Reflow soldering positioning and fixing structure based on PCB carrier

Abstract

The utility model discloses a reflow soldering positioning and fixing structure based on a PCB carrier. The reflow soldering positioning and fixing structure comprises a carrier plate, a cover plate, a film and a tearing film, the outer edge of the carrier plate vertically extends towards one side to form a four-direction surrounding groove body structure, the bottom of the carrier plate is sunken downwards to form a magnetic attraction area, and a step-shaped bearing table top is formed between the magnetic attraction area and the side wall of the carrier plate; the cover plate is in an iron sheet shape, and a plurality of back-welding opening parts are formed in the cover plate; a film is arranged on one side of the cover plate and is attached to the circuit board, and the back-welding opening part penetrates through the cover plate and the film at the same time; the back-welding opening part is covered with a tearing film covering the back-welding opening part; according to the utility model, the gold finger area on the circuit board can be shielded by magnetically fixing the iron cover sheet on the circuit board, so that a welding block is prevented from splashing due to high-temperature tin explosion when any area on the circuit board is subjected to tin soldering, the welding block is prevented from being attached to the gold finger area, gold finger contacts on the circuit board are effectively protected, and the service life of the circuit board is prolonged. And the conduction performance is improved, so that defective board scrapping caused by tin bonding of the golden finger can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing carriers, and in particular to a reflow soldering positioning and fixing structure based on a PCB carrier. Background Art

[0002] Reflow soldering is a soldering technology used to connect electronic components and circuit boards. It uses a heat source to melt the solder paste and solder the connecting parts between the electronic components and the circuit board.

[0003] During the reflow process, the solder blocks splashed by high-temperature tin explosion may adhere to any gold finger contact of the PCB. In order to solve this problem, in the prior art, a carrier is usually customized for the PCB, and a cover is used to cover the gold finger contact of the printed circuit board to prevent the solder blocks splashed by high-temperature tin explosion from adhering to the gold finger contact of the circuit board during the reflow process, thereby producing defective boards.

[0004] However, this cover has a poor fixing effect during actual use and is prone to wear of the gold finger area. Utility Model Content

[0005] The purpose of the utility model is to provide a reflow soldering positioning and fixing structure based on a PCB carrier to solve the technical problems in the prior art of poor fixing effect and easy wear of the gold finger when protecting the gold finger area on the circuit board from tin explosion and splashing.

[0006] In order to solve the above technical problems, the utility model specifically provides the following technical solutions:

[0007] The utility model provides a reflow soldering positioning and fixing structure based on a PCB carrier, comprising: a carrier plate, an outer edge of which vertically extends to one side to form a groove structure surrounded in four directions, the bottom of the carrier plate is recessed downward to form a magnetic attraction area, a stepped bearing table is formed between the magnetic attraction area and the side wall of the carrier plate for bearing the circuit board, and a plurality of magnetic blocks close to the circuit board are arranged in the magnetic attraction area; a cover plate, which is in the shape of an iron sheet, and a plurality of reflow soldering openings are opened on the cover plate, the opening positions of the reflow soldering openings correspond to the gold finger areas on the circuit board, and the cover plate is adsorbed on the circuit board through the magnetic attraction of the magnetic blocks; wherein a film is provided on one side of the cover plate to fit with the circuit board, and the reflow soldering openings penetrate the cover plate and the film at the same time; the reflow soldering openings are covered with a tear film covering them, and any gold finger area on the circuit board is exposed by tearing off the tear film.

[0008] Furthermore, the magnetic block is movably arranged at the bottom of the magnetic attraction area, and a removable cover is provided at the opening of the magnetic attraction area. The cover is provided with a magnetic hole, and the magnetic block is embedded in the cover through the magnetic hole; a magnetic iron plate is provided on the inner bottom of the carrier plate, and the magnetic block can be movably attracted to the magnetic iron plate.

[0009] Furthermore, the outer edge of the film extends toward one side thereof to surround the edge and a portion of the inner area of ​​the cover plate.

[0010] Furthermore, a support pad is provided on the film to support the cover plate on the circuit board.

[0011] Further, the film is arranged close to the opposite side edges of the cover sheet, and the film forms a hollow area in the middle of the cover sheet.

[0012] Furthermore, through holes are provided at four corners of the cover sheet, so that the cover sheet can be positioned through positioning holes provided on the circuit board through the through holes.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] The utility model can use the removable tear film on the iron cover sheet to shield the gold finger area on the circuit board by magnetically fixing the iron cover sheet on the circuit board, so as to avoid the splashing of solder blocks due to high-temperature tin explosion when soldering any area on the circuit board, so that the solder blocks are attached to the gold finger area, effectively protecting the gold finger contacts on the circuit board, improving the conduction performance thereof, and reducing the scrapping of defective boards caused by the sticking of tin on the gold fingers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0016] Figure 1 A three-dimensional structural diagram of a reflow soldering positioning and fixing structure based on a PCB carrier provided by the utility model;

[0017] Figure 2 for Figure 1 A top view of

[0018] Figure 3 for Figure 2 Enlarged view of middle Ⅰ;

[0019] Figure 4 for Figure 1 Exploded diagram of

[0020] Figure 5 for Figure 4 Enlarged view of middle II.

[0021] Figure 6 for Figure 4 Enlarged view of middle III;

[0022] Figure 7 This is a schematic structural diagram of a film in another embodiment of the present invention.

[0023] The numbers in the figure represent the following:

[0024] 10. Carrier board; 11. Magnetic area; 12. Carrier surface; 13. Magnetic block; 14. Cover plate; 141. Magnetic hole; 15. Magnetic iron plate; 20. Cover sheet; 21. Reflow opening; 22. Film; 23. Film tearing; 24. Support pad; 25. Through hole; 30. Circuit board; 31. Gold finger area; 32. Positioning hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] like Figure 1 As shown, the utility model provides a reflow soldering positioning and fixing structure based on a PCB carrier, comprising:

[0027] The outer edge of the carrier 10 vertically extends to one side to form a four-way surrounding slot structure. The bottom of the carrier 10 is recessed downward to form a magnetic attraction area 11. A stepped carrying table 12 is formed between the magnetic attraction area 11 and the side wall of the carrier 10 for carrying the circuit board 30. A plurality of magnetic blocks 13 close to the circuit board 30 are arranged in the magnetic attraction area 11.

[0028] The cover sheet 20 is an iron sheet, and a plurality of reflow openings 21 are formed on the cover sheet 20. The opening positions of the reflow openings 21 correspond to the gold finger areas 31 on the circuit board 30. The cover sheet 20 is adsorbed on the circuit board 30 by the magnetic attraction of the magnetic block 13.

[0029] Among them, a film 22 is provided on one side of the cover 20 to fit the circuit board 30, and the reflow opening 21 penetrates the cover 20 and the film 22 at the same time; the reflow opening 21 is covered with a tear film 23 covering it, and any gold finger area 31 on the circuit board 30 is exposed by tearing off the tear film 23.

[0030] The utility model provides a reflow soldering positioning and fixing structure based on a PCB carrier, which facilitates the reflow soldering process on the production line by placing a circuit board 30 in a special carrier board 10 and carrying it on a carrying table 12. During this operation, the gold finger area 31 on the circuit board 30 can be shielded by magnetically fixing an iron cover sheet 20 on the circuit board 30, thereby avoiding the splashing of solder blocks due to high-temperature tin explosion when soldering any area on the circuit board 30, causing the solder blocks to adhere to the gold finger area 31, effectively protecting the gold finger contacts on the circuit board 30, and improving its conduction performance, thereby reducing the scrapping of defective boards caused by gold finger tin sticking.

[0031] It should be noted that in the above embodiment, the operation process of placing the circuit board 30 on the carrier 10 can be completed by a robot suction cup or manual operation. Since there will be circuit boards 30 of different sizes and specifications in the production process, in this embodiment, the carrier 10 and the cover sheet 20 can be designed to adapt to the specifications of the circuit boards 30 of different sizes, so that each specification of the carrier 10 and the cover sheet 20 can be reused in the production of the same batch of products. For the tearing operation of the tear film 23, it can be carried out by fixed-point blowing or manual pre-tearing. The gold finger areas 31 to be soldered in the same batch of products are the same. Before soldering, the tear film 23 covering the reflow opening 21 on the gold finger area 31 to be soldered is torn off, and the tear film 23 covering the other reflow openings 21 is retained, thereby protecting the gold finger area 31 corresponding to the reflow opening 21, so that the soldering process of each gold finger area 31 does not affect each other, reducing the defective boards caused by gold finger sticking.

[0032] In order to flexibly adjust the magnetic force distribution generated by the magnetic block 13 in the magnetic attraction area 11, please refer to Figure 1 , 4 As shown in Figure 5, in a preferred embodiment of the utility model provided based on the above embodiments, the magnetic block 13 is movably arranged at the bottom of the magnetic attraction area 11, and a detachable cover plate 14 is provided at the opening of the magnetic attraction area 11. The cover plate 14 is provided with a magnetic hole 141, and the magnetic block 13 is embedded in the cover plate 14 through the magnetic hole 141; a magnetic iron plate 15 is provided on the inner bottom of the carrier plate 10, and the magnetic block 13 can be movably attracted to the magnetic iron plate 15.

[0033] In the above embodiment, the cover sheet 20 directly attached to the circuit board 30 will cause wear and scratches on its surface. The iron sheet-like cover sheet 20 is light in weight and easily disturbed by external forces and cannot be well attached to the circuit board 30, which is not convenient for the reflow soldering process.

[0034] In order to solve the above problems, Figure 4 , 6As shown, in the preferred embodiment provided by the present invention based on the above-mentioned embodiment, the outer edge of the film 22 extends toward one side thereof to surround the edge of the cover plate 20 and a part of the inner area.

[0035] In this embodiment, by arranging a film 22 around the edge of the cover sheet 20, it can replace it to contact the surface of the circuit board 30, thereby reducing the wear or scratches on the surface of the circuit board 30. The film 22 can be made of soft silicone.

[0036] Further, in order to prevent the cover sheet 20 and the film 22 from over-pressing the circuit board 30 and affecting the distribution of the circuits on the circuit board 30, please continue to refer to Figure 4 As shown, in a preferred embodiment of the present invention provided based on the above embodiments, a support pad 24 is provided on the film 22 to support the cover sheet 20 on the circuit board 30 .

[0037] In this embodiment, by providing the support pad 24 under the film 22, the film 22 and the circuit board 30 can be prevented from contacting each other, thereby preventing the overall combination of the cover sheet 20 and the film 22 from excessively pressing the circuit board 30, while also not hindering the protective effect of the tear film 23 on the cover sheet 20 on the gold finger area 31.

[0038] In another embodiment of the present invention, in order to solve the same problem as in the above embodiment, the cover sheet 20 and the film 22 are prevented from over-pressing the circuit board 30. Figure 7 As shown, in a preferred embodiment of the present invention provided based on the above embodiments, the film 22 is arranged close to the opposite side edges of the cover sheet 20 , and the film 22 forms a hollow area in the middle of the cover sheet 20 .

[0039] In this embodiment, the cover sheet 20 is supported by the film 22 itself, so that the cover sheet 20 can be supported on the edge of the circuit board 30, thereby avoiding direct contact between the circuit area of ​​the cover sheet 20 and the circuit board 30, thereby protecting the circuit board 30.

[0040] In the above embodiment, it is difficult to accurately position the cover sheet 20 on the circuit board 30 , so that the reflow opening 21 is difficult to expose the complete gold finger area 31 to assist the soldering operation.

[0041] In order to solve the above problems, Figure 2-4 As shown, in a preferred embodiment of the present invention based on the above embodiment, through holes 25 are provided at four corners of the cover sheet 20 so that the cover sheet 20 can be positioned through positioning holes 32 provided on the circuit board 30 through the through holes 25 .

[0042] In this embodiment, the positioning hole 32 provided on the circuit board 30 can be specially designed, or the original CCD hole on the board can be used as a positioning reference to position the cover plate 20 above the circuit board 30 .

[0043] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A reflow soldering positioning and fixing structure based on a PCB carrier, characterized in that: include: A carrier plate (10) having an outer edge extending vertically to one side to form a groove structure surrounded in four directions; the bottom of the carrier plate (10) is recessed downward to form a magnetic attraction area (11); a stepped bearing table (12) is formed between the magnetic attraction area (11) and the side wall of the carrier plate (10) for bearing a circuit board (30); a plurality of magnetic blocks (13) close to the circuit board (30) are provided in the magnetic attraction area (11); A cover sheet (20) is in the shape of an iron sheet, a plurality of reflow openings (21) are provided on the cover sheet (20), the opening positions of the reflow openings (21) correspond to the gold finger areas (31) on the circuit board (30), and the cover sheet (20) is adsorbed on the circuit board (30) by the magnetic attraction of the magnetic block (13); Wherein, a film (22) is provided on one side of the cover sheet (20) to fit the circuit board (30), and the reflow opening (21) penetrates the cover sheet (20) and the film (22) at the same time; The reflow opening (21) is covered with a tear film (23) thereon, and any gold finger area (31) on the circuit board (30) is exposed by tearing off the tear film (23).

2. A reflow soldering positioning and fixing structure based on a PCB carrier according to claim 1, characterized in that: The magnetic block (13) is movably arranged at the bottom of the magnetic attraction area (11); a detachable cover plate (14) is provided at the opening of the magnetic attraction area (11); a magnetic attraction hole (141) is provided on the cover plate (14); and the magnetic block (13) is embedded in the cover plate (14) through the magnetic attraction hole (141); A magnetic iron plate (15) is provided on the inner bottom of the carrier plate (10), and the magnetic block (13) can be movably attracted to the magnetic iron plate (15).

3. A reflow soldering positioning and fixing structure based on a PCB carrier according to claim 2, characterized in that: The outer edge of the film (22) extends toward one side thereof to surround the edge and a part of the inner area of ​​the cover sheet (20).

4. The reflow soldering positioning and fixing structure based on a PCB carrier according to claim 3, characterized in that: A support pad (24) is provided on the film (22) to support the cover sheet (20) on the circuit board (30).

5. The reflow soldering positioning and fixing structure based on a PCB carrier according to claim 4, characterized in that: The film (22) is arranged close to the opposite side edges of the cover sheet (20), and the film (22) forms a hollow area in the middle of the cover sheet (20).

6. A reflow soldering positioning and fixing structure based on a PCB carrier according to any one of claims 1 to 5, characterized in that: Through holes (25) are provided at four corners of the cover sheet (20), so that the cover sheet (20) can be positioned through positioning holes (32) provided on the circuit board (30) through the through holes (25).

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