Electromagnetic shielding structure capable of adjusting process distance

Abstract

The utility model discloses an electromagnetic shielding structure capable of adjusting process distance, which relates to the technical field of ion etching and comprises a chamber body, a lifting assembly, a substrate table and a shielding assembly. A partition plate assembly is horizontally arranged in the chamber body, the interior of the chamber body is divided into an upper chamber and a lower chamber by the partition plate assembly, and a fabrication hole is formed in the partition plate assembly; the lifting assembly is arranged in the lower cavity; the substrate table is connected with the upper end of the lifting assembly, the substrate table is located in the process hole, the lifting assembly is used for driving the substrate table to ascend and descend, and a workpiece is placed above the substrate table; the shielding assembly is installed on the partition plate assembly and used for sealing the gap between the auxiliary hole and the substrate table in a sliding mode. The utility model can reduce electromagnetic field leakage and improve etching quality.

Description

Technical Field

[0001] The utility model relates to the technical field of ion etching, in particular to an electromagnetic shielding structure capable of adjusting process distance. Background Art

[0002] Ion etching is the most common form of dry etching. Its principle is that the gas exposed to the high-frequency electric field area is excited to form plasma. The plasma is composed of charged electrons and ions. In addition to being converted into ions, the gas also absorbs energy and forms active groups. The charged ions and active groups are accelerated by the electric field and hit the surface of the etched material, which will release enough force to tightly bond the material or etch the surface with the surface expulsion force. In the ion etching chamber, a process area is formed between the upper electrode assembly and the lower electrode assembly. There is an electromagnetic field in the upper chamber. If the electromagnetic field leaks into the lower chamber, it will cause abnormal discharge to damage the equipment in the lower chamber and increase energy consumption. At this time, the abnormal discharge will also affect the etching quality of the workpiece. It is necessary to effectively control the plasma density and plasma energy in the process area to prevent the electromagnetic field from leaking into the lower chamber. In order to meet various process requirements, the process distance between the upper electrode assembly and the lower electrode assembly needs to be changed during debugging. Therefore, a movable shielding structure is required to prevent the electromagnetic field from leaking into the lower chamber. The sealed shielding structure in the prior art has a poor shielding effect, which will cause electromagnetic field leakage, abnormal discharge and reduced etching quality. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an electromagnetic shielding structure with adjustable process distance, which can reduce electromagnetic field leakage and improve etching quality.

[0004] According to the first aspect of the utility model, an electromagnetic shielding structure with adjustable process distance includes: a chamber body, a lifting assembly, a substrate stage, and a shielding assembly. A partition assembly is horizontally arranged in the chamber body, and the partition assembly separates the interior of the chamber body into an upper chamber and a lower chamber, and the partition assembly is provided with a process hole; the lifting assembly is arranged in the lower chamber; the substrate stage is connected to the upper end of the lifting assembly, and the substrate stage is located in the process hole. The lifting assembly is used to drive the substrate stage to rise and fall, and the workpiece is placed above the substrate stage; the shielding assembly is installed on the partition assembly, and the shielding assembly is used to slide and seal the gap between the process hole and the substrate stage.

[0005] An electromagnetic shielding structure with adjustable process distance according to an embodiment of the utility model has at least the following beneficial effects: the gap between the process hole and the substrate stage is sealed by the shielding component, so that when the lifting component drives the substrate stage to lift, the substrate stage, the partition assembly and the shielding assembly jointly completely shield the upper chamber and the lower chamber, and the electromagnetic field in the upper chamber will not leak into the lower chamber, thereby ensuring that abnormal discharge does not occur, thereby improving the processing quality of workpiece etching.

[0006] According to some embodiments of the present invention, an upper electrode assembly is disposed in the upper chamber, and a lower electrode assembly is disposed under the substrate stage.

[0007] According to some embodiments of the utility model, a sealing groove is provided at the upper end of the partition assembly around the process hole, the shielding assembly includes a shielding ring, a shielding portion is provided around the lower end of the shielding ring, the shielding portion extends into the sealing groove and can move up and down, and the shielding ring is abutted against the upper edge of the substrate table.

[0008] According to some embodiments of the utility model, a guiding protrusion is vertically arranged in the sealing groove, and a guiding recess is arranged at the lower end of the shielding portion for cooperating with the guiding protrusion.

[0009] According to some embodiments of the utility model, the partition assembly includes an isolation plate and an adjustment part, the process hole is opened in the isolation plate, the sealing groove is opened in the adjustment part, the adjustment part is arranged around the process hole, and the adjustment part and the isolation plate are fixed by a connecting piece.

[0010] According to some embodiments of the utility model, a mounting hole for mounting the connecting member is provided on the adjusting portion, and a blocking member is provided in the mounting hole.

[0011] According to some embodiments of the present invention, the mounting hole is located outside the sealing groove.

[0012] According to some embodiments of the present invention, a first shielding wire is provided between the adjustment portion and the shielding ring.

[0013] According to some embodiments of the present invention, a second shielding wire is provided between the isolation plate and the adjustment part.

[0014] According to some embodiments of the present utility model, the shielding assembly includes a pressure plate, which is placed on the upper end of the shielding ring, and the inner edge of the lower end of the pressure plate abuts against the workpiece.

[0015] An electromagnetic shielding structure with adjustable process distance according to an embodiment of the utility model has at least the following beneficial effects:

[0016] (1) When the substrate stage is raised or lowered within a certain range, the substrate stage, the partition assembly and the shielding assembly together completely shield the upper chamber from the lower chamber, so that the electromagnetic field in the upper chamber will not leak into the lower chamber, thus avoiding abnormal discharge and improving the processing quality of workpiece etching;

[0017] (2) The shielding part slides in the sealing groove to achieve the shielding effect of sliding seal, which has a simple structure and is easy to maintain;

[0018] (3) A first shielding line and a second shielding line are provided to meet the grounding requirements of the process.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a cross-sectional schematic diagram of an installation structure of an embodiment of the utility model;

[0022] Figure 2 A top view of a partition assembly according to an embodiment of the utility model;

[0023] Figure 3 for Figure 2 Sectional view in the AA direction;

[0024] Figure 4 for Figure 3 Enlarged view of point C in the middle;

[0025] Figure 5 for Figure 2 Cross-sectional view in the BB direction;

[0026] Figure 6 for Figure 5 Enlarged view of point D in the middle.

[0027] Figure Number:

[0028] Chamber body 100, vacuum pump 101, upper chamber 110, lower chamber 120;

[0029] The partition assembly 200, the process hole 201, the sealing groove 202, the guide protrusion 203, the isolation plate 210, the adjustment part 220, the installation hole 221, and the blocking member 222;

[0030] Lifting assembly 300;

[0031] Substrate stage 400, workpiece 410;

[0032] Shielding assembly 500, shielding ring 510, shielding portion 511, guide recess 512, shielding groove 513, pressing plate 520;

[0033] Upper electrode assembly 600;

[0034] Lower electrode assembly 700;

[0035] Connector 800;

[0036] A first shielding line 900 and a second shielding line 910 . DETAILED DESCRIPTION

[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0040] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0041] Reference Figures 1 to 6As shown, an electromagnetic shielding structure with adjustable process distance according to an embodiment of the utility model comprises: a chamber body 100, a lifting assembly 300, a substrate stage 400, and a shielding assembly 500. The chamber body 100 is made of metal. The chamber body 100 is connected to various equipment required for vacuum etching, such as a vacuum pump 101 and a heater. The etching of the workpiece 410 is completed in the chamber body 100. A partition assembly 200 is horizontally arranged in the chamber body 100. The partition assembly 200 divides the space inside the chamber body 100 into an upper chamber 110 and a lower chamber 120. Process gas is introduced into the upper chamber 110 for etching, and the space in the lower chamber is used to install other equipment required for the etching process. A process hole 201 is opened in the center of the partition assembly 200; the process hole 201 is located in the center of the chamber body 100. The lifting assembly 300 is arranged in the lower chamber 120. The lifting assembly 300 can be a device with lifting function such as a cylinder or an electric push rod. The specific structure and installation method of the lifting assembly 300 are prior art, so they are not described in detail. The substrate stage 400 is bolted to the upper end of the lifting assembly 300. The lifting assembly 300 is used to drive the substrate stage 400 to rise and fall in the vertical direction. The shape and size of the substrate stage 400 match the shape and size of the workpiece 410 to be processed. Since the workpiece 410 to be processed is usually a square plate, the substrate stage 400 is also square, and the process hole 201 is square to match the square substrate stage 400. The substrate stage 400 is located in the process hole 201, and the substrate stage 400 is aligned with the process hole 201 in the vertical direction. The horizontal dimension of the substrate stage 400 is 5 mm-15 mm smaller than the horizontal dimension of the process hole 201, so that the substrate stage 400 can be smoothly moved from the lower chamber 120 to the process hole 201. The workpiece 410 is placed above the substrate stage 400. When the substrate stage 400 is located in the process hole 201, the upper end of the substrate stage 400 is located in the upper chamber 110 and the lower end of the substrate stage 400 is located in the lower chamber 120, so the workpiece 410 above the substrate stage 400 is also located in the upper chamber 110. The shielding assembly 500 is installed on the partition assembly 200, and the shielding assembly 500 is used to slide and seal the gap between the process hole 201 and the substrate stage 400. The shielding component 500 is used to seal the gap between the process hole 201 and the substrate stage 400, so that when the substrate stage 400 is raised or lowered within a certain range, the upper chamber 110 and the lower chamber 120 are completely isolated, and the electromagnetic field in the upper chamber 110 will not leak into the lower chamber 120, thereby ensuring the uniformity of the electromagnetic field in the upper chamber 110, so that the workpiece 410 can be etched evenly, thereby improving the etching processing quality of the workpiece 410.

[0042] Reference Figure 1As shown, it can be understood that an upper electrode assembly 600 is disposed in the upper chamber 110, and a lower electrode assembly 700 is disposed below the substrate stage 400. The upper electrode assembly 600 and the lower electrode are respectively connected to the positive and negative poles of the power supply, so that a potential difference is formed between the upper electrode assembly 600 and the lower electrode assembly 700, so that an electric field is formed in the upper chamber 110, and the ion gas in the upper chamber 110 descends and deposits on the upper surface of the workpiece 410 under the action of the electric field force. The shape and size of the upper electrode assembly 600 match the shape and size of the lower electrode assembly 700 to form a uniform electric field. It can be foreseen that the electric field range in the upper chamber 110 is larger than the size of the workpiece 410 so that the entire workpiece 410 can be etched.

[0043] Reference Figures 2 to 5 As shown, it can be understood that a sealing groove 202 is provided around the process hole 201 at the upper end of the partition assembly 200, and the distance between the sealing groove 202 and the process hole 201 is between 5 mm and 20 mm. Since the shape of the process hole 201 is square, the sealing groove 202 is a square annular groove. The cross-sectional shape of the sealing groove 202 is rectangular, and the shielding assembly 500 includes a shielding ring 510, which is annular, and a shielding portion 511 is provided around the lower end of the shielding ring 510. The shielding portion 511 is located at the outer edge of the lower end of the shielding ring 510, and the shielding portion 511 extends into the sealing groove 202 and can move up and down. The shielding ring 510 is against the upper edge of the substrate stage 400. When the substrate stage 400 is raised or lowered, it can drive the shielding ring 510 to move up and down, thereby driving the shielding portion 511 to move up and down in the sealing groove 202. It is foreseeable that the larger the vertical dimension of the shielding portion 511 is, the longer the sealing stroke is. The smaller the distance between the side wall of the shielding portion 511 and the side wall of the sealing groove 202 is, the better the sealing effect is. However, if the distance between the side wall of the shielding portion 511 and the side wall of the sealing groove 202 is too small, the shielding portion 511 cannot move up and down smoothly in the sealing groove 202. Therefore, the distance between the side wall of the shielding portion 511 and the side wall of the sealing groove 202 is between 0.2 mm and 1 mm to ensure that the electromagnetic field in the upper chamber 110 does not leak to the lower chamber 120 through the gap between the side wall of the shielding portion 511 and the side wall of the sealing groove 202.

[0044] Reference Figure 4As shown, it can be understood that a guide protrusion 203 is vertically arranged in the sealing groove 202, and the guide protrusion 203 uses a cylindrical positioning pin. It can be foreseen that the guide protrusion 203 can also be cylindrical, cubic, etc. A guide recess 512 is arranged at the lower end of the shielding portion 511, and the guide recess 512 uses a positioning hole. The size of the guide recess 512 matches the size of the guide protrusion 203 so that the guide protrusion 203 can be just inserted into the guide recess 512. The guide recess 512 is used to cooperate with the guide protrusion 203. In the process of lifting and lowering the shielding portion 511, the guide recess 512 and the guide protrusion 203 guide the shielding portion 511, so that the shielding portion 511 can be lifted and lowered smoothly.

[0045] Reference Figure 1 and Figure 4 As shown, it can be understood that the partition assembly 200 includes an isolation plate 210 and an adjustment part 220, the isolation plate 210 is arranged horizontally, and the outer wall of the isolation plate 210 is welded to the inner wall of the chamber body 100. The process hole 201 is opened at the center of the isolation plate 210, the sealing groove 202 is opened in the adjustment part 220, the adjustment part 220 is arranged around the process hole 201, and the adjustment part 220 and the isolation plate 210 are fixed by a connecting member 800. The connecting member 800 uses bolts, and it is foreseeable that the connecting member 800 can also use buckles, glue, etc. In addition. The adjustment part 220 and the isolation plate 210 can also be connected by welding. Since the size of the isolation plate 210 is large, and the precision requirement of the processing size of the sealing groove 202 is high, if the manufacturing cost of one-piece molding will be high, and the isolation plate 210 and the adjustment part 220 are manufactured separately, it is conducive to reducing the difficulty of the manufacturing process and reducing the production cost. Since the adjusting part 220 abuts and rubs against the shielding assembly 500 during long-term use, it needs to be replaced regularly. The bolt connection between the adjusting part 220 and the isolation plate 210 also facilitates disassembly and assembly to replace the adjusting part 220 .

[0046] Reference Figure 4 As shown, it can be understood that the shielding ring 510 is also provided with a shielding groove 513 for the adjustment part 220 to be embedded in, and the shielding groove 513 is located on the inner side of the shielding part 511 to enhance the effect of shielding the electromagnetic field.

[0047] Reference Figure 6As shown, it can be understood that the adjustment part 220 is provided with a mounting hole 221 for the connection member 800 to be installed, and a plugging member 222 is provided in the mounting hole 221 of the connection member 800. The plugging member 222 is made of aluminum alloy, and a boss is provided at the center of the plugging member 222. The mounting hole 221 is set in a stepped shape that matches the shape of the boss on the plugging member 222. An insulating layer is provided on the surface of the plugging member 222. In order to avoid affecting the electromagnetic field, the upper end of the adjustment part 220 is covered with an insulating layer. However, since the connection member 800 is usually made of metal, the mounting hole 221 cannot be directly connected to the upper chamber 110. The function of the plugging member 222 is to prevent the electromagnetic field in the upper chamber 110 from contacting the connection member 800.

[0048] Reference Figure 6 As shown, it can be understood that the mounting hole 221 is located outside the sealing groove 202. The mounting hole 221 is arranged outside the sealing groove 202, which can reduce the distance between the side wall of the sealing groove 202 and the inner wall of the process hole 201, and reduce the probability of electromagnetic field leakage through small size matching. In addition, the connector 800 in the mounting hole 221 can be operated without removing the shielding ring 510.

[0049] Reference Figure 4 and Figure 6 As shown, it can be understood that, in order to meet the process requirements, the adjustment part 220 and the isolation plate 210 are made of aluminum alloy, and the surfaces of the adjustment part 220 and the isolation plate 210 are provided with an insulating layer. The contact portion between the adjustment part 220 and the isolation plate 210 is not provided with an insulating layer so that the adjustment part 220 and the isolation plate 210 are mutually conductive to meet the grounding requirements. The upper surface of the shielding ring 510 is also provided with an insulating layer. The contact portion between the adjustment part 220 and the shielding ring 510 is not provided with an insulating layer so that the adjustment part 220 and the isolation plate 210 are mutually conductive to meet the grounding requirements. A first shielding wire 900 is provided between the adjustment part 220 and the shielding ring 510. The first shielding wire 900 is made of a conductive metal material. The first shielding wire 900 has a certain elasticity along its diameter direction. The first shielding wire 900 maintains good electrical contact between the adjustment part 220 and the shielding ring 510. It can be foreseen that setting a first shielding wire 900 between the side wall of the sealing groove 202 and the side wall of the shielding part 511 can also play the same role, and the first shielding wire 900 can also play its conductive role when the shielding ring 510 moves up and down, but it may cause the shielding part 511 to have too much friction in the sealing groove 202 and cannot slide smoothly.

[0050] Reference Figure 4 and Figure 6 As shown, it can be understood that a second shielding wire 910 is provided between the isolation plate 210 and the adjustment part 220. The second shielding wire 910 is used to maintain good electrical contact between the isolation plate 210 and the adjustment part 220 to meet the grounding process requirements.

[0051] Reference Figure 1 As shown, it can be understood that the shielding assembly 500 includes a pressing plate 520, which is placed on the upper end of the shielding ring 510, and the inner edge of the lower end of the pressing plate 520 is against the workpiece 410. The pressing plate 520 contacts the workpiece 410 to fix the position of the workpiece 410 on the substrate stage 400, preventing the workpiece 410 from being displaced during lifting and lowering, resulting in a decrease in the etching effect. When the shielding ring 510 moves up and down with the substrate stage 400, since the pressing plate 520 is placed on the upper end of the shielding ring 510, the pressing plate 520 will also move up and down, so that the workpiece 410 always keeps in contact with the pressing plate 520. It can be foreseen that, in order to facilitate the installation of the pressing plate 520, a positioning pin or other structure can be set on the upper end of the shielding ring 510 to position the pressing plate 520 to increase the installation speed.

[0052] Working principle: The substrate stage 400 is driven to rise and fall by the lifting assembly 300 to adjust the height, and the shielding ring 510 abuts against the upper edge of the substrate stage 400. When the substrate stage 400 is raised and lowered, the shielding ring 510 can be driven to move up and down, and the shielding portion 511 slides in the sealing groove 202. The shielding portion 511 is always located in the sealing groove 202 on the partition assembly 200 when the substrate stage 400 is raised and lowered. The sliding seal between the partition assembly 200 and the shielding ring 510 is realized through the cooperation of the shielding portion 511 and the sealing groove 202. The shielding ring 510, the substrate stage 400 and the partition assembly 200 work together to separate the upper chamber 110 from the lower chamber 120, and prevent the electromagnetic field in the upper chamber 110 from leaking into the lower chamber 120 when the substrate stage 400 is raised and lowered.

[0053] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An electromagnetic shielding structure with adjustable process distance, characterized in that: include: A chamber body, wherein a baffle assembly is horizontally arranged in the chamber body, the baffle assembly separates the interior of the chamber body into an upper chamber and a lower chamber, and the baffle assembly is provided with a process hole; Lifting components; Located in the lower chamber; A substrate stage connected to the upper end of the lifting assembly, the substrate stage is located in the process hole, the lifting assembly is used to drive the substrate stage to rise and fall, and the workpiece is placed above the substrate stage; A shielding assembly is installed on the partition assembly, and the shielding assembly is used for slidingly sealing the gap between the process hole and the substrate stage.

2. The electromagnetic shielding structure with adjustable process distance according to claim 1, characterized in that: An upper electrode assembly is disposed in the upper chamber, and a lower electrode assembly is disposed below the substrate stage.

3. The electromagnetic shielding structure with adjustable process distance according to claim 1, characterized in that: A sealing groove is provided at the upper end of the partition assembly around the process hole, and the shielding assembly includes a blocking ring, a blocking portion is provided around the lower end of the blocking ring, the blocking portion extends into the sealing groove and can move up and down, and the blocking ring abuts against the upper edge of the substrate table.

4. The electromagnetic shielding structure with adjustable process distance according to claim 3, characterized in that: A guiding protrusion is vertically arranged in the sealing groove, and a guiding recess is arranged at the lower end of the shielding portion for cooperating with the guiding protrusion.

5. The electromagnetic shielding structure with adjustable process distance according to claim 3, characterized in that: The partition assembly includes an isolation plate and an adjustment part. The process hole is opened in the isolation plate, the sealing groove is opened in the adjustment part, the adjustment part is arranged around the process hole, and the adjustment part and the isolation plate are fixed by a connecting piece.

6. The electromagnetic shielding structure with adjustable process distance according to claim 5, characterized in that: The adjusting portion is provided with a mounting hole for mounting the connecting member, and a blocking member is arranged in the mounting hole.

7. The electromagnetic shielding structure with adjustable process distance according to claim 6, characterized in that: The mounting hole is located outside the sealing groove.

8. The electromagnetic shielding structure with adjustable process distance according to claim 5, characterized in that: A first shielding wire is arranged between the adjusting portion and the shielding ring.

9. The electromagnetic shielding structure with adjustable process distance according to claim 5, characterized in that: A second shielding wire is arranged between the isolation plate and the adjustment part.

10. The electromagnetic shielding structure with adjustable process distance according to claim 3, characterized in that: The shielding assembly includes a pressing plate, which is placed on the upper end of the blocking ring, and the inner edge of the lower end of the pressing plate abuts against the workpiece.

Images