrical connector to form a first grounding protrusion.

8. The optical assembly according to any one of claims 1 to 3, characterized in that: The optical component also includes a second grounding member, a first end of the second grounding member passes through the mounting seat, a first accommodating space is defined between the second end of the first grounding member and the second end of the second grounding member, and the first electrical connector is located inside the first accommodating space.

9. The optical assembly according to claim 8, characterized in that: The second end of the first grounding member extends to form a first connecting arm, and the second end of the second grounding member extends to form a second connecting arm, and the first connecting arm and the second connecting arm are connected to each other.

10. The optical assembly according to any one of claims 1 to 3, characterized in that: The mounting seat further fixes a second electrical connector, wherein the first electrical connector and the second electrical connector form a pair of differential electrodes; Among them, there is a gap between the first grounding component and the second electrical connecting component, the second electrical connecting component includes a fourth sub-component and a fifth sub-component connected in sequence, the fourth sub-component is electrically connected to the optical chip, and there is a third transition section between the fourth sub-component and the fifth sub-component, and the outer side wall of the third transition section is smoothly connected between the outer side wall of the fourth sub-component and the outer side wall of the fifth sub-component.

11. The optical assembly according to any one of claims 1 to 3, characterized in that: The cross section of the first sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular. The cross section of the first sub-component intersects with the mounting surface of the mounting seat, and the first electrical connector passes through the mounting surface.

12. The optical assembly according to claim 4, characterized in that: The cross-section of the second sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular, and the cross-section of the second sub-component is parallel to the radial direction of the second sub-component. The cross-section of the third sub-component is rectangular, square, elliptical, circular, diamond, triangular, or irregular, and the cross-section of the third sub-component is parallel to the radial direction of the third sub-component.

13. The optical assembly according to any one of claims 1 to 3, characterized in that: The mounting seat includes a mounting surface, the mounting surface is the first grounding member, and the first electrical connection member passes through the mounting surface.

14. An optical module, characterized in that: It comprises a circuit board and the optical component according to any one of claims 1 to 13, wherein the first grounding member and the first electrical connector included in the optical component are electrically connected to the circuit board respectively.

15. An optical module, characterized in that: It comprises a module body, a routing module and a plurality of optical components, wherein the optical components are as claimed in any one of claims 1 to 13; The multiple optical components are respectively connected to different positions of the module body. The module body has an optical interface. The routing module located in the module body is used to conduct the optical path between each of the optical components and the optical interface.

16. An optical communication device, characterized in that: It comprises a device board and the optical module as claimed in claim 14, wherein the first electrical connector of the optical module is electrically connected to the device board.

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