Water drain suitable for water-cooled radiator of computer
By using multiple sets of heat sinks to form a heat dissipation component formed by superimposed groups, the problems of cumbersome assembly and poor heat dissipation performance of traditional water drains are solved, and more efficient energy exchange and longer service life of electronic products are achieved.
Patent Information
- Application Number
- CN202421957528.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-31
- Filing Date
- 2024-08-13
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-08-13
AI Technical Summary
Traditional water discharge is complicated when assembling and assembling PCB boards, has poor heat dissipation performance, and low energy exchange efficiency, which cannot meet the needs of high-performance electronic products.
Instead of the traditional heat sink, the heat sink assembly is formed by superimposed groups of heat sinks, and is equipped with accommodating space and through-holes to accommodate the liquid tube, which increases the contact area and energy exchange efficiency.
It simplifies the assembly process of water drains, improves heat dissipation performance and energy exchange efficiency, and extends the service life of electronic products.
Smart Images

Figure CN222887757U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of a water drain device, and in particular to a water drain suitable for a computer water cooling radiator. Background Technology
[0002] Water discharge is widely used in electronic products and is an indispensable part of the stable operation of electronic products. The heat dissipation effect of water discharge determines the performance of electronic equipment;
[0003] Traditional water radiators usually use wavy heat dissipation belts for heat dissipation. Since the water radiator is composed of multiple groups of heat dissipation belts and multiple groups of liquid pipes repeatedly arranged alternately, the assembly of the water radiator with this structure is relatively cumbersome during production. In addition, when assembling the PCB board on the water radiator, since the PCB board has a power interface and a power supply interface, the heat dissipation belt of the water radiator needs to be cut off to make way for the power interface and the power supply interface, which greatly increases the time efficiency of manual operation and the production cost of the product;
[0004] Only two ends of the heat dissipation belt are in contact with the liquid pipe, and the small contact area leads to low energy exchange efficiency and poor heat dissipation performance of the water row;
[0005] The existing water pipes can no longer meet the needs of today's high-performance electronic products, so further improvements and upgrades are needed. SUMMARY OF THE INVENTION
[0006] The purpose of the utility model is to provide a water drain suitable for a computer water cooling radiator designed to solve at least one technical problem in the background technology.
[0007] To achieve the above purpose, the utility model adopts the following scheme: a water drain suitable for a water cooling radiator of a computer, comprising a water drain body, on which a heat dissipation component, an upper water chamber, a lower water chamber, and a plurality of groups of liquid pipes are arranged, one end of the liquid pipe is communicated with the upper water storage space of the upper water chamber, and the other end of the liquid pipe is communicated with the lower water storage space of the lower water chamber, and a storage space for accommodating the liquid pipe is arranged on the heat dissipation component, and the liquid pipe is accommodated in the storage space of the heat dissipation component.
[0008] Wherein, a clearance space is provided on the heat dissipation component.
[0009] Wherein, the heat dissipation assembly includes multiple groups of heat dissipation fins, and the left and right ends of the heat dissipation fins are provided with bending parts, and multiple groups of the heat dissipation fins are superimposed to form the heat dissipation assembly.
[0010] Wherein, a through hole is provided at a position corresponding to the heat sink and the liquid pipe, and the through hole is provided through from one side of the heat sink to the other side of the heat sink to form the accommodation space.
[0011] Wherein, an opening is provided on one side of the heat sink, and the opening is communicated with the through hole.
[0012] Wherein, an extension piece is provided on the heat sink, and the extension piece protrudes and extends outward from the inner wall of the through hole.
[0013] Wherein, the protruding direction of the extension piece is the same as or opposite to the direction of the bending part.
[0014] Wherein, a bending piece is provided on the heat sink, and the bending pieces of adjacent heat sinks are in contact with each other.
[0015] Wherein, the extension length of the extension piece is close to or equal to the bending length of the bending part and / or the bending piece.
[0016] Wherein, multiple groups of the heat sinks are connected by a snap fit, welding or adhesion method.
[0017] Wherein, multiple groups of the through holes are provided, and the multiple groups of through holes are arranged at intervals on the heat sink.
[0018] Wherein, it includes a water row applicable to a computer water-cooled radiator with any of the above structures, and the water row body further includes an outer frame, and the outer frame is assembled on the left and right sides of the heat dissipation component.
[0019] Wherein, assembly holes are provided on the outer frame, and avoidance parts are provided at positions corresponding to the assembly holes on the heat dissipation component.
[0020] The advantages of the present utility model are as follows: This water row uses a heat dissipation component to replace the traditional structure with multiple groups of heat dissipation belts. The heat dissipation component is formed by stacking multiple groups of heat sinks into one body, and its structure is simple, making the assembly of the water row relatively easy. Moreover, there is a larger contact area between the heat dissipation component and the liquid pipe, improving the energy exchange between the heat dissipation component and the liquid pipe, enhancing the heat absorption performance of the water row during the operation of electronic components, and thus further improving the service life of electronic products. Description of the Drawings
[0021] Figure 1 It is a front view schematic diagram of a traditional water row;
[0022] Figure 2 It is a three-dimensional schematic diagram of a traditional water row;
[0023] Figure 3 It is a three-dimensional schematic of a water row applicable to a computer water-cooled radiator Figure 1 ;
[0024] Figure 4 It is a front view schematic of a water row applicable to a computer water-cooled radiator Figure 1 ;
[0025] Figure 5 Schematic three - dimensional view of the heat dissipation component Figure 1 ;
[0026] Figure 6 Schematic three - dimensional view of the heat sink Figure 1 ;
[0027] Figure 7 Schematic three - dimensional view of the heat sink Figure 2 ;
[0028] Figure 8 Front view schematic of the heat sink;
[0029] Figure 9 Top view schematic of the heat sink;
[0030] Figure 10 Schematic three - dimensional view of the water block applicable to the computer water - cooled radiator Figure 2 ;
[0031] Figure 11 Front view schematic of the water block applicable to the computer water - cooled radiator Figure 2 ;
[0032] Figure 12 Schematic three - dimensional view of the heat dissipation component Figure 2 ;
[0033] Figure 13 For Figure 12 Enlarged schematic view of part A in Detailed implementation manners
[0034] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The role of the drawings is to supplement the description in the text part of the specification, so as to be able to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model. However, it should not be construed as a limitation on the protection scope of the present utility model.
[0035] In the description of the present utility model, if it involves orientation description, such as "up", "down", "front", "rear", "left", "right", etc., the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the present utility model. When a certain feature is referred to as "set", "fixed", "connected" to another feature, it can be directly set, fixed, connected to another feature, or indirectly set, fixed, connected to another feature.
[0036] In the description of the present utility model, if "several" is involved, it means one or more; if "multiple" is involved, it means more than two; if "greater than", "less than", or "exceeding" is involved, it should be understood as not including the present number; if "above", "below", or "within" is involved, it should be understood as including the present number. If "first" or "second" is involved, it should be understood as being used to distinguish technical features, rather than indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features or implicitly specifying the sequence relationship of the indicated technical features.
[0037] In addition, unless otherwise defined, the technical terms and scientific terms used in the present utility model have the same meanings as those generally understood by those skilled in the technical field to which it belongs. The terms used in the present utility model are only for describing specific embodiments and are not intended to limit the present utility model. It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.
[0038] Embodiment:
[0039] As Figure 1-2 shown is a schematic diagram of a traditional water cooler.
[0040] As Figure 2-13 shown, a water cooler applicable to a computer water-cooled radiator includes a water cooler main body 1, and a heat dissipation assembly 10, an upper water chamber 20, a lower water chamber 30, and multiple groups of liquid pipes 40 are arranged on the water cooler main body 1. One end of the liquid pipe 40 is communicated with the upper water-containing space of the upper water chamber 20, and the other end of the liquid pipe 40 is communicated with the lower water-containing space of the lower water chamber 30. A receiving space 11 for accommodating the liquid pipe 40 is arranged on the heat dissipation assembly 10, and the liquid pipe 40 is accommodated in the receiving space 11 of the heat dissipation assembly 10. This type of water cooler uses a heat dissipation assembly to replace the structure of multiple groups of heat dissipation belts in the traditional one. The heat dissipation assembly is formed by stacking multiple groups of heat dissipation fins into one body, with a simple structure, making the assembly of the water cooler relatively easy. Moreover, there is a larger contact area between the heat dissipation assembly and the liquid pipe, improving the energy exchange between the heat dissipation assembly and the liquid pipe, enhancing the heat absorption performance of the water cooler during the operation of electronic components, and thus further improving the service life of electronic products.
[0041] Among them, multiple groups of the heat dissipation assemblies are arranged, and multiple groups of the heat dissipation assemblies are arranged vertically. Preferably, the heat dissipation assemblies are divided into two or three groups for easy and quick assembly.
[0042] Among them, a clearance space 13 is provided on the heat dissipation component 10. When the PCB board is assembled inside the water drain body, the power interface and the power supply interface provided on the PCB board are located inside the clearance space, so that the connection between the PCB board and the water drain body is more compact and is conducive to enhancing the stability of the connection between the various components.
[0043] Wherein, the liquid pipe is connected to the accommodating space of the heat dissipation component by interference fit.
[0044] Wherein, the heat dissipation assembly 10 includes multiple groups of heat dissipation fins 101, and the left and right ends of the heat dissipation fins 101 are provided with bending portions 102. Multiple groups of heat dissipation fins 101 are stacked to form the heat dissipation assembly 10. The provision of the bending portions increases the contact area between adjacent heat dissipation fins and is conducive to improving the stability of the overall structure when multiple groups of heat dissipation fins are stacked on each other.
[0045] Wherein, a through hole 103 is provided at a position corresponding to the heat sink 101 and the liquid pipe 40, and the through hole 103 is provided from one side of the heat sink 101 to the other side of the heat sink 101 to form the accommodation space 11.
[0046] An opening 104 is provided on one side of the heat sink 101, and the opening 104 is connected to the through hole 103. The provision of the opening is conducive to improving the assembly speed of the heat sink assembly during the production of the water drain.
[0047] During assembly, first align the opening of the heat sink assembly with the liquid pipe, and then push the heat sink assembly in the direction of the liquid pipe to complete the assembly of the heat sink assembly, greatly improving the assembly efficiency.
[0048] Wherein, an extension piece 105 is provided on the heat sink 101, and the extension piece 105 protrudes outward from the inner wall of the through hole 103, and the contact area between the heat sink and the liquid pipe is increased by providing the extension piece.
[0049] Wherein, the heat sink 101 is provided with a bending piece 106, and the bending pieces 106 of adjacent heat sinks 101 are in contact with each other. The provision of the bending piece increases the contact area between adjacent heat sinks and is conducive to improving the stability of the overall structure when multiple groups of heat sinks are stacked on each other.
[0050] Wherein, the protruding direction of the extension piece 105 is consistent with or opposite to the direction of the bending portion 102 and / or the bending piece 106.
[0051] Wherein, the extension length of the extension piece 105 is close to or equal to the bending length of the bending portion 102 and / or the bending piece 106.
[0052] Wherein, the extension piece is arranged on a side of the heat sink away from the opening.
[0053] Wherein, multiple groups of the extension pieces are provided, and the multiple groups of extension pieces are arranged at intervals.
[0054] Wherein, between multiple groups of the heat sinks 101, they are connected by a snap-fit or welding or adhesion method, and the multiple groups of heat sinks form a heat dissipation assembly, which is convenient for the assembly during the production of the water radiator, greatly shortening the assembly time and improving the production efficiency of the product.
[0055] Wherein, multiple groups of the through holes 103 are provided, and the multiple groups of through holes 103 are arranged at intervals and distributed on the heat sink 101.
[0056] Wherein, it includes the water radiator applicable to the computer water-cooled radiator with any of the above structures. The water radiator body 1 further includes an outer frame 50. The outer frame 50 is assembled on the left and right sides of the heat dissipation assembly 10. Assembly holes 51 are provided on the outer frame 50, and avoidance parts 12 are provided at positions corresponding to the assembly holes 51 on the heat dissipation assembly 10. The assembly holes are used for the assembly of screws, and the avoidance parts avoid the screws.
[0057] This water radiator uses a heat dissipation assembly to replace the traditional structure with multiple groups of heat dissipation belts. The heat dissipation assembly is formed by stacking multiple groups of heat sinks into one body. Its structure is simple, making the assembly of the water radiator relatively easy. Moreover, there is a larger contact area between the heat dissipation assembly and the liquid pipe, improving the energy exchange between the heat dissipation assembly and the liquid pipe, enhancing the heat absorption performance of the water radiator during the operation of electronic components, and thus further improving the service life of electronic products.
[0058] As mentioned above, the above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or replacements, and these modifications or replacements should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims
1. A water drain for a water cooling radiator of a computer, comprising a water drain body, on which a heat dissipation component, an upper water chamber, a lower water chamber, and a plurality of liquid pipes are arranged, one end of the liquid pipe is connected to the upper water storage space of the upper water chamber, and the other end of the liquid pipe is connected to the lower water storage space of the lower water chamber, characterized in that: The heat dissipation component is provided with an accommodating space for accommodating a liquid pipe, and the liquid pipe is accommodated in the accommodating space of the heat dissipation component.
2. The water drain for a computer water cooling radiator according to claim 1, characterized in that: The heat dissipation component includes a plurality of groups of heat dissipation fins, and bending portions are arranged at the left and right ends of the heat dissipation fins. The plurality of groups of heat dissipation fins are stacked to form the heat dissipation component.
3. The water drain for a computer water cooling radiator according to claim 1, characterized in that: A clearance space is arranged on the heat dissipation component.
4. The water drain for a computer water cooling radiator according to claim 2, characterized in that: Through holes are provided at locations corresponding to the heat sink and the liquid pipe, and the through holes are provided through one surface of the heat sink to the other surface of the heat sink to form the accommodation space.
5. The water drain for a computer water cooling radiator according to claim 4, characterized in that: An opening is provided on one side of the heat sink, and the opening is communicated with the through hole.
6. The water drain for a computer water cooling radiator according to claim 4, characterized in that: An extension piece is arranged on the heat sink, and the extension piece is extended and protrudes outward from the inner wall of the through hole.
7. The water drain for a computer water cooling radiator according to claim 6, characterized in that: The protruding direction of the extension piece is consistent with or opposite to the direction of the bending portion.
8. The water drain for a computer water cooling radiator according to claim 2, characterized in that: The heat sink is provided with a bending piece, and the bending pieces of adjacent heat sinks are in contact with each other.
9. The water drain for a computer water cooling radiator according to claim 6, characterized in that: The extension length of the extension piece is close to or equal to the bending length of the bending portion.
10. The water drain for a computer water cooling radiator according to any one of claims 1 to 9, characterized in that: The water drain body also includes an outer frame, and the outer frame is assembled on the left and right sides of the heat dissipation component.