Gland of SMT furnace jig

Abstract

The utility model discloses a gland of a surface mount technology (SMT) furnace jig, which comprises a support plate, a raised plate is arranged in the middle of the support plate, a plurality of top blocks are distributed at the upper end of the raised plate in a rectangular array mode, the lower ends of the top blocks are fixedly connected with movable columns, the lower ends of every four movable columns are fixedly connected with a pressing plate, and the pressing plate is fixedly connected with the raised plate. Through holes A are formed in the four end corners of the periphery of the supporting plate in a penetrating mode, rotating columns are movably arranged in the through holes A, rotating blocks are fixedly connected to the upper ends of the rotating columns, and clamping blocks are fixedly connected to the lower ends of the rotating columns. According to the utility model, the SMD electronic component is placed on the welding position on the PCB, then the PCB on which the electronic component is placed is placed at the lower end of the raised plate, the upper end of the raised plate is provided with a plurality of through holes B in a penetrating manner, and the integral movable column and the pressing plate fall down due to gravity, so that the electronic component can be welded on the PCB. And the integral movable column and the pressing plate are used for carrying out gravity extrusion on the surface-mounted electronic component on the PCB.

Description

Technical Field

[0001] The utility model relates to the technical field of furnace fixture pressure covers, in particular to a pressure cover of an SMT furnace fixture. Background Art

[0002] SMT is the abbreviation of Surface Mount Technology, which means surface mount technology in Chinese. SMT is a new generation of electronic assembly technology and the most popular technology and process in the electronic assembly industry. It compresses traditional electronic components into devices with a volume of only a few tenths. Its principle is to place chip-type electronic components on the PCB board for welding to form a circuit board.

[0003] The existing chip-type electronic components on the PCB board are susceptible to vibration during the placement process. During the vibration process, this setting makes the entire chip-type electronic components very easy to run out of the original welding point position, resulting in the electronic components on the PCB board being soldered crookedly or having cold solder joints, further causing the entire circuit board to be unqualified. Therefore, the existing technology does not meet the needs. In this regard, we propose a pressure cover for the SMT furnace fixture. Utility Model Content

[0004] The utility model aims to provide a pressure cover for an SMT furnace fixture to solve the problem that the chip-type electronic components on the PCB board are susceptible to vibration during the placement process proposed in the above-mentioned background technology. During the vibration process, this arrangement makes it very easy for the entire chip-type electronic components to run out from the original welding point position, resulting in the electronic components on the PCB board being soldered crookedly or having cold solder joints, which further leads to the phenomenon that the entire circuit board is unqualified.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a pressure cover of an SMT furnace fixture, comprising a support plate, a raised plate is provided in the middle of the support plate, a plurality of top blocks are distributed in a rectangular array on the upper end of the raised plate, a movable column is fixedly connected to the lower end of the top block, a pressure plate is fixedly connected to the lower end of every four movable columns, a through hole A is penetrated at the four end corners around the support plate, a rotating column is movably provided in the through hole A, a rotating block is fixedly connected to the upper end of the rotating column, and a clamping block is fixedly connected to the lower end of the rotating column.

[0006] Preferably, a tension spring A is fixedly connected between the four sides of the lower end of the rotating block and the upper end of the supporting plate.

[0007] Preferably, the rotating column is rotatably located in through hole A.

[0008] Preferably, a plurality of through holes B are penetrated through the upper end of the raised plate, and the movable column is movably located in the through holes B.

[0009] Preferably, the pressing plate is made of heavy metal material.

[0010] Preferably, a tension spring B is connected between the four end corners on the upper end of the pressure plate and the lower end of the raised plate, and the movable column is located inside the tension spring B.

[0011] Preferably, the pressing plate is made of colorless metal.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model places the SMD electronic components on the soldering position on the PCB, and then places the PCB board with the electronic components on the lower end of the raised plate, wherein the upper end of the raised plate is penetrated with a plurality of through holes B, the movable column is movably located in the through holes B, and the pressing plate is made of heavy metal material. The integral movable column and the pressing plate fall downward due to gravity. This arrangement enables the integral movable column and the pressing plate to squeeze the SMD electronic components on the PCB board by gravity;

[0014] 2. In the utility model, a tension spring B is connected between the four end corners on the upper end of the pressure plate and the lower end of the raised plate, the movable column is located in the tension spring B, and the pressure plate is made of colorless metal. The tension spring B therein provides a downward elastic force, so that the entire tension spring B presses the pressure plate downward, so that the entire pressure plate can elastically squeeze the surface-mount electronic components on the PCB board. Compared with squeezing the surface-mount electronic components at the lower end by the pressure plate's own gravity, this setting further improves the squeezing and fixing performance of the pressure plate, and the fixing method is more convenient, making it difficult for the surface-mount electronic components to rotate on the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0016] Figure 2 It is a front view cutaway view of the utility model as a whole;

[0017] Figure 3 For this utility model Figure 2 A magnified section view at center A;

[0018] Figure 4 For this utility model Figure 2 A is a structural diagram of another embodiment.

[0019] In the figure: 1. support plate; 2. rotating block; 3. extension spring A; 4. raised plate; 5. clamping block; 6. through hole A; 7. rotating column; 8. movable column; 9. top block; 10. extension spring B; 11. pressure plate; 12. through hole B. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] See also Figures 1 to 3 , the utility model provides an embodiment: a pressure cover of an SMT furnace fixture, comprising a support plate 1, a raised plate 4 is provided in the middle of the support plate 1, a plurality of top blocks 9 are distributed in a rectangular array on the upper end of the raised plate 4, a movable column 8 is fixedly connected to the lower end of the top block 9, and a pressure plate 11 is fixedly connected to the lower end of each of the four movable columns 8, and a through hole A6 is penetrated at the four end corners around the support plate 1, and a rotating column 7 is movably provided in the through hole A6, and a rotating block 2 is fixedly connected to the upper end of the rotating column 7, and a clamping block 5 is fixedly connected to the lower end of the rotating column 7, and a tension spring A3 is fixedly connected between the surrounding of the lower end of the rotating block 2 and the upper end of the support plate 1, and the rotating column 7 is rotatably located in the through hole A6;

[0022] During operation, first place the SMD electronic components on the soldering position on the PCB, then place the PCB board with the electronic components on the lower end of the raised plate 4, wherein the upper end of the raised plate 4 is penetrated with a plurality of through holes B12, the movable column 8 is movably located in the through hole B12, and the pressing plate 11 is made of heavy metal material, then the whole movable column 8 and the pressing plate 11 fall downward due to gravity, and this arrangement enables the whole movable column 8 and the pressing plate 11 to squeeze the SMD electronic components on the PCB board by gravity;

[0023] Generally, the four corners of the internal table of the heating furnace are provided with fixing grooves. When the integral support plate 1 and the raised plate 4 are placed on the internal table of the heating furnace, the clamping block 5 at the lower end of the rotating block 2 is aligned with the fixing groove on the table. Then, the rotating block 2 is pressed, so that the rotating column 7 and the clamping block 5 at the lower end of the rotating block 2 move downward, so that the clamping block 5 is inserted into the fixing groove. Then, the integral rotating block 2 and the clamping block 5 are rotated so that the clamping block 5 is rotated and clamped to the inside of the fixing groove. Through the above settings and operations, the integral support plate 1 and the raised plate 4 are fixed on the internal table of the heating furnace. At the same time, through this operation, the surface-mount electronic components on the PCB board are squeezed by the upper movable column 8 and the pressing plate 11, so that the surface-mount electronic components are fixed on the PCB board by squeezing;

[0024] Figure 4Another embodiment provided by the utility model is disclosed: wherein the four end corners of the upper end of the pressing plate 11 and the lower end of the protruding plate 4 are connected with a stretch spring B10, the movable column 8 is located in the stretch spring B10, and the pressing plate 11 is made of colorless metal, and the stretch spring B10 provides a downward elastic force, so that the overall stretch spring B10 presses the pressing plate 11 downward, so that the overall pressing plate 11 can elastically squeeze the patch-type electronic components on the PCB board, and the weight of the pressing plate 11 itself can squeeze the patch at the lower end. Compared with the extrusion of chip-type electronic components, this arrangement further improves the extrusion and fixing performance of the pressing plate 11, and the fixing method is more convenient, so that the chip-type electronic components are not easy to rotate on the PCB board. When the entire PCB board is fixed on the internal table of the heating furnace, the heating furnace door can be closed, and the switch of the heating furnace can be turned on, so that the heating furnace heats the PCB board and the chip-type electronic components, so that the metal tin between the electronic components and the PCB board is melted, thereby realizing the welding process between the CB board and the chip-type electronic components.

[0025] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A gland for an SMT furnace fixture, comprising a support plate (1), characterized in that: A raised plate (4) is provided in the middle of the support plate (1), a plurality of top blocks (9) are distributed in a rectangular array on the upper end of the raised plate (4), a movable column (8) is fixedly connected to the lower end of each of the top blocks (9), a pressing plate (11) is fixedly connected to the lower end of each of the four movable columns (8), and a through hole A (6) is penetrated at the four end corners around the support plate (1), a rotating column (7) is movably provided in the through hole A (6), the upper end of the rotating column (7) is fixedly connected to the rotating block (2), and the lower end of the rotating column (7) is fixedly connected to the clamping block (5).

2. The gland of the SMT furnace fixture according to claim 1, characterized in that: A tension spring A (3) is fixedly connected between the four sides of the lower end of the rotating block (2) and the upper end of the supporting plate (1).

3. The gland of the SMT furnace fixture according to claim 2 is characterized in that: The rotating column (7) is rotatably located in the through hole A (6).

4. The gland of the SMT furnace fixture according to claim 1, characterized in that: The upper end of the raised plate (4) is penetrated by a plurality of through holes B (12), and the movable column (8) is movably located in the through holes B (12).

5. The gland of the SMT furnace fixture according to claim 4, characterized in that: The pressing plate (11) is made of heavy metal material.

6. The gland of the SMT furnace fixture according to claim 4, characterized in that: Extension springs B (10) are connected between the four end corners of the upper end of the pressure plate (11) and the lower end of the raised plate (4), and the movable column (8) is located inside the extension spring B (10).

7. The gland of the SMT furnace fixture according to claim 6, characterized in that: The pressing plate (11) is made of colorless metal.

Images