Laser tube shell

Abstract

The utility model discloses a laser tube shell, the laser tube shell is used for packaging an optical fiber laser or other laser generating assemblies, and cooling fins for air cooling are integrally formed on the lower surface of a bottom plate of the laser tube shell, so that thermal resistance can be effectively reduced, and efficient heat dissipation can be realized. A refrigerant pipeline can also be embedded in the bottom plate of the laser tube shell and can be used for circulating a phase change refrigerant or a refrigerant such as water, so that heat on the radiating fins on the lower surface of the body can be continuously taken away in an air cooling manner besides the heat taken away by the refrigerant through the pipeline, and the heat dissipation efficiency of the laser is improved. The heat conduction capacity of a non-pipeline area in the cold plate can be effectively utilized, double heat dissipation is achieved so as to improve the heat dissipation efficiency, and therefore the pipe shell bottom plate is a refrigerant refrigeration pipe shell and is also a direct air cooling pipe shell.

Description

Technical Field

[0001] The utility model relates to a laser tube shell, in particular to a packaging tube shell of an optical fiber laser. Background Art

[0002] With the development of lasers, the power of existing lasers is getting higher and higher. Therefore, the demand for heat dissipation of lasers is getting higher and higher. Conventional semiconductor pumps are mostly packaged / sealed using tube shells, and multiple semiconductor laser chips are installed or welded on the base of the tube shell. The heat generated by the semiconductor laser chip is conducted to the base of the tube shell. The base of the existing tube shell is installed on a cold plate, and the base of the tube shell transfers the heat to the cold plate, and then the cold plate is used for heat conduction and heat dissipation. It is realized that due to the thermal conductivity gradient of heat conduction, heat accumulation will be formed at the contact position of the tube shell and the cold plate, resulting in an increase in the temperature of the semiconductor laser chip, and excessively high temperature will easily damage the semiconductor laser chip. Utility Model Content

[0003] The utility model aims to provide a laser tube shell which can have a better heat dissipation capability while having a good sealing package.

[0004] In order to solve the above problems, the utility model provides a laser tube shell, including a bottom plate and a side plate, a plurality of semiconductor laser chips are fixedly mounted on the bottom plate of the laser tube shell, a containing space is formed by the bottom plate at the lower side and the side plates around, the containing space contains a laser generating component, the laser generating component includes a plurality of semiconductor laser chips; the bottom plate of the laser tube shell supports the laser generating component; it is characterized in that: the bottom plate of the laser tube shell includes a plate-shaped body, the first surface of the body is used to receive the heat generated by the heat source and conduct it downward, the second surface of the body forms heat dissipation fins, which can take away the heat on the heat dissipation fins on the lower surface of the body by air cooling, the body and the heat dissipation fins are integrally formed, and the body and the heat dissipation fins are both made of heat conductive material.

[0005] Preferably, a pipe is buried in the bottom plate of the laser tube shell, and a refrigerant circulates in the pipe, and the refrigerant is a phase change refrigerant or a water refrigerant; when the phase change refrigerant circulates in the pipe, the pipe in the bottom plate is connected to the refrigerant pipe of the external compression refrigeration device; when the water refrigerant circulates in the pipe, the pipe in the bottom plate is connected to the external water supply pipe and drainage pipe.

[0006] Preferably, a pipeline is embedded in the body of the bottom plate of the laser tube shell, and a phase-change refrigerant is stored in the pipeline in the body.

[0007] Preferably, the laser generating assembly includes a semiconductor laser chip and a gain cavity fiber, the bottom plate of the laser tube shell includes a semiconductor laser chip placement area and a gain cavity fiber placement area, and the gain cavity fiber and the semiconductor laser chip are packaged in the accommodating space of the laser tube shell.

[0008] Preferably, at least one semiconductor laser chip is mounted on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, active optical fiber and various devices are mounted on the surface of the gain cavity fiber placement area and are in thermal contact with the cold plate, at least one semiconductor laser chip outputs pump light through an output pigtail, the pump light couples the pump light of the output pigtail into the gain cavity fiber through a coupler, and fiber laser is generated and output through the gain cavity fiber; the gain cavity fiber placement area has a second fin area on the lower side, the semiconductor laser chip placement area has a first fin area on the lower side, and the length of the fins of the first fin area extending downward is twice or more the length of the fins of the second fin area extending downward.

[0009] Preferably, the laser tube shell further comprises a top plate, and a receiving space is enclosed by a bottom plate at the lower side, side plates at the surrounding sides, and a top plate at the upper side.

[0010] Preferably, the body and the heat dissipation fins are both made of aluminum or graphene.

[0011] Preferably, the side panels around the tube shell are integrated with the bottom plate at the lower side, or the side panels around the tube shell are integrated with the top plate at the upper side.

[0012] Preferably, a pipeline is buried in the bottom plate of the laser tube shell, and a refrigerant flows in the pipeline. The pipeline density in the semiconductor laser chip placement area is P1, and the pipeline density in the gain cavity fiber placement area is P2, and P1>P2.

[0013] Preferably, a pipeline is provided in the semiconductor laser chip placement area, and a refrigerant flows in the pipeline, and a groove is provided in the gain cavity optical fiber placement area but no pipeline is provided.

[0014] The beneficial effect of the utility model is that a new type of laser tube shell abandons the existing technical solution of setting a cold plate on the lower side of the pump tube shell bottom plate, and can have a good packaging effect while having a better heat dissipation effect. The bottom plate of the laser tube shell includes a plate-shaped body, the first surface of the body is used to receive the heat generated by the heat source and conduct it downward, and the heat dissipation fins are formed on the second surface of the body, which can take away the heat on the heat dissipation fins on the lower surface of the body by air cooling. The body and the heat dissipation fins are integrally formed.

[0015] A refrigerant pipe is set in the bottom plate of the tube shell, and a heat sink is formed on the lower side of the bottom plate, which can effectively utilize the heat conductivity of the non-pipeline area in the bottom plate of the tube shell and realize double heat dissipation to improve the heat dissipation efficiency. It can have the effects of phase change cooling and direct air cooling at the same time, or the effects of water cooling and direct air cooling. In order to reduce the thermal resistance of air cooling and improve the heat dissipation capacity of air cooling.

[0016] The bottom plate of the laser tube shell includes a semiconductor laser chip placement area and a gain cavity fiber placement area, which can effectively realize the packaging and effective heat dissipation of the current fiber laser. In order to dissipate heat more effectively and more evenly, the fins on the lower side of the semiconductor laser chip placement area are longer than the fins on the lower side of the gain cavity fiber placement area. Pipes are buried in the bottom plate of the laser tube shell, and refrigerant circulates or stores in the pipes. The pipe density in the semiconductor laser chip placement area is P1, and the pipe density in the gain fiber placement area is P2, and P1>P2. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the bottom plate and heat dissipation fin structure of the utility model.

[0018] Figure 2 It is a schematic diagram of the heat dissipation fin of the utility model.

[0019] Figure 3 It is an explosion schematic diagram of the utility model.

[0020] Figure 4 It is a schematic diagram of the utility model. DETAILED DESCRIPTION

[0021] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0022] Existing lasers usually use semiconductor lasers as pump sources or part of the light source, and the heat generated by semiconductor laser chips is extremely large. Therefore, in lasers, it is most important to dissipate heat for semiconductor chips. In the usual technical solution, multiple semiconductor laser chips are used in the pump source or light source as a group of semiconductor laser chip modules, and multiple semiconductor laser chips have a common tube shell for packaging / sealing. The tube shell can be called a laser tube shell. Multiple semiconductor laser chips are installed on the base of the tube shell. The heat generated by the semiconductor laser chips is conducted to the base of the tube shell. The base of the existing tube shell is installed on a cold plate. The base of the tube shell transfers the heat to the cold plate, and then conducts and dissipates heat through the cold plate. We realize that this type of heat dissipation will form heat accumulation at the contact position of the tube shell and the cold plate due to the effect of the tube shell and the thermal conductivity gradient of heat conduction, which makes it more difficult to dissipate heat for the semiconductor laser chip, and excessively high temperature will easily damage the semiconductor laser chip. In order to solve this problem, we decided to adopt a new packaging method. We abandoned the technical solution of using ordinary tube shells and installing the pump laser tube shells on the cold plate. Instead, we designed a tube shell with water cooling / phase change cooling and air cooling, and directly installed multiple semiconductor chips on the water cooling / phase change cooling and air cooling tube shells.

[0023] The specific scheme is as follows: a new type of laser tube shell, including a bottom plate at the bottom, side plates around, and a top plate at the top. A plurality of semiconductor laser chips are fixedly mounted on the bottom plate of the laser tube shell. A storage space is formed by the bottom plate at the bottom, the side plates around, and the top plate at the top. The storage space receives and stores the laser generating components including the plurality of semiconductor laser chips, and even seals them. The bottom plate of the laser tube shell supports the laser generating components including the plurality of semiconductor laser chips. The laser generating component is an optical component that can generate the final output laser or the intermediate process laser. The laser generating component may include a semiconductor laser chip, a collimation / coupling component, and in some embodiments, an active optical fiber and / or a passive optical fiber. Preferably, the bottom plate of the laser tube shell includes a plate-shaped body, the body is made of a heat-conducting material, and the first surface (upper surface) of the body is used to receive the heat generated by the heat source and conduct it downward. In order to improve the heat dissipation efficiency, a pipeline is buried in the bottom plate of the tube shell, and a pipeline is arranged in the body. The refrigerant can flow or be stored in the pipeline. Specifically, when water cooling is adopted, water refrigerant flows in the pipeline in the body, and when the compression refrigeration scheme is adopted, the phase change refrigerant flows in the pipeline in the body. Preferably, when the circulating refrigerant is selected, the following conditions exist: when the phase change refrigerant flows in the pipeline, the pipeline in the bottom plate of the laser tube shell is connected to the refrigerant pipeline of the external compression refrigeration device; when the water refrigerant flows in the pipeline, the pipeline in the bottom plate of the laser tube shell is connected to the external water supply pipe and drainage pipe; preferably, when the storage refrigerant scheme is adopted, the phase change refrigerant is stored in the pipeline. Preferably, heat dissipation fins are formed on the second surface (lower surface) of the body, and the heat on the heat dissipation fins on the lower surface of the body can be continuously taken away by air cooling (a device for accelerating the airflow, such as a fan, can be provided in a matching manner). Thus, the heat conduction capacity of the non-pipeline area in the bottom plate of the tube shell can be effectively utilized and double heat dissipation can be achieved to improve the heat dissipation efficiency, and the effects of phase change cooling and direct air cooling can be achieved at the same time, or the effects of water cooling and direct air cooling can be achieved. In order to reduce the thermal resistance of air cooling and improve the heat dissipation capacity of air cooling, preferably, the body and the heat dissipation fins are integrally formed, and the body and the heat dissipation fins are both made of heat-conducting materials, especially the body and the heat dissipation fins are both made of high heat-conducting materials, such as high heat-conducting aluminum and graphene materials. Of course, when it is not the most preferred, there is also a laser tube shell bottom plate that uses pure air cooling, that is, the body of the bottom plate of the laser tube shell is made of heat-conducting materials, and the bottom plate of the tube shell adopts a solid structure, but the heat dissipation fins are formed on the second surface (lower surface) of the body, and the heat on the heat dissipation fins on the lower surface of the body can still be continuously taken away by air cooling. Generally speaking, the side panels around the tube shell are integrated with the bottom plate at the bottom; the bottom plate at the bottom, the side panels around, and the top plate at the top form a receiving space; of course, the structure of the tube shell can also be Figure 3As shown, the side panels around the tube shell are integrated with the upper top plate, and by placing the upper top plate cover on the lower bottom plate, the lower bottom plate, the side panels around, and the upper top plate enclose a receiving space.

[0024] For the semiconductor pump laser generating components packaged in the tube shell, currently, multiple chips are packaged in the conventional pump tube shell, and there are only a plurality of semiconductor laser chips in the tube shell, coupled with an optical fiber output. When used in a fiber laser, N pump modules are selected and installed on a cooling plate, and the gain cavity optical fiber is installed on other structures outside the tube shell, resulting in the need for additional support structures, making the structure complicated, and the heat dissipation of the optical fiber also requires additional structures; therefore, preferably, reference Figure 3 , 4 , so that the gain cavity fiber and the semiconductor laser chip are simultaneously packaged on the bottom plate of the laser tube shell, that is, the bottom plate of the laser tube shell includes a semiconductor laser chip placement area and a gain fiber placement area, at least one semiconductor laser chip is installed on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, and the active fiber and various devices are installed on the surface of the gain cavity fiber placement area and are in thermal contact with it, at least one semiconductor laser chip outputs pump light through the output pigtail, and the pump light couples the pump light of the output pigtail into the gain cavity fiber through a fiber combiner or other coupler, and generates and outputs fiber laser through the gain cavity active fiber (that is, the semiconductor laser chip, active fiber and other related optical components together constitute the laser generation component of the fiber laser). That is, the fiber laser is arranged on the bottom plate of the laser tube shell, and the fiber laser is packaged by the laser tube shell. The bottom plate, the surrounding side plates and the upper top plate of the laser tube shell will package the fiber laser in the laser tube shell. Since the semiconductor laser chip generates more heat than the gain cavity fiber, in order to dissipate heat more effectively and more evenly, preferably, the fins on the lower side of the semiconductor laser chip placement area are longer than the fins on the lower side of the gain cavity fiber placement area, that is, the lower side of the gain cavity fiber placement area has a second fin area, and the lower side of the semiconductor laser chip placement area has a first fin area, and the length of the fins of the first fin area extending downward is more than twice the length of the fins of the second fin area extending downward. A pipeline is buried in the bottom plate of the laser tube shell, and a refrigerant circulates in the pipeline. The pipeline density in the semiconductor laser chip placement area is P1, and the pipeline density in the active fiber placement area is P2, and P1>P2. The pipeline density can be defined by the ratio of the area of ​​the pipeline projected on the first surface in the predetermined area to the total area of ​​the predetermined area. Of course, the following implementation method can also be adopted, in which a pipeline is provided in the semiconductor laser chip placement area, a refrigerant circulates in the pipeline, and no pipeline is provided in the gain cavity fiber placement area. Of course, although this can balance the heat dissipation, it will reduce the heat dissipation capacity of the active fiber placement area compared with the previous implementation method.

[0025] That is, the utility model relates to a laser tube shell, which is used to encapsulate a fiber laser or other laser generating components. The lower surface of the bottom plate of the laser tube shell is integrally formed with heat dissipation fins for air cooling (instead of arranging a cold plate on the lower side of the tube shell bottom plate as usual), which can effectively reduce thermal resistance and achieve efficient heat dissipation. Preferably, a refrigerant pipeline can also be buried in the bottom plate of the laser tube shell, and the refrigerant pipeline can be used to circulate phase change refrigerant or refrigerant such as water. In this way, in addition to the refrigerant taking away heat through the pipeline, the heat on the heat dissipation fins on the lower surface of the body 1 can also be continuously taken away by air cooling. Therefore, the thermal conductivity of the non-pipeline area in the cold plate can be effectively utilized and double heat dissipation can be achieved to improve the heat dissipation efficiency. In this way, the tube shell bottom plate is both a refrigerant cooling tube shell and a direct air cooling tube shell.

[0026] like Figure 1 As shown, the utility model includes a laser tube shell bottom plate, which is used to dissipate heat for the laser device. The bottom plate includes a plate-shaped body 1, which is made of a heat-conducting material. The first surface (upper surface) of the body 1 is used to receive the heat generated by the heat source and conduct it downward. In order to improve the heat dissipation efficiency, a pipeline is buried in the bottom plate (see Figure 3 ), a pipe is arranged in the base plate, and a refrigerant can flow in the pipe. Specifically, when water cooling is adopted, water refrigerant flows in the pipe in the heat dissipation base plate, and when a compression cooling solution is adopted, a phase change refrigerant flows in the pipe in the heat dissipation base plate.

[0027] This solution can solve some problems of the solution of cooling only through refrigerant in the pipe. Among them, since only the refrigerant circulating in the refrigerant pipe is the final way for heat to flow out, the efficiency of introducing heat from the heat dissipation base plate into the refrigerant pipe is crucial. Therefore, the more comprehensive the distribution area of ​​the refrigerant pipe in the heat dissipation base plate, the greater the density of the refrigerant pipe, and the larger the surface area, the higher the heat dissipation efficiency. However, the refrigerant pipe only bends and extends in the area inside the heat dissipation base plate and does not cover the entire transverse cross-section of the heat dissipation base plate. The setting of refrigerant pipes with too high density is not only costly but also reduces the mechanical strength of the entire heat dissipation base plate. In addition, refrigerant pipes that are too long will also increase the resistance to refrigerant transportation. Therefore, preferably, heat dissipation fins are formed on the second surface (lower surface) of the main body 1. In addition to the refrigerant taking away heat through the pipe, the heat on the heat dissipation fins on the lower surface of the main body 1 can also be continuously taken away by air cooling. Thus, the thermal conductivity of the non-pipeline area in the heat dissipation base plate can be effectively utilized and double heat dissipation can be achieved to improve the heat dissipation efficiency. In order to reduce the thermal resistance of air cooling and improve the heat dissipation capacity of air cooling, preferably, the main body 1 and the heat dissipation fins are integrally formed, and the main body 1 and the heat dissipation fins are both made of thermally conductive materials, especially the main body 1 and the heat dissipation fins are both made of high thermal conductivity materials, such as high thermal conductivity aluminum (including ordinary aluminum and special doped aluminum alloys, etc.) and graphene materials.

[0028] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A laser tube shell, comprising a bottom plate and a side plate, wherein a plurality of semiconductor laser chips are fixedly mounted on the bottom plate of the laser tube shell, and a receiving space is formed by the bottom plate at the lower side and the surrounding side plates, wherein the receiving space receives a laser generating component, wherein the laser generating component comprises a plurality of semiconductor laser chips; the bottom plate of the laser tube shell supports the laser generating component; wherein the laser generating component is characterized in that: The bottom plate of the laser tube shell includes a plate-shaped body. The first surface of the body is used to receive the heat generated by the heat source and conduct it downward. The second surface of the body is formed with heat dissipation fins, which can take away the heat on the heat dissipation fins on the lower surface of the body by air cooling. The body and the heat dissipation fins are integrally formed, and both the body and the heat dissipation fins are made of heat-conducting materials.

2. According to claim 1, a laser tube shell has a pipe buried in the bottom plate of the laser tube shell, and a refrigerant flows in the pipe, and the refrigerant is a phase change refrigerant or a water refrigerant; when the phase change refrigerant flows in the pipe, the pipe in the bottom plate is connected to the refrigerant pipe of an external compression refrigeration device; when the water refrigerant flows in the pipe, the pipe in the bottom plate is connected to an external water supply pipe and a drainage pipe.

3. According to the laser tube shell of claim 1, a pipeline is buried in the body of the bottom plate of the laser tube shell, and the phase change refrigerant is stored in the pipeline in the body.

4. According to a laser tube shell of claim 2, the laser generating component includes a semiconductor laser chip and a gain cavity fiber, the bottom plate of the laser tube shell includes a semiconductor laser chip placement area and a gain cavity fiber placement area, and the gain cavity fiber and the semiconductor laser chip are packaged in the accommodating space of the laser tube shell.

5. According to a laser tube shell of claim 4, at least one semiconductor laser chip is installed on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, the active optical fiber and various devices are installed on the surface of the gain cavity fiber placement area and are in thermal contact with the cold plate, at least one semiconductor laser chip outputs pump light through an output pigtail, and the pump light couples the pump light of the output pigtail into the gain cavity fiber through a coupler, and fiber laser is generated and output through the gain cavity fiber; the gain cavity fiber placement area has a second fin area on the lower side, and the semiconductor laser chip placement area has a first fin area on the lower side, and the length of the fins of the first fin area extending downward is twice or more the length of the fins of the second fin area extending downward.

6. A laser tube shell according to claim 1, wherein the laser tube shell further comprises a top plate, and a receiving space is formed by a bottom plate at the lower side, side plates around, and a top plate at the upper side.

7. According to claim 1, the laser tube shell, the body and the heat dissipation fins are both made of aluminum or graphene.

8. A laser tube shell according to claim 6, wherein the side plates around the tube shell are integrated with the bottom plate at the lower side, or the side plates around the tube shell are integrated with the top plate at the upper side.

9. According to claim 4, a laser tube shell is provided with a pipe buried in the bottom plate of the laser tube shell, a refrigerant flows in the pipe, the pipe density in the semiconductor laser chip placement area is P1, the pipe density in the gain cavity fiber placement area is P2, and P1>P2.

10. A laser tube shell according to claim 4, wherein a pipeline is arranged in the semiconductor laser chip placement area, and a refrigerant flows in the pipeline, and a groove is arranged in the gain cavity optical fiber placement area but no pipeline is arranged.

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