Chip glue sealing device

Abstract

The utility model provides a chip glue sealing device which comprises a mold and a movable objective table arranged in the mold, a driving mechanism is installed at the bottom of the mold, and the driving mechanism is rotated to drive the objective table to move up and down in the mold in the vertical direction so as to achieve height adjustment between the upper surface of a chip and the upper surface of the mold. And according to parameters of chips of different models, the driving mechanism is rotated to enable the upper surfaces of the chips to be flush with the upper surface of the mold. After the chip is uncovered, the glue is added to the bare crystal, and the glue scraping plate is adopted to translate on the mold to scrape off the redundant glue, so that the scraping treatment of the chip sealing glue is realized. According to the chip glue sealing device, due to the fact that the flatness of glue sealing is improved, uncertain factors caused by manual glue scraping are avoided, and the yield and efficiency of glue sealing are improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip packaging, and in particular to a chip sealing device. Background Art

[0002] In the field of semiconductor manufacturing and maintenance, focused ion beam circuit repair technology has become a key means to repair nano-chip circuit failures. After repair, in order to restore the chip packaging state and protect the internal circuit, the chip needs to be sealed back. Currently, the existing technology usually uses manual methods for sealing. Manual sealing has the following shortcomings:

[0003] For example, manual sealing makes it difficult to ensure the flatness of the package surface. Due to differences in operator skills and experience, as well as the precision limitations of manual operation, the surface after sealing often becomes uneven, such as being higher or lower than the original package surface of the chip. This not only affects the appearance of the chip, but also causes the fixture to be unable to accurately fix the chip during subsequent testing, thus affecting the accuracy and reliability of the test.

[0004] If the colloid is higher than the chip package surface after manual sealing, the commonly used treatment method is to use sandpaper for polishing. However, this method has many disadvantages. After baking, the colloid becomes rigid after hardening, and it is difficult to effectively polish with sandpaper, which increases the difficulty and time of the operation. In addition, the polishing process requires high experience and skills of the operator, and it is easy to damage the binding wires and pins on the chip. This damage may not only cause chip failure, but also cause more serious consequences, such as circuit short circuit and damage. Furthermore, the polishing thickness is difficult to control accurately. Excessive polishing may cause the chip package to be too thin, reducing its protection ability, while insufficient polishing cannot meet the customer's subsequent test fixture requirements. In addition, manual polishing operations are inefficient and cannot meet the needs of large-scale production and rapid repair. Utility Model Content

[0005] The purpose of the present application is to provide a chip sealing device. According to the above chip sealing device, the uncertainties caused by manual sealing can be resolved and the yield and efficiency of sealing can be improved.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] A chip sealing device comprises a mold, wherein the upper surface of the mold is at least partially flat, a receiving groove is provided at the plane position of the mold, a movable stage is provided in the receiving groove, and the stage is used to carry the chip; a driving mechanism is installed at the bottom of the mold, and the driving mechanism is rotated to drive the stage to move up and down in the receiving groove along the vertical direction.

[0008] In some embodiments, at least one pushing mechanism is disposed on the side of the mold to push the chip in a horizontal direction.

[0009] In some embodiments, a guide rail is provided in the mold, and the stage moves along an extension direction of the guide rail.

[0010] In some embodiments, the rotating shaft of the driving mechanism is a screw.

[0011] In some embodiments, the driving mechanism includes a first push block assembled with an end of the screw rod close to the stage.

[0012] In some embodiments, the rotating shaft of the pushing mechanism is a screw.

[0013] In some embodiments, the push-block mechanism includes a second push block assembled with an end of the screw rod close to the stage.

[0014] In some embodiments, a scraper is further included, and the bottom of the scraper is a flat surface.

[0015] In some embodiments, the squeegee includes a handle.

[0016] In some embodiments, the scraper is made of polyurethane, silicone or rubber.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] The present application provides a chip sealing device, which includes a mold and a movable stage arranged in the mold, and the upper surface of the mold is at least partially flat. A driving mechanism is installed at the bottom of the mold, and the driving mechanism is rotated to drive the stage to move up and down in the vertical direction in the mold to achieve height adjustment between the upper surface of the chip and the upper surface of the mold. According to the parameters of chips of different models, the driving mechanism is rotated to make the upper surface of the chip flush with the upper surface of the mold. After the chip is opened, colloid is added to the bare crystal, and a scraper is used to move horizontally on the mold to scrape off excess colloid, thereby achieving a flattening process of the chip seal. The chip sealing device of the present application improves the flatness of the seal, solves the uncertainties caused by manual scraping, and improves the yield and efficiency of the seal. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1A schematic structural diagram of a chip sealing device according to an embodiment of the present application is shown;

[0021] Figure 2 Shows this application Figure 1 A cross-sectional view of the chip sealing device shown;

[0022] Figure 3A A schematic diagram showing the structure of a scraper plate in a chip sealing device of the present application is shown;

[0023] Figure 3B It shows a schematic structural diagram of the chip sealing device of the present application before scraping glue;

[0024] Figure 3C The schematic diagram of the structure of the chip sealing device of the present application after scraping glue is shown.

[0025] Description of reference numerals:

[0026] 1. Mold; 2. Stage; 3. Chip; 4. Driving mechanism; 5. Pushing and blocking mechanism; 6. Squeegee. DETAILED DESCRIPTION

[0027] The technical solutions of the specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings. These implementation methods are only used to illustrate the present application, but not to limit the present application.

[0028] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] When a chip circuit fails due to manufacturing defects, environmental factors or improper operation, the focused ion beam technology can accurately remove, add or modify the circuit structure to restore or optimize the performance of the chip. Before performing the focused ion beam circuit repair experiment, the packaged chip needs to be decapped. This step is to remove the packaging layer and expose the bare die inside for subsequent repair work. The decapping process usually involves physical or chemical methods and requires precise control to avoid damage to the circuit inside the chip.

[0031] After the experiment is completed, in order to restore the chip packaging state and protect the internal circuit, the chip needs to be backfilled with sealant. The purpose of backfilling is to ensure the flatness and sealing of the chip surface to meet the needs of subsequent testing and customer use. However, the current manual sealant method has obvious shortcomings, such as it is difficult to ensure the flatness of the sealant surface.

[0032] In order to solve the problems existing in the prior art, the present application provides a chip sealing device. The chip sealing device of the present application is described in detail below in conjunction with the accompanying drawings.

[0033] Figures 1 to 3C The schematic diagram of the structure of a chip sealing device of an embodiment of the present application is shown. As shown in the figure, the chip sealing device of the present application includes a mold 1, the upper surface of the mold 1 is at least partially flat, and a receiving groove is provided at the plane position of the mold 1. A movable stage 2 is provided in the receiving groove, and the stage 2 is used to carry a chip 3. A driving mechanism 4 is installed at the bottom of the mold 1, and the driving mechanism 4 is rotated to drive the stage 2 to move up and down in the vertical direction in the receiving groove. In one embodiment, a guide rail extending in the vertical direction can be provided on the side wall of the receiving groove, and the aforementioned stage 2 can move along the extension direction of the guide rail.

[0034] The aforementioned driving mechanism 4 may be a screw structure, which includes a rotating shaft screw, a knob disposed at one end of the screw, and a first push block disposed at the other end of the screw, and the screw extends in the vertical direction. Correspondingly, a threaded hole is disposed at the bottom of the mold 1, and the screw of the driving mechanism 4 is threadedly connected to the mold 1. When in use, the stage 2 carrying the chip is placed on the first push block, and the knob is rotated to make the screw rise or fall, driving the stage 2 to rise or fall in the vertical direction in the receiving groove to adjust the height difference between the surface of the chip placed on the stage 2 and the upper surface of the mold 1.

[0035] At least one push mechanism 5 is arranged on the side of the mold 1, and the rotating shaft of the push mechanism 5 extends in the horizontal direction. The push mechanism 5 is rotated to fix the position of the chip in the horizontal direction. The push mechanism 5 can be a screw structure, which includes a screw with a rotating shaft extending in the horizontal direction, a knob arranged at one end of the screw, and a second push block arranged at the other end of the screw, and the lower end of the second push block is arranged higher than the upper surface of the stage 2. Correspondingly, a threaded hole is arranged on the side of the mold 1, and the screw of the push mechanism 5 is threadedly connected to the mold 1. When used specifically, the knob is rotated to make the screw advance against the chip 3 on the stage 2 to fix the position of the chip 3 in the horizontal direction. In one embodiment, the push mechanism 5 can be set to two. That is, the two push mechanisms 5 are respectively arranged on different sides of the mold, and the extension directions of the screws of the two push mechanisms 5 are vertical. The setting of this structure can limit the chip in different directions.

[0036] The chip sealing device of the present application also includes a scraper plate 6, the bottom of which is a plane, which is used to remove excess colloid from the chip surface after the sealing is completed. The scraper plate 6 can be a flat structure, or a handle can be provided on the flat structure to facilitate the operation of the staff. In order to avoid damage to the chip during the scraping process, the scraper plate 6 can be made of polyurethane, silicone or rubber, which helps to improve the yield and efficiency of the sealing. The silicone material has good elasticity and flexibility, which can effectively reduce the pressure on the chip during the scraping process and reduce the risk of damage. At the same time, the wear resistance of silicone is excellent and suitable for long-term use. The rubber scraper plate also has good elasticity and flexibility, and can be customized as needed to use chips of different shapes and sizes. In addition, the price of the rubber scraper plate is low, which helps to reduce production costs. The polyurethane material has excellent wear resistance and corrosion resistance, and has a certain flexibility. The scraper plate 6 of this material is suitable for use under harsh conditions such as high temperature and high humidity.

[0037] In a specific application scenario, the handle of the rotating driving mechanism 4 adjusts the height of the chip 3 on the stage so that the upper surface of the chip 3 is flush with the upper surface of the mold 1. Further, the rotating push mechanism 5 fixes the position of the chip 3 in the horizontal direction. The chip 3 with the package is uncapped to expose the bare crystal inside, and the colloid is dripped on the bare crystal of the exposed chip 3, and the colloid is evenly spread on the bare crystal to ensure that all areas that need to be protected are covered. Then, the scraper 6 is moved horizontally along one end of the mold 1, passing through the chip 3 and moving to the other end of the mold 1, so as to achieve the purpose of flattening the chip surface. It can be understood that due to the limiting effect of the push mechanism 5 on the chip 3 in the horizontal direction, the scraping action of the scraper 6 will not cause the chip 3 to move, which can help to ensure the quality of the chip 3. The technical solution of the present application is suitable for processing chip sealing backfilling operations of various types. It is only necessary to adjust the driving mechanism 4 or the push mechanism 5 according to the chip model to limit the position of the chip.

[0038] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present application. These improvements and substitutions should also be regarded as the scope of protection of the present application.

Claims

1. A chip sealing device, characterized in that: It comprises a mold, wherein at least a part of the upper surface of the mold is a plane, a receiving groove is arranged at the plane position of the mold, a movable stage is arranged in the receiving groove, and the stage is used to carry the chip; A driving mechanism is installed at the bottom of the mold, and the driving mechanism is rotated to drive the stage to move up and down in the receiving groove along the vertical direction.

2. The chip sealing device according to claim 1, characterized in that: At least one pushing mechanism is arranged on the side of the mold for pushing the chip in a horizontal direction.

3. The chip sealing device according to claim 1, characterized in that: A guide rail is arranged in the mold, and the loading platform moves along the extending direction of the guide rail.

4. The chip sealing device according to claim 1, characterized in that: The rotating shaft of the driving mechanism is a screw.

5. The chip sealing device according to claim 4, characterized in that: The driving mechanism comprises a first push block assembled with one end of the screw rod close to the stage.

6. The chip sealing device according to claim 2, characterized in that: The rotating shaft of the pushing mechanism is a screw.

7. The chip sealing device according to claim 6, characterized in that: The push mechanism comprises a second push block assembled with one end of the screw rod close to the loading platform.

8. The chip sealing device according to claim 1, characterized in that: It also comprises a scraper plate, the bottom of which is a plane.

9. The chip sealing device according to claim 8, characterized in that: The rubber scraper comprises a handle.

10. The chip sealing device according to claim 8, characterized in that: The scraper plate is made of polyurethane, silicone or rubber.

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