Heat dissipation device

Abstract

The utility model provides a heat dissipation device which comprises a substrate and fins, the substrate is used for being connected with a heating piece in a heat conduction mode, a heat conduction cavity is formed in the substrate, a phase change working medium is arranged in the heat conduction cavity, each fin comprises a body and a pulsating heat pipe, the body is connected with the substrate in a heat conduction mode, and a gas-liquid circulation flow channel communicating with the heat conduction cavity is formed in the body; at least part of the pulsating heat pipes are arranged on the surface of the body so that the pulsating heat pipes can be connected with the body in a heat conduction mode, and inner cavities of the pulsating heat pipes do not communicate with the heat conduction cavity. Through the arrangement, the heat dissipation structure of the heat dissipation device is enriched, the diffusion speed of heat on the fin body is effectively increased, and then the heat dissipation efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a heat dissipation device. Background Art

[0002] With the vigorous development of the electronic cooling industry and the iterative updates of electronic products, the power of chips is getting higher and higher, and the heat is getting higher and higher, which leads to some communication equipment that uses natural convection for heat dissipation requiring better cooling devices to meet the requirements of outdoor heat dissipation.

[0003] However, the existing heat dissipation devices that use natural convection to dissipate heat have a relatively simple heat dissipation structure, resulting in that their heat dissipation efficiency cannot meet the heat dissipation requirements of some current communication devices. Utility Model Content

[0004] In view of this, the present application is dedicated to providing a heat dissipation device, which effectively improves the heat dissipation efficiency of the heat dissipation device by setting up a variety of heat dissipation structures.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A heat dissipation device, comprising:

[0007] A substrate, used for thermal connection with the heating element, wherein the interior of the substrate has a heat conduction cavity for filling a phase change medium;

[0008] The fin comprises a body and a pulsating heat pipe, wherein the body is thermally connected to the substrate, and a gas-liquid circulation channel connected to the heat conduction cavity is arranged inside the body, so that the gaseous phase change medium in the heat conduction cavity can enter the gas-liquid circulation channel, at least part of the pulsating heat pipe is arranged on the surface of the body, so that the pulsating heat pipe is thermally connected to the body, and the inner cavity of the pulsating heat pipe is not connected to the heat conduction cavity.

[0009] Preferably, the main body has a flow channel opening for connecting the gas-liquid circulation channel and the heat conduction cavity;

[0010] The end of the pulsating heat pipe that absorbs heat is the evaporation end, and the end that dissipates heat is the condensation end. The condensation end is arranged away from the flow channel opening relative to the evaporation end.

[0011] Preferably, a portion of the pulsating heat pipe is laid on the body, and another portion extends out of the body, so that airflow in all directions can pass through the heat dissipation device and take away the heat in the pulsating heat pipe.

[0012] Preferably, the pulsating heat pipe includes a dense part and a sparse part, the sparse part is located in a region of the main body where the gas-liquid circulation channel is provided, and the dense part is located in a region of the main body where the gas-liquid circulation channel is not provided.

[0013] Preferably, one of the heat conduction chambers is connected to one of the gas-liquid circulation channels to form a phase change cooling chamber;

[0014] A plurality of independent heat-conducting cavities are arranged inside the substrate, and a plurality of independent gas-liquid circulation channels respectively connected with different heat-conducting cavities are arranged inside the body to form a plurality of phase-change cooling cavities.

[0015] Preferably, the gas-liquid circulation channel includes a plurality of gas-liquid channel units distributed in an array and / or staggered manner, and adjacent gas-liquid channel units have a common portion.

[0016] Preferably, the flow width around any intersection of three adjacent gas-liquid flow channel units is greater than the flow width at other positions of the gas-liquid flow channel units.

[0017] Preferably, a plurality of fins are provided on the substrate, and the plurality of fins are distributed in parallel and are provided on a side of the substrate away from the heat generating element.

[0018] Preferably, in the arrangement direction of the fins, the area of ​​the fins occupied by the gas-liquid circulation channel in the fins located in the middle is larger than the area of ​​the fins occupied by the gas-liquid circulation channel in the fins located at the ends;

[0019] And / or, in the arrangement direction of the fins, the area of ​​the heat dissipation surface of the body occupied by the pulsating heat pipes in the fins located in the middle is larger than the area of ​​the heat dissipation surface of the body occupied by the pulsating heat pipes in the fins located at the ends.

[0020] Preferably, the substrate is a temperature homogenizing plate, comprising:

[0021] A bottom plate, located on a side of the temperature homogenizing plate away from the fins, and thermally connected to the heat generating element;

[0022] A cover plate, located on a side of the temperature homogenizing plate close to the fins and thermally connected to the fins;

[0023] In which, the bottom plate and / or the cover plate are provided with grooves so that the bottom plate and the cover plate cooperate to form the heat conduction cavity, and the surface of the bottom plate used to form the heat conduction cavity is the first surface, the first surface is provided with a capillary structure layer, and the cover plate is provided with an opening for connecting the heat conduction cavity and the gas-liquid circulation channel.

[0024] It can be seen from the above technical scheme that the heat dissipation device provided by the present application has a gas-liquid circulation channel arranged inside the fin, and the gas-liquid circulation channel is connected with the heat conduction cavity inside the substrate, thereby forming a cavity for realizing gas-liquid circulation transformation, and the phase change working fluid absorbs heat in the substrate and is transformed into a gaseous phase change working fluid, and dissipates heat in the gas-liquid circulation channel and is transformed into a liquid phase change working fluid. In this way, the heat dissipation efficiency of the heat dissipation device can be effectively improved by using phase change heat dissipation; in addition, pulsating heat pipes are laid on the surface of the fins, which enriches the heat dissipation structure of the heat dissipation device, so that heat can be diffused faster on the heat dissipation surface of the body, thereby improving the heat exchange efficiency between the fins and the external environment, thereby further improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Shown is an exploded view of a heat dissipation device provided in an embodiment of the present application;

[0026] Figure 2 Shown is an exploded view of a fin provided in an embodiment of the present application;

[0027] Figure 3 Shown is a schematic diagram of another fin provided in an embodiment of the present application;

[0028] Figure 4 Shown is an exploded view of another heat dissipation device provided in an embodiment of the present application;

[0029] Figure 5 Shown Figure 4 A cross-sectional view of the heat sink shown.

[0030] exist Figure 1-Figure 5 middle:

[0031] 1-substrate, 2-fins, 3-liquid injection pipe, 4-heating element;

[0032] 11-bottom plate, 12-capillary structure layer, 13-cover plate, 14-opening;

[0033] 21-body, 22-pulsating heat pipe, 23-gas-liquid circulation flow channel, 24-flow channel opening;

[0034] 111 - support column, 112 - connection protrusion, 113 - first surface, 114 - second surface;

[0035] 221-dense local, 222-sparse local;

[0036] 231-Gas-liquid flow channel unit. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] First of all, it should be noted that the heat dissipation device in the present application is suitable for scenarios where natural convection is used for heat dissipation, for example, it is suitable for scenarios where heat is dissipated in outdoor communication base stations, or it is also suitable for scenarios where heat is dissipated in outdoor electronic equipment cabinets.

[0039] like Figure 1 As shown, an embodiment of the present application discloses a heat dissipation device, including a substrate 1 and fins 2, wherein the substrate 1 is used for thermal connection with the heating element 4, and the interior of the substrate 1 has a heat conduction cavity for filling a phase change medium (the phase change medium here refers to a medium that can be transformed from liquid to gas when heated, and can be transformed from gas to liquid when cooled); in this way, without considering the heat dissipation of the substrate 1 itself, a part of the heat generated by the heating element 4 can be transferred to the phase change medium in the heat conduction cavity through the cavity wall of the heat conduction cavity, and the liquid phase change medium is transformed into a gaseous phase change medium; and the other part of the heat will be directly transferred to the fins 2 through the substrate 1 in the form of heat conduction.

[0040] like Figure 2As shown, the fin 2 includes a body 21 and a pulsating heat pipe 22, wherein the body 21 is thermally connected to the substrate 1, and a gas-liquid circulation channel 23 connected to the heat conduction cavity is provided inside the body 21, so that the gaseous phase-change medium in the heat conduction cavity can enter the gas-liquid circulation channel 23, and the gaseous phase-change medium entering the gas-liquid circulation channel 23 will exchange heat with the body 21 of the fin 2 to be re-condensed in the gas-liquid circulation channel 23, and the condensed phase-change medium will return to the heat conduction cavity under the action of gravity and the side wall of the gas-liquid circulation channel 23 to participate in the next cycle. In addition, based on the above structure, at least part of the pulsating heat pipe 22 is arranged (preferably the pulsating heat pipe 22 is laid flat on the surface of the body 21, i.e., laid) on the surface of the body 21, so that the pulsating heat pipe 22 is thermally connected to the body 21, and the inner cavity of the pulsating heat pipe 22 is not connected to the heat conduction cavity. In this way, part of the heat transferred to the fin 2 (the heat source includes the heat transferred to the fin 2 by the above-mentioned heating element 4 directly through the substrate 1 in the form of heat conduction, and the heat dissipated by the gas phase change medium inside the gas-liquid circulation channel 23) will be directly transferred to the external environment through the heat dissipation surface of the main body 21, and the other part will be transferred to the pulsating heat pipe 22, and then the heat dissipation efficiency will be improved by using the pulsating heat pipe 22. Specifically, the arrangement of the pulsating heat pipe 22 on the main body 21 can include a variety of ways, for example, the pulsating heat pipe 22 is only arranged on one surface of the main body 21, or it can be arranged on two opposite surfaces of the main body 21, and the pulsating heat pipe 22 and the main body 21 can be connected by welding, or the pulsating heat pipe 22 and the main body 21 can be integrally formed, etc.

[0041] As described above, the above-mentioned heat dissipation device has a gas-liquid circulation channel 23 set inside the fin 2, and the gas-liquid circulation channel 23 is connected to the heat conduction cavity inside the substrate 1, thereby forming a cavity for realizing gas-liquid circulation transformation, and the phase change working fluid absorbs heat in the substrate 1 and transforms into a gaseous phase change working fluid, and dissipates heat in the gas-liquid circulation channel 23 and transforms into a liquid phase change working fluid. In this way, the heat dissipation efficiency of the heat dissipation device can be effectively improved by using phase change heat dissipation; in addition, pulsating heat pipes 22 are laid on the surface of the fin 2, which enriches the heat dissipation structure of the heat dissipation device, so that heat can be diffused faster on the heat dissipation surface of the main body 21, thereby improving the heat exchange efficiency between the fin 2 and the external environment, thereby further improving the heat dissipation efficiency of the heat dissipation device.

[0042] In some preferred embodiments, the body 21 and the substrate 1, as well as the body 21 and the pulsating heat pipe 22 are connected by welding (e.g., brazing). In this way, the stability between the body 21 and the substrate 1, as well as between the body 21 and the pulsating heat pipe 22 can be improved, and effective contact between the body 21 and the substrate 1, as well as between the body 21 and the pulsating heat pipe 22 can be ensured, so as to facilitate heat transfer.

[0043] In addition, regarding the formation method of the pulsating heat pipe 22, in some exemplary embodiments, the pulsating heat pipe 22 is a bent aluminum tube, the ends of the aluminum tube are connected to form a closed pipeline, the interior of the pulsating heat pipe 22 has a one-way connected micro channel, and the interior of the micro channel is filled with a phase change working fluid (the filling method of the phase change working fluid is: the interior of the pulsating heat pipe 22 is evacuated, and the phase change working fluid is filled under a low vacuum degree).

[0044] Furthermore, in order to facilitate filling the phase change medium inside the pulsating heat pipe 22, as Figure 2 As shown, the heat dissipation device in the present application is also provided with a liquid injection pipe 3, and the liquid injection pipe 3 is connected to the pulsating heat pipe 22. It should be noted that when the heat dissipation device is in a working state, the liquid injection pipe 3 is in a closed state to ensure the sealing of the pulsating heat pipe 22 and ensure the circulation of the phase change working medium inside the pulsating heat pipe 22.

[0045] Continue as Figure 2 As shown, the body 21 has a flow channel opening 24 for connecting the gas-liquid circulation flow channel 23 and the heat conduction cavity. During the heat dissipation process, the gaseous phase change medium generated by heat absorption in the heat conduction cavity enters the gas-liquid circulation flow channel 23 through the flow channel opening 24, and flows along the guiding direction of the gas-liquid circulation flow channel 23, and continuously dissipates heat during the flow process. Based on the above process, under the premise of no interference, the temperature of the flow channel opening 24 area is higher than the temperature of other areas of the body 21 of the fin 2. Based on this point, the present application sets the condensation end of the pulsating heat pipe 22 away from the flow channel opening 24 relative to the evaporation end (wherein, the end of the pulsating heat pipe 22 that absorbs heat is the evaporation end, and the end that dissipates heat is the condensation end). In this way, during the heat dissipation process, the evaporation end of the pulsating heat pipe 22 can absorb the heat dissipated by the gaseous phase change medium in the flow channel opening 24 area, which is not only conducive to the full heat dissipation of the pulsating heat pipe 22, but also can accelerate the condensation efficiency of the gaseous phase change medium, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0046] As mentioned above, at least part of the pulsating heat pipe 22 is laid on the surface of the main body 21. In some preferred embodiments, part of the pulsating heat pipe 22 is laid on the main body 21, and the other part extends out of the main body 21, so that airflow in all directions can pass through the heat dissipation device and take away the heat in the pulsating heat pipe 22. That is to say, part of the pulsating heat pipe 22 is not laid on the main body 21, but extends out of the main body 21 to achieve a suspended arrangement, so that the fin 2 includes both a plate-like part (the plate-like part refers to the main body 21 and a part of the pulsating heat pipe 22 laid on the main body 21) and a tubular part (the tubular part refers to the part of the pulsating heat pipe 22 that extends out of the main body 21 to achieve a suspended arrangement). Since the pulsating heat pipe 22 is bent and extended, different sections of the tubular part will have gaps due to the bending, so that the airflow flowing in all directions can pass through the gap to achieve heat dissipation of the tubular part, that is, the airflow in all directions can pass through the heat dissipation device and take away the heat in the pulsating heat pipe 22; since it will not restrict the flow of wind, the ventilation effect is better, thereby further improving the heat dissipation efficiency of the heat dissipation device.

[0047] Of course, as needed, the pulsating heat pipe 22 can also be laid entirely on the heat dissipation surface of the main body 21, that is, in the direction perpendicular to the heat dissipation surface of the main body 21, the projection of the pulsating heat pipe 22 on the main body 21 falls completely inside the main body 21. Such a setting can reduce the probability of the pulsating heat pipe 22 being damaged by force, thereby increasing the service life of the heat dissipation device.

[0048] Furthermore, in some preferred embodiments, the heat dissipation device also includes a mesh protective cover (not shown in the figure), and the mesh protective cover is connected to the substrate 1 to cooperate with the substrate 1 to form a protective cavity, and the fin 2 is arranged in the protective cavity so that the protective cover can protect the fin 2 and reduce the probability of it being damaged due to force.

[0049] Furthermore, on the basis of setting up the protective cover, the protective cover is made of a material with good thermal conductivity (such as aluminum or copper), so that the protective cover serves as a part of the heat dissipation structure, further improving the heat dissipation capacity and heat dissipation efficiency of the heat dissipation device.

[0050] like Figure 3 As shown, in some embodiments, the pulsating heat pipe 22 includes a dense part 221 and a sparse part 222. The sparse part 222 is located in the area where the gas-liquid circulation channel 23 is provided on the main body 21, and the dense part 221 is located in the area where the gas-liquid circulation channel 23 is not provided on the main body 21. Such a setting can balance the heat dissipation efficiency of each area of ​​the fin 2, thereby improving the heat dissipation effect.

[0051] Further preferably, one fin 2 includes a plurality of pulsating heat pipes 22, and the plurality of pulsating heat pipes 22 are respectively arranged on the body 21 of the fin 2 in an area where a gas-liquid circulation channel 23 is provided and an area where a gas-liquid circulation channel 23 is not provided, so as to ensure good contact between the pulsating heat pipe 22 and the surface of the body 21, and the pulsating heat pipes 22 in different areas will not interfere with each other. Different pulsating heat pipes 22 can be arranged according to different temperature distributions of the body 21, which is more convenient for optimizing the arrangement of the pulsating heat pipes 22.

[0052] In addition, a heat conduction cavity is connected to a gas-liquid circulation channel 23 to form a phase change cooling cavity; in some embodiments, a plurality of independent heat conduction cavities are arranged inside the substrate 1, and a plurality of independent gas-liquid circulation channels 23 respectively connected to different heat conduction cavities are arranged inside the body 21 to form a plurality of phase change cooling cavities. In this way, the heat generated by different heating areas of the heating element 4 (or different heating elements 4) is simultaneously transferred toward one side of the substrate 1, which can effectively improve the uniformity of heat dissipation.

[0053] The gas-liquid circulation channel 23 includes a plurality of gas-liquid flow channel units 231, and adjacent gas-liquid flow channel units 231 have a common portion. In this way, under the segmentation effect of the gas-liquid flow channel units 231, the uniformity of the distribution of the gas phase change medium in the gas-liquid circulation channel 23 can be improved. In addition, the heat exchange area between the body 21 and the gas phase change medium can be increased, thereby improving the heat dissipation efficiency.

[0054] Furthermore, regarding the distribution mode of the gas-liquid flow channel unit 231, in the specific implementation, an adaptive design can be performed as needed. For example, in some embodiments, a plurality of gas-liquid flow channel units 231 are distributed in an array. In other embodiments, a plurality of gas-liquid flow channel units 231 are staggered. In addition, in some other embodiments, some gas-liquid flow channel units 231 are distributed in an array, and some gas-liquid flow channel units 231 are staggered. Compared with the flow channels in the form of tree-like branching structures, the flow channel setting mode in the above-mentioned embodiments has stronger connectivity at various locations of the gas-liquid circulation flow channel 23 in the present application. This provides a variety of circulation possibilities for the phase change working medium, which is often in a gas-liquid mixed state in the gas-liquid circulation flow channel 23. The gaseous phase change working medium and the liquid phase change working medium naturally form areas that are conducive to their own rapid flow, respectively, which is very beneficial for the reciprocating circulation in the fins 2 and the substrate 1, and optimizes the heat dissipation effect.

[0055] Furthermore, the gas-liquid circulation channel 23 is honeycomb-shaped, that is, the shape of a single gas-liquid flow channel unit 231 is hexagonal, and the flow width at the intersection of any three adjacent gas-liquid flow channel units 231 is greater than the flow width at other positions of the gas-liquid flow channel unit 231, or in other words, the flow width at the intersection of a gas-liquid flow channel unit 231 with other gas-liquid flow channel units 231 is greater than the flow width at the straight edge of the gas-liquid flow channel unit 231.

[0056] In this arrangement, although the flow direction of the phase-change medium changes at the intersection of the gas-liquid flow channel unit 231, the widened flow width here is still conducive to the rapid passage of the gaseous or liquid phase-change medium, thereby optimizing the heat dissipation efficiency of the radiator. In addition, this arrangement can also make the gas-liquid flow channel unit 231 have a stronger anti-deformation ability.

[0057] It should be understood that the above only provides an exemplary description of the gas-liquid flow channel unit 231 as a hexagon, but the present application is not limited to this. For example, the shape of the gas-liquid flow channel unit 231 can also be designed as a circular ring, an elliptical ring, a polygonal ring surrounded by multiple straight edges (such as a triangular ring, a quadrilateral ring, a pentagonal ring, a hexagonal ring), a ring surrounded by multiple arc edges, and a ring surrounded by several straight edges and several arc edges, etc. Of course, the gas-liquid flow channel unit 231 in the same fin 2 is not limited to one shape, it can also be a combination of the above-mentioned shapes, for example, Figure 2 As shown, the same fin 2 may include both elliptical rings and polygonal rings.

[0058] like Figure 1 As shown, a plurality of fins 2 are arranged on the substrate 1, and the plurality of fins 2 are evenly distributed on the side of the substrate 1 away from the heat-generating element 4. Thus, on the one hand, the plurality of fins 2 can increase the heat dissipation area of ​​the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device; on the other hand, the plurality of fins 2 are evenly distributed, which can improve the uniformity of heat dissipation, thereby ensuring the heat dissipation effect.

[0059] It should be noted that the specific number of fins 2 can be adaptively designed according to the heat dissipation needs, and the present invention does not specifically limit it. For example, in some embodiments, 10 fins 2 are provided on the substrate 1; in other embodiments, 14 fins 2 are provided on the substrate 1. Of course, in some extreme cases, the number of fins 2 may be only 1.

[0060] Furthermore, on the basis of the plurality of fins 2, in some embodiments, a plurality of fins 2 are arranged in parallel, and this arrangement can reduce the disturbance of the fins 2 to the airflow, thereby reducing the resistance of the air flow and ensuring the heat dissipation effect. Of course, adjacent fins 2 can also be arranged in other distribution modes as needed, for example, adjacent fins 2 can be arranged in an "eight" shape.

[0061] In some embodiments, when the heat generated by the heating element 4 is transferred to the middle area of ​​the substrate 1, the fins 2 on both sides of the middle fin 2 are provided with gas-liquid circulation channels 23, and the fins 2 in the middle will be disturbed by the fins 2 on both sides, resulting in poor heat dissipation effect in the middle area of ​​the substrate 1. Therefore, an optional implementation is provided here, in the arrangement direction of the fins 2, the area of ​​the fins 2 occupied by the gas-liquid circulation channels 23 in the fins 2 in the middle is larger than the area of ​​the fins 2 occupied by the gas-liquid circulation channels 23 in the fins 2 at the ends, and such an arrangement can improve the heat dissipation effect in the middle area of ​​the substrate 1.

[0062] In this embodiment, another implementation is provided, in which, in the arrangement direction of the fins 2, the area of ​​the heat dissipation surface of the body 21 occupied by the pulsating heat pipes 22 in the fins 2 located in the middle is larger than the area of ​​the heat dissipation surface of the body 21 occupied by the pulsating heat pipes 22 in the fins 2 located at the ends. This arrangement can also improve the heat dissipation effect of the middle area of ​​the substrate 1.

[0063] Of course, in some other embodiments, in the arrangement direction of the fins 2, the area occupied by the gas-liquid circulation channel 23 in the middle fin 2 can be larger than the area occupied by the gas-liquid circulation channel 23 in the end fin 2, and the area of ​​the heat dissipation surface of the main body 21 occupied by the pulsating heat pipe 22 in the middle fin 2 can be larger than the area of ​​the heat dissipation surface of the main body 21 occupied by the pulsating heat pipe 22 in the end fin 2.

[0064] In a preferred embodiment, the substrate 1 is a temperature averaging plate. By utilizing the good temperature averaging capability of the temperature averaging plate, the heat generated by the heating element 4 can be more evenly transferred to the body 21 of the fin 2, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device.

[0065] Furthermore, when the substrate 1 is a temperature-averaging plate, Figure 4 and Figure 5As shown, the substrate 1 includes a bottom plate 11 and a cover plate 13, wherein the bottom plate 11 is located on a side of the temperature-averaging plate away from the fins 2 and is thermally connected to the heating element 4, and the cover plate 13 is located on a side of the temperature-averaging plate close to the fins 2 and is thermally connected to the fins 2, and a groove is provided on the bottom plate 11 and / or the cover plate 13 so that the bottom plate 11 and the cover plate 13 can cooperate to form a temperature-averaging cavity of the temperature-averaging plate (the temperature-averaging cavity at this time is the above-mentioned heat-conducting cavity), and the temperature-averaging cavity has a phase change medium, and in addition, the cover plate 13 is provided with an opening 14 to achieve the connection between the temperature-averaging cavity and the gas-liquid circulation channel 23, and the surface of the bottom plate 11 used to form the temperature-averaging cavity is a first surface 113, and the first surface 113 is provided with a capillary Structure layer 12, under normal conditions (i.e., the heating element 4 does not generate heat, or generates very little heat), the phase change medium in the temperature-averaging chamber is located in layer 12 of the capillary structure. When the heating element 4 generates a large amount of heat during operation, the heat dissipation device starts to work. At this time, the heat generated by the heating element 4 is transferred to the phase change medium in the temperature-averaging chamber through heat conduction. The phase change medium undergoes a phase change after absorbing heat, i.e., changes from liquid to gas, and moves toward the side of the cover plate 13. Since the temperature on one side of the cover plate 13 is relatively low, the gaseous phase change medium transfers heat to the cover plate 13 on one side of the cover plate 13, and changes from gas to liquid, and returns to layer 12 of the capillary structure to participate in the next phase change cycle.

[0066] Further, such as Figure 5 As shown, a plurality of support columns 111 are provided in the temperature-averaging chamber, and one end of the support column 111 is connected to the bottom plate 11, and the other end is connected to the cover plate 13, so that the pressure resistance of the temperature-averaging plate can be effectively increased. Furthermore, in some preferred embodiments, the support column 111 is made of a material with good thermal conductivity (such as aluminum or copper), and the support column 111 can further improve the heat transfer efficiency on the substrate 1, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0067] In addition, in some embodiments, the surface of the cover plate 13 used to form the uniform temperature chamber is also provided with a capillary structure 12 layer. In this way, the uniformity of the temperature on one side of the cover plate 13 can be further improved, thereby improving the heat dissipation effect of the heat dissipation device.

[0068] Furthermore, the surface of the bottom plate 11 connected to the heating element 4 is the second surface 114; the part of the bottom plate 11 connected to the heating element 4 is recessed in a direction away from the fins 2 to form a groove on the first surface 113, and a connecting protrusion 112 is formed on the second surface 114. The groove located on the first surface 113 can store more phase change working fluid, so that in the heat dissipation process, the heat generated by the heating element 4 can be absorbed faster and more. The connecting protrusion 112 located on the second surface 114, as a boss connected to the heating element 4, can reduce the flatness requirements of the temperature-averaging plate during the processing, thereby improving the yield rate and reducing the processing cost; specifically, as mentioned above, the temperature-averaging plate is connected to the heating element 4 by thermal conductivity. In order to ensure the thermal conductivity efficiency, it is necessary to ensure that the connecting surface of the heating element 4 and the temperature-averaging plate is tightly fitted. On this basis, if the connecting protrusion 112 is not provided, it is necessary to strictly control the flatness of the entire first surface 113 of the bottom plate 11. After the connecting protrusion 112 is provided, it is only necessary to ensure the flatness of the area corresponding to the connecting protrusion 112 in the first surface 113, which greatly reduces the processing difficulty. In addition, the provision of the connecting protrusion 112 provides an avoidance space between the temperature-averaging plate and the heating element 4, which is more conducive to the connection between the temperature-averaging plate and the heating element 4.

[0069] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details are not limited to the present application must be implemented by using the above specific details.

[0070] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0071] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0072] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0073] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A heat dissipation device, characterized in that: include: A substrate, used for thermal connection with the heating element, wherein the interior of the substrate has a heat conduction cavity for filling a phase change medium; The fin comprises a body and a pulsating heat pipe, wherein the body is thermally connected to the substrate, and a gas-liquid circulation channel connected to the heat conduction cavity is arranged inside the body, so that the gaseous phase change medium in the heat conduction cavity can enter the gas-liquid circulation channel, at least part of the pulsating heat pipe is arranged on the surface of the body, so that the pulsating heat pipe is thermally connected to the body, and the inner cavity of the pulsating heat pipe is not connected to the heat conduction cavity.

2. The heat dissipation device according to claim 1, characterized in that: The main body is provided with a flow channel opening for connecting the gas-liquid circulation flow channel and the heat conduction cavity; The end of the pulsating heat pipe that absorbs heat is the evaporation end, and the end that dissipates heat is the condensation end. The condensation end is arranged away from the flow channel opening relative to the evaporation end.

3. The heat dissipation device according to claim 1, characterized in that: A portion of the pulsating heat pipe is laid on the body, and another portion extends out of the body, so that airflows in all directions can pass through the heat dissipation device and take away the heat in the pulsating heat pipe.

4. The heat dissipation device according to claim 1, characterized in that: The pulsating heat pipe includes a dense part and a sparse part. The sparse part is located in a region of the body where the gas-liquid circulation channel is provided, and the dense part is located in a region of the body where the gas-liquid circulation channel is not provided.

5. The heat dissipation device according to claim 1, characterized in that: One of the heat conduction chambers is connected to one of the gas-liquid circulation channels to form a phase change cooling chamber; A plurality of independent heat-conducting cavities are arranged inside the substrate, and a plurality of independent gas-liquid circulation channels respectively connected with different heat-conducting cavities are arranged inside the body to form a plurality of phase-change cooling cavities.

6. The heat dissipation device according to claim 1, characterized in that: The gas-liquid circulation channel includes a plurality of gas-liquid channel units that are distributed in an array and / or staggered, and adjacent gas-liquid channel units have a common part.

7. The heat dissipation device according to claim 6, characterized in that: The flow width around any intersection of three adjacent gas-liquid flow channel units is greater than the flow width at other positions of the gas-liquid flow channel units.

8. The heat dissipation device according to claim 1, characterized in that: A plurality of fins are arranged on the substrate, and the plurality of fins are distributed in parallel and arranged on a side of the substrate away from the heating element.

9. The heat dissipation device according to claim 8, characterized in that: In the arrangement direction of the fins, the area of ​​the fins occupied by the gas-liquid circulation channel in the fins located in the middle is larger than the area of ​​the fins occupied by the gas-liquid circulation channel in the fins located at the ends; And / or, in the arrangement direction of the fins, the area of ​​the heat dissipation surface of the body occupied by the pulsating heat pipes in the fins located in the middle is larger than the area of ​​the heat dissipation surface of the body occupied by the pulsating heat pipes in the fins located at the ends.

10. The heat dissipation device according to claim 1, characterized in that: The substrate is a temperature homogenizing plate, comprising: A bottom plate, located on a side of the temperature homogenizing plate away from the fins, and thermally connected to the heat generating element; A cover plate, located on a side of the temperature homogenizing plate close to the fins and thermally connected to the fins; In which, the bottom plate and / or the cover plate are provided with grooves so that the bottom plate and the cover plate cooperate to form the heat conduction cavity, and the surface of the bottom plate used to form the heat conduction cavity is the first surface, the first surface is provided with a capillary structure layer, and the cover plate is provided with an opening for connecting the heat conduction cavity and the gas-liquid circulation channel.

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