Transparent and invisible RFID tag
By directly making a metal conductive layer divided into antenna area and non-antenna area on a colorless transparent substrate, and using transparent optical glue to protect it, the problem that existing RFID tags require secondary composite occlusion and cannot be performed for text and pattern photocopy is solved, and the design of transparent invisible RFID tags is realized, which is more convenient to use and cost-saving.
Patent Information
- Application Number
- CN202421973981.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-08-14
AI Technical Summary
When making tags, existing RFID tags require secondary composite occlusion antenna pattern design, and the PET film surface cannot be copied in text and pattern, which is inconvenient to use.
A transparent and invisible RFID tag is designed, and a colorless transparent substrate is used as the main substrate. A metal conductive layer is directly made on it. The metal conductive layer is divided into unconnected antenna areas and non-antenna areas, and an antenna circuit pattern and non-antenna circuit patterns are set respectively, and the metal conductive layer is protected by transparent optical glue as an adhesive layer.
It realizes that the antenna circuit pattern design is not directly identified without secondary composite occlusion, and can directly copy text and pattern on the label surface, which is very convenient to use, optimizes the structure of the RFID antenna and saves costs.
Smart Images

Figure CN222883073U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of RFID tag antennas, and more specifically, particularly relates to a transparent and invisible RFID tag. Background Art
[0002] The conventional antenna design adopted by the existing RFID tag industry is to use colorless and transparent PET film as the main base material of the antenna, glue aluminum foil to the PET film with glue, and then make the antenna through printing, etching and other processes. However, when such antennas are made into labels, in order to ensure that the antenna pattern design is not directly recognized, it is necessary to use coated paper or other materials for secondary compounding to block it. In addition, the surface of the PET film cannot be photocopied with text and patterns, and paper materials or other materials must be used for photocopying before use. Therefore, there are many inconveniences in the use of existing RFID tags. Utility Model Content
[0003] The utility model provides a transparent invisible RFID tag to solve the problems raised in the above background technology. To achieve the above purpose, the utility model provides the following technical solutions: a transparent invisible RFID tag, including a main substrate, a metal conductive layer and an adhesive layer;
[0004] The main substrate is a colorless and transparent substrate, and the metal conductive layer is a metal grid structure, which is composed of a plurality of metal fine wires;
[0005] The metal conductive layer includes an antenna area and a non-antenna area. The antenna area is provided with an antenna circuit pattern, the non-antenna area is provided with a non-antenna circuit pattern, and the antenna area is not connected to the non-antenna area.
[0006] Preferably, the metal conductive layer is in a rectangular structure, wherein the antenna area is located at a corner of the rectangular structure, and the remaining area is a non-antenna area.
[0007] Preferably, the antenna circuit pattern and the non-antenna circuit pattern have the same pattern.
[0008] Preferably, the material of the main substrate includes but is not limited to PET, COP or CPI.
[0009] Preferably, the thickness of the main substrate includes but is not limited to 50um, 100um or 125um.
[0010] Preferably, the material of the metal conductive layer includes but is not limited to gold, silver or copper.
[0011] Preferably, the thickness of the metal conductive layer is 2-10 um.
[0012] Preferably, the adhesive layer is a transparent optical adhesive with a thickness less than or equal to 125 um.
[0013] Preferably, the metal conductive layer is manufactured on the surface of the main substrate by an additive method or an etching subtractive process.
[0014] Preferably, the line width of the metal fine wire is less than 15um, and the line spacing is greater than 100um.
[0015] Compared with the prior art, the utility model has the following beneficial effects: the utility model has a reasonable design and a simple structure. The metal conductive layer is directly made on a colorless and transparent main substrate, and then the metal conductive layer is protected by an adhesive layer; the metal conductive layer is divided into an unconnected antenna area and a non-antenna area and an antenna circuit pattern and a non-antenna circuit pattern are respectively arranged, so that the antenna circuit pattern design can be protected from being directly recognized without secondary composite shielding, and text and pattern photocopying can be directly performed on its surface, which is very convenient to use. The utility model optimizes the structure of the RFID antenna, can protect the antenna pattern design from being directly recognized, makes it easy to print various patterns on the antenna surface, and maintains performance, saving costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic structural diagram of a transparent invisible RFID tag according to an embodiment of the utility model;
[0017] Figure 2 A cross-sectional view of a transparent invisible RFID tag according to an embodiment of the present utility model;
[0018] Figure 3 This is a schematic diagram of the metal conductive layer structure of a transparent invisible RFID tag according to an embodiment of the utility model;
[0019] exist Figures 1 to 3 In the figure, the corresponding relationship between the names of the components and the numbers of the drawings is as follows:
[0020] 1--main substrate, 2--metal conductive layer, 21--metal fine wire, 22--antenna area, 23--non-antenna area, 3--adhesive layer. DETAILED DESCRIPTION
[0021] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.
[0022] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] Please refer to Figures 1 to 3 The utility model provides a transparent invisible RFID tag, comprising a main substrate 1, a metal conductive layer 2 and an adhesive layer 3;
[0025] The main substrate 1 is a colorless and transparent substrate, and the metal conductive layer 2 is a metal grid structure, which is composed of a plurality of metal fine wires 21;
[0026] The metal conductive layer 2 includes an antenna area 22 and a non-antenna area 23 . The antenna area 22 is provided with an antenna circuit pattern, and the non-antenna area 23 is provided with a non-antenna circuit pattern. The antenna area 22 and the non-antenna area 23 are not connected.
[0027] In the embodiment of the utility model, the label is composed of a three-layer structure, including a main substrate 1, a metal conductive layer 2 and an adhesive layer 33, wherein the metal conductive layer 2 includes an antenna area 22 and a non-antenna area 23, and the antenna area 22 and the non-antenna area 23 are both provided with corresponding circuit patterns, so that the pattern of the entire metal conductive layer 2 is consistent, which can protect the antenna pattern design from being directly recognized. The adhesive layer 3 can select a transparent optical glue to ensure the transparency of the label sample and protect the metal conductive layer 2.
[0028] In this embodiment, the antenna circuit pattern and the non-antenna circuit pattern in the metal conductive layer 2 are both composed of metal fine wires 21. In order to achieve a transparent effect, this embodiment strictly controls the line width of the metal fine wires 21 and the spacing between adjacent metal fine wires 21, thereby improving the visual invisibility of the metal fine wires 21. The light transmittance of the manufactured label is high, so that the label achieves a transparent visual effect.
[0029] Preferably, the metal conductive layer 2 is in a rectangular structure, wherein the antenna area 22 is located at a corner of the rectangular structure, and the remaining area is a non-antenna area 23. In this embodiment, the RFID tag adopts a rectangular structure design, and the antenna area 22 is set at a corner of the rectangular structure. The antenna area 22 is also designed as a rectangle, and the remaining area of the rectangular structure is the non-antenna area 23. Through the above structural design, the antenna area 22 is set at the corner, which is convenient for the layout of the internal chip, ensuring that the antenna area 22 has good signal strength and receiving sensitivity, and at the same time makes the non-antenna area 23 and the antenna area 22 integrated.
[0030] Preferably, the antenna circuit pattern is the same as the non-antenna circuit pattern. Through the above structural design, the non-antenna area 23 has the same pattern as the antenna area 22, and the two can be well integrated, so that the tag does not need secondary composite shielding to protect the antenna pattern design from being directly recognized.
[0031] Preferably, the material of the main substrate 1 includes but is not limited to PET, COP or CPI.
[0032] Preferably, the thickness of the main substrate 1 includes but is not limited to 50um, 100um or 125um. In this embodiment, the main substrate 1 is a colorless transparent substrate, including but not limited to transparent media such as PET, COP, CPI, etc., and the thickness generally includes but is not limited to conventional sizes such as 50um, 100um, 125um, etc.
[0033] Preferably, the material of the metal conductive layer 2 includes but is not limited to gold, silver or copper.
[0034] Preferably, the thickness of the metal conductive layer 2 is 2-10 um.
[0035] Preferably, the adhesive layer 3 is a transparent optical adhesive with a thickness less than or equal to 125um. In this embodiment, the adhesive layer 3 can be a transparent optical adhesive, including but not limited to OCA, PVB, etc., with a thickness of ≤125um to ensure the transparency of the label sample and effectively protect the metal conductive layer 2.
[0036] Preferably, the metal conductive layer 2 is made on the surface of the main substrate 1 by an additive method or an etching subtractive process. In this embodiment, the metal conductive layer 2 can be made into transparent antenna area 22 and non-antenna area 23 grid lines at one time by an additive method or an etching subtractive process.
[0037] Preferably, the line width of the metal thin wire 21 is less than 15 um, and the line distance is greater than 100 um. In this embodiment, the line width and line distance of the metal thin wire 21 are controlled within a certain range to ensure the invisibility of the antenna.
[0038] Compared with the prior art, the utility model has the following beneficial effects: the utility model has a reasonable design and a simple structure. The metal conductive layer is directly made on a colorless and transparent main substrate, and then the metal conductive layer is protected by an adhesive layer; the metal conductive layer is divided into an unconnected antenna area and a non-antenna area and an antenna circuit pattern and a non-antenna circuit pattern are respectively arranged, so that the antenna circuit pattern design can be protected from being directly recognized without secondary composite shielding, and text and pattern photocopying can be directly performed on its surface, which is very convenient to use. The utility model optimizes the structure of the RFID antenna, can protect the antenna pattern design from being directly recognized, makes it easy to print various patterns on the antenna surface, and maintains performance, saving costs.
[0039] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. A transparent invisible RFID tag, characterized in that: It comprises a main substrate (1), a metal conductive layer (2) and an adhesive layer (3); The main substrate is a colorless and transparent substrate, and the metal conductive layer is a metal grid structure, which is composed of a plurality of metal fine wires (21); The metal conductive layer comprises an antenna area (22) and a non-antenna area (23), the antenna area is provided with an antenna circuit pattern, the non-antenna area is provided with a non-antenna circuit pattern, and the antenna area is not connected to the non-antenna area.
2. The transparent invisible RFID tag according to claim 1, characterized in that: The metal conductive layer is in a rectangular structure, wherein the antenna area is located at a corner of the rectangular structure, and the remaining area is a non-antenna area.
3. The transparent invisible RFID tag according to claim 2, characterized in that: The antenna circuit pattern has the same pattern as the non-antenna circuit pattern.
4. The transparent invisible RFID tag according to claim 1, characterized in that: The material of the main substrate includes but is not limited to PET, COP or CPI.
5. The transparent invisible RFID tag according to claim 1, characterized in that: The thickness of the main substrate includes but is not limited to 50um, 100um or 125um.
6. The transparent invisible RFID tag according to claim 1, characterized in that: The material of the metal conductive layer includes but is not limited to gold, silver or copper.
7. The transparent invisible RFID tag according to claim 6, characterized in that: The thickness of the metal conductive layer is 2-10 um.
8. The transparent invisible RFID tag according to claim 1, characterized in that: The adhesive layer is a transparent optical adhesive, and the thickness thereof is less than or equal to 125 um.
9. The transparent invisible RFID tag according to claim 1, characterized in that: The metal conductive layer is manufactured on the surface of the main substrate by using an additive method or an etching subtractive process.
10. The transparent invisible RFID tag according to claim 1, characterized in that: The line width of the metal fine wire is less than 15um, and the line spacing is greater than 100um.