Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The utility model relates to a driving mechanism, and more specifically, to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens driving module to drive an optical element to move, thereby achieving the functions of auto focusing (AF) and optical image stabilization (OIS), wherein light can pass through the aforementioned optical element and form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and improve its stability and reliability has become an important challenge for researchers in this technical field. Utility Model Content

[0005] The purpose of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, wherein the driving mechanism comprises a fixed portion, a movable portion, and a driving assembly. The movable portion is connected to the fixed portion, the optical element is disposed on the movable portion, and the driving assembly is used to drive the optical element to move relative to the fixed portion.

[0007] In one embodiment, the driving mechanism further includes a substrate, the fixed portion includes an outer frame, and the movable portion includes an elastic circuit board, wherein at least a portion of the circuit board is located between the substrate and the outer frame.

[0008] In one embodiment, the substrate is formed with a groove, and the circuit board has a conductive terminal portion, wherein the conductive terminal portion is located in the groove.

[0009] In one embodiment, when viewed along a horizontal direction, the conductive terminal portion at least partially overlaps with the substrate, and the horizontal direction is perpendicular to an optical axis of the optical element.

[0010] In one embodiment, a bottom surface of the conductive terminal portion is aligned with a lower surface of the substrate.

[0011] In one embodiment, the optical element is an image sensor.

[0012] In one embodiment, the substrate shields the circuit board.

[0013] In one embodiment, the circuit board is electrically connected to the substrate.

[0014] In one embodiment, the hardness of the substrate is greater than the hardness of the circuit board.

[0015] In one embodiment, the driving mechanism further includes a first module, a second module and a third module which are interconnected, wherein the first module includes the outer frame, the circuit board, the driving assembly, a first shell and a first optical mirror disposed in the first shell, and the outer frame is connected to the first shell, wherein the second module includes a second shell and a second optical mirror disposed in the second shell, and the third module includes a third shell, a third optical mirror disposed on the third shell and the substrate, wherein the substrate is fixed to the bottom side of the third shell.

[0016] In one embodiment, the second module is located between the first module and the third module, wherein the first and third optical lenses are prisms, the second optical lens is a lens, and the optical element is an image sensor.

[0017] In one embodiment, the first module further includes a first frame and a second frame disposed on the circuit board, the second frame is located between the first frame and the outer frame, and the driving component includes a first coil and a first magnet, wherein the first coil is disposed on the first frame, and the first magnet is disposed on the second frame.

[0018] In one embodiment, the driving component further includes a second coil and a second magnet, wherein the second coil is disposed on the second frame, and the second magnet is disposed on the outer frame.

[0019] In one embodiment, the outer frame, the first frame and the second frame are all in a U-shape, and the openings of the outer frame, the first frame and the second frame are all facing the same direction.

[0020] In one embodiment, the first coil surrounds an optical axis of the optical element, and the optical axis passes through the first optical mirror.

[0021] In one embodiment, the first module further includes a first frame and a second frame, the second frame is located between the first frame and the outer frame, and the driving component includes a first coil, a second coil and a common magnet, wherein the first coil is arranged on the first frame, the common magnet is arranged on the second frame, the second coil is arranged on a lower surface of the first shell, and the positions of the first and second coils are adjacent to the common magnet.

[0022] In one embodiment, the circuit board has a first connection portion, a second connection portion and a first elastic structure, the first frame is fixed on the first connection portion, the second frame is fixed on the second connection portion, and the first elastic structure connects the first and second connection portions.

[0023] In one embodiment, the circuit board further has a third connection portion and a second elastic structure, the outer frame is fixed to the third connection portion, and the second elastic structure connects the second and third connection portions.

[0024] In one embodiment, the outer frame is fixed on the substrate.

[0025] In one embodiment, the circuit board has an extension portion extending from the first module, through the second module and reaching the third module.

[0026] In one embodiment, the extension portion is formed with a through hole for accommodating a portion of the driving component.

[0027] In one embodiment, the extension portion has a C-shaped structure and is parallel to an optical axis of the optical element.

[0028] In one embodiment, the fixed portion includes an outer frame, the movable portion includes a flexible circuit board, and the driving mechanism also includes a first frame and a second frame disposed on the circuit board, wherein the driving component is disposed on the outer frame, the first frame and the second frame, and the second frame is located between the first frame and the outer frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A three-dimensional diagram showing a driving mechanism according to an embodiment of the utility model.

[0030] Figure 2 express Figure 1 Another perspective stereogram of the drive mechanism in .

[0031] Figure 3 express Figure 1 and Figure 2 Exploded diagram of the drive mechanism in .

[0032] Figure 4 express Figure 3 An exploded view of the first module in the .

[0033] Figure 5 A three-dimensional diagram showing the first module after assembly with the first housing and the first optical mirror removed.

[0034] Figure 6 Another perspective view of the first module after assembly with the first housing and the first optical mirror removed.

[0035] Figure 7 Indicates along Figure 2 Cross-sectional view along line segment A1-A2 in FIG.

[0036] Figure 8 Indicates along Figure 2 A cross-sectional view of line segment A3-A4 in FIG.

[0037] Fig. 9 A three-dimensional diagram showing a driving mechanism according to another embodiment of the present invention.

[0038] Fig.10 express Fig. 9 An exploded view of the first module in the .

[0039] Fig.11 A cross-sectional view showing a driving mechanism according to another embodiment of the present invention.

[0040] Fig.12 A partial enlarged view showing a driving mechanism according to another embodiment of the utility model.

[0041] Fig.13 and Fig.14 A three-dimensional diagram showing a driving mechanism according to another embodiment of the present invention.

[0042] Fig.15 express Fig.13 and Fig.14 An exploded view of the first module in the .

[0043] Fig.16 express Figure 13 to Figure 15 An exploded view of the first module after removing the first shell and the first optical mirror.

[0044] Fig.17 Exploded view showing the optical components and circuit board before assembly.

[0045] Fig.18 A schematic diagram showing that the extended portion of the circuit board passes through the second module and reaches the third module along the -Y axis direction.

[0046] Fig.19A three-dimensional diagram showing a driving mechanism according to another embodiment of the present invention.

[0047] Fig. 20 express Fig.19 Exploded diagram of the drive mechanism.

[0048] The reference numerals are as follows:

[0049] 100: Driving mechanism

[0050] 10: First module

[0051] 11: First shell

[0052] 111: Lower surface

[0053] 20: Second module

[0054] 21: Second shell

[0055] 22: Second optical mirror

[0056] 30: The third module

[0057] 31: The third shell

[0058] 200: Driving mechanism

[0059] 300: Driving mechanism

[0060] 400: Driving mechanism

[0061] 401: First optical mirror

[0062] 402: First shell

[0063] B:Substrate

[0064] B1: Lower surface

[0065] B10: Groove

[0066] BL:Ball

[0067] C1: First coil

[0068] C2: Second coil

[0069] C3: The third coil

[0070] F1: First Frame

[0071] F2: Second frame

[0072] H: Outer frame

[0073] L: Light

[0074] M1: First magnet

[0075] M2: Second magnet

[0076] M3: The third magnet

[0077] M12: Shared magnet

[0078] O: Optical axis

[0079] P: The third optical mirror

[0080] Q: Circuit board

[0081] Q1: First connection

[0082] Q12: The first elastic structure

[0083] Q2: Second connection

[0084] Q23: Second elastic structure

[0085] Q3: The third connection

[0086] Q4: Conductive terminal

[0087] Q41: Bottom

[0088] Q42:Metal Contact

[0089] QC: Extension

[0090] QC1: Perforation

[0091] R: First optical mirror

[0092] W: Outer frame DETAILED DESCRIPTION

[0093] The following describes the drive mechanism of the embodiment of the utility model. However, it is easy to understand that the embodiment of the utility model provides many suitable utility model concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the utility model in a specific way, and are not used to limit the scope of the utility model.

[0094] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0095] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and not to limit the present invention.

[0096] First, please refer to Figures 1 to 3 ,in Figure 1 A three-dimensional diagram showing a driving mechanism 100 according to an embodiment of the present utility model is shown. Figure 2 express Figure 1 Another perspective view of the driving mechanism 100, Figure 3 express Figure 1 and Figure 2 Exploded view of the drive mechanism 100 in FIG.

[0097] like Figure 1 , Figure 2 and Figure 3 As shown, the driving mechanism 100 of the present embodiment includes a voice coil motor (VCM), and can be installed in a mobile phone or other portable electronic device to drive an optical mirror (such as a lens or a prism) to move, thereby achieving functions such as auto focusing (AF) and / or optical image stabilization (OIS).

[0098] The driving mechanism 100 mainly includes a first module 10, a second module 20 and a third module 30 which are interconnected, wherein the first module 10 includes a first shell 11, an outer frame W, a first optical lens R (such as a prism) and a flexible circuit board Q, wherein the first optical lens R is arranged inside the first shell 11, and the outer frame W connects the first shell 11 and the circuit board Q.

[0099] The second module 20 is located between the first module 10 and the third module 30, and mainly includes a second shell 21 and a second optical mirror 22 (such as a lens) fixed on the shell 21; in addition, the third module 30 includes a third shell 31, a third optical mirror P (such as a prism) and a substrate B (such as a printed circuit board), wherein the third optical mirror P is arranged on the top side of the third shell 31, and the substrate B is fixed on the bottom side of the third shell 31 to shield and carry the circuit board Q, wherein the hardness of the substrate B is greater than the hardness of the circuit board Q.

[0100] from Figure 1 and Figure 2It can be seen that when the driving mechanism 100 is assembled, at least a portion of the aforementioned circuit board Q is located between the aforementioned substrate B and the outer frame W, wherein the circuit board Q can be electrically connected to the substrate B, thereby enabling the circuit board Q and the substrate B to be integrated together to simplify the circuit structure and save space.

[0101] Specifically, the external light L can enter the third optical mirror P (such as Figure 8 As shown), the light will be refracted by the third optical mirror P and pass through the second optical mirror 22 along the Y-axis direction. Then the light will enter the first optical mirror R and be refracted by the first optical mirror R along the -Z-axis direction to reach an optical element S (such as an image sensor) located in the center of the circuit board Q to generate a digital image.

[0102] Figure 4 express Figure 3 An exploded view of the first module 10 in FIG. Figure 5 A three-dimensional diagram showing the first module 10 after assembly with the first housing 11 and the first optical lens R removed, Figure 6 Another perspective view showing the first module 10 after assembly with the first housing 11 and the first optical lens R removed, Figure 7 Indicates along Figure 2 The cross-sectional view of the line segment A1-A2 in FIG. Figure 5 and Figure 6 It can be seen that the circuit board Q of the first module 10 and the base plate B of the third module 30 are connected to each other.

[0103] like Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the circuit board Q of this embodiment is elastic and can be used as a movable part of the driving mechanism 100, which mainly includes a first connecting part Q1, a second connecting part Q2, a third connecting part Q3, a conductive terminal part Q4, a first elastic structure Q12 and a second elastic structure Q23. The first connecting part Q1 and the second connecting part Q2 are connected to each other through the slender and tortuous first elastic structure Q12, and the second connecting part Q2 and the third connecting part Q3 are connected to each other through the slender and tortuous second elastic structure Q23; in addition, the conductive terminal part Q4 protrudes from one side of the third connecting part Q3 toward the X-axis direction, and the coil and the optical element S arranged inside the first module 10 can be electrically connected to the circuit board Q, and can be further connected to the external circuit through the conductive terminal part Q4.

[0104] On the other hand, the outer frame W of the first module 10 is used as a fixed part of the driving mechanism 100, wherein a first frame F1 and a second frame F2 are provided inside the outer frame W. It should be particularly noted that the outer frame W, the first frame F1 and the second frame F2 are all in a U-shape, and their openings are all facing the same direction (-Y axis direction), the first frame F1 is fixed on the first connecting part Q1, the second frame F2 is fixed on the second connecting part Q2, and the outer frame W is fixed on the third connecting part Q3.

[0105] from Figure 4 , Figure 5 , Figure 6 and Figure 7 It can be seen that two first coils C1 are provided on the outer surface of the aforementioned first frame F1, and two first magnets M1 are provided on the inner side of the aforementioned second frame F2, corresponding to the aforementioned first coils C1, wherein the aforementioned second frame F2 is located between the first frame F1 and the outer frame W, and the aforementioned optical element S is arranged in the center of the first connecting portion Q1.

[0106] In addition, two second magnets M2 and one third magnet M3 are provided on the outer side of the second frame F2, and two second coils C2 and one third coil C3 are provided on the inner side of the outer frame W, wherein the position of the second coil C2 corresponds to the second magnet M2, and the position of the third coil C3 corresponds to the third magnet M3.

[0107] It should be particularly noted that the first connection part Q1, the second connection part Q2, the first elastic structure Q12, the second elastic structure Q23 of the aforementioned circuit board Q and the optical element S arranged in the center of the circuit board Q will be separated from the substrate B by a gap, while the third connection part Q3 and the conductive terminal part Q4 can be fixed on the substrate B by bonding or welding.

[0108] In detail, the aforementioned first, second and third coils C1, C2, C3 and the first, second and third magnets M1, M2, M3 can constitute a driving component in the driving mechanism 100, which is used to drive the aforementioned optical element S to move; wherein, when the current signal is passed into the first coil C1, an electromagnetic driving force parallel to the Z-axis direction can be generated between the first coil C1 and the first magnet M1, thereby driving the optical element S in the center of the first connecting part Q1 and the first frame F1 to move relative to the second frame F2 along the direction parallel to the Z-axis, so as to achieve auto focus (AF) and / or optical image stabilization (OIS) function in the Z-axis direction.

[0109] Secondly, when the current signal is passed into the second coil C2, an electromagnetic driving force parallel to the X-axis direction can be generated between the second coil C2 and the second magnet M2, thereby driving the second connecting part Q2 and the second frame F2 to move relative to the outer frame W along the direction parallel to the X-axis, so that the driving mechanism 100 can have the function of optical image stabilization (OIS) in the X-axis direction.

[0110] Similarly, when the current signal is passed into the third coil C3, an electromagnetic driving force parallel to the Y-axis direction can be generated between the third coil C3 and the third magnet M3, thereby driving the second connecting part Q2 and the second frame F2 to move relative to the outer frame W along the direction parallel to the Y-axis, so that the driving mechanism 100 can also have the function of optical image stabilization (OIS) in the Y-axis direction.

[0111] In this embodiment, a ball bearing BL is further provided between the first frame F1 and the second frame F2, so that the first frame F1 can be more stable when sliding relative to the second frame F2 along the Z-axis direction, thereby improving the reliability of the driving mechanism 100 and the accuracy of imaging.

[0112] Figure 8 Indicates along Figure 2 The cross-sectional view of the line segment A3-A4 in FIG. Figure 8 As shown, the external light L can enter the third optical mirror P along the -Z axis direction (as shown in FIG. Figure 8 As shown), the light will be refracted by the third optical mirror P and pass through the second optical mirror 22 along the Y-axis direction. Then the light will enter the first optical mirror R and be refracted by the first optical mirror R and reach the optical element S located in the center of the circuit board Q along the -Z-axis direction to generate a digital image.

[0113] Fig. 9 A three-dimensional diagram showing a driving mechanism 200 according to another embodiment of the present invention. Fig.10 express Fig. 9 An exploded view of the first module 10 in FIG.

[0114] like Fig. 9 and Fig.10 As shown, the driving mechanism 200 and Figures 1 to 8 The main difference of the driving mechanism 100 is that the first coil C1 of this embodiment is arranged above the first frame 10 and surrounds the optical axis O of the optical element S (such as an image sensor) in the center of the circuit board Q, wherein the aforementioned optical axis O passes through the first coil C1 and the first optical mirror R.

[0115] In addition, in this embodiment, the common magnet M12 replaces the aforementioned first magnet M1 and the second magnet M2, wherein an electromagnetic driving force parallel to the Z-axis direction can be generated between the first coil C1 and the common magnet M12, and an electromagnetic driving force parallel to the X-axis direction can be generated between the second coil C2 and the common magnet M12. In this way, the driving mechanism 200 can not only have the functions of auto focus (AF) and / or optical image stabilization (OIS), but also can reduce its width in the X-axis direction, thereby helping to achieve miniaturization of the overall size of the electronic device.

[0116] Fig.11 A cross-sectional view showing a driving mechanism of another embodiment of the utility model. Fig.11 As shown, this embodiment and Figures 1 to 8 The main difference of the driving mechanism 100 is that the present embodiment replaces the first magnet M1 and the second magnet M2 with a common magnet M12 , and the second coil C2 is disposed on the lower surface 111 of the first housing 11 and adjacent to the common magnet M12 .

[0117] from Fig.11 It can be seen that the first connection part Q1, the second connection part Q2, the first elastic structure Q12, the second elastic structure Q23 of the aforementioned circuit board Q and the optical element S arranged in the center of the circuit board Q are separated from the substrate B by a gap, and the third connection part Q3 and the conductive terminal part Q4 can be fixed on the substrate B by bonding or welding.

[0118] Through the above-mentioned mechanism configuration, an electromagnetic driving force parallel to the Z-axis direction can be generated between the first coil C1 and the common magnet M12, and an electromagnetic driving force perpendicular to the Z-axis direction can be generated between the second coil C2 and the common magnet M12; in this way, the driving mechanism can not only have the functions of autofocus (AF) and / or optical image stabilization (OIS), but also can further reduce its width in the X-axis direction, thereby helping to achieve miniaturization of the overall size of the electronic device.

[0119] Fig.12 A partial enlarged view of the driving mechanism of another embodiment of the utility model is shown. Fig.12 As shown, in order to effectively reduce the thickness of the driving mechanism in the Z-axis direction to achieve miniaturization of the product, a groove B10 can be formed on the substrate B of the present embodiment, wherein the conductive terminal portion Q4 protruding from the side of the circuit board Q can be bent relative to the third connecting portion Q3 and embedded in the groove B10 on the side of the substrate B.

[0120] That is, when viewed along the horizontal direction (X-axis or Y-axis direction), the conductive terminal portion Q4 at least partially overlaps with the substrate B. In one embodiment, the bottom surface Q41 of the conductive terminal portion Q4 can be aligned with the lower surface B1 of the substrate B, wherein a plurality of metal contacts Q42 are disposed on the bottom surface Q41 of the conductive terminal portion Q4, and the aforementioned metal contacts Q42 can be electrically connected to an external circuit without passing through the aforementioned substrate B.

[0121] Fig.13 and Fig.14 A three-dimensional diagram showing a driving mechanism 300 according to another embodiment of the present invention. Fig.15 express Fig.13 and Fig.14 An exploded view of the first module 10 in FIG.

[0122] like Fig.13 , Fig.14 and Fig.15 As shown, this embodiment and Figures 1 to 8 The main difference of the driving mechanism 100 is that the circuit board Q of this embodiment is formed with two long strip extensions QC for electrically connecting the coil and the optical element S (such as an image sensor) inside the first module 10 to the circuit (not shown) inside the third module 30.

[0123] In addition, from Fig.15 It can be seen that the first shell 11, the second shell 21, and the third shell 31 of the first module 10, the second module 20, and the third module 30 are fixed to each other, or can also be made by an integral molding method, but is not limited to the disclosed embodiment of the utility model.

[0124] Please also refer to Fig.16 , Fig.17 and Fig.18 ,in Fig.16 express Figure 13 to Figure 15 An exploded view of the first module 10 after removing the first housing 11 and the first optical lens R, Fig.17 An exploded view showing the optical component S and the circuit board Q before assembly. Fig.18 A schematic diagram showing the extension portion QC of the circuit board Q passing through the second module 20 and reaching the third module 30 along the −Y axis direction.

[0125] like Fig.16 and Fig.17 As shown, the circuit board Q of this embodiment has a first connecting portion Q1, a second connecting portion Q2, a first elastic structure Q12 and two extension portions QC, wherein the first connecting portion Q1 and the second connecting portion Q2 are connected to each other via a slender and tortuous first elastic structure Q12, and the extension portion QC is connected to the second connecting portion Q2 and can be bent relative to the second connecting portion Q2 to make it parallel to the optical axis O.

[0126] On the other hand, a first frame F1 and a second frame F2 are provided inside the outer frame W of the first module 10. It should be particularly noted that the outer frame W, the first frame F1 and the second frame F2 are all in a U-shape, and their openings are all facing the same direction (-Y axis direction), the first frame F1 is fixed on the first connection part Q1, the second frame F2 is fixed on the second connection part Q2, and the outer frame W is fixed on the substrate B.

[0127] from Fig.16 It can be seen that two first coils C1 are provided on the outer surface of the aforementioned first frame F1, and two first magnets M1 are provided on the inner side of the aforementioned second frame F2, corresponding to the aforementioned first coils C1, wherein the aforementioned second frame F2 is located between the first frame F1 and the outer frame W, and the aforementioned optical element S (for example, an image sensor) is arranged in the center of the first connecting portion Q1.

[0128] In addition, two second magnets M2 and one third magnet M3 are provided on the outer side of the second frame F2, and two second coils C2 and one third coil C3 are provided on the inner side of the outer frame W, wherein the position of the second coil C2 corresponds to the second magnet M2, and the position of the third coil C3 corresponds to the third magnet M3.

[0129] It should be particularly noted that, in this embodiment, a portion of the circuit board Q is bent to form two extension portions QC with a C-shaped structure, wherein the extension portion QC is parallel to the optical axis O and is located between the outer frame W and the second frame F2, so as to electrically connect the coil and the optical element S inside the first module 10 to the circuit inside the third module 30.

[0130] from Fig.16 and Fig.17 As can be seen in FIG. 1 , a through hole QC1 is formed on the extension portion QC, which can be used to accommodate the second magnet M2 , thereby greatly reducing the size of the driving mechanism 300 in the X-axis direction.

[0131] Then, if Fig.18 As shown, the external light L can enter the third optical lens P along the -Z axis direction, and then the light will sequentially pass through the third optical lens P, the second optical lens 22 and the first optical lens R to reach the optical element S located in the center of the circuit board Q, thereby generating a digital image. Among them, the two extensions QC of the circuit board Q pass through the second module 20 along the -Y axis direction to reach the inside of the third module 30, thereby electrically connecting the electrical contacts (not shown) located on the inner side surface 311 of the third housing 31, so that the internal space of the driving mechanism 300 can be effectively utilized, so as to facilitate the miniaturization of the overall volume of the electronic device.

[0132] Fig.19 A three-dimensional diagram showing a driving mechanism 400 according to another embodiment of the present invention. Fig. 20 express Fig.19 An exploded view of the drive mechanism 400.

[0133] like Fig.19 and Fig. 20 As shown, the driving mechanism 400 of another embodiment of the present invention mainly includes a first optical mirror 401, a first shell 402, an outer frame H (fixed part), a circuit board Q (movable part) and an optical element S (such as an image sensor).

[0134] Specifically, the first optical mirror 401 (such as a lens) is fixed at the center of the first shell 402, the outer frame H connects the first shell 402 and the circuit board Q, and the optical element S is arranged at the center of the circuit board Q, wherein the optical axis O of the optical element S passes through the first optical mirror 401.

[0135] like Fig.19 and Fig. 20 As shown, the elastic circuit board Q of this embodiment mainly includes a first connecting part Q1, a second connecting part Q2, a third connecting part Q3, a conductive terminal part Q4, a first elastic structure Q12 and a second elastic structure Q23, wherein the first connecting part Q1 and the second connecting part Q2 are connected to each other through the slender and tortuous first elastic structure Q12, and the second connecting part Q2 and the third connecting part Q3 are connected to each other through the slender and tortuous second elastic structure Q23.

[0136] In addition, the aforementioned conductive terminal portion Q4 protrudes from one side of the third connecting portion Q3 toward the X-axis direction, wherein the coil and optical element S (such as an image sensor) arranged inside the first module 10 are electrically connected to the circuit board Q and can be electrically connected to an external circuit through the conductive terminal portion Q4.

[0137] On the other hand, a first frame F1 and a second frame F2 are provided inside the outer frame H. It should be particularly noted that the outer frame H, the first frame F1 and the second frame F2 all have a hollow rectangular structure, wherein the first frame F1 is fixed on the first connection portion Q1, the second frame F2 is fixed on the second connection portion Q2, and the outer frame H is fixed on the third connection portion Q3.

[0138] from Fig. 20 It can be seen that two first coils C1 are provided on the outer surface of the aforementioned first frame F1, and two first magnets M1 are provided on the inner side of the aforementioned second frame F2, corresponding to the aforementioned first coils C1, wherein the aforementioned second frame F2 is located between the first frame F1 and the outer frame H, and the aforementioned optical element S is arranged in the center of the first connecting portion Q1.

[0139] In addition, two second magnets M2 and one third magnet M3 are provided on the outer side of the second frame F2, and two second coils C2 and one third coil C3 are provided on the inner side of the outer frame H, wherein the position of the second coil C2 corresponds to the second magnet M2, and the position of the third coil C3 corresponds to the third magnet M3.

[0140] Through the above-mentioned mechanism configuration, an appropriate electromagnetic driving force can be generated between the coil and the magnet arranged inside the driving mechanism 400 to drive the optical element S in the center of the first connecting part Q1 and the first frame F1 to move relative to the second frame F2 along a direction parallel to the optical axis O (Z axis). In addition, the second connecting part Q2 and the second frame F2 can also be driven to move relative to the outer frame H along a direction perpendicular to the optical axis O (Z axis), so that the driving mechanism 400 can realize the functions of auto focus (AF) and / or optical image stabilization (OIS).

[0141] Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present invention, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present invention.

[0142] Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claim and embodiment.

[0143] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the attached claims.

Claims

1. A driving mechanism for driving an optical element to move, characterized in that: The driving mechanism comprises: a fixing portion; a movable portion connected to the fixed portion, wherein the optical element is disposed on the movable portion; and A driving assembly is used to drive the optical element to move relative to the fixing portion.

2. The driving mechanism according to claim 1, characterized in that: The driving mechanism further comprises a substrate, the fixed portion comprises an outer frame, and the movable portion comprises an elastic circuit board, wherein at least a portion of the circuit board is located between the substrate and the outer frame.

3. The driving mechanism according to claim 2, characterized in that: The substrate is formed with a groove, and the circuit board has a conductive terminal portion, wherein the conductive terminal portion is located in the groove.

4. The driving mechanism according to claim 3, characterized in that: When viewed along a horizontal direction, the conductive terminal portion at least partially overlaps with the substrate, and the horizontal direction is perpendicular to an optical axis of the optical element.

5. The driving mechanism according to claim 4, characterized in that: A bottom surface of the conductive terminal portion is aligned with a lower surface of the substrate.

6. The driving mechanism according to claim 4, characterized in that: The optical element is an image sensor.

7. The driving mechanism according to claim 2, characterized in that: The substrate shields the circuit board.

8. The driving mechanism according to claim 2, characterized in that: The circuit board is electrically connected to the substrate.

9. The driving mechanism according to claim 2, characterized in that: The hardness of the substrate is greater than the hardness of the circuit board.

10. The driving mechanism according to claim 2, characterized in that: The driving mechanism also includes a first module, a second module and a third module that are interconnected, the first module includes the outer frame, the circuit board, the driving assembly, a first shell and a first optical mirror disposed in the first shell, and the outer frame is connected to the first shell, wherein the second module includes a second shell and a second optical mirror disposed in the second shell, the third module includes a third shell, a third optical mirror disposed on the third shell and the substrate, wherein the substrate is fixed to the bottom side of the third shell.

11. The driving mechanism according to claim 10, characterized in that: The second module is located between the first module and the third module, wherein the first optical lens and the third optical lens are prisms, the second optical lens is a lens, and the optical element is an image sensor.

12. The driving mechanism according to claim 10, characterized in that: The first module also includes a first frame and a second frame arranged on the circuit board, the second frame is located between the first frame and the outer frame, and the driving component includes a first coil and a first magnet, wherein the first coil is arranged on the first frame, and the first magnet is arranged on the second frame.

13. The driving mechanism according to claim 12, characterized in that: The driving component also includes a second coil and a second magnet, wherein the second coil is arranged on the second frame, and the second magnet is arranged on the outer frame.

14. The driving mechanism according to claim 13, characterized in that: The outer frame, the first frame and the second frame are all in a U-shape, and the openings of the outer frame, the first frame and the second frame all face the same direction.

15. The driving mechanism according to claim 12, characterized in that: The first coil surrounds an optical axis of the optical element, and the optical axis passes through the first optical mirror.

16. The driving mechanism according to claim 10, characterized in that: The first module also includes a first frame and a second frame, the second frame is located between the first frame and the outer frame, and the driving component includes a first coil, a second coil and a common magnet, wherein the first coil is arranged on the first frame, the common magnet is arranged on the second frame, the second coil is arranged on a lower surface of the first shell, and the positions of the first coil and the second coil are adjacent to the common magnet.

17. The driving mechanism according to claim 10, characterized in that: The circuit board has a first connecting part, a second connecting part and a first elastic structure. The first module also includes a first frame and a second frame. The first frame is fixed on the first connecting part, the second frame is fixed on the second connecting part, and the first elastic structure connects the first connecting part and the second connecting part.

18. The driving mechanism according to claim 17, characterized in that: The circuit board also has a third connection portion and a second elastic structure. The outer frame is fixed on the third connection portion, and the second elastic structure connects the second connection portion and the third connection portion.

19. The driving mechanism according to claim 17, characterized in that: The outer frame is fixed on the base plate.

20. The driving mechanism according to claim 10, characterized in that: The circuit board has an extension portion extending from the first module, through the second module and reaching the third module.

21. The driving mechanism according to claim 20, characterized in that: The extension portion is formed with a through hole for accommodating a portion of the driving component.

22. The driving mechanism according to claim 21, characterized in that: The extension portion has a C-shaped structure and is parallel to an optical axis of the optical element.

23. The driving mechanism according to claim 1, characterized in that: The fixed part includes an outer frame, the movable part includes an elastic circuit board, and the driving mechanism also includes a first frame and a second frame arranged on the circuit board, wherein the driving component is arranged on the outer frame, the first frame and the second frame, and the second frame is located between the first frame and the outer frame.

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