Wire shifting device
By designing a wire dialing device including a mobile base and a wire dialing needle, the problem that traditional manual wire dialing method easily destroys the internal wiring and operation difficulty of the chip in the focus ion beam line repair experiment is solved, and more efficient and accurate wire dialing operation is achieved.
Patent Information
- Application Number
- CN202421432488.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-06-21
AI Technical Summary
In the focus ion beam line repair experiment, the chip construction position was blocked by the bonded wire, resulting in the inability to continue the experiment. The traditional manual wire dialing method is easy to destroy the internal wiring of the chip, making the operation difficult and inefficient.
A wire dialing device is designed, including a moving base and a wire dialing needle. The mobile base is located on the moving platform, and the movement in the X and Y directions is realized through the first and second moving mechanisms, and the up and down movement in the Z direction is realized by combining the lifting knob and the connecting rod to accurately control the position and movement of the wire dialing needle.
It improves the accuracy and efficiency of the dialing wire, reduces the risk of damage to the bond wire, reduces the requirements of engineers' technical experience, and improves the yield and efficiency of the dialing wire.
Smart Images
Figure CN222896672U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip sealing and testing, in particular to a wire dialing device. Background Art
[0002] When doing focused ion beam circuit repair experiments, if the chip construction position is blocked by the bonding wire, the experiment cannot be continued. The traditional solution is to find the blocked bonding wire under a microscope, hold a very thin soft needle, slowly approach the target bonding wire and slightly push it away before conducting the experiment. The main disadvantages of this method are: the bonding wire and the wire pulling needle are very small. If the operation is improper, it will damage the internal wiring of the chip, causing the chip to fail, and the operator needs to be very experienced; if a novice operates, the bonding wire is relatively fragile, the manual operation force cannot be controlled, and excessive force will easily cause the bonding wire to be broken. In addition, the handheld wire pulling method is slow to operate, and it takes time and effort to complete high-precision fine movements, which is inefficient. Utility Model Content
[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a wire-placing device to replace manual wire-placing to improve efficiency and avoid damage to the bonding wires.
[0004] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a wire-digging device, which includes a movable base, a wire-digging needle extending from the front end of the movable base, and the wire-digging needle is used to divert the chip bonding wire; the movable base is located on a first motion mechanism so that the movable base can move in a first direction, and the first motion mechanism is located on a second motion mechanism so that the first motion mechanism and the movable base can move synchronously in a second direction.
[0005] Optionally, the movable base forms an upwardly convex arc surface at least at the top.
[0006] Optionally, the first motion mechanism and the second motion mechanism are respectively provided with a first control knob and a second control knob to control the motion stroke along respective directions.
[0007] Optionally, it also includes a lifting knob and a connecting rod, the mobile base includes an outer shell and a accommodating cavity located inside the outer shell, the connecting rod obliquely penetrates the outer shell, the upper end of the connecting rod is connected to the thread dialing needle, a spring sheet is horizontally placed inside the accommodating cavity, the lifting knob penetrates the outer shell of the mobile base from top to bottom and is connected to the spring sheet, and the spring sheet is connected to the lower end of the connecting rod in the area located in front of the lifting knob along its length direction.
[0008] Optionally, the outer wall of the lifting knob is provided with a thread so as to be threadedly connected to the outer shell of the movable base.
[0009] Optionally, a column is further provided inside the accommodating cavity of the mobile base, the front edge of the spring sheet is connected to the bottom of the mobile base near the thread-shifting needle, and the rear edge of the spring sheet is connected to the column.
[0010] Optionally, the spring piece is inclined upward from the direction close to the thread shifting needle to the direction away from the thread shifting needle.
[0011] Optionally, the needle tip diameter of the thread-pulling needle is 1-3 microns.
[0012] Optionally, the needle head of the thread-moving needle is made of flexible material.
[0013] Optionally, the first direction and the second direction are perpendicular to each other.
[0014] As described above, the utility model provides a wire-pulling device, which includes a movable base, and a wire-pulling needle extends from the front end of the movable base, which is used to pull apart the chip bonding wire; the movable base is located on a motion platform so that the movable base can move in a first direction or a second direction. At the same time, a spring sheet is provided inside the movable base, and a lifting knob passes through the outer shell of the movable base from top to bottom and is connected to the spring sheet, and the spring sheet is connected to the lower end of the connecting rod by a bolt, and the upper end of the connecting rod is connected to the wire-pulling needle; the lifting knob drives the connecting rod to rotate after pressing down or pulling up the spring sheet, so that the wire-pulling needle moves up and down, and realizes the up and down movement of the wire-pulling needle in a third direction. When in use, the height of the wire-pulling needle is first lowered by the lifting knob and contacts the bonding wire, and then the first control knob and the second control knob are fine-tuned, so that the movable base synchronously drives the wire-pulling needle to move in the first direction or the second direction, thereby pulling apart the bonding wire.
[0015] The entire wire-pickup device uses mechanized auxiliary operation, and the three knobs control the movement in the X, Y, and Z directions respectively, making the entire operation process more precise and convenient for completing fine movements under a microscope to complete the wire-pickup operation. This wire-pickup method can more accurately control the contact between the wire-pickup needle and the bonding wire, solves the uncertainty factors caused by manual operation, improves the accuracy of wire-pickup, reduces the requirements for engineers' technical experience, and improves the yield and efficiency of wire-pickup. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Shown is a side view schematic diagram of a wire dialing device in an embodiment of the present utility model.
[0017] Figure 2 Shown is a top view of a wire dialing device in an embodiment of the present utility model.
[0018] Figure 3 Shown is a cross-sectional schematic diagram of a wire dialing device in an embodiment of the present utility model.
[0019] Figure 4Shown is a schematic diagram of the bonding wire state before wire setting in an embodiment of the present utility model.
[0020] Figure 5 Shown is a schematic diagram of the bonding wire state after wire removal in the present invention.
[0021] Component number description
[0022] 1-connecting rod; 2-movable base; 3-lifting knob; 4-first control knob; 5-second control knob; 6-chip; 7-bonding wire; 8-wire pulling needle; 9-chip construction position; 20-first motion mechanism; 21-second motion mechanism; 22-shrapnel; 23-column; 30, 31-bolts. DETAILED DESCRIPTION
[0023] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.
[0024] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.
[0025] For ease of description, spatial relational terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatial relational terms are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there can be one or more intervening layers. As used herein, "between..." means including the end point values.
[0026] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
[0027] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the utility model in a schematic manner, and therefore the illustrations only show components related to the utility model rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0028] like Figures 1 to 3 As shown, the utility model provides a wire dialing device, which includes:
[0029] A mobile base 2, a wire-pulling needle 8 extending from the front end of the mobile base 2, the wire-pulling needle is used to pull away the chip bonding wire;
[0030] Preferably, the mobile base 2 forms at least an upwardly convex curved surface at the top, for example, similar to the shape of a mouse, which is convenient for holding;
[0031] The mobile base 2 is located on the first motion mechanism 20 so that the mobile base 2 can move in the first direction (X direction), and the first motion mechanism 20 is located on the second motion mechanism 21 so that the first motion mechanism 20 and the mobile base 2 can move synchronously in the second direction (Y direction), and the first direction and the second direction are perpendicular to each other. The above-mentioned motion mechanism can realize movement through the combination of slide rails and sliders, and can also realize movement through screw transmission. The first motion mechanism and the second motion mechanism are respectively equipped with a first control knob 4 and a second control knob 5 to control the movement in their respective directions. When in use, first adjust the position of the wire-pulling needle 8 so that it contacts the chip bonding wire, and then slowly rotate the first control knob 4 and the second control knob 5 to drive the wire-pulling needle 8 to move so that it can pull the chip bonding wire, thereby exposing the area blocked by the chip bonding wire, which is convenient for subsequent focused ion beam line repair experiments. For the specific form of the control knob, common gear transmission or other commonly used mechanical connection methods can be used, and no excessive restrictions are made here.
[0032] More specifically, as an embodiment, the first motion mechanism 20 and / or the second motion mechanism adopts a screw slider structure, the mobile base 2 is arranged on the slider of the first motion mechanism 20 or is formed integrally with the slider, and the mobile base 2 can slide along the X direction under the action of the screw of the first motion mechanism 20; the first motion mechanism is arranged on the slider of the second motion mechanism 21 or is formed integrally with the slider, where the screw of the first motion mechanism is arranged perpendicular to the screw of the second motion mechanism, and the first motion mechanism can slide along the Y direction under the action of the screw of the second motion mechanism 21; through the setting of the first motion mechanism and the second motion mechanism, the mobile base 2 can move along the X direction or the Y direction, so that the thread-drying needle set on the mobile base 2 moves to the desired position.
[0033] Furthermore, the mobile base 2 includes an outer shell and a receiving cavity inside the outer shell, the outer shell forms the upwardly protruding arc surface at least at the top, a spring sheet 22 is arranged inside the receiving cavity, the spring sheet 22 is horizontally placed in the receiving cavity, the lifting knob 3 penetrates the outer shell of the mobile base 2 from top to bottom and is connected to the spring sheet 22, the spring sheet 22 is connected to the lower end of the connecting rod 1 by a bolt 31 in the area located in front of the lifting knob 3 along its length direction, the upper end of the connecting rod 1 penetrates the outer shell of the mobile base 2 toward the front and upward, and the thread-shifting needle 8 is connected to the upper end of the connecting rod 1 by a bolt 30. The lifting knob 3 is rotated, and the lifting knob 3 presses down or pulls up the spring sheet 22, which drives the connecting rod 1 to rotate, thereby moving the thread-shifting needle 8 up and down, realizing the up and down movement of the thread-shifting needle 8 in a third direction, and the third direction is perpendicular to the plane defined by the first direction and the second direction.
[0034] Furthermore, the outer wall of the lifting knob 3 is provided with a thread to be threadedly connected with the outer shell of the movable base 2. By rotating the lifting knob 3, the bottom end of the lifting knob 3 moves up and down, causing the spring piece 22 to deform and drive the connecting rod 1 to rotate.
[0035] Furthermore, the spring piece 22 is inclined upward from the direction close to the thread pin 8 to the direction away from the thread pin 8. In this embodiment, a column 23 is further provided inside the mobile base 2, and the front edge of the spring piece 22 close to the thread pin 8 is connected to the bottom of the mobile base 2, and the rear edge of the spring piece 22 is connected to the column 23. The spring piece 22 is inclined with the front lower and the rear higher.
[0036] Furthermore, the needle tip diameter of the wire-moving needle 8 is 1-3 microns, preferably 1 micron, and the material of the wire-moving needle 8 is preferably flexible, and can be moved without damaging the chip bonding wire.
[0037] The method of using the wire-diffusion device in the above embodiment is as follows: first fix the chip 6 under the microscope, such as Figure 4 As shown, the operator places the entire wire-pickup device at a suitable position near the chip 6, so that the wire-pickup needle 8 is suspended above the chip 6, and observes the position of the target bonding wire 7 through a microscope (in other embodiments, this can also be achieved by adjusting the placement of the wire-pickup device). The lifting knob 3 of the movable base is rotated to lower the height of the wire-pickup needle 8 and contact the bonding wire 7, and then the first control knob 4 and the second control knob 5 are fine-tuned so that the movable base 2 synchronously drives the wire-pickup needle 8 to move in the first direction or the second direction, thereby spreading the bonding wire 7, that is, causing the bonding wire 7 to undergo a certain bending deformation, such as Figure 5 As shown, the chip construction position 9 originally hidden under the bonding wire 7 is exposed, so as to carry out the subsequent circuit repair experiment.
[0038] In summary, the utility model provides a wire-pulling device, which includes a movable base, and a wire-pulling needle extends from the front end of the movable base, which is used to pull apart the chip bonding wire; the movable base is located on a motion platform so that the movable base can move in a first direction or a second direction. At the same time, a spring sheet is provided inside the movable base, and a lifting knob passes through the outer shell of the movable base from top to bottom and is connected to the spring sheet, and the spring sheet is connected to the lower end of the connecting rod by a bolt, and the upper end of the connecting rod is connected to the wire-pulling needle; the lifting knob drives the connecting rod to rotate after pressing down or pulling up the spring sheet, so that the wire-pulling needle moves up and down, and realizes the up and down movement of the wire-pulling needle in a third direction. When in use, the height of the wire-pulling needle can be first lowered by the lifting knob and contacted with the bonding wire, and then the first control knob and the second control knob can be fine-tuned so that the movable base synchronously drives the wire-pulling needle to move in the first direction or the second direction, thereby pulling apart the bonding wire.
[0039] The entire wire-pickup device uses mechanized auxiliary operation, and the three knobs control the movement in the X, Y, and Z directions respectively, making the entire operation process more precise and convenient for completing fine movements under a microscope to complete the wire-pickup operation. This wire-pickup method can more accurately control the contact between the wire-pickup needle and the bonding wire, solves the uncertainty factors caused by manual operation, improves the accuracy of wire-pickup, reduces the requirements for engineers' technical experience, and improves the yield and efficiency of wire-pickup.
[0040] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
Claims
1. A wire dialing device, characterized in that: The wire-pushing device includes a movable base, a wire-pushing needle extending from the front end of the movable base, and the wire-pushing needle is used to pull apart the chip bonding wire; the movable base is located on a first motion mechanism so that the movable base can move along a first direction, and the first motion mechanism is located on a second motion mechanism so that the first motion mechanism and the movable base can move synchronously along a second direction.
2. The wire-dial device according to claim 1, characterized in that: The movable base forms at least an upwardly convex arc surface at the top.
3. The wire-dial device according to claim 1, characterized in that: The first motion mechanism and the second motion mechanism are respectively equipped with a first control knob and a second control knob to control the motion stroke along respective directions.
4. The wire-dial device according to any one of claims 1 to 3, characterized in that: It also includes a lifting knob and a connecting rod. The movable base includes an outer shell and a accommodating cavity inside the outer shell. The connecting rod obliquely penetrates the outer shell. The upper end of the connecting rod is connected to the thread-shifting needle. A spring sheet is horizontally placed inside the accommodating cavity. The lifting knob penetrates the outer shell of the movable base from top to bottom and is connected to the spring sheet. The spring sheet is connected to the lower end of the connecting rod in the area in front of the lifting knob along its length direction.
5. The wire-dial device according to claim 4, characterized in that: The outer wall of the lifting knob is provided with threads so as to be threadedly connected with the outer shell of the movable base.
6. The wire-dial device according to claim 4, characterized in that: A column is also provided inside the accommodating cavity of the mobile base, the front edge of the spring sheet close to the thread-shifting needle is connected to the bottom of the mobile base, and the rear edge of the spring sheet is connected to the column.
7. The wire-dial device according to claim 4, characterized in that: The spring piece is inclined upward from the direction close to the thread-shifting needle to the direction away from the thread-shifting needle.
8. The wire-dial device according to claim 1, characterized in that: The needle tip diameter of the thread-shifting needle is 1-3 microns.
9. The wire-dial device according to any one of claims 1 to 3, characterized in that: The needle head of the thread-shifting needle is made of flexible material.
10. The wire dialing device according to any one of claims 1 to 3, characterized in that: The first direction and the second direction are perpendicular to each other.