Automatic face-down welding equipment
By designing automated rewelding equipment, using alignment detection and driving mechanisms to achieve automatic and accurate alignment of microneedles and microstrip lines, the problems of low operating accuracy and low production efficiency caused by manual adjustment in the prior art are solved, and product yield and production efficiency are significantly improved.
Patent Information
- Application Number
- CN202421613744.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-09
AI Technical Summary
In the prior art, the re-welding operation of microneedles and microstrip lines relies on manual adjustment, resulting in low operating accuracy, poor equipment interchangeability, poor repeatability accuracy and low production efficiency.
An automated re-welding equipment is designed, including a micro-needle stage, a micro-strip wire clamping unit, aligning drive mechanism, a re-welding drive mechanism and aligning detection mechanism. The relative positions of the micro-needle and micro-strip wire are detected through the re-welding detection mechanism, and automated precise alignment and re-welding are achieved using the re-welding drive mechanism and a re-welding drive mechanism.
The quality and production efficiency of the rewelding connection between the microstrip wire and the microneedle are improved, the operation difficulty and labor intensity are reduced, and the product yield is greatly improved.
Smart Images
Figure CN222902976U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of neural interfaces, and particularly relates to an automatic down-bonding device, which is mainly used for the down-bonding operation between micro needles and microstrip lines. Background Art
[0002] In a neural interface, brain signals are collected through electrodes, where the electrodes include invasive and non-invasive forms, etc. The brain signals collected by invasive electrodes are more accurate and reliable. Invasive electrodes mainly use micro needles, and the micro needles are generally electrically connected to an external device through microstrip lines. Currently, the down-bonding between the microstrip line and the micro needle is carried out manually. The operator observes the image in the lens with the eyes. The micro needle is placed on a placement table, and the microstrip line is adsorbed by a vacuum suction nozzle. By manually adjusting the relative positions of the micro needle and the microstrip line, the alignment and pressing are completed to achieve the down-bonding function.
[0003] This method has the following problems:
[0004] ① Manual adjustment depends on the fine degree and stability of hand movements, as well as the sharpness of the eyes. Prolonged operation will cause fatigue in people, thus affecting the operation accuracy and ultimately the product yield.
[0005] ② Manual adjustment depends on the experience of the operator, and the interchangeability of the equipment is poor; the accuracy of single-step manual adjustment is poor, and there is no position feedback, so the repeatability accuracy is poor, resulting in large fluctuations in product quality.
[0006] ③ Manual adjustment is cumbersome and inconvenient to operate, and the production efficiency is low. Summary of the Utility Model
[0007] The utility model relates to an automatic down-bonding device, which can at least solve some defects of the prior art.
[0008] The utility model relates to an automatic down-bonding device, comprising:
[0009] A micro needle stage, which has a micro needle fixing unit for fixing the micro needles to be down-bonded;
[0010] A microstrip line clamping unit for clamping the microstrip lines to be down-bonded;
[0011] A driving device, which includes an alignment driving mechanism and a down-bonding driving mechanism for relatively moving the micro needle stage and the microstrip line clamping unit to achieve the down-bonding action. The alignment driving mechanism includes a micro needle adjusting unit for adjusting the spatial position of the micro needle stage and / or a microstrip line adjusting unit for adjusting the spatial position of the microstrip line clamping unit.
[0012] The automatic down-bonding device further includes an alignment detection mechanism for detecting the relative positions of the micro needles to be down-bonded and the microstrip lines to be down-bonded.
[0013] The alignment detection mechanism includes a plurality of vision detection units, and each of the vision detection units is arranged around the flip-chip soldering station.
[0014] The vision detection unit includes a vision detection module and a focusing drive module for driving the vision detection module to perform active focusing.
[0015] This automated flip-chip soldering device further includes a controller. The alignment detection mechanism, the alignment drive mechanism, and the flip-chip soldering drive mechanism are all electrically connected to the controller. The controller is used to obtain the detection signal of the alignment detection mechanism and control the actions of the alignment drive mechanism and the flip-chip soldering drive mechanism.
[0016] This automated flip-chip soldering device further includes a display module, and the display module is electrically connected to the controller.
[0017] The alignment drive mechanism includes the micro-needle adjustment unit. The micro-needle adjustment unit is a multi-axis motion module, including some or all of an X-axis motion structure, a Y-axis motion structure, a pitching motion structure, a rolling motion structure, and a yawing motion structure.
[0018] The alignment drive mechanism further includes the microstrip line adjustment unit. The microstrip line adjustment unit includes a Z-axis rotation motion structure for driving the microstrip line clamping unit to rotate around the Z axis.
[0019] The microstrip line clamping unit is located above the micro-needle stage. The alignment drive mechanism includes the microstrip line adjustment unit, and the microstrip line adjustment unit is integrally connected to the flip-chip soldering drive mechanism.
[0020] As one of the embodiments, this automated flip-chip soldering device further includes a frame. The micro-needle stage, the microstrip line clamping unit, and the driving device are all arranged on the frame. The frame is also provided with a microstrip line fixing table for fixedly storing the microstrip line body, and / or a micro-needle storage unit for storing the micro-needles after the flip-chip soldering operation.
[0021] The present utility model has at least the following beneficial effects:
[0022] In the present utility model, an alignment drive mechanism is configured to adjust the relative position between the micro-needle stage and the microstrip line clamping unit, so as to realize the automatic and precise alignment between the microstrip line and the micro-needle, which can effectively improve the flip-chip soldering connection quality and production efficiency between the microstrip line and the micro-needle, reduce the operation difficulty and labor intensity, and greatly improve the product yield. Description of the Drawings
[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0024] Figure 1 Structural schematic diagram of the automatic flip-chip soldering device provided by the embodiment of the present invention;
[0025] Figure 2 Structural schematic diagram of the micro-needle carrier and the micro-needle adjustment unit provided by the embodiment of the present invention;
[0026] Figure 3 Structural schematic diagram of the microstrip line clamping unit - microstrip line adjustment unit - flip-chip soldering drive mechanism provided by the embodiment of the present invention;
[0027] Figure 4 Structural schematic diagram of the alignment detection mechanism provided by the embodiment of the present invention. Detailed implementation manners
[0028] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.
[0029] As Figure 1 , the embodiment of the present invention provides an automatic flip-chip soldering device, including:
[0030] A micro-needle carrier 21, which has a micro-needle fixing unit for fixing the micro-needles to be flip-chip soldered;
[0031] A microstrip line clamping unit 31 for clamping the microstrip lines to be flip-chip soldered;
[0032] A driving device, which includes an alignment driving mechanism and a flip-chip soldering driving mechanism 322 for making the micro-needle carrier 21 and the microstrip line clamping unit 31 move relative to each other to achieve the flip-chip soldering action. The alignment driving mechanism includes a micro-needle adjustment unit 22 for adjusting the spatial position of the micro-needle carrier 21 and / or a microstrip line adjustment unit 321 for adjusting the spatial position of the microstrip line clamping unit 31.
[0033] Preferably, as Figure 1 , the above flip-chip soldering device further includes a frame 1, on which an operation table is provided, and the above micro-needle carrier 21 can be arranged on the operation table.
[0034] Preferably, the micro-needles to be flip-chip soldered are fixed by adsorption, and the above-mentioned micro-needle fixing unit is correspondingly a micro-needle adsorption unit, including but not limited to arranging a plurality of micro-needle adsorption holes on the micro-needle carrier 21 and correspondingly configuring a vacuum adsorption structure 23.
[0035] Preferably, the microstrip line is adsorbed by a nozzle, and the above-mentioned microstrip line clamping unit 31 correspondingly includes a microstrip line nozzle.
[0036] In one embodiment, as Figure 3 , the above-mentioned flip-chip soldering device further includes a microstrip line fixing table 61, which is used to fixedly store the microstrip line body. The microstrip line clamping unit 31 grabs the microstrip line from the microstrip line fixing table 61 and then performs subsequent operations. Among them, the microstrip line fixing table 61 can be arranged on the above-mentioned operating table.
[0037] Since the position adjustment of the micro-needles and the microstrip line is a fine-tuning operation, the above-mentioned micro-needle carrier 21 and the microstrip line clamping unit 31 are arranged adjacent to each other and the two define a flip-chip soldering station.
[0038] In one embodiment, the alignment driving mechanism includes a micro-needle adjustment unit 22 and a microstrip line adjustment unit 321. By the cooperation of the micro-needle adjustment unit 22 and the microstrip line adjustment unit 321, the micro-needles and the microstrip line can be aligned in a two-way manner, which can improve the alignment accuracy and alignment efficiency.
[0039] Optionally, as Figure 2 , the alignment driving mechanism includes the micro-needle adjustment unit 22, and the micro-needle adjustment unit 22 is a multi-axis motion module, including some or all of an X-axis motion structure, a Y-axis motion structure, a pitching motion structure, a rolling motion structure, and a yawing motion structure.
[0040] Among them, the X-axis motion structure is used to drive the micro-needle carrier 21 to generate a translational motion in the X direction;
[0041] The Y-axis motion structure is used to drive the micro-needle carrier 21 to generate a translational motion in the Y direction;
[0042] The pitching motion structure is used to drive the micro-needle carrier 21 to generate a pitching motion around the X axis;
[0043] The rolling motion structure is used to drive the micro-needle carrier 21 to generate a rolling motion around the Y axis;
[0044] The yawing motion structure is used to drive the micro-needle carrier 21 to generate a yawing motion around the Z axis;
[0045] Among them, the Z axis is parallel to the vertical direction.
[0046] Preferably, the microneedle adjustment unit 22 includes all of the X-axis movement structure, Y-axis movement structure, pitching movement structure, rolling movement structure, and yaw movement structure, that is, the microneedle performs the main alignment adjustment, and the microstrip line performs the auxiliary alignment fine adjustment. This method can improve the alignment accuracy and efficiency.
[0047] Furthermore, as Figure 3 , the alignment driving mechanism further includes the microstrip line adjustment unit 321, and the microstrip line adjustment unit 321 includes a Z-axis rotation movement structure for driving the microstrip line clamping unit 31 to rotate around the Z axis. In particular, on the basis that the microneedle adjustment unit 22 includes the X-axis movement structure, Y-axis movement structure, pitching movement structure, rolling movement structure, and yaw movement structure, the microstrip line adjustment unit 321 only including the Z-axis rotation movement structure can ensure the alignment accuracy between the microneedle and the microstrip line.
[0048] Optionally, when the microneedle adjustment unit 22 includes some of the X-axis movement structure, Y-axis movement structure, pitching movement structure, rolling movement structure, and yaw movement structure, the remaining movement structures can be configured for the microstrip line. For example, the microneedle adjustment unit 22 includes the X-axis movement structure, Y-axis movement structure, pitching movement structure, and yaw movement structure, and correspondingly, the rolling movement structure is configured for the microstrip line clamping unit 31.
[0049] Of course, on the basis that the microneedle adjustment unit 22 includes some or all of the X-axis movement structure, Y-axis movement structure, pitching movement structure, rolling movement structure, and yaw movement structure, the microstrip line adjustment unit 321 can also be configured with some or all of the above-mentioned movement structures.
[0050] Preferably, the above-mentioned flip-chip driving mechanism 322 is used to drive the microneedle stage 21 and the microstrip line clamping unit 31 to move relatively in the vertical direction. It can be to drive the microneedle stage 21 to move unidirectionally in the vertical direction to approach or move away from the microstrip line clamping unit 31, it can be to drive the microstrip line clamping unit 31 to move unidirectionally in the vertical direction to approach or move away from the microneedle stage 21, or it can be to drive the microneedle stage 21 and the microstrip line clamping unit 31 to approach or move away from each other bidirectionally.
[0051] In one embodiment, the microstrip line clamping unit 31 is located above the microneedle stage 21; as Figure 3 , the alignment driving mechanism includes the microstrip line adjustment unit 321, and the microstrip line adjustment unit 321 is integrally connected to the flip-chip driving mechanism 322, with high equipment integration and can improve the flip-chip quality. In this solution, preferably, the flip-chip driving mechanism 322 drives the microstrip line clamping unit 31 to approach or move away from the microneedle stage 21 to complete the press-fit flip-chip between the microstrip line and the microneedle.
[0052] In addition, based on the integration of the flip-chip driving mechanism 322 and the microstrip line adjusting unit 321, the flip-chip driving mechanism 322 can also be used to drive the microstrip line clamping unit 31 to move up and down in the Z direction, facilitating the grasping of the microstrip line and the transfer of the micro needles after the flip-chip operation. Accordingly, a set of Z-axis movement structures can be saved.
[0053] In this embodiment, a alignment driving mechanism is configured to adjust the relative position between the micro needle stage 21 and the microstrip line clamping unit 31, so as to realize the automatic and precise alignment between the microstrip line and the micro needle, which can effectively improve the flip-chip connection quality and production efficiency between the microstrip line and the micro needle, reduce the operation difficulty and labor intensity, and greatly improve the product yield.
[0054] Optionally, the above-mentioned automatic flip-chip device further includes a micro needle storage unit 62, which is used to store the micro needles after the flip-chip operation, and the transfer of the micro needles can be realized through the microstrip line adjusting unit 321.
[0055] In one embodiment, as Figure 1 , the automatic flip-chip device further includes a alignment detection mechanism 4 for detecting the relative position between the micro needle to be flip-chip and the microstrip line to be flip-chip, so as to further improve the alignment accuracy between the microstrip line and the micro needle.
[0056] Furthermore, the automatic flip-chip device further includes a controller 51. The alignment detection mechanism 4, the alignment driving mechanism and the flip-chip driving mechanism 322 are all electrically connected to the controller 51. The controller 51 is used to obtain the detection signal of the alignment detection mechanism 4 and control the actions of the alignment driving mechanism and the flip-chip driving mechanism 322. It should be noted that the automatic control involved in this solution is a conventional feedback control method and does not require additional programming.
[0057] In one embodiment, the alignment detection mechanism 4 includes a plurality of vision detection units 41, and each vision detection unit 41 is arranged around the flip-chip station for vision detection in multiple directions, which can effectively improve the alignment detection accuracy and further improve the alignment accuracy between the micro needle and the microstrip line. In Figure 4 the shown solution, three vision detection units 41 are arranged around the flip-chip station.
[0058] Furthermore, as Figure 4 , the vision detection unit 41 includes a vision detection module 411 and a focusing driving module 412 for driving the vision detection module 411 to perform active focusing.
[0059] Among them, the vision detection module 411 can adopt an image acquisition device such as a camera. The focusing driving module 412 can adopt a linear driving device such as a cylinder / hydraulic cylinder to drive the corresponding vision detection module 411 to approach or move away from the flip-chip station to realize active focusing.
[0060] Optionally, the above alignment detection mechanism 4 further includes a mounting substrate 42, and each vision detection unit 41 is mounted on the mounting substrate 42; the mounting substrate 42 can be mounted on the above-mentioned frame 1. Preferably, a relief hole is provided on the mounting substrate 42 for the corresponding equipment to pass through. For example, in the case where the microstrip line clamping unit 31 is located above the micro-needle stage 21, the relief hole allows the microstrip line clamping unit 31 to pass through.
[0061] Optionally, as Figure 1 , the automatic flip-chip bonding equipment further includes a display module 52, and the display module 52 is electrically connected to the controller 51. The display module 52 can display the image acquisition and comparison effects in real time, monitor in real time, has good visualization effect, and can improve the flip-chip bonding quality.
[0062] The following shows the specific operation steps of the above automatic flip-chip bonding equipment:
[0063] Place the micro-needles to be flip-chip bonded on the micro-needle stage 21, generate vacuum on the micro-needle stage 21, and the micro-needles are adsorbed;
[0064] Fix the microstrip line body on the microstrip line fixing table 61, generate negative pressure on the microstrip line suction nozzle, and adsorb a single microstrip line after moving into place;
[0065] Multiple vision detection units 41 respectively collect images of the indium pillars on the micro-needles and microstrip lines in multiple directions and feed them back to the controller 51; the controller 51 determines the displacement compensation and angle compensation required for alignment according to the image signals fed back by each vision detection unit 41, and controls the micro-needle adjustment unit 22 and the microstrip line adjustment unit 321 to drive the micro-needle stage 21 and the microstrip line clamping unit 31 to move for alignment; judge in real time whether the alignment is accurate through the alignment detection mechanism 4;
[0066] After the micro-needles and the microstrip lines are aligned, the flip-chip bonding driving mechanism 322 drives the microstrip line clamping unit 31 to move downward to achieve the pressing action. After dispensing and curing, the flip-chip bonding is completed.
[0067] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. An automated back-welding device, characterized in that: include: A microneedle carrier, wherein the microneedle carrier has a microneedle fixing unit for fixing the microneedles to be reversely welded; A microstrip line clamping unit for clamping a microstrip line to be reversely soldered; A driving device, the driving device includes a positioning driving mechanism and a reverse soldering driving mechanism for making the microneedle carrier and the microstrip line clamping unit move relative to each other to achieve reverse soldering action, the positioning driving mechanism includes a microneedle adjustment unit for adjusting the spatial position of the microneedle carrier and / or a microstrip line adjustment unit for adjusting the spatial position of the microstrip line clamping unit.
2. The automatic back-welding equipment according to claim 1, characterized in that: It also includes a positioning detection mechanism for detecting the relative positions of the micro-needle to be reversed soldered and the micro-strip line to be reversed soldered.
3. The automatic back-welding equipment according to claim 2, characterized in that: The alignment detection mechanism includes a plurality of visual detection units, and each of the visual detection units is arranged around a reverse welding station.
4. The automatic back-welding equipment according to claim 3, characterized in that: The visual detection unit includes a visual detection module and a focus driving module for driving the visual detection module to focus.
5. The automatic back-welding equipment according to claim 2, characterized in that: It also includes a controller, and the alignment detection mechanism, the alignment drive mechanism and the reverse soldering drive mechanism are all electrically connected to the controller. The controller is used to obtain the detection signal of the alignment detection mechanism and control the actions of the alignment drive mechanism and the reverse soldering drive mechanism.
6. The automatic back-welding equipment according to claim 5, characterized in that: It also includes a display module, which is electrically connected to the controller.
7. The automated back-welding equipment according to claim 1, characterized in that: The alignment driving mechanism includes the microneedle adjustment unit, which is a multi-axis motion module, including part or all of an X-axis motion structure, a Y-axis motion structure, a pitch motion structure, a roll motion structure, and a yaw motion structure.
8. The automatic back-welding equipment according to claim 7, characterized in that: The alignment driving mechanism further includes the microstrip line adjusting unit, and the microstrip line adjusting unit includes a Z-axis rotation motion structure for driving the microstrip line clamping unit to rotate around the Z-axis.
9. The automated back-welding equipment according to claim 1, characterized in that: The microstrip line clamping unit is located above the microneedle carrier, the alignment driving mechanism includes the microstrip line adjusting unit, and the microstrip line adjusting unit is integrally connected with the reverse soldering driving mechanism.
10. The automated back-flow soldering equipment according to claim 1, characterized in that: It also includes a frame, on which the microneedle carrier, the microstrip line clamping unit and the driving device are all arranged; the frame is also provided with a microstrip line fixing table for fixing and storing the microstrip line body, and / or a microneedle storage unit for storing the microneedles after the reverse soldering operation.