Circuit board solder paste printing device

By setting adjustment components in the circuit board solder paste printing device to adjust the angle of the circuit board, the scraping mechanism can scrape the solder paste from different angles, solving the problem of uneven application of solder paste, achieving uniform filling of solder paste in the mesh and improving printing quality.

CN222884901UActive Publication Date: 2025-05-16LUCKY TECH TONGLING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421872089.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-05
Publication Date
2025-05-16
Estimated Expiration
2034-08-05

AI Technical Summary

Technical Problem

The existing solder paste printing device can only scrape the solder paste in one direction, resulting in uneven application of the solder paste and cannot fully fill each mesh hole, thereby creating empty holes, affecting the quality of solder paste printing on the circuit board.

Method used

A circuit board solder paste printing device is designed. By setting up adjustment components, the angle of the circuit board can be adjusted so that the scraping mechanism can scrape the solder paste from different angles, ensuring the fullness of the solder paste in the mesh, and eliminating the gap during printing.

Benefits of technology

By scraping materials at different angles, the solder paste is evenly filled in the mesh, eliminating the gaps during printing, and avoiding the adhesion of the solder paste remaining on the steel mesh and the solder paste in the mesh.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222884901U_ABST
    Figure CN222884901U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of solder paste printing, in particular to a circuit board solder paste printing device which comprises a base, and a scraping mechanism and a supporting mechanism used for placing a circuit board are arranged on the base. Wherein the supporting mechanism comprises a rotating disc, the rotating disc is rotationally connected with the inner wall of the base, and an adjusting assembly is arranged at the bottom end of the rotating disc; the top end of the rotating disc penetrates through the base and is fixedly connected with a containing table, and the containing table is connected with a steel mesh through a limiting mechanism. According to the circuit board solder paste printing device, by arranging the adjusting assembly, the angle of the circuit board can be adjusted, the scraping mechanism can scrape solder paste from different angles, the situation that the filling degree of the solder paste is affected due to the fact that the solder paste is not evenly smeared is avoided, and holes in the solder paste printing process are eliminated. In addition, by scraping the materials from different angles, redundant solder paste can be scraped off more easily, and the solder paste remaining on the steel mesh is prevented from being adhered to the solder paste in the mesh holes.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste printing, in particular to a circuit board solder paste printing device. Background Art

[0002] During the production process of PCB boards, the first step of production, solder paste printing, is completed by a solder paste printer. Existing solder paste printers usually include a mounting table, a fixed frame fixedly connected to the mounting table, a solder paste scraping assembly slidably connected to the fixed frame, a screen, and a support plate fixedly connected to the fixed frame for supporting the circuit board. The staff first applies solder paste on the screen, scrapes the solder paste on the screen back and forth through the solder paste scraping assembly, and infiltrates the solder paste on the screen into the circuit board on the support plate, thereby completing the painting work.

[0003] The current solder paste printing device can only scrape the solder paste in one direction, and often the solder paste is not evenly applied, resulting in the solder paste not being able to completely fill each mesh hole, which in turn causes empty pores inside the solder paste, affecting the quality of solder paste printing on the circuit board. In view of this, we propose a solder paste printing device for a circuit board. Utility Model Content

[0004] The purpose of the embodiment of the utility model is to provide a circuit board solder paste printing device, which solves the problems in the background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A circuit board solder paste printing device comprises a base, on which a scraping mechanism and a supporting mechanism for placing the circuit board are arranged;

[0007] Wherein, the support mechanism comprises a turntable, the turntable is rotatably connected to the inner wall of the base, and an adjustment component is arranged at the bottom end of the turntable;

[0008] The top end of the turntable passes through the base and is fixedly connected with a placing table, and the placing table is connected with a steel net through a limiting mechanism.

[0009] Preferably, the adjustment assembly includes a connecting shaft, the top end of the connecting shaft is fixedly connected to the bottom end of the turntable, a worm wheel is rotatably connected to the connecting shaft, a worm is meshed with the surface of the connecting shaft, the worm is rotatably connected to the inner wall of the base, and one end of the worm passes through the base and is fixedly connected to a rotating handle.

[0010] Preferably, the limiting mechanism comprises a frame, and the inner wall of the frame is fixedly connected to the surface of the steel mesh;

[0011] The cross section of the placement platform is convex, the inner side wall and the bottom surface of the frame are both in contact with the surface of the placement platform, and a cavity for placing the circuit board is provided between the bottom surface of the steel mesh and the top surface of the placement platform.

[0012] Preferably, the limiting mechanism also includes a movable frame, the bottom end of which is hinged to the placement table, and the inner wall of the movable frame is elastically connected to a wedge block via a spring; grooves are provided on both sides of the frame, and the inner walls of the grooves abut against the surface of the wedge block.

[0013] Preferably, the top surface of the steel mesh, the top surface of the frame and the top surface of the movable frame are flush.

[0014] Preferably, the scraper mechanism includes a support plate, the bottom end of the support plate is fixedly connected to the base, a motor is fixedly mounted on the support plate, a reciprocating screw is fixedly mounted on the output end of the motor, a sliding seat is spirally driven on the surface of the reciprocating screw, and a scraper is fixedly connected to the bottom end of the sliding seat.

[0015] Preferably, a limit frame is fixedly connected to the support plate, a limit slider is slidably connected to the inner wall of the limit frame, and the bottom end of the limit slider is fixedly connected to the sliding seat.

[0016] By means of the above technical solution, the utility model provides a circuit board solder paste printing device. It has at least the following beneficial effects: the circuit board solder paste printing device can adjust the angle of the circuit board by setting an adjustment component, so that the scraping mechanism can scrape the solder paste from different angles, thereby avoiding the influence of the fullness of the solder paste filling due to the uneven application of the solder paste, and eliminating the pores during solder paste printing. In addition, scraping from different angles is also more conducive to scraping off excess solder paste, thereby avoiding the adhesion of the solder paste remaining on the steel mesh with the solder paste in the mesh. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0019] Figure 2 A cross-sectional view of the base in the embodiment of the utility model;

[0020] Figure 3 A schematic diagram of a worm gear in an embodiment of the utility model;

[0021] Figure 4 It is a cross-sectional view of the placement table and the frame in the embodiment of the utility model;

[0022] Figure 5 It is a schematic diagram of a frame in an embodiment of the utility model;

[0023] Figure 6 for Figure 5 A schematic diagram of the structure enlargement in the middle;

[0024] Figure 7 It is a schematic diagram of the scraping mechanism in the embodiment of the utility model.

[0025] In the figure: 1. base; 2. supporting mechanism; 21. turntable; 22. placing table; 23. connecting shaft; 24. worm gear; 25. worm; 26. turning handle; 3. steel mesh; 4. limiting mechanism; 41. frame; 42. movable frame; 43. wedge block; 5. scraper mechanism; 51. supporting plate; 52. motor; 53. reciprocating screw; 54. sliding seat; 55. scraper; 56. limiting frame; 57. limiting slider. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-Figure 7 , a technical solution provided by the utility model:

[0028] A circuit board solder paste printing device comprises a base 1, on which a scraping mechanism 5 and a supporting mechanism 2 for placing the circuit board are arranged, and the supporting mechanism 2 is connected to a steel mesh 3 through a limiting mechanism 4;

[0029] The support mechanism 2 includes a turntable 21, which is rotatably connected to the inner wall of the base 1. The top of the turntable 21 passes through the base 1 and is fixedly connected to a placement table 22 for placing a circuit board. The placement table 22 is connected to a steel mesh 3 through a limit mechanism 4. An adjustment component is provided at the bottom of the turntable 21 to adjust the angle of the support mechanism 2, and then the angle of the circuit board can be adjusted, so that the scraping mechanism 5 can scrape the solder paste from different angles, so that the solder paste is filled in the mesh more evenly and compactly, eliminating the gaps during printing. In addition, scraping at different angles is also more conducive to scraping off excess solder paste, avoiding the adhesion of the residual solder paste on the steel mesh 3 to the solder paste in the mesh.

[0030] See also Figure 2 and Figure 3The adjustment assembly includes a connecting shaft 23, the top of which is fixedly connected to the bottom of the turntable 21, the surface of which is rotatably connected to the inner wall of the base 1, a worm wheel 24 is rotatably connected to the connecting shaft 23, and a worm 25 is meshed on the surface of the connecting shaft 23. The angle of the turntable 21 is adjusted by meshing the worm wheel 24 with the worm 25, which can achieve self-locking to a certain extent and improve the stability of the turntable 21. The surface of the worm 25 is rotatably connected to the inner wall of the base 1, and one end of the worm 25 passes through the base 1 and is fixedly connected to a handle 26, which is convenient for adjusting the angle of the turntable 21.

[0031] See also Figure 4 The limiting mechanism 4 includes a frame 41, the inner wall of the frame 41 is fixedly connected to the surface of the steel mesh 3; the cross-section of the placement table 22 is a convex shape, and the inner wall and the bottom surface of the frame 41 are both in contact with the surface of the placement table 22, so as to achieve the purpose of positioning the steel mesh 3, and a cavity for placing a circuit board is provided between the bottom surface of the steel mesh 3 and the top surface of the placement table 22. When in use, the circuit board is first placed on the top of the placement table 22, and then the frame 41 and the steel mesh 3 are placed above the placement table 22, and the lower surface of the steel mesh 3 is in contact with the upper surface of the circuit board.

[0032] See also Figure 4-Figure 6 The limiting mechanism 4 also includes a movable frame 42, the bottom end of which is hinged to the side of the placing table 22, and the two inner side walls of the movable frame 42 are elastically connected with wedge blocks 43 through springs. The side of the wedge block 43 close to the steel mesh 3 is provided with an inclined surface, and the direction of force transmission can be changed through the inclined surface. During the rotation of the movable frame 42, when the wedge block 43 contacts the edge of the frame 41, the wedge block 43 can be pushed to both sides through the inclined surface, so that the spring is compressed. When the movable frame 42 stops rotating, the wedge block 43 can clamp the frame 41 under the elastic force of the spring, so as to achieve the purpose of limiting the frame 41. In coordination with this, grooves are provided on both sides of the frame 41, and the inner wall of the groove abuts against the surface of the wedge block 43. By setting the grooves, the top surface of the steel mesh 3, the top surface of the frame 41 and the top surface of the movable frame 42 are flush, so that the scraper mechanism 5 can move on the top of the limiting mechanism 4 and the steel mesh 3.

[0033] See also Figure 7 The scraper mechanism 5 includes two support plates 51, the bottom ends of the two support plates 51 are fixedly connected to the base 1, and the two support plates 51 are symmetrically distributed with the center line of the base 1 as the symmetry axis, a motor 52 is fixedly installed on one of the support plates 51, a reciprocating screw 53 is fixedly installed on the output end of the motor 52, the surface of the reciprocating screw 53 is rotatably connected to the inner wall of the support plate 51, the surface of the reciprocating screw 53 is spirally driven with a sliding seat 54, and the bottom end of the sliding seat 54 is fixedly connected with a scraper 55. When in use, the reciprocating screw 53 drives the sliding seat 54 to move back and forth, thereby driving the scraper 55 to scrape back and forth, thereby improving the convenience of use.

[0034] In order to limit the circular motion of the sliding seat 54 , a limit frame 56 is fixedly connected to the support plate 51 . A slide groove is provided inside the limit frame 56 . A limit slider 57 is slidably connected to the inner wall of the slide groove. The bottom end of the limit slider 57 is fixedly connected to the sliding seat 54 .

[0035] When the circuit board solder paste printing device of the utility model is used, the movable frame 42 is first opened to both sides so that the movable frame 42 is separated from the frame 41, and the frame 41 and the steel mesh 3 are removed. Then the circuit board to be printed is placed on the placement table 22, and the frame 41 and the steel mesh 3 are reset so that the lower surface of the steel mesh 3 fits the upper surface of the circuit board. Then the movable frame 42 is rotated upward so that the movable frame 42 is sleeved on the frame 41. During the movement of the movable frame 42, the inclined surface on the wedge block 43 will contact the edge of the frame 41. Then the wedge block 43 moves to both sides under the pressure of the inclined surface, so that the spring is compressed. When the movable frame 42 stops rotating, the wedge block 43 can clamp the frame 41 under the elastic force of the spring. Finally, solder paste is applied on the surface of the steel mesh 3, and the motor 52 is started. The output end of the motor 52 drives the reciprocating screw 53 to rotate. At this time, the sliding seat 54 cannot rotate with the reciprocating screw 53 due to the limiting effect of the limiting frame 56 and the limiting slider 57. Therefore, the sliding seat 54 will move back and forth along the axial direction of the reciprocating screw 53, and drive the scraper 55 to move back and forth, so that the solder paste on the steel mesh 3 fills the mesh holes. During the scraping process, the worm 25 can be driven to rotate by the rotating handle 26, and the worm 25 drives the worm wheel 24 to rotate by meshing, and the worm wheel 24 drives the turntable 21 to rotate through the connecting shaft 23, and then drives the placement table 22 to rotate. The placement table 22 drives the steel mesh 3 and the circuit board between the steel mesh 3 and the placement table 22 to rotate through the limiting mechanism 4, so that the angle between the steel mesh 3 and the circuit board changes, so that the solder paste can be scraped from different angles, so that the solder paste is filled more evenly and compactly in the mesh, eliminating gaps during printing. In addition, scraping at different angles is also more conducive to scraping off excess solder paste, avoiding the adhesion of the residual solder paste on the steel mesh 3 and the solder paste in the mesh.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board solder paste printing device, comprising a base (1), characterized in that: The base (1) is provided with a scraping mechanism (5) and a supporting mechanism (2) for placing a circuit board; Wherein, the support mechanism (2) comprises a turntable (21), the turntable (21) is rotatably connected to the inner wall of the base (1), and an adjustment component is arranged at the bottom end of the turntable (21); The top end of the rotating disk (21) passes through the base (1) and is fixedly connected to a placement table (22); the placement table (22) is connected to a steel mesh (3) via a limiting mechanism (4).

2. The circuit board solder paste printing device according to claim 1, characterized in that: The adjustment assembly comprises a connecting shaft (23), the top end of the connecting shaft (23) is fixedly connected to the bottom end of the rotating disk (21), a worm wheel (24) is rotatably connected to the connecting shaft (23), a worm (25) is meshed on the surface of the connecting shaft (23), the worm (25) is rotatably connected to the inner wall of the base (1), and one end of the worm (25) passes through the base (1) and is fixedly connected to a rotating handle (26).

3. The circuit board solder paste printing device according to claim 1, characterized in that: The limiting mechanism (4) comprises a frame (41), and the inner wall of the frame (41) is fixedly connected to the surface of the steel mesh (3); The cross section of the placement platform (22) is convex-shaped, the inner side wall and the bottom surface of the frame (41) are both in contact with the surface of the placement platform (22), and a cavity for placing a circuit board is provided between the bottom surface of the steel mesh (3) and the top surface of the placement platform (22).

4. The circuit board solder paste printing device according to claim 3, characterized in that: The limiting mechanism (4) also includes a movable frame (42), the bottom end of which is hinged to the placement table (22), and the inner side wall of the movable frame (42) is elastically connected to a wedge block (43) via a spring; grooves are provided on both sides of the frame (41), and the inner wall of the groove abuts against the surface of the wedge block (43).

5. The circuit board solder paste printing device according to claim 4, characterized in that: The top surface of the steel mesh (3), the top surface of the frame (41) and the top surface of the movable frame (42) are flush.

6. The circuit board solder paste printing device according to claim 1, characterized in that: The scraper mechanism (5) comprises a support plate (51), the bottom end of the support plate (51) is fixedly connected to the base (1), a motor (52) is fixedly mounted on the support plate (51), a reciprocating screw (53) is fixedly mounted on the output end of the motor (52), a sliding seat (54) is spirally driven on the surface of the reciprocating screw (53), and a scraper (55) is fixedly connected to the bottom end of the sliding seat (54).

7. The circuit board solder paste printing device according to claim 6, characterized in that: The support plate (51) is fixedly connected to a limit frame (56), the inner wall of the limit frame (56) is slidably connected to a limit slider (57), and the bottom end of the limit slider (57) is fixedly connected to a sliding seat (54).