Laser module and laser

Abstract

The utility model relates to a laser module and a laser. The laser module comprises a substrate, a conductive layer and a laser chip. The conducting layer is arranged on one side of the substrate, the conducting layer comprises a first conducting sub-layer and a second conducting sub-layer which are arranged on the same layer and electrically isolated, the first conducting sub-layer comprises a first conducting area and a second conducting area which are integrally arranged, the first conducting area extends in the first direction, and the second conducting area extends in the second direction; the second sub-conductive layer is at least partially located in a gap region formed by the first conductive region and the second conductive region; the laser chip is arranged on the side, away from the substrate, of the first conductive area, a first electrode of the laser chip is electrically connected with the first conductive area, and a second electrode of the laser chip is electrically connected with the second sub-conductive layer through a conductive wire. According to the laser module, few materials are adopted, and the packaging process is simpler compared with the prior art, so that the production cost of the laser module can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field related to lasers, and specifically relates to a laser module and a laser. Background Art

[0002] As lasers are used more widely in various industries, the market demand for low-cost and simple-structured lasers continues to increase.

[0003] A laser can be packaged with multiple laser modules. The structure of the laser module determines the structure of the laser to a certain extent. However, currently laser modules generally have a complex structure, resulting in high costs. Utility Model Content

[0004] The present application provides a laser module and a laser to solve the technical problem of high cost caused by complex structure.

[0005] To solve the above technical problems, a technical solution adopted in the present application is: a laser module, comprising: a substrate; a conductive layer, arranged on one side of the substrate, the conductive layer comprising a first sub-conductive layer and a second sub-conductive layer arranged in the same layer and electrically isolated, the first sub-conductive layer comprising a first conductive area and a second conductive area arranged integrally, the first conductive area extending along a first direction, the second conductive area extending along a second direction, the first direction and the second direction intersecting; the second sub-conductive layer is at least partially located in a gap area formed by the first conductive area and the second conductive area; in the second direction, the width of the substrate is greater than the width of the conductive layer, and the difference between the width of the substrate and the width of the conductive layer is less than a first predetermined value; a laser chip, arranged on a side of the first conductive area away from the substrate, and the first electrode of the laser chip is electrically connected to the first conductive area, and the second electrode of the laser chip is electrically connected to the second sub-conductive layer through a conductive line; in the second direction, the width of the second conductive area is greater than the width of the laser chip, and the difference between the width of the second conductive area and the width of the laser chip is less than a second predetermined value.

[0006] According to an embodiment of the present application, the first direction is perpendicular to the second direction, so that the first sub-conductive layer is arranged in an L-shape, and the second sub-conductive layer is located in a rectangular gap area formed by the first sub-conductive layer.

[0007] According to one embodiment of the present application, the laser chip is electrically connected to the second sub-conductive layer through a plurality of the conductive wires; the spacing between ends of adjacent conductive wires connected to the laser chip is greater than the spacing between ends connected to the second sub-conductive layer.

[0008] According to an embodiment of the present application, the laser module further includes: a metal layer, which is arranged on a side of the substrate away from the conductive layer.

[0009] According to an embodiment of the present application, projections of the outer peripheral edges of the conductive layer and the metal layer on the substrate are both located within the substrate.

[0010] According to an embodiment of the present application, the laser module further includes a welding layer, which is located between the laser chip and the first conductive area and is used to weld the laser chip to the first conductive area.

[0011] To solve the above technical problems, another technical solution adopted in the present application is: a laser, comprising: a heat sink; a plurality of laser modules described in any of the above, connected in series on the upper surface of the heat sink along the first direction; wherein the second conductive area of ​​one adjacent laser module is electrically connected to the second sub-conductive layer of another adjacent laser module; an electrode sheet, at least partially disposed on the upper surface of the heat sink and arranged with the laser module along a third direction, wherein the third direction is disposed perpendicular to the first direction, the electrode sheet comprising a first electrode sheet and a second electrode sheet, the first electrode sheet being electrically connected to the second conductive area of ​​the first laser module, and the second electrode sheet being electrically connected to the second sub-conductive layer of the last laser module.

[0012] According to one embodiment of the present application, the first electrode sheet includes: a first electrode portion, which is bonded to the side surface of the heat sink; a second electrode portion, which is integrally arranged with the first electrode portion and is located on the upper surface, the second electrode portion and the laser module are arranged along the second direction, and the second electrode portion is electrically connected to the second conductive area of ​​the first laser module; and / or the second electrode sheet includes: a third electrode portion, which is bonded to the side surface of the heat sink; a fourth electrode portion, which is integrally arranged with the third electrode portion and is located on the upper surface, the fourth electrode portion and the laser module are arranged along the second direction, and the fourth electrode portion is electrically connected to the second sub-conductive layer of the last laser module.

[0013] According to one embodiment of the present application, a water inlet and a water outlet are respectively provided at two ends of the heat sink, and a water flow channel connected to the water inlet and the water outlet is formed inside the heat sink, and the water flow channel is used to dissipate heat for the laser module.

[0014] According to one embodiment of the present application, the laser further includes a heat dissipation component, and the heat dissipation component is disposed between the heat sink and the electrode sheet.

[0015] According to one embodiment of the present application, the heat dissipation assembly includes: a first heat sink, arranged between the first electrode portion and the third electrode portion and the heat sink; a second heat sink, adhered to the side surface of the heat sink and located between the second electrode portion and the fourth electrode portion and the side surface of the heat sink.

[0016] The beneficial effect of the present application is as follows: the structure of the laser module of the present application is compared with the laser module in the prior art. In the present application, the conductive layer on the substrate forms the first sub-conductive layer and the second sub-conductive layer of the laser module, and the laser chip is electrically connected to the first sub-conductive layer directly. At this time, there is no need to use conductive wires or other connecting wires to achieve electrical connection, and the second electrode of the laser chip is electrically connected to the second sub-conductive layer through a conductive wire. At this time, there is no need to achieve electrical connection through an additional metal layer. Therefore, the laser module in the present application has a simple structure, uses less material, and the packaging process is simpler than the packaging process in the prior art, thereby being able to greatly reduce the production cost of the laser module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0018] Figure 1 It is a partial structural schematic diagram of an embodiment of a laser module of the present application;

[0019] Figure 2 It is a structural schematic diagram of an embodiment of a laser module of the present application;

[0020] Figure 3 It is a schematic structural diagram of a laser embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of a partial explosion structure of a laser embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of a partial cross-sectional structure of a laser embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] In the horizontal array structure of the prior art, the packaging structure of the laser unit is relatively complex. It often uses a double-sided clamping method to package the laser chip, or a double-sided conductive wire electrical connection method to package the laser chip. However, the double-sided clamping packaging method and the double-sided conductive wire method often use a variety of materials, complex structures, and difficult process control, and their production costs often increase accordingly. In addition, in the horizontal array, if the laser chip is damaged, it is often difficult to repair. In view of this, an embodiment of the present application provides a laser module.

[0028] See also Figure 1 and Figure 2 , wherein the laser module 10 includes a substrate 11 , a conductive layer 12 and a laser chip 13 .

[0029] The conductive layer 12 may be a conductive and thermally conductive material. For example, the conductive layer 12 may be made of pure copper. The thickness of the conductive layer 12 may be 75um-85um, and preferably, the thickness of the conductive layer 12 is 80um.

[0030] The conductive layer 12 is disposed on one side of the substrate 11. The substrate 11 can play a certain supporting role for the conductive layer 12 and other structural members disposed on the conductive layer 12. The substrate 11 can be a material of a high thermal conductivity ceramic with a flat cut edge. Exemplarily, the substrate 11 can be an aluminum nitride ceramic material or an aluminum oxide ceramic material.

[0031] The conductive layer 12 includes a first sub-conductive layer 121 and a second sub-conductive layer 122 which are arranged in the same layer and are electrically isolated. The first sub-conductive layer 121 includes a first conductive area 1211 and a second conductive area 1212 which are arranged integrally. The first conductive area 1211 extends along a first direction X. The second conductive area 1212 extends along a second direction Y. The first direction X and the second direction Y intersect. The second sub-conductive layer 122 is at least partially located in a gap area formed by the first conductive area 1211 and the second conductive area 1212. In the second direction Y, the width of the substrate 11 is greater than the width of the conductive layer 12, and the difference between the width of the substrate 11 and the width of the conductive layer 12 is less than a first predetermined value. The laser chip 13 is arranged on a side of the first conductive area 1211 away from the substrate 11, and the first electrode of the laser chip 13 is electrically connected to the first conductive area 1211. The second electrode of the laser chip 13 is electrically connected to the second sub-conductive layer 122 through the conductive wire 30. In the second direction, the width of the second conductive region 1212 is greater than the width of the laser chip 13, and the difference between the width of the second conductive region 1212 and the width of the laser chip 13 is below a second predetermined value.

[0032] It can be seen from the above structure that in the process of implementing the packaging process of the laser module 10, it is only necessary to electrically connect the first electrode of the laser chip 13 to the first conductive area 1211, and the second electrode to the second sub-conductive layer 122 through the conductive wire 30 to realize the packaging of the laser chip 13. Compared with the packaging method in the prior art, the packaging method in the embodiment of the present application is that the first electrode of the laser chip 13 in the present application is directly electrically connected to the first conductive area 1211, and no additional conductive wire is required for connection, and the second electrode of the laser chip 13 is directly electrically connected to the second sub-conductive layer 122, and no additional metal layer is required to be electroplated on the second electrode of the laser chip 13. Therefore, the materials used in the embodiment of the present application are less, and the packaging process is also simpler than the packaging process in the prior art, thereby greatly reducing the production cost of the laser module 10. Therefore, the laser module 10 in the present application has the advantages of simple structure, simple process and low cost.

[0033] In addition, compared with the packaging method of the prior art, the packaging method of the laser module 10 in the present application can also make the inspection of the performance of the laser chip 13 more convenient, and can be directly inspected without removing the metal layer, conductive wires and other structural parts. And when the laser chip 13 is repaired and replaced during the later use, there is no need to disassemble and install unnecessary structural parts, and the laser chip 13 can be repaired and replaced by only removing the connecting wires, thereby improving the user's operating experience.

[0034] In addition, in the second direction Y, the difference between the width of the substrate 11 and the width of the conductive layer 12 is below a first predetermined value, and the difference between the width of the second conductive region 1212 and the width of the laser chip 13 is below a second predetermined value. At this time, not only can the overall volume of the laser module 10 be reduced, but also the packaging of the laser module 10 can be facilitated.

[0035] It should be noted that the first predetermined value is 0.5 mm, and the second predetermined value is 2 mm.

[0036] See also Figure 2 and Figure 3, further, another embodiment of the present application provides a laser 20. The laser 20 includes a heat sink 21, a plurality of the above-mentioned laser modules 10 and an electrode sheet 22. The plurality of laser modules 10 are connected in series to the upper surface B of the heat sink 21 along the first direction X. The second conductive region 1212 of an adjacent laser module 10 is electrically connected to the second sub-conductive layer 122 of another laser module 10. The electrode sheet 22 is at least partially disposed on the upper surface B of the heat sink 21 and is arranged along a third direction Z with the laser module 10, and the third direction Z is disposed perpendicular to the first direction X. The electrode sheet 22 includes a first electrode sheet 221 and a second electrode sheet 222. The first electrode sheet 221 is electrically connected to the second conductive region 1212 of the first laser module 10, and the second electrode sheet 222 is electrically connected to the second sub-conductive layer 122 of the last laser module 10.

[0037] It can be seen that a plurality of laser modules 10 are arranged in series on the upper surface B of the heat sink 21. Since the first conductive region 1211 of the laser module 10 in the embodiment of the present application extends along the first direction X. The second conductive region 1212 extends along the second direction Y. The first direction X and the second direction Y intersect. The second sub-conductive layer 122 is at least partially located in the gap region formed by the first conductive region 1211 and the second conductive region 1212. At this time, when adjacent laser modules 10 are connected in series, the distance between the second sub-conductive layer 122 of the previous laser module 10 and the second conductive region 1212 of the next laser module 10 can be made shorter, so that when bonding is achieved, the length of the conductive wire 30 is shorter, so as to save the cost of using the conductive wire 30. At the same time, this arrangement can also realize the close arrangement of adjacent laser modules 10 in the extension direction of the heat sink 21, so that the laser 20 using the laser module 10 has the advantages of simple structure, low cost, and easy electrical connection.

[0038] In addition, when the electrode sheet 22 is electrically connected to the laser module 10, the first electrode sheet 221 is electrically connected to the second conductive area 1212 of the first laser module 10, and the second electrode sheet 222 is electrically connected to the second sub-conductive layer 122 of the last laser module 10. This connection method can also prevent the conductive wires 30 connected in series between multiple laser modules 10 on the laser 20 and the conductive wires 30 connecting the laser module 10 and the electrode sheet 22 from crossing. At this time, not only is it less likely to have installation errors that cause the laser 20 to fail to work properly, but the installation accuracy can also be improved. At the same time, during bonding, the length of the conductive wire 30 is shorter, thereby saving the cost of using the conductive wire 30.

[0039] Preferably, a single laser module 10 is usually connected and conducted via a gold wire, and external connections can be made via aluminum wires, etc. Of course, in some other embodiments, conventional conductive wires 30 can also be used to achieve conduction, which is not limited here.

[0040] Optionally, the first sub-conductive layer 121 may be a positive electrode region, in which case the second sub-conductive layer 122 is a negative electrode region, and the positive electrode region generally includes a welding region and a bonding region, that is, the first conductive region 1211 is a welding region, and the second conductive region 1212 is a bonding region, wherein the laser chip 13 is disposed in the welding region, and the laser chip 13 also includes a first electrode and a second electrode, wherein the first electrode is a positive electrode, and the second electrode is a negative electrode, and in this case, the positive electrode of the laser chip 13 is electrically connected to the welding region of the positive electrode region of the conductive layer 12, and the negative electrode of the laser chip 13 is electrically connected to the negative electrode region of the conductive layer 12 through the conductive wire 30. Accordingly, when the laser module 10 is connected in series to the heat sink 21, in this case, since the first electrode sheet 221 is electrically connected to the second conductive region 1212, the first electrode sheet 221 is a negative electrode, and the second electrode sheet 222 is electrically connected to the second sub-conductive layer 122, and therefore the second electrode sheet 222 is a positive electrode.

[0041] Alternatively, in some other embodiments, the first sub-conductive layer 121 may also be a negative electrode region, and in this case, the second sub-conductive layer 122 is a positive electrode region. In this case, correspondingly, the first electrode of the laser chip 13 is a negative electrode, and the second electrode is a positive electrode. The first electrode sheet 221 in the laser 20 is a positive electrode, and the second electrode sheet 222 is a negative electrode, which is not limited here.

[0042] Preferably, the heat sink 21 is located at the bottom of the entire laser 20 , and is usually made of TU1 material with good thermal conductivity, and the heat sink 21 is a long strip structure.

[0043] Please continue reading Figure 1 and Figure 2 Preferably, in an embodiment of the present application, the first direction X and the second direction Y are perpendicular, so that the first sub-conductive layer 121 is arranged in an L shape, wherein the second sub-conductive layer 122 is located in the rectangular gap area formed by the first sub-conductive layer 121. Compared with the packaging method in the prior art, the first sub-conductive layer 121 arranged in an L shape in the present application can reduce the materials generated during packaging when the laser module 10 is packaged, and at the same time simplify the process, thereby effectively reducing the packaging cost. Furthermore, when the laser module 10 is applied to the laser 20, adjacent laser modules 10 are connected in series. At this time, the distance between the second sub-conductive layer 122 of the previous laser module 10 and the second conductive area 1212 of the next laser module 10 is shorter. When bonding is achieved, the length of the conductive wire 30 can be made shorter to save the use cost of the conductive wire 30. At the same time, this arrangement can also realize close arrangement of adjacent laser modules 10 in the horizontal direction, so that the laser 20 using the laser module 10 has the advantages of simple structure, low cost, and easy electrical connection.

[0044] It should be noted that, since the first sub-conductive layer is arranged in an L-shape, at this time, when the laser chip 13 is electrically connected to the second sub-conductive layer 122 through multiple conductive wires 30, the spacing between the ends connected to the laser chip 13 of adjacent conductive wires 30 is greater than the spacing between the ends connected to the second sub-conductive layer 122.

[0045] In one embodiment of the present application, the laser module 10 further includes a metal layer (not shown in the figure). The metal layer is arranged on the side of the substrate 11 away from the conductive layer 12. At this time, it is convenient to weld the substrate 11 with the remaining structural parts. When the laser module 10 is applied to the laser 20, the metal layer is welded to the heat sink 21 of the laser 20.

[0046] Preferably, the projections of the outer edges of the conductive layer 12 and the metal layer on the substrate 11 are both located inside the substrate 11. At this time, when the laser module 10 is produced and processed, the processing efficiency of the production personnel can be improved. Specifically, since the substrate 11 is usually made of a ceramic material with high thermal conductivity, and the ceramic material is easier to cut than the conductive layer 12 and the metal layer made of metal, in the process of producing the laser module 10, the conductive layer 12 and the metal layer of the metal material are usually first electroplated on the upper and lower surfaces of the substrate 11, respectively, and then the substrate 11 of the ceramic material is cut. Since the charge-coupled device (CCD) can more easily identify ceramic materials, the projections of the outer edges of the conductive layer 12 and the metal layer on the substrate 11 are both set to be located inside the substrate 11. The conductive layer 12 and the metal layer are retracted to expose the substrate 11, which can facilitate the identification of the CCD and facilitate the cutting and positioning of the substrate 11, thereby improving the processing efficiency of the production personnel.

[0047] Furthermore, when the laser module 10 is set on the heat sink 21 of the laser 20, since some positioning steps are usually set on the heat sink 21 to position the laser module 10, the conductive layer 12 is set inward at this time, which can avoid the conductive layer 12 overlapping the heat sink 21 and being connected to the heat sink 21, or, when the distance between the conductive layer 12 and the heat sink 21 is small, when the laser chip 13 is welded to the conductive layer 12, the solder overflows and connects the conductive layer 12 with the heat sink 21. Therefore, the conductive layer 12 shrinking inward can also achieve a good insulation effect between the heat sink 21 and the conductive layer 12.

[0048] In one embodiment of the present application, the laser module 10 further includes a welding layer 14. The welding layer 14 is located between the laser chip 13 and the first conductive area 1211, and is used to weld the laser chip 13 to the first conductive area 1211. Since a large amount of heat is generated when the laser chip 13 is welded to the first conductive area 1211, if it is directly welded to the first conductive area 1211, the heat generated during welding will be destructive to the laser chip 13. The welding layer 14 has the characteristics of low melting point and controllable thermal stress. Therefore, it can melt at a limited temperature and connect the laser chip 13 and the welding layer 14 together, and will not cause damage to the laser chip 13. Therefore, the welding layer 14 can achieve the purpose of welding without melting the laser chip 13.

[0049] Please continue reading Figure 3 In another embodiment of the present application, the first electrode sheet 221 includes a first electrode portion 2211 and a second electrode portion 2212. The first electrode portion 2211 is arranged in contact with the side surface A of the heat sink 21. The second electrode portion 2212 is integrally arranged with the first electrode portion 2211 and is located on the upper surface B. The second electrode portion 2212 and the laser module 10 are arranged along the second direction Y. The second electrode portion 2212 is electrically connected to the second conductive region 1212 of the first laser module 10. And / or, the second electrode sheet 222 includes a third electrode portion 2221 and a fourth electrode portion 2222. The third electrode portion 2221 is arranged in contact with the side surface A of the heat sink 21. The fourth electrode portion 2222 is integrally arranged with the third electrode portion 2221 and is located on the upper surface B. The fourth electrode portion 2222 and the laser module 10 are arranged along the second direction Y. The fourth electrode portion 2222 is electrically connected to the second sub-conductive layer 122 of the last laser module 10.

[0050] Specifically, the first electrode portion 2211 is arranged to fit the side surface A of the heat sink 21, and the second electrode portion 2212 is arranged to fit the upper surface B of the heat sink 21. The first electrode portion 2211 and the second electrode portion 2212 are arranged integrally, that is, the first electrode sheet 221 includes the first electrode portion 2211 and the second electrode portion 2212 that are bent. At this time, when the laser 20 is connected to an external module, the bent first electrode sheet 221 is more ergonomically designed, which can facilitate the staff to realize the connection between the external conductive wire 30 and the laser 20, and at the same time can increase the selectivity of the power connection solution.

[0051] The third electrode portion 2221 is arranged to fit the side surface A of the heat sink 21, and the fourth electrode portion 2222 is arranged to fit the upper surface B of the heat sink 21. The third electrode portion 2221 and the fourth electrode portion 2222 are arranged integrally, that is, the second electrode sheet 222 includes the third electrode portion 2221 and the fourth electrode portion 2222 which are bent. At this time, when the laser 20 is connected to an external module, the bent second electrode sheet 222 is more ergonomically designed, which can facilitate the staff to realize the connection between the external conductive wire 30 and the laser 20, and at the same time can increase the selectivity of the power connection scheme.

[0052] Preferably, the first electrode sheet 221 and the second electrode sheet 222 are both bent, and at this time, the laser 20 can be more convenient when connected to the outside. Of course, in some other embodiments, only the first electrode sheet 221 can be bent, or only the second electrode sheet 222 can be bent, and when the first electrode sheet 221 and / or the second electrode sheet 222 are bent, the third direction Z is perpendicular to the first direction X and the second direction Y. Alternatively, in some other embodiments, the first electrode sheet 221 and the second electrode sheet 222 can also be unbent. There is no restriction here. When the first electrode sheet 221 and the second electrode sheet 222 are not bent, at this time, the third direction Z is the second direction Y.

[0053] In another embodiment of the present application, a water inlet 211 and a water outlet 212 are respectively provided at the two ends of the heat sink 21, and a water flow channel (not shown in the figure) connected to the water inlet 211 and the water outlet 212 is formed inside the heat sink 21. The water flow channel is used to dissipate heat for the laser module 10. Since the laser 20 itself will have a certain amount of heat during use because it emits light, therefore, by respectively providing a water inlet 211 and a water outlet 212 at the two ends of the heat sink 21, water flows from the water inlet 211 into the water flow channel, and is finally discharged from the water outlet 212. At this time, the water flow in the water flow channel can cool down the laser module 10 arranged on the upper surface B of the heat sink 21, thereby reducing the temperature generated by the laser 20 during operation.

[0054] In order to further reduce the temperature generated by the laser 20 during operation, in another embodiment of the present application, the laser 20 further includes a heat dissipation component 23 , which is disposed between the heat sink 21 and the electrode sheet 22 .

[0055] Specifically, the heat dissipation assembly 23 includes a first heat sink 231 and a second heat sink 232, and the first heat sink 231 is arranged between the first electrode portion 2211 and the third electrode portion 2221 and the heat sink 21. The second heat sink 232 is attached to the side surface A of the heat sink 21, and is located between the second electrode portion 2212 and the fourth electrode portion 2222 and the side surface A of the heat sink 21. At this time, the first heat sink 231 can be used for heat dissipation between the electrode sheet 22 and the heat sink 21 to ensure reliability under high current. In addition, the first heat sink 231 can usually be made by cutting aluminum nitride ceramic sheets, and the aluminum nitride ceramic sheets have strong insulation properties. Therefore, in addition to being able to dissipate heat between the electrode sheet 22 and the heat sink 21, the first heat sink 231 can also serve as an insulator between the electrode sheet 22 and the heat sink 21. Similarly, the second heat sink 232 is arranged to fit the side surface A of the heat sink 21 and is located between the second electrode portion 2212 and the fourth electrode portion 2222 and the side surface A of the heat sink 21. At this time, the second heat sink 232 can not only be used for heat dissipation between the electrode sheet 22 and the heat sink 21 to ensure reliability under high current, but also the material of the second heat sink 232 and the first heat sink 231 can be the same. At this time, it can also play an insulating role between the electrode sheet 22 and the heat sink 21.

[0056] Optionally, in some other embodiments, the materials of the first heat sink 231 and the second heat sink 232 may also be different, for example, the first heat sink 231 is an aluminum nitride ceramic sheet, and the second heat sink 232 is an aluminum oxide ceramic sheet, or the first heat sink 231 and the second heat sink 232 may also be other insulating materials, which are not described here one by one.

[0057] Optionally, the first heat sink 231 and the second heat sink 232 may be integrally formed, or the first heat sink 231 and the second heat sink 232 may be separately provided, which is not limited here.

[0058] Please continue reading Figure 4 and Figure 5 In another embodiment of the present application, the laser 20 further includes a plurality of fastening components 24. The fastening components 24 are used to fix the electrode sheet 22 to the heat sink 21. The provision of the fastening components 24 can make the connection between the electrode sheet 22 and the heat sink 21 more stable.

[0059] Specifically, the heat sink 21 is provided with a first mounting hole (not shown in the figure), and the electrode sheet 22 is provided with a second mounting hole 223. The fastening assembly 24 includes an insulating step washer 241, a flat washer 242, a spring washer 243 and a screw 244. Among them, the insulating step washer 241 is arranged in contact with the electrode sheet 22, and at least part of it is located in the second mounting hole 223. The flat washer 242 is arranged on the side of the insulating step washer 241 away from the electrode sheet 22. The spring washer 243 is arranged on the side of the flat washer 242 away from the insulating step washer 241. The screw 244 is sequentially penetrated through the spring washer 243, the flat washer 242, the insulating step washer 241, the second mounting hole 223 and the first mounting hole.

[0060] Among them, the insulating step washer 241 can prevent the conduction between the electrode sheet 22 and the heat sink 21 to ensure water-electricity separation. The flat washer 242 can prevent the screw 244 from squeezing the insulating step washer 241 during the tightening process, thereby causing damage to the insulating step washer 241, and the spring washer 243 can prevent the screw 244 from being easily loosened. The screw 244 is sequentially inserted through the spring washer 243, the flat washer 242, the insulating step washer 241, the second mounting hole 223 and the first mounting hole, and then the electrode sheet 22 can be fastened to prevent the laser 20 from being affected in terms of laser emission stability due to the loosening of the electrode sheet 22 during use.

[0061] It should be noted that the terms "horizontal", "vertical" and the like do not mean that the components are absolutely horizontal or vertical, but can be slightly tilted; the terms "parallel", "vertical" and the like do not mean that the components are absolutely parallel or vertical, but can form a certain angle deviation. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. In addition, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the present application is usually placed when used, which is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0062] It is to be understood that the meaning of "plurality" herein is at least two, such as two, three, etc., unless there is a special limitation. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices. The term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " herein generally indicates that the associated objects before and after are in an "or" relationship.

[0063] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A laser module, characterized in that: The laser module comprises: substrate; A conductive layer is arranged on one side of the substrate, the conductive layer comprises a first sub-conductive layer and a second sub-conductive layer which are arranged in the same layer and are electrically isolated, the first sub-conductive layer comprises a first conductive area and a second conductive area which are arranged integrally, the first conductive area extends along a first direction, the second conductive area extends along a second direction, and the first direction and the second direction intersect; the second sub-conductive layer is at least partially located in a gap area formed by the first conductive area and the second conductive area; in the second direction, the width of the substrate is greater than the width of the conductive layer, and the difference between the width of the substrate and the width of the conductive layer is less than a first predetermined value; A laser chip is arranged on a side of the first conductive area away from the substrate, and a first electrode of the laser chip is electrically connected to the first conductive area, and a second electrode of the laser chip is electrically connected to the second sub-conductive layer through a conductive line, and in the second direction, a width of the second conductive area is greater than a width of the laser chip, and a difference between the width of the second conductive area and the width of the laser chip is less than a second predetermined value.

2. The laser module according to claim 1, characterized in that: The first direction is perpendicular to the second direction, so that the first sub-conductive layer is arranged in an L-shape, and the second sub-conductive layer is located in a rectangular gap region formed by the first sub-conductive layer.

3. The laser module according to claim 2, characterized in that: The laser chip is electrically connected to the second sub-conductive layer through a plurality of the conductive wires; the spacing between ends of adjacent conductive wires connected to the laser chip is greater than the spacing between ends of adjacent conductive wires connected to the second sub-conductive layer.

4. The laser module according to claim 1, characterized in that: The laser module also includes: The metal layer is arranged on a side of the substrate away from the conductive layer.

5. The laser module according to claim 4, characterized in that: Projections of the outer peripheral edges of the conductive layer and the metal layer on the substrate are both located within the substrate.

6. The laser module according to claim 1, characterized in that: The laser module further includes a welding layer located between the laser chip and the first conductive area and used for welding the laser chip to the first conductive area.

7. A laser, characterized in that: The laser comprises: Heat sink; A plurality of laser modules according to any one of claims 1 to 6, connected in series on the upper surface of the heat sink along the first direction; wherein the second conductive region of one adjacent laser module is electrically connected to the second sub-conductive layer of another adjacent laser module; The electrode sheet is at least partially disposed on the upper surface of the heat sink and is arranged along a third direction with the laser module, wherein the third direction is perpendicular to the first direction, and the electrode sheet comprises a first electrode sheet and a second electrode sheet, wherein the first electrode sheet is electrically connected to the second conductive area of ​​the first laser module, and the second electrode sheet is electrically connected to the second sub-conductive layer of the last laser module.

8. The laser according to claim 7, characterized in that The first electrode sheet comprises: A first electrode portion is disposed in contact with a side surface of the heat sink; a second electrode portion, which is integrally provided with the first electrode portion and is located on the upper surface, the second electrode portion and the laser module are arranged along the second direction, and the second electrode portion is electrically connected to the second conductive area of ​​the first laser module; and / or The second electrode sheet comprises: A third electrode portion is disposed in contact with a side surface of the heat sink; The fourth electrode portion is integrally provided with the third electrode portion and is located on the upper surface. The fourth electrode portion and the laser module are arranged along the second direction. The fourth electrode portion is electrically connected to the second sub-conductive layer of the last laser module.

9. The laser according to claim 7, characterized in that A water inlet and a water outlet are respectively formed at two ends of the heat sink, and a water flow channel connected to the water inlet and the water outlet is formed inside the heat sink, and the water flow channel is used to dissipate heat for the laser module.

10. The laser according to claim 8, characterized in that The laser further comprises a heat dissipation component, and the heat dissipation component is arranged between the heat sink and the electrode sheet.

11. The laser according to claim 10, characterized in that The heat dissipation component comprises: A first heat sink is disposed between the first electrode portion, the third electrode portion and the heat sink; The second heat sink is attached to the side surface of the heat sink and is located between the second electrode portion, the fourth electrode portion and the side surface of the heat sink.

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