Wafer processing equipment

Abstract

The utility model relates to wafer processing equipment. The wafer processing equipment comprises a feeding and discharging device; the grinding and thinning device is arranged on one side, in the first horizontal direction, of the feeding and discharging device, and the grinding and thinning device is used for grinding the wafers and transferring the ground wafers to the feeding and discharging device; the polishing device is arranged on one side of the grinding and thinning device in the second horizontal direction; the cleaning and transferring device is arranged on one side, in the first horizontal direction, of the polishing device and located on one side, in the second horizontal direction, of the feeding and discharging device; wherein the cleaning and transferring device comprises a transferring mechanism and a first cleaning mechanism, the transferring mechanism is used for transferring a wafer subjected to grinding processing on the feeding and discharging device among the polishing device, the first cleaning mechanism and the feeding and discharging device, and the polishing device is used for carrying out chemical mechanical polishing on the wafer transferred by the transferring mechanism; the first cleaning mechanism is used for cleaning and drying the wafer transferred by the transfer mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer processing equipment. Background Art

[0002] The manufacturing process of integrated circuits is usually divided into: silicon wafer manufacturing, front-end process and back-end process. The main purpose of the back-end process is to make the whole wafer with circuit devices into independent finished chips. The back-end process can be roughly divided into 8 main steps: back thinning, wafer cutting, wafer mounting, wire bonding, plastic packaging, laser printing, rib cutting and finished product testing. Back thinning of the wafer (Grinding) refers to the high-precision grinding of various materials such as silicon wafers or compound semiconductors before packaging to reduce their thickness to a suitable ultra-thin form.

[0003] Wafer processing equipment needs to integrate many functional components such as grinding and thinning, chemical mechanical polishing (CMP), wafer cleaning, and wafer transfer, which makes the equipment larger in size and requires a large space. Utility Model Content

[0004] Based on this, it is necessary to provide a wafer processing equipment that improves the above defects in order to solve the problem that the wafer processing equipment in the prior art is large in size and requires a large space.

[0005] A wafer processing device, comprising:

[0006] A loading and unloading device for supplying and receiving wafers;

[0007] A grinding and thinning device is arranged on one side of the feeding and discharging device in the first horizontal direction, and is used to grind the wafers provided by the feeding and discharging device and transfer the wafers that have been ground to the feeding and discharging device;

[0008] a polishing device, arranged on one side of the grinding and thinning device in a second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction; and

[0009] A cleaning and transferring device is arranged on one side of the polishing device in the first horizontal direction and is located on one side of the feeding and discharging device in the second horizontal direction;

[0010] Among them, the cleaning and transfer device includes a transfer mechanism and a first cleaning mechanism. The transfer mechanism is used to transfer the wafers that have completed the grinding process on the feeding and discharging device between the polishing device, the first cleaning mechanism and the feeding and discharging device. The polishing device is used to perform chemical mechanical polishing on the wafers transferred by the transfer mechanism. The first cleaning mechanism is used to clean and dry the wafers transferred by the transfer mechanism.

[0011] In one embodiment, the first cleaning mechanism and the material loading and unloading device are arranged at intervals along the second horizontal direction, and the transfer mechanism is arranged between the first cleaning mechanism and the material loading and unloading device and is movable along the second horizontal direction.

[0012] In one embodiment, the loading and unloading device includes a wafer box, a centering mechanism, a first transport mechanism and a second transport mechanism;

[0013] The wafer box is used to store wafers, the centering mechanism is used to center and position the wafers thereon, the first transport mechanism is used to transfer the wafers in the wafer box to the centering mechanism, and the second transport mechanism is used to transfer the wafers on the centering mechanism to the grinding and thinning device.

[0014] In one embodiment, the feeding and discharging device also includes a second cleaning mechanism, and the second transporting mechanism is also used to transfer the wafers on the grinding and thinning device to the second cleaning mechanism, the second cleaning mechanism is used to clean the wafers thereon, and the transfer mechanism is used to transfer the wafers on the second cleaning mechanism to the polishing device.

[0015] In one embodiment, the centering mechanism and the second cleaning mechanism are arranged between the wafer box and the grinding and thinning device, the centering mechanism and the second cleaning mechanism are arranged at intervals along the second horizontal direction, and the centering mechanism is located on a side of the second cleaning mechanism away from the transfer mechanism;

[0016] The first transport mechanism is arranged between the wafer box, the centering mechanism and the second cleaning mechanism, and the second transport mechanism is arranged between the centering mechanism, the second cleaning mechanism and the grinding and thinning device.

[0017] In one embodiment, the material loading and unloading device also includes a cache mechanism arranged between the second cleaning mechanism and the wafer box, the transfer mechanism is used to transfer the wafers in the first cleaning mechanism to the cache mechanism, and the first transport mechanism is also used to transfer the wafers on the cache mechanism to the wafer box.

[0018] In one embodiment, the polishing device comprises a rotating frame, a polishing head group, a polishing disc and a carrying cup group; the polishing head group is mounted on the rotating frame, and the rotating frame can controllably drive the polishing head group to pass through a material loading and unloading station and a polishing station, the carrying cup group is arranged at the material loading and unloading station, and the polishing disc is arranged at the polishing station; the polishing head group comprises two polishing heads, the carrying cup group comprises two carrying cups, and the transfer mechanism is further used to transfer the wafers that have completed the grinding process of the feeding and unloading device to the two carrying cups of the carrying cup group;

[0019] When the rotating frame drives the polishing head group to rotate to the loading and unloading station, the two polishing heads of the polishing head group can respectively pick up the wafers on the two carrying cups of the carrying cup group, or the two polishing heads of the polishing head group can respectively release the wafers picked up to the two carrying cups of the carrying cup group; when the rotating frame drives the polishing head group to rotate to the polishing station, the polishing disk can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

[0020] In one embodiment, two first cleaning mechanisms are provided, and the transfer mechanism is further used to transfer the wafers on the two carrying cups of the carrying cup group to the two first cleaning mechanisms respectively.

[0021] When the above-mentioned wafer processing equipment is actually used, first, the loading and unloading device provides the wafer to be processed to the grinding and thinning device; then, the grinding and thinning device grinds the wafer to achieve wafer thinning; then, the grinding and thinning device transfers the wafer that has completed the grinding process to the loading and unloading device; then, the transfer mechanism picks up the wafer that has completed the grinding process on the loading and unloading device, and transfers it to the polishing device for chemical mechanical polishing; after the chemical mechanical polishing process is completed, the transfer mechanism transfers the wafer on the polishing device to the first cleaning mechanism for cleaning and drying; after the cleaning is completed, the transfer mechanism transfers the wafer on the first cleaning mechanism to the loading and unloading device for storage.

[0022] In this way, the wafer processing equipment in the present application integrates related mechanisms such as wafer transfer, wafer grinding and thinning, wafer polishing, cleaning and drying after wafer polishing, and by adjusting the spatial layout of the feeding and unloading device, the grinding and thinning device, the polishing device and the cleaning and transfer device, the wafer transfer path is optimized, the equipment structure is simplified, which is conducive to improving space utilization, making the structure more compact, and thus reducing the equipment volume and the space required. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a wafer processing equipment in one embodiment of the utility model. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0030] See also Figure 1 An embodiment of the utility model provides a wafer processing device, including a feeding and discharging device 10, a grinding and thinning device 20, a polishing device 30 and a cleaning and transferring device 40. The feeding and discharging device 10 is used to provide and receive wafers. The grinding and thinning device 20 is arranged on one side of the feeding and discharging device 10 in the first horizontal direction X1, that is, the grinding and thinning device 20 and the feeding and discharging device 10 are arranged at intervals along the first horizontal direction X1. The grinding and thinning device 20 is used to grind the wafers provided by the feeding and discharging device 10, and transfer the wafers that have completed the grinding process to the feeding and discharging device 10. The polishing device 30 is arranged on one side of the grinding and thinning device 20 in the second horizontal direction X2, that is, the polishing device 30 and the grinding and thinning device 20 are arranged at intervals along the second horizontal direction X2. The second horizontal direction X2 is perpendicular to the first horizontal direction X1. The cleaning and transferring device 40 is arranged on one side of the polishing device 30 in the first horizontal direction X1, and is located on one side of the feeding and discharging device 10 in the second horizontal direction X2. The cleaning and transferring device 40 includes a transfer mechanism 41 and a first cleaning mechanism 42. The transfer mechanism 41 is used to transfer the wafers that have completed the grinding process on the feeding and discharging device 10 between the polishing device 30, the first cleaning mechanism 42 and the feeding and discharging device 10. The polishing device 30 is used to perform chemical mechanical polishing on the wafers transferred by the transfer mechanism 41. The first cleaning mechanism 42 is used to clean and dry the wafers transferred by the transfer mechanism 41.

[0031] When the above-mentioned wafer processing equipment is actually used, first, the loading and unloading device 10 provides the wafer to be processed to the grinding and thinning device 20; then, the grinding and thinning device 20 grinds the wafer to achieve wafer thinning; then, the grinding and thinning device 20 transfers the wafer that has completed the grinding process to the loading and unloading device 10; then, the transfer mechanism 41 picks up the wafer that has completed the grinding process on the loading and unloading device 10, and transfers it to the polishing device 30 for chemical mechanical polishing; after the chemical mechanical polishing process is completed, the transfer mechanism 41 transfers the wafer on the polishing device 30 to the first cleaning mechanism 42 for cleaning and drying; after the cleaning is completed, the transfer mechanism 41 transfers the wafer on the first cleaning mechanism 42 to the loading and unloading device 10 for storage.

[0032] In this way, the wafer processing equipment in the present application integrates relevant mechanisms such as wafer transfer, wafer grinding and thinning, wafer polishing, cleaning and drying after wafer polishing, and by adjusting the spatial layout of the feeding and discharging device 10, the grinding and thinning device 20, the polishing device 30 and the cleaning and transfer device 40, the wafer transfer path is optimized, the equipment structure is simplified, which is conducive to improving space utilization, making the structure more compact, and thus reducing the equipment volume and the space required.

[0033] Specifically in the embodiment, the first cleaning mechanism 42 and the feeding and discharging device 10 are arranged at intervals along the second horizontal direction X2. The transfer mechanism 41 is arranged between the first cleaning mechanism 42 and the feeding and discharging device 10, and is movable along the second horizontal direction X2. In this way, in actual use, the transfer mechanism 41 moves to the first cleaning mechanism 42 along the second horizontal direction X2, and picks up the wafer on the first cleaning mechanism 42. Afterwards, the transfer mechanism 41 moves to the feeding and discharging device 10 along the second horizontal direction X2, and releases the picked-up wafer to the feeding and discharging device 10, thereby transferring the wafer that has been cleaned and dried in the first cleaning mechanism 42 to the feeding and discharging device 10, so as to realize the recovery of the wafer that has been processed. Optionally, the transfer mechanism 41 can be a manipulator that can realize wafer transfer.

[0034] In an embodiment of the present application, the loading and unloading device 10 includes a wafer box 11, a centering mechanism 13, a first conveying mechanism 12 and a second conveying mechanism 14. The wafer box 11 is used to store wafers, and the centering mechanism 13 is used to center and position the wafers thereon. The first conveying mechanism 12 is used to transfer the wafers in the wafer box 11 to the centering mechanism 13, and the second conveying mechanism 14 is used to transfer the wafers on the centering mechanism 13 to the grinding and thinning device 20. In this way, first, the first conveying mechanism 12 transfers the wafers to be processed in the wafer box 11 to the centering mechanism 13, and the centering mechanism 13 centers and positions the wafers thereon; then, the second conveying mechanism 14 transfers the wafers on the centering mechanism 13 to the grinding and thinning device 20, and the grinding and thinning device 20 grinds the wafers.

[0035] Specifically in the embodiment, the feeding and discharging device 10 further includes a second cleaning mechanism 15, and the second transport mechanism 14 is also used to transfer the wafer on the grinding and thinning device 20 to the second cleaning mechanism 15. The second cleaning mechanism 15 is used to clean the wafer thereon (for example, to clean the surface of one side of the wafer that has been ground). The transfer mechanism 41 is used to transfer the wafer on the second cleaning mechanism 15 to the polishing device 30. In this way, after the grinding and thinning device 20 completes the grinding of the wafer, the second transport mechanism 14 transfers the wafer on the grinding and thinning device 20 to the second cleaning mechanism 15 of the feeding and discharging device 20, and the second cleaning mechanism 15 cleans the wafer thereon; then, the transfer mechanism 41 moves toward the feeding and discharging device 10 along the second horizontal direction X2 until the transfer mechanism 41 picks up the wafer on the second cleaning mechanism 15; then, the transfer mechanism 41 moves away from the feeding and discharging device 10 along the second horizontal direction X2 until the transfer mechanism 41 releases the picked-up wafer to the polishing device 30.

[0036] Furthermore, the centering mechanism 13 and the second cleaning mechanism 15 are arranged between the wafer box 11 and the grinding and thinning device 20, and the centering mechanism 13 and the second cleaning mechanism 15 are arranged at intervals along the second horizontal direction X2, and the centering mechanism 13 is located on the side of the second cleaning mechanism 15 away from the transfer mechanism 41, so as to facilitate the transfer mechanism 41 to pick up the wafer on the second cleaning mechanism 15. The first transport mechanism 12 is arranged between the wafer box 11, the centering mechanism 13 and the second cleaning mechanism 15, so as to facilitate the first transport mechanism 12 to transfer the wafer in the wafer box 11 to the centering mechanism 13. The second transport mechanism 14 is arranged between the centering mechanism 13, the second cleaning mechanism 15 and the grinding and thinning device 20, so as to facilitate the second transport mechanism 14 to transfer the wafer between the centering mechanism 13, the grinding and thinning device 20 and the second cleaning mechanism 15.

[0037] Furthermore, the loading and unloading device 10 also includes a cache mechanism 16 arranged between the second cleaning mechanism 15 and the wafer box 11. The transfer mechanism 41 is used to transfer the wafers in the first cleaning mechanism 42 to the cache mechanism 16. The first transport mechanism 12 is also used to transfer the wafers on the cache mechanism 16 to the wafer box 11 for storage.

[0038] Thus, in actual use, first, the first transport mechanism 12 transfers the wafers in the wafer box 11 to the centering mechanism 13 for centering and positioning; after the centering and positioning is completed, the second transport mechanism 14 transfers the wafers on the centering mechanism 13 to the grinding and thinning device 20 for grinding; after the grinding is completed, the second transport mechanism 14 transfers the wafers on the grinding and thinning device 20 to the second cleaning mechanism 15 for cleaning; after the cleaning is completed, the transfer mechanism 41 transfers the wafers in the second cleaning mechanism 15 to the polishing device 30 for chemical mechanical polishing; after the chemical mechanical polishing is completed, the transfer mechanism 41 transfers the wafers on the polishing device 30 to the first cleaning mechanism 42 for cleaning and drying; after the cleaning and drying are completed, the transfer mechanism 41 transfers the wafers in the first cleaning mechanism 42 to the cache mechanism 16 for temporary storage; then, the first transport mechanism 12 transfers the wafers on the cache mechanism 16 to the wafer box 11 for storage.

[0039] In an embodiment of the present application, the polishing device 30 includes a rotating frame, a polishing head group, a polishing disc 33 and a carrying cup group 32. The polishing head group is mounted on the rotating frame, and the rotating frame can controllably drive the polishing head group to circulate through the loading and unloading station a1 and the polishing station a2. The carrying cup group 32 is arranged at the loading and unloading station a1, and the polishing disc 33 is arranged at the polishing station a2. The polishing head group includes a polishing head, and the carrying cup group 32 includes a carrying cup 321. The transfer mechanism 41 is also used to transfer the wafer on the second cleaning mechanism 15 to the carrying cup 321 of the carrying cup group 32. When the rotating frame drives the polishing head group to rotate to the loading and unloading station a1, the polishing head can pick up the wafer on the carrying cup 321, or the polishing head can release the picked-up wafer to the carrying cup 321. When the rotating frame drives the polishing head group to rotate to the polishing station a2, the polishing disc 33 can perform chemical mechanical polishing on the wafer on the polishing head.

[0040] Further, the polishing head group includes two polishing heads, and the carrying cup group 32 includes two carrying cups 321 corresponding to the two polishing heads of the polishing head group. When the rotating frame drives the polishing head group to rotate to the loading and unloading station a1, the two polishing heads of the polishing head group can pick up the wafers on the two carrying cups 321 of the carrying cup group 32, or the two polishing heads of the polishing head group can release the wafers picked up by each other to the two carrying cups 321 of the carrying cup group 32. When the rotating frame drives the polishing head group to rotate to the polishing station a2, the polishing plate 33 can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

[0041] Furthermore, two first cleaning mechanisms 42 are provided, and the transfer mechanism 41 is also used to transfer the wafers on the two carrying cups 321 of the carrying cup group 32 to the two first cleaning mechanisms 42 for cleaning and drying, which is beneficial to improving production efficiency.

[0042] Furthermore, two polishing stations a2 are provided, and both polishing stations a2 are provided with polishing disks 33. The rotating frame can drive the polishing head group to circulate through the loading and unloading station a1 and the two polishing stations a2, so that the wafer is subjected to two chemical mechanical polishings in the two polishing stations a2 in turn (for example, rough polishing is performed first, and then fine polishing is performed), which is beneficial to improving the polishing effect.

[0043] Furthermore, three groups of polishing head groups are arranged on the rotating frame, and the three groups of polishing head groups are arranged at intervals along the rotating direction of the rotating frame. The angle between the material loading and unloading station a1 and the two adjacent polishing stations a2 is 120°, and the angle between the adjacent two of the three groups of polishing head groups on the rotating frame is 120°. Every time the rotating frame rotates 120°, one group of polishing head groups can be driven to rotate to the material loading and unloading station a1, and the other two groups of polishing head groups can reach the two polishing stations a2 respectively.

[0044] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer processing equipment, characterized in that: include: A material loading and unloading device (10), used for supplying and receiving wafers; a grinding and thinning device (20), arranged on one side of the feeding and discharging device (10) in the first horizontal direction (X1), the grinding and thinning device (20) being used to grind the wafers provided by the feeding and discharging device (10) and transfer the wafers that have been ground to the feeding and discharging device (10); a polishing device (30) arranged on one side of the grinding and thinning device (20) in a second horizontal direction (X2), wherein the second horizontal direction (X2) is perpendicular to the first horizontal direction (X1); and a cleaning and transferring device (40), arranged on one side of the polishing device (30) in the first horizontal direction (X1), and located on one side of the feeding and discharging device (10) in the second horizontal direction (X2); The cleaning and transferring device (40) comprises a transfer mechanism (41) and a first cleaning mechanism (42); the transfer mechanism (41) is used to transfer the wafers that have completed grinding processing on the feeding and discharging device (10) between the polishing device (30), the first cleaning mechanism (42) and the feeding and discharging device (10); the polishing device (30) is used to perform chemical mechanical polishing on the wafers transferred by the transfer mechanism (41); and the first cleaning mechanism (42) is used to clean and dry the wafers transferred by the transfer mechanism (41).

2. The wafer processing equipment according to claim 1, characterized in that: The first cleaning mechanism (42) and the material loading and unloading device (10) are arranged at intervals along the second horizontal direction (X2), and the transfer mechanism (41) is arranged between the first cleaning mechanism (42) and the material loading and unloading device (10) and is movable along the second horizontal direction (X2).

3. The wafer processing equipment according to claim 1, characterized in that: The loading and unloading device (10) comprises a wafer box (11), a centering mechanism (13), a first transport mechanism (12) and a second transport mechanism (14); The wafer box (11) is used to store wafers, the centering mechanism (13) is used to center and position the wafers thereon, the first transport mechanism (12) is used to transfer the wafers in the wafer box (11) to the centering mechanism (13), and the second transport mechanism (14) is used to transfer the wafers on the centering mechanism (13) to the grinding and thinning device (20).

4. The wafer processing equipment according to claim 3, characterized in that: The loading and unloading device (10) also includes a second cleaning mechanism (15), and the second transporting mechanism (14) is also used to transfer the wafers on the grinding and thinning device (20) to the second cleaning mechanism (15), and the second cleaning mechanism (15) is used to clean the wafers thereon, and the transfer mechanism (41) is used to transfer the wafers on the second cleaning mechanism (15) to the polishing device (30).

5. The wafer processing equipment according to claim 4, characterized in that: The centering mechanism (13) and the second cleaning mechanism (15) are arranged between the wafer box (11) and the grinding and thinning device (20), the centering mechanism (13) and the second cleaning mechanism (15) are arranged at intervals along the second horizontal direction (X2), and the centering mechanism (13) is located on a side of the second cleaning mechanism (15) away from the transfer mechanism (41); The first transport mechanism (12) is arranged between the wafer box (11), the centering mechanism (13) and the second cleaning mechanism (15), and the second transport mechanism (14) is arranged between the centering mechanism (13), the second cleaning mechanism (15) and the grinding and thinning device (20).

6. The wafer processing equipment according to claim 5, characterized in that: The loading and unloading device (10) further comprises a buffer mechanism (16) arranged between the second cleaning mechanism (15) and the wafer box (11); the transfer mechanism (41) is used to transfer the wafers in the first cleaning mechanism (42) to the buffer mechanism (16); and the first transport mechanism (12) is also used to transfer the wafers on the buffer mechanism (16) to the wafer box (11).

7. The wafer processing equipment according to claim 1, characterized in that: The polishing device (30) comprises a rotating frame, a polishing head group, a polishing disc (33) and a carrying cup group (32); the polishing head group is mounted on the rotating frame; the rotating frame can controllably drive the polishing head group to pass through a material loading and unloading station (a1) and a polishing station (a2); the carrying cup group (32) is arranged at the material loading and unloading station (a1); the polishing disc (33) is arranged at the polishing station (a2); the polishing head group comprises two polishing heads; the carrying cup group (32) comprises two carrying cups (321); the transfer mechanism (41) is also used to transfer the wafers that have completed grinding processing on the feeding and unloading device (10) to the two carrying cups (321) of the carrying cup group (32); When the rotating frame drives the polishing head group to rotate to the loading and unloading station (a1), the two polishing heads of the polishing head group can respectively pick up the wafers on the two carrying cups (321) of the carrying cup group (32), or the two polishing heads of the polishing head group can respectively release the wafers picked up to the two carrying cups (321) of the carrying cup group (32); when the rotating frame drives the polishing head group to rotate to the polishing station (a2), the polishing disk (33) can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

8. The wafer processing equipment according to claim 7, characterized in that: The first cleaning mechanisms (42) are provided in two numbers, and the transfer mechanism (41) is also used to transfer the wafers on the two carrying cups (321) of the carrying cup group (32) to the two first cleaning mechanisms (42) respectively.

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