Conveying device for chemical mechanical polishing

Abstract

The utility model relates to the technical field of polishing agent conveying, in particular to a conveying device for chemical mechanical polishing, which comprises a conveying barrel and a bottom plate, a straight rotating pipe is rotatably arranged between the conveying barrel and the bottom plate, the bottom end of the straight rotating pipe is connected with a straight nozzle, and a U-shaped positioning frame is annularly and slidably arranged on the side wall of the periphery of the bottom plate. The peripheral side wall of the straight rotating pipe is connected with a side rotating pipe, the other end of the side rotating pipe is detachably connected with a positioning pipe through a hose, the positioning pipe is rotationally arranged in the U-shaped positioning frame, and the bottom end of the positioning pipe is connected with a movable nozzle. According to the utility model, on the premise that the movable nozzle is driven to carry out 360-degree omnibearing polishing agent conveying operation around the wafer, the movable nozzle can carry out multi-angle spraying and conveying operation on the polishing agent, so that multi-direction and multi-angle polishing agent spraying and conveying operation can be carried out on the surfaces of some larger wafers; and the problems that the polishing agent needs to wait for flowing and the polishing agent flows slowly to cause insufficient content of the polishing agent at partial positions of the surface of the wafer are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing agent feeding, in particular to a feeding device for chemical mechanical polishing. Background Art

[0002] Chemical mechanical polishing is a recognized planarization method. This planarization method achieves planarization of the film layer through the dual effects of physical grinding and chemical reaction. It mainly uses abrasives or polishing agents (generally containing silicon or aluminum oxide particles dispersed in chemical solvents) to remove the unevenness of the wafer surface. During polishing, the wafer is placed on a polishing disk, the abrasive or polishing agent is transported to the wafer surface, and the grinding head uses the abrasive to grind the wafer surface to obtain a flat surface.

[0003] In the process of chemical mechanical polishing, abrasives or polishing agents serve as the main polishing lubricants, and their quality or the content of polishing agents directly affects the quality of chemical polishing of wafers. However, in the existing polishing agent feeding devices for chemical mechanical polishing, the polishing agent can often only be fed in a straight direction through a straight nozzle, that is, the feeding direction of the polishing agent is fixed, so that the position of the polishing agent fed to the wafer is fixed. Therefore, it is necessary to wait for the polishing agent to flow evenly on the wafer before chemical mechanical polishing can be performed. This process requires a certain waiting time and there is a situation where the polishing agent flows slowly, resulting in insufficient polishing agent content in some positions on the wafer surface, which affects the subsequent overall flattening of the wafer surface.

[0004] Therefore, it is necessary to invent a feeding device for chemical mechanical polishing to solve the above problems. Utility Model Content

[0005] In order to solve the shortcomings of the prior art, the purpose of the utility model is to provide a feeding device for chemical mechanical polishing, which solves the problem that the prior art can only feed the polishing agent in a straight direction through a straight nozzle, that is, the feeding direction of the polishing agent is fixed, so that the position of the polishing agent when it is fed to the wafer is fixed. Therefore, it is necessary to wait for the polishing agent to flow evenly on the wafer before performing chemical mechanical polishing. This process requires a certain waiting time and there is a problem that the polishing agent flows slowly, resulting in insufficient polishing agent content at some positions on the wafer surface, which affects the subsequent overall flattening treatment of the wafer surface.

[0006] In order to achieve the above objectives, the utility model adopts the following technical solutions:

[0007] A feeding device for chemical mechanical polishing comprises a feeding cylinder for temporarily storing polishing agent and a bottom plate located directly below the feeding cylinder, a straight-rotating tube is rotatably arranged between the feeding cylinder and the bottom plate, the bottom end of the straight-rotating tube is connected to a straight nozzle that can longitudinally penetrate the bottom plate, a U-shaped positioning frame is annularly slidably arranged on the outer peripheral side wall of the bottom plate, a side-rotating tube is connected to the peripheral side wall of the straight-rotating tube, the other end of the side-rotating tube is detachably connected to a positioning tube via a hose, the positioning tube is rotatably arranged in the U-shaped positioning frame, and the rotation angle of the positioning tube is controllable, and the bottom end of the positioning tube is connected to a movable nozzle.

[0008] As a preferred solution of the utility model, both side edges of the U-shaped positioning frame are provided with slots with open ends, and the adapting positions of the side walls of the positioning tube are connected with positioning studs that can rotate through the slots and extend to the outside of the U-shaped positioning frame, and the threaded sleeve of the positioning stud located outside the U-shaped positioning frame is provided with a nut that can lock the rotation angle of the positioning tube.

[0009] As a preferred solution of the utility model, an annular slide rail is detachably mounted on the outer peripheral side wall of the bottom plate, and a slide seat is connected to one end of the U-shaped positioning frame close to the bottom plate, and the slide seat can slide in an annular manner along the annular slide rail.

[0010] As a preferred solution of the utility model, an end of the positioning stud away from the positioning tube is connected to an indicator arrow, and both side walls of the slide seat are detachably connected to an annular scale plate for the indicator arrow to point at an angle through a connecting frame.

[0011] As a preferred solution of the utility model, a connecting tube is provided at the center of the bottom end of the feeding tube, an upper clamp is provided at the bottom end of the connecting tube, the bottom end of the upper clamp is detachably abutted against a lower clamp, and the top end of the straight-rotating tube is rotatably inserted into a circular space formed by the upper clamp and the lower clamp.

[0012] As a preferred solution of the utility model, a through hole is opened in the center of the bottom plate for the straight nozzle to pass through longitudinally, a push ring is extended from the center of the top end of the bottom plate, and the inner diameter of the push ring is larger than the inner diameter of the through hole, and a push plate is connected to the bottom end of the straight rotating tube, and the bottom end of the push plate is rotatably engaged with the top end of the bottom plate, and the outer peripheral side wall of the push plate is rotatably engaged with the inner peripheral side wall of the push ring.

[0013] As a preferred solution of the utility model, a feed pipe for conveying polishing agent into the feed cylinder is installed at the center of the top end of the feed cylinder.

[0014] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0015] In the utility model, the polishing agent required for chemical mechanical polishing is temporarily stored by a feeding cylinder, and the polishing agent is fed and ejected in a straight direction by a straight-rotating tube and a straight nozzle. This ejection method can spray the polishing agent in a straight direction on a fixed position on the surface of the wafer, which is suitable for some wafers of smaller sizes. For some larger wafers, on the one hand, the polishing agent is fed in a straight direction to the surface of the wafer by the straight-rotating tube and the straight nozzle, and on the other hand, the U-shaped positioning frame is forced to slide in an annular manner along the outer peripheral side wall of the bottom plate, thereby driving the positioning tube and the movable nozzle to slide in an annular manner along the peripheral side wall of the bottom plate. In the process of feeding, the polishing agent can be fed in a straight direction to the surface of the wafer by the straight-rotating tube and the straight nozzle. By changing the rotation angle of the positioning tube in the U-shaped positioning frame, the spraying angle of the movable nozzle is controlled. Under the premise of driving the movable nozzle to perform 360-degree all-round polishing agent feeding operations around the wafer, the movable nozzle can perform multi-angle spraying and feeding operations on the polishing agent, thereby performing multi-directional and multi-angle polishing agent spraying and feeding operations on some larger wafer surfaces, avoiding the need to wait for the flow time of the polishing agent fed by the straight nozzle and the slow flow of the polishing agent causing insufficient polishing agent content in some parts of the wafer surface. This ensures that the polishing agent flows evenly on the wafer surface and improves the effect of subsequent chemical mechanical polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the plan view structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the utility model when viewed from below;

[0019] Figure 4 For this utility model Figure 1 A schematic diagram of the partially enlarged structure at center A;

[0020] Figure 5 For this utility model Figure 3 Schematic diagram of the cross-sectional structure at BB in the middle.

[0021] Description of reference numerals:

[0022] 1. Feeding barrel; 2. Feeding pipe; 3. Connecting pipe; 4. Upper clamping barrel; 5. Lower clamping barrel; 6. Straight rotating pipe; 7. Butt plate; 8. Bottom plate; 9. Straight nozzle; 10. Annular slide rail; 11. Side rotating pipe; 12. Slide seat; 13. U-shaped positioning frame; 14. Hose; 15. Positioning pipe; 16. Movable nozzle; 17. Positioning stud; 18. Slot; 19. Nut; 20. Connecting frame; 21. Annular scale plate; 22. Indicator arrow; 23. Butt ring; 24. Through hole. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and cannot be used to limit the protection scope of the utility model.

[0024] The utility model provides Figure 1-5 A feeding device for chemical mechanical polishing shown in the figure includes a feeding cylinder 1 for temporarily storing polishing agent and a bottom plate 8 located directly below the feeding cylinder 1, a straight rotation tube 6 is rotatably arranged between the feeding cylinder 1 and the bottom plate 8, the bottom end of the straight rotation tube 6 is connected to a straight nozzle 9 which can longitudinally penetrate the bottom plate 8, a U-shaped positioning frame 13 is annularly slidably arranged on the outer peripheral side wall of the bottom plate 8, a side rotation tube 11 is connected to the peripheral side wall of the straight rotation tube 6, the other end of the side rotation tube 11 is detachably connected to a positioning tube 15 through a hose 14, the positioning tube 15 is rotatably arranged in the U-shaped positioning frame 13, and the rotation angle of the positioning tube 15 is controllable, and a movable nozzle 16 is connected to the bottom end of the positioning tube 15, and a fixed structure is present between the feeding cylinder 1 and the bottom plate 8, which is not drawn in the figure, and is used to ensure that the bottom plate 8 and the feeding cylinder 1 are in a relatively static state to prevent the bottom plate 8 from rotating.

[0025] The U-shaped positioning frame 13 has two side edges with slots 18 with open ends, and the positioning tube 15 has positioning studs 17 connected to the fitting positions of the side walls thereof, which can rotate through the slots 18 and extend to the outside of the U-shaped positioning frame 13. The threaded sleeve of the positioning stud 17 located outside the U-shaped positioning frame 13 is provided with a nut 19 for locking the rotation angle of the positioning tube 15. One end of the slot 18 is an open end, so that the positioning stud 17 can be inserted conveniently and rotated along the slot 18.

[0026] An annular slide rail 10 is detachably mounted on the outer peripheral side wall of the base plate 8, and a slide seat 12 is connected to one end of the U-shaped positioning frame 13 close to the base plate 8. The slide seat 12 can slide in a circle along the annular slide rail 10. The sliding of the slide seat 12 along the annular slide rail 10 is mainly driven by electricity, and the sliding speed and annular sliding distance of the slide seat 12 are controlled by writing corresponding programs, thereby controlling the changing speed and distance of the polishing agent spraying position of the movable nozzle 16.

[0027] An end of the positioning stud 17 away from the positioning tube 15 is connected to an indicating arrow 22, and both side walls of the slide seat 12 are detachably connected to an annular scale plate 21 for the indicating arrow 22 to point to an angle through a connecting frame 20. The positioning stud 17 rotates to drive the positioning tube 15 to rotate in the U-shaped positioning frame 13, thereby changing the polishing agent spraying and feeding angle of the movable nozzle 16. The rotation angle of the positioning stud 17 can be locked by the nut 19, and the real-time value of the rotation angle can be recorded by the indicating arrow 22 pointing to the annular scale plate 21.

[0028] A connecting tube 3 is provided at the center of the bottom end of the feeding cylinder 1, an upper clamp 4 is provided at the bottom end of the connecting tube 3, a lower clamp 5 is detachably abutted against the bottom end of the upper clamp 4, and the top end of the straight-rotating tube 6 is rotatably passed through a circular space surrounded by the upper clamp 4 and the lower clamp 5. The upper clamp 4 and the lower clamp 5 fix the position of the top end of the straight-rotating tube 6 while ensuring that the straight-rotating tube 6 can rotate, thereby fixing the position of the straight-rotating tube 6 between the feeding cylinder 1 and the bottom plate 8.

[0029] A through hole 24 is provided in the center of the bottom plate 8 for the straight nozzle 9 to pass longitudinally, a butt ring 23 is extended from the center of the top end of the bottom plate 8, and the inner diameter of the butt ring 23 is larger than the inner diameter of the through hole 24, and a butt plate 7 is connected to the bottom end of the straight-rotating tube 6. The bottom end of the butt plate 7 is rotatably abutted against the top end of the bottom plate 8, and the outer peripheral side wall of the butt plate 7 is rotatably clamped against the inner peripheral side wall of the butt ring 23. There is no contact between the straight nozzle 9 and the through hole 24 to avoid affecting the rotation effect of the straight-rotating tube 6 between the feed barrel 1 and the bottom plate 8.

[0030] A feeding pipe 2 for conveying polishing agent into the feeding cylinder 1 is installed at the center of the top end of the feeding cylinder 1 .

[0031] In the utility model, the polishing agent required for chemical mechanical polishing is temporarily stored by the feeding cylinder 1, and the polishing agent is fed and ejected in a straight direction by the straight-rotating tube 6 and the straight nozzle 9. This ejection method can spray the polishing agent in a straight direction on a fixed position on the surface of the wafer, which is suitable for some smaller-sized wafers. For some larger wafers, on the one hand, the polishing agent is fed in a straight direction to the surface of the wafer by the straight-rotating tube 6 and the straight nozzle 9, and on the other hand, the U-shaped positioning frame 13 is forced to slide in an annular manner along the outer peripheral side wall of the bottom plate 8, thereby driving the positioning tube 15 and the movable nozzle 16 to slide in an annular manner along the peripheral side wall of the bottom plate 8. In the process of feeding, the polishing agent can be ejected in a straight direction on the surface of the wafer. By changing the rotation angle of the positioning tube 15 in the U-shaped positioning frame 13, the spraying angle of the movable nozzle 16 is controlled, so that the movable nozzle 16 can perform multi-angle spraying and feeding operations on the polishing agent while driving the movable nozzle 16 to perform 360-degree all-round polishing agent feeding operations around the wafer, thereby performing multi-directional and multi-angle polishing agent spraying and feeding operations on some larger wafer surfaces, avoiding the need for the straight nozzle 9 to feed the polishing agent and the slow flow of the polishing agent causing insufficient polishing agent content in some parts of the wafer surface. This ensures that the polishing agent flows evenly on the wafer surface and improves the effect of subsequent chemical mechanical polishing.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A feeding device for chemical mechanical polishing, characterized in that: The invention comprises a feeding cylinder (1) capable of temporarily storing a polishing agent and a bottom plate (8) located directly below the feeding cylinder (1); a straight-rotating tube (6) is rotatably arranged between the feeding cylinder (1) and the bottom plate (8); the bottom end of the straight-rotating tube (6) is connected to a straight nozzle (9) capable of longitudinally penetrating the bottom plate (8); a U-shaped positioning frame (13) is slidably arranged on the outer peripheral side wall of the bottom plate (8); a side-rotating tube (11) is connected to the peripheral side wall of the straight-rotating tube (6); the other end of the side-rotating tube (11) is detachably connected to a positioning tube (15) via a hose (14); the positioning tube (15) is rotatably arranged in the U-shaped positioning frame (13); the rotation angle of the positioning tube (15) is controllable; and the bottom end of the positioning tube (15) is connected to a movable nozzle (16).

2. A material feeding device for chemical mechanical polishing according to claim 1, characterized in that: Both side edges of the U-shaped positioning frame (13) are provided with slots (18) with open ends, and the positioning tube (15) is connected to the fitting position of the peripheral side wall with positioning studs (17) that can rotate through the slots (18) and extend to the outside of the U-shaped positioning frame (13), and the threaded sleeve of the part of the positioning stud (17) located outside the U-shaped positioning frame (13) is provided with a nut (19) that can lock the rotation angle of the positioning tube (15).

3. A material feeding device for chemical mechanical polishing according to claim 2, characterized in that: An annular slide rail (10) is detachably mounted on the outer peripheral side wall of the bottom plate (8); an end of the U-shaped positioning frame (13) close to the bottom plate (8) is connected to a slide seat (12); and the slide seat (12) can slide in an annular manner along the annular slide rail (10).

4. A material feeding device for chemical mechanical polishing according to claim 3, characterized in that: An end of the positioning stud (17) away from the positioning tube (15) is connected to an indicating arrow (22), and both side walls of the slide seat (12) are detachably connected to an annular scale plate (21) for the indicating arrow (22) to point at an angle via a connecting frame (20).

5. The material feeding device for chemical mechanical polishing according to claim 1, characterized in that: A connecting tube (3) is provided at the center of the bottom end of the feeding tube (1), an upper clamping tube (4) is provided at the bottom end of the connecting tube (3), a lower clamping tube (5) is detachably abutted against the bottom end of the upper clamping tube (4), and the top end of the straight-rotating tube (6) is rotatably inserted into a circular space formed by the upper clamping tube (4) and the lower clamping tube (5).

6. A material feeding device for chemical mechanical polishing according to claim 1, characterized in that: A through hole (24) is provided at the center of the bottom plate (8) for the straight nozzle (9) to pass through longitudinally. A retaining ring (23) is formed by extending from the center of the top end of the bottom plate (8). The inner diameter of the retaining ring (23) is larger than the inner diameter of the through hole (24). A retaining plate (7) is connected to the bottom end of the straight rotating tube (6). The bottom end of the retaining plate (7) is rotatably abutted against the top end of the bottom plate (8). The outer peripheral side wall of the retaining plate (7) is rotatably clamped against the inner peripheral side wall of the retaining ring (23).

7. A material feeding device for chemical mechanical polishing according to claim 1, characterized in that: A feeding pipe (2) capable of conveying polishing agent into the feeding cylinder (1) is installed at the center of the top end of the feeding cylinder (1).

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