Integrated circuit packaging equipment and process

Abstract

The invention relates to the technical field of integrated circuit packaging, and discloses integrated circuit packaging equipment which comprises a fixed base, a grinding disc is rotationally arranged on the fixed base, a positioning mechanism used for fixing a wafer is arranged on the grinding disc, a supporting frame is fixed to the fixed base, and the supporting frame is arranged on the fixed base. A feeding column used for adding grinding liquid to the grinding disc is arranged on the supporting frame in a sliding mode. A rotating shaft is rotationally arranged on the fixed base, the end of the rotating shaft is fixed to the grinding disc, a disc is fixed to the circumference of the rotating shaft, an annular sliding groove is formed in the disc, and a lifting rod is arranged in the annular sliding groove in a sliding mode; according to the technical scheme, when the grinding disc rotates, the feeding column can be driven to reciprocate left and right along the supporting frame, so that the feeding column conveniently adds grinding liquid to the grinding disc from outside to inside and from inside to outside, the grinding liquid is added more uniformly, and the grinding effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and specifically provides an integrated circuit packaging device and process. Background Art

[0002] An integrated circuit is a microelectronic device or component. Before use, the integrated circuit needs to be packaged. One of the functions of integrated circuit packaging is to protect the chip from the environment and prevent the chip from coming into contact with external air, so that the integrated circuit chip can function properly and ensure its high stability and reliability.

[0003] During the process of integrated circuit packaging, it generally includes wafer grinding, dicing, die bonding, wire bonding, and plastic encapsulation. When grinding the wafer, grinding fluid needs to be added while grinding. The addition of grinding fluid can reduce the scratches generated during wafer grinding and improve the grinding effect. However, when the existing grinding fluid is added, the addition position of the grinding fluid remains unchanged, so that the grinding fluid is always added to the same position on the grinding disc, resulting in a low addition range of the grinding fluid and uneven addition of the grinding fluid. If the addition of the grinding fluid is not uniform, the force on the wafer during grinding will be uneven, which easily causes scratches on the wafer surface and thus reduces the grinding effect. Summary of the Invention

[0004] The present invention provides an integrated circuit packaging device and process. When the grinding disc rotates, it can drive the feeding column to reciprocate left and right along the support frame, so that the feeding column can add the grinding fluid to the grinding disc from the outside to the inside and from the inside to the outside, making the grinding fluid added to the grinding disc more evenly, and solving the problem mentioned in the above background art that if the addition of the grinding fluid is not uniform, the force on the wafer during grinding will be uneven, which easily causes scratches on the wafer surface and thus reduces the grinding effect.

[0005] The present invention provides the following technical solutions: An integrated circuit packaging device includes a fixed base, a grinding disc is rotatably arranged on the fixed base, a positioning mechanism for fixing the wafer is arranged on the grinding disc, a support frame is fixed on the fixed base, and a feeding column for adding grinding fluid to the grinding disc is slidably arranged on the support frame; A rotating shaft is rotatably arranged on the fixed base, the end of the rotating shaft is fixed to the grinding disc, a disc is fixed on the circumference of the rotating shaft, an annular sliding groove is formed in the disc, a lifting rod is slidably arranged in the annular sliding groove, the lifting rod is lifted and lowered by sliding in the annular sliding groove, and the feeding column reciprocates left and right along the support frame through the lifting and lowering of the lifting rod.

[0006] As an alternative solution of the integrated circuit packaging device described in the present invention, a first hydraulic oil tank is provided inside the fixed base. A first piston plate is elastically arranged inside the first hydraulic oil tank. The first piston plate is fixed to the end of the lifting rod. A second hydraulic oil tank is provided inside the support frame. An oil delivery tank is provided for communicating between the second hydraulic oil tank and the first hydraulic oil tank. A second piston plate is slidably arranged inside the second hydraulic oil tank. A movable rod is fixed to the surface of the second piston plate. A movable block is fixed to the end of the movable rod. The end of the feeding column is fixed to the movable block.

[0007] As an alternative solution of the integrated circuit packaging device described in the present invention, a first spring is fixed between the second piston plate and the inner wall of the first hydraulic oil tank. A second spring is fixed between the movable block and the inner wall of the support frame, and the second spring is sleeved on the circumference of the movable rod.

[0008] As an alternative solution of the integrated circuit packaging device described in the present invention, a first sliding protrusion is fixed to the end of the lifting rod. A first track groove for the first sliding protrusion to slide is provided on the inner wall of the annular sliding groove, and the first track groove includes an ascending part and a descending part which are connected in sequence.

[0009] As an alternative solution of the integrated circuit packaging device described in the present invention, a material delivery pipe communicating with the feeding pipe is provided inside the feeding column. A first material discharging port and a second material discharging port are provided inside the feeding column. A blocking block is provided inside the feeding column. One end of the material delivery pipe is communicated with the blocking block. A first through groove and a second through groove are respectively provided at both ends of the blocking block. The blocking block alternately opens the first material discharging port and the second material discharging port by reciprocating left and right. A side plate is fixed to the lower surface of the support frame. A longitudinal plate is fixed to the surface of the blocking block. An adjusting assembly for driving the blocking block to move is provided between the longitudinal plate and the side plate.

[0010] As an alternative solution of the integrated circuit packaging device described in the present invention, the adjusting assembly includes a strip-shaped sliding groove provided on the side plate. A first sliding rod is fixed to the surface of the longitudinal plate. The end of the first sliding rod is slidably arranged inside the strip-shaped sliding groove. A second sliding protrusion is fixed to the surface of the first sliding rod. A second track groove for the second sliding protrusion to slide is provided on the inner wall of the strip-shaped sliding groove. The second track groove includes a rightward moving part and a leftward moving part which are connected in sequence.

[0011] As an alternative solution of the integrated circuit packaging device of the present invention, the adjusting assembly includes a wavy chute formed in the side plate. A second sliding rod is fixed on the surface of the longitudinal plate. A positioning piece is fixed on the surface of the second sliding rod. A third spring is fixed between the positioning piece and the outer surface of the feeding column. The third spring is movably sleeved on the circumference of the second sliding rod.

[0012] As an alternative solution of the integrated circuit packaging device of the present invention, an air supply seat is fixed on the outer surface of the feeding column. An air supply cavity is formed inside the air supply seat. A third piston plate is elastically arranged in the air supply cavity. A connecting rod is fixed on the surface of the third piston plate. A jacking rod is fixed at the end of the connecting rod. A slideway for the jacking rod to slide is formed on the longitudinal plate. A third sliding protrusion is fixed at the end of the jacking rod. A third track groove for the third sliding protrusion to slide is formed on the inner wall of the slideway.

[0013] As an alternative solution of the integrated circuit packaging device of the present invention, a fourth spring is fixed between the third piston plate and the inner wall of the air supply seat. The third track groove includes a jacking part, a release part and a translation part which are connected in sequence. A rotating baffle is elastically arranged between the connection of the jacking part and the translation part.

[0014] As an alternative solution of the integrated circuit packaging device of the present invention, an integrated circuit packaging process includes the following steps: S1. Fix the wafer to be polished through the positioning mechanism, place the positioning mechanism on the polishing disk, so that the wafer is located between the polishing disk and the positioning mechanism, and the polishing surface of the wafer contacts the polishing disk. S2. Drive the polishing disk to rotate by the rotating shaft to polish the wafer. At the same time, supply polishing liquid to the feeding column through the feeding pipe and add the polishing liquid to the polishing disk. S3. While the rotating shaft rotates, drive the disk to rotate. The rotation of the disk causes the lifting rod to slide inside the annular chute, so that the lifting rod performs a lifting motion. The motion of the lifting rod drives the movable rod to perform a reciprocating left and right motion, so that the movable rod drives the feeding column to perform a reciprocating left and right motion, so that the feeding column adds the polishing liquid to the polishing disk from the outside to the inside and then from the inside to the outside. S4. When the feeding column performs a reciprocating left and right motion, the feeding column drives the blocking block to perform a reciprocating left and right motion through the adjusting assembly, so that the first blanking port and the second blanking port are alternately opened, changing the outlet for adding the polishing liquid, so that the polishing liquid is added at different positions. S5. When the first blanking port and the second blanking port are opened, through the reciprocating left and right motion of the blocking block, the air supply cavity can supply air to the first blanking port and the second blanking port. Using the principle of air-liquid mixing, the polishing liquid is more dispersed during the falling process until the wafer polishing is completed, and then the wafer is taken off. S6. Perform subsequent dicing, chip mounting, bonding, and encapsulation processes on the wafer to complete the encapsulation of the integrated circuit.

[0015] The present invention has the following beneficial effects:

[0016] 1. In this integrated circuit encapsulation device and process, when the rotating shaft drives the grinding disc to rotate, the rotating shaft drives the disc to rotate, causing the lifting rod to slide along the annular chute. The lifting rod drives the first sliding protrusion to slide along the first track groove, enabling the lifting rod to perform a lifting motion. The lifting motion of the lifting rod can drive the movable rod to perform a reciprocating left-right motion. The movable rod drives the movable block to perform a reciprocating left-right motion, and the movable block drives the feeding column to perform a reciprocating left-right motion, enabling the feeding column to perform a reciprocating motion from the outside to the inside and then from the inside to the outside, thus facilitating the addition of the grinding fluid to more positions on the grinding disc, increasing the uniformity of the addition of the grinding fluid, and improving the grinding effect.

[0017] 2. In this integrated circuit encapsulation device and process, when the feeding column moves along the grinding disc, through the provided adjusting component, it can drive the blocking block inside the feeding column to perform a reciprocating left-right motion. When the blocking block moves to the left, the first through groove and the first feeding port are connected, opening the first feeding port for feeding, and the second feeding port is closed. When the blocking block moves to the right, the second through groove and the second feeding port are connected, opening the second feeding port for feeding, and the first feeding port is closed. Thus, the first feeding port and the second feeding port can be alternately opened, changing the falling position of the grinding fluid, which is beneficial to increasing the addition range of the grinding fluid, further increasing the uniformity of the added grinding fluid, and improving the grinding effect.

[0018] 3. In this integrated circuit encapsulation device and process, when the blocking block performs a left-right motion, it can drive the vertical plate to perform a left-right motion. The left-right motion of the vertical plate causes the jacking rod to slide inside the slideway. The jacking rod drives the third sliding protrusion to slide along the third track groove, enabling the third sliding protrusion to drive the jacking rod to perform a reciprocating up-down motion. The jacking rod drives the third piston plate to perform a reciprocating up-down motion inside the air supply chamber through the connecting rod, enabling the air supply chamber to perform suction and blowing processes. Thus, when the first through groove is connected to the first feeding port, air is blown into the first feeding port, and when the second through groove is connected to the second feeding port, air is blown into the second feeding port, enabling the gas and the grinding fluid to be discharged simultaneously. Utilizing the combined action of gas and liquid, the grinding fluid can be more dispersed when discharged, thereby further increasing the uniformity of the added grinding fluid and further improving the grinding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0020] Figure 2 It is a structural cross-sectional view of the fixed base and the support frame part of the present invention.

[0021] Figure 3 Schematic diagram of the planar distribution of the first track groove part in the disk of the present invention.

[0022] Figure 4 Schematic diagram of the partial structure of the feeding column and the side plate in the present invention.

[0023] Figure 5 Cross-sectional view of the partial structure of the feeding column and the side plate in the present invention.

[0024] Figure 6 Top view structure diagram of the second track groove in the side plate of the present invention.

[0025] Figure 7 Schematic diagram of the structure of another technical solution of the adjusting component in the present invention.

[0026] Figure 8 Schematic diagram of the partial structure of the plugging block in the present invention.

[0027] Figure 9 For the present invention Figure 5 Enlarged view at A in

[0028] Figure 10 For the present invention Figure 5 Enlarged view at B in

[0029] Figure 11 Cross-sectional view of the structure of the rotating baffle part in the present invention.

[0030] Figure 12 Cross-sectional view of the connection structure between the longitudinal plate and the second sliding rod in another technical solution of the adjusting component in the present invention.

[0031] In the figure: 1, fixed base; 2, grinding disc; 3, positioning mechanism; 4, support frame; 5, feeding column; 6, rotating shaft; 7, disc; 8, annular chute; 9, lifting rod; 10, first hydraulic oil tank; 11, first piston plate; 12, second hydraulic oil tank; 13, oil delivery groove; 14, second piston plate; 15, movable rod; 16, movable block; 17, first spring; 18, second spring; 19, first sliding protrusion; 20, first track groove; 201, rising part; 202, descending part; 21, material delivery pipe; 22, first discharge port; 23, second discharge port; 24, blocking block; 25, first through groove; 26, second through groove; 27, side plate; 28, vertical plate; 29, strip chute; 30, first sliding rod; 31, second sliding protrusion; 32, second track groove; 321, rightward movement part; 322, leftward movement part; 33, wavy chute; 34, second sliding rod; 35, positioning piece; 36, third spring; 37, air supply seat; 38, air supply cavity; 39, third piston plate; 40, connecting rod; 41, jacking rod; 42, slideway; 43, third sliding protrusion; 44, third track groove; 441, jacking part; 442, releasing part; 443, translation part; 444, rotating baffle; 45, fourth spring; 46, servo motor; 47, air inlet; 48, first one-way valve; 49, air outlet groove; 50, second one-way valve; 51, rotating groove; 52, rotating rod; 53, abutting block; 54, limiting block; 55, torsion spring; 56, feeding pipe; 57, rubber sealing piece. Detailed implementation mode

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Example 1, please refer to Figures 1-12 , an integrated circuit packaging device, including a fixed base 1, a grinding disc 2 is rotatably arranged on the fixed base 1, a positioning mechanism 3 for fixing a wafer is arranged on the grinding disc 2, a support frame 4 is fixed on the fixed base 1, and a feeding column 5 for adding grinding fluid to the grinding disc 2 is slidably arranged on the support frame 4; A rotating shaft 6 is rotatably arranged on the fixed base 1, the end of the rotating shaft 6 is fixed to the grinding disc 2, a disc 7 is fixed on the circumference of the rotating shaft 6, an annular chute 8 is opened on the disc 7, a lifting rod 9 is slidably arranged in the annular chute 8, the lifting rod 9 is lifted and lowered by sliding in the annular chute 8, and the feeding column 5 makes a left-right reciprocating movement along the support frame 4 through the lifting and lowering of the lifting rod 9; The interior of the fixed base 1 is provided with a first hydraulic oil tank 10. An elastic first piston plate 11 is arranged inside the first hydraulic oil tank 10. The first piston plate 11 is fixed to the end of the lifting rod 9. The interior of the support frame 4 is provided with a second hydraulic oil tank 12. An oil delivery tank 13 is communicated between the second hydraulic oil tank 12 and the first hydraulic oil tank 10. A second piston plate 14 is slidably arranged inside the second hydraulic oil tank 12. A movable rod 15 is fixed to the surface of the second piston plate 14. A movable block 16 is fixed to the end of the movable rod 15. The end of the feeding column 5 is fixed to the movable block 16; A first spring 17 is fixed between the second piston plate 14 and the inner wall of the first hydraulic oil tank 10. A second spring 18 is fixed between the movable block 16 and the inner wall of the support frame 4. And the second spring 18 is sleeved on the circumference of the movable rod 15; A first sliding protrusion 19 is fixed to the end of the lifting rod 9. A first track groove 20 for the first sliding protrusion 19 to slide is opened on the inner wall of the annular sliding groove 8. And the first track groove 20 includes a rising part 201 and a falling part 202 which are communicated in sequence.

[0034] In this technical solution, a servo motor 46 is installed inside the fixed base 1. The output end of the servo motor 46 is fixedly connected to the rotating shaft 6; when it is necessary to grind a wafer, first, the wafer is fixed by the positioning mechanism 3. The positioning mechanism 3 fixes the wafer through a vacuum chuck. After the wafer is fixed, the end of the positioning mechanism 3 with the wafer is placed on the upper surface of the grinding disk 2, so that the grinding surface of the wafer contacts the grinding disk 2. At the same time, the positioning mechanism 3 can rotate on the grinding disk 2. And the positioning mechanism 3 is a prior art and not an innovation point of this application, so no detailed description is made; When grinding the wafer, the rotating shaft 6 is driven to rotate by the servo motor 46. The rotating shaft 6 drives the grinding disk 2 to rotate, so that the grinding disk 2 grinds the wafer. While the rotating shaft 6 rotates, it drives the disk 7 to rotate. The rotation of the disk 7 causes the lifting rod 9 to slide along the annular sliding groove 8. The lifting rod 9 drives the first sliding protrusion 19 to slide inside the first track groove 20. When the first sliding protrusion 19 slides along the rising part 201, the first sliding protrusion 19 drives the lifting rod 9 to rise. The lifting rod 9 drives the first piston plate 11 to move upward, compressing the first spring 17 and making the first spring 17 store energy. The upward movement of the first piston plate 11 fills the hydraulic oil in the first hydraulic oil tank 10 into the second hydraulic oil tank 12, causing the second piston plate 14 to move to the right. The rightward movement of the second piston plate 14 drives the movable rod 15 to move to the right. The movable rod 15 drives the movable block 16 to move to the right, while stretching the second spring 18 and making the second spring 18 store energy. The rightward movement of the movable block 16 drives the feeding column 5 to move to the right, so that the feeding column 5 adds grinding liquid to the grinding disk 2 from the outside to the inside; When the first sliding protrusion 19 slides along the descending portion 202, the lifting rod 9 descends, and the second spring 18 and the first spring 17 release force simultaneously, prompting the hydraulic oil inside the second hydraulic oil tank 12 to return to the first hydraulic oil tank 10, causing the movable rod 15 to drive the movable block 16 to move leftward synchronously and reset. The feeding column 5 moves leftward and resets, enabling the feeding column 5 to add grinding fluid to the grinding disc 2 from the inside to the outside; through the reciprocating movement of the feeding column 5 left and right, the grinding fluid can be added to different positions on the grinding disc 2, thereby increasing the uniformity of the added grinding fluid and improving the grinding effect.

[0035] Embodiment 2. When the feeding column 5 adds grinding fluid, generally, a feeding hole needs to be opened at the bottom of the feeding column 5. Since the position of the feeding column 5 remains unchanged, the feeding range of the feeding hole remains unchanged, thereby reducing the uniformity of the added grinding fluid. To address this problem, this embodiment is an improvement based on Embodiment 1. Specifically, please refer to Figures 1-12 , a material conveying pipe 21 communicating with the feeding pipe 56 is arranged inside the feeding column 5. A first material discharging port 22 and a second material discharging port 23 are opened inside the feeding column 5. A blocking block 24 is arranged inside the feeding column 5. One end of the material conveying pipe 21 communicates with the blocking block 24. First through grooves 25 and second through grooves 26 are respectively opened at both ends of the blocking block 24. The blocking block 24 alternately opens the first material discharging port 22 and the second material discharging port 23 through reciprocating movement left and right. A side plate 27 is fixed to the lower surface of the support frame 4. A longitudinal plate 28 is fixed to the surface of the blocking block 24. An adjusting assembly for driving the movement of the blocking block 24 is arranged between the longitudinal plate 28 and the side plate 27; The adjusting assembly includes a strip-shaped sliding groove 29 opened on the side plate 27. A first sliding rod 30 is fixed to the surface of the longitudinal plate 28. The end of the first sliding rod 30 is slidably arranged inside the strip-shaped sliding groove 29. A second sliding protrusion 31 is fixed to the surface of the first sliding rod 30. A second track groove 32 for the second sliding protrusion 31 to slide is opened on the inner wall of the strip-shaped sliding groove 29. The second track groove 32 includes a rightward moving portion 321 and a leftward moving portion 322 which are sequentially communicated.

[0036] In this technical solution, when the feeding column 5 moves reciprocally from outside to inside and then from inside to outside, the feeding column 5 drives the first sliding rod 30 to move, so that the first sliding rod 30 moves along the strip-shaped sliding groove 29. The first sliding rod 30 drives the second sliding protrusion 31 to slide in the second track groove 32. When the second sliding protrusion 31 slides along the leftward movement part 322, the second sliding protrusion 31 drives the second sliding rod 34 to move leftward. The second sliding rod 34 drives the longitudinal plate 28 to move leftward. The longitudinal plate 28 drives the blocking block 24 to move leftward. The leftward movement of the blocking block 24 drives the first through groove 25 to move leftward, so that the first through groove 25 communicates with the first feeding port 22. At this time, the second through groove 26 does not communicate with the second feeding port 23. The grinding fluid is discharged from the first feeding port 22 through the feeding pipe 21, the blocking block 24, and the first through groove 25. When the second sliding protrusion 31 slides along the rightward movement part 321, the second sliding rod 34 moves rightward. The rightward movement of the second sliding rod 34 drives the longitudinal plate 28 to move rightward. The longitudinal plate 28 drives the blocking block 24 to move rightward. The blocking block 24 drives the second through groove 26 to move rightward, so that the second through groove 26 communicates with the second feeding port 23. At this time, the first through groove 25 does not communicate with the first feeding port 22. The grinding fluid is discharged from the second feeding port 23 through the feeding pipe 21, the blocking block 24, and the second through groove 26. Through the above process, the blocking block 24 can move reciprocally left and right inside the feeding column 5, so that the first feeding port 22 and the second feeding port 23 are alternately opened, thereby changing the falling position of the grinding fluid, which is beneficial to increasing the adding range of the grinding fluid, further increasing the uniformity of the added grinding fluid, and improving the grinding effect.

[0037] In this technical solution, a rubber sealing sheet 57 is fixed at the bottom end of the feeding pipe 21. The rubber sealing sheet 57 is slidably connected with the blocking block 24, so that the feeding pipe 21 can slide relative to the blocking block 24 without affecting the sealed connection between the feeding pipe 21 and the blocking block 24.

[0038] Embodiment 3. This embodiment is another technical solution of the adjusting assembly. Specifically, please refer to Figures 1-12 , the adjusting assembly includes a wavy sliding groove 33 opened on the side plate 27. A second sliding rod 34 is fixed on the surface of the longitudinal plate 28. A positioning piece 35 is fixed on the surface of the second sliding rod 34. A third spring 36 is fixed between the positioning piece 35 and the outer surface of the feeding column 5. The third spring 36 is movably sleeved on the circumference of the second sliding rod 34.

[0039] In this technical solution, when the feeding column 5 moves reciprocally from outside to inside and then from inside to outside, the feeding column 5 drives the second sliding rod 34 to move, so that the second sliding rod 34 slides inside the wavy sliding groove 33, as Figure 6As shown, when the second slide bar 34 slides along the wavy chute 33, first, the end of the second slide bar 34 is resisted by the wavy chute 33 and moves to the right. The second slide bar 34 drives the positioning piece 35 to move to the right, compressing the third spring 36 and storing energy in the third spring 36. Then the second slide bar 34 continues to slide. The second slide bar 34 loses the resistance of the wavy chute 33, and at the same time, the third spring 36 releases its force, prompting the second slide bar 34 to move leftward to reset, thereby realizing the left-right reciprocating motion of the blocking block 24.

[0040] Embodiment 4. Whether it is the first material discharge port 22 or the second material discharge port 23, when discharging the grinding fluid, the grinding fluid falls in the form of water droplets or columns, so that the grinding fluid is in an aggregated state when falling. When the grinding fluid is added to the grinding disc 2, the thickness of the grinding fluid is relatively thick, resulting in a smaller range of addition of the grinding fluid. To solve this problem, this embodiment is an improvement based on Embodiment 2 or Embodiment 3. Specifically, please refer to Figures 1-12 , an air supply seat 37 is fixed on the outer surface of the feeding column 5. An air supply cavity 38 is opened inside the air supply seat 37. A third piston plate 39 is elastically arranged in the air supply cavity 38. A connecting rod 40 is fixed on the surface of the third piston plate 39. A jacking rod 41 is fixed at the end of the connecting rod 40. A slideway 42 for the jacking rod 41 to slide is opened on the vertical plate 28. A third sliding protrusion 43 is fixed at the end of the jacking rod 41. A third track groove 44 for the third sliding protrusion 43 to slide is opened on the inner wall of the slideway 42; A fourth spring 45 is fixed between the third piston plate 39 and the inner wall of the air supply seat 37. The third track groove 44 includes a jacking part 441, a release part 442 and a translation part 443 which are connected in sequence. A rotating baffle 444 is elastically arranged between the connection points of the jacking part 441 and the translation part 443.

[0041] In this technical solution, when the plugging block 24 moves to the left, the plugging block 24 drives the left vertical plate 28 to move to the left. As the left vertical plate 28 moves to the left, the jacking rod 41 drives the third sliding protrusion 43 to slide along the third track groove 44. First, the third sliding protrusion 43 slides along the jacking part 441. The third sliding protrusion 43 drives the jacking rod 41 to move upward. The jacking rod 41 drives the third piston plate 39 to move upward through the connecting rod 40. As the third piston plate 39 moves upward, the air supply cavity 38 inhales air, and at the same time compresses the fourth spring 45, causing the fourth spring 45 to store energy. When the third sliding protrusion 43 slides to the top of the jacking part 441, at this time, the third sliding protrusion 43 loses the resistance of the jacking part 441, and at the same time the fourth spring 45 releases its force, causing the third sliding protrusion 43 to move downward instantaneously along the release part 442, causing the third piston plate 39 to move downward instantaneously, and discharging the gas inside the air supply cavity 38 instantaneously. At this time, the left air supply cavity 38, the first through groove 25 and the first material discharge port 22 are in a communicating state, enabling the gas to act on the grinding fluid and then be discharged through the first material discharge port 22. By the release of the fourth spring 45, the gas inside the air supply cavity 38 is instantaneously released, thereby increasing the flow rate of the gas discharge and improving the effect of liquid dispersion. When the plugging block 24 moves to the right, the plugging block 24 drives the right vertical plate 28 to move to the right, causing the air supply cavity 38 to supply air to the second material discharge port 23. The air supply principle is the same as when supplying air to the first material discharge port 22. By utilizing the combination of gas and liquid, the discharged grinding fluid can be more dispersed, thereby further increasing the uniformity of the added grinding fluid and achieving a better grinding effect.

[0042] In this technical solution, when the left jacking rod 41 drives the left third sliding protrusion 43 to move along the jacking part 441, the right jacking rod 41 drives the right third sliding protrusion 43 to move along the translation part 443, so that the movements of the left and right jacking rods 41 do not affect each other and there will be no jamming situation. One side of the air supply cavity 38 is connected with an air inlet 47, and a first one-way valve 48 is arranged inside the air inlet 47. The other side of the air supply cavity 38 is connected with an air outlet groove 49, and a second one-way valve 50 is arranged inside the air outlet groove 49. The first one-way valve 48 enables the gas to only enter the air supply cavity 38 from the air inlet 47 and does not allow the gas to be discharged from the air inlet 47. The second one-way valve 50 enables the gas to only be discharged from the air outlet groove 49 and does not allow the gas to enter the air supply cavity 38 from the air outlet groove 49. Therefore, when the third piston plate 39 moves upward, the gas enters the air supply cavity 38 from the air inlet 47, and when the third piston plate 39 moves downward, the gas is discharged from the air outlet groove 49. The inner wall of the longitudinal plate 28 is provided with a rotating groove 51 for the rotating baffle 444 to rotate. A rotating rod 52 is rotatably arranged in the rotating groove 51. The rotating baffle 444 is fixed on the rotating rod 52. An abutment block 53 is fixed on the surface of the rotating baffle 444. A limit block 54 is fixed on the surface of the rotating groove 51. A torsion spring 55 is sleeved on the circumference of the rotating rod 52. The a end of the torsion spring 55 is fixed to the inner wall of the rotating groove 51, and the b end of the torsion spring 55 is fixed to the surface of the rotating baffle 444. Figure 10 and Figure 11 As shown, due to the interference of the stop block 54 with the interference block 53, the rotating baffle 444 can only be pressed Figure 11 In the state of clockwise rotation, it will not press Figure 11 When the third sliding protrusion 43 slides along the translation portion 443 toward the lifting portion 441, the third sliding protrusion 43 abuts against the rotating baffle 444, causing the rotating baffle 444 to rotate clockwise, so that the torsion spring 55 accumulates force. When the third sliding protrusion 43 completely slides to the lowest part of the lifting portion 441, the rotating baffle 444 loses the abutment of the third sliding protrusion 43, and the torsion spring 55 releases force, causing the rotating baffle 444 to return to the position. Figure 11 At this time, since the rotating baffle 444 cannot continue to rotate counterclockwise, the third sliding protrusion 43 can only move upward along the lifting portion 441, so that the third sliding protrusion 43 can perform a circular motion inside the third track groove 44.

[0043] Embodiment 5: This embodiment is an improvement made on the basis of Embodiment 4. For details, please refer to Figures 1-12 , an integrated circuit packaging process, comprising the following steps: S1. The wafer to be ground is fixed by the positioning mechanism 3, and the positioning mechanism 3 is placed on the grinding disc 2, so that the wafer is positioned between the grinding disc 2 and the positioning mechanism 3, and the grinding surface of the wafer is in contact with the grinding disc 2; S2. The rotating shaft 6 drives the grinding disc 2 to rotate, and the wafer is ground. At the same time, the grinding liquid is provided to the feeding column 5 through the feeding pipe 56, and the grinding liquid is added to the grinding disc 2; S3. The rotating shaft 6 rotates while driving the disc 7 to rotate. The rotation of the disc 7 causes the lifting rod 9 to slide inside the annular chute 8, so that the lifting rod 9 performs a lifting movement. The movement of the lifting rod 9 drives the movable rod 15 to reciprocate left and right, so that the movable rod 15 drives the feeding column 5 to reciprocate left and right, so that the feeding column 5 adds the grinding liquid to the grinding disc 2 from the outside to the inside and then from the inside to the outside; S4. When the feeding column 5 reciprocates left and right, the feeding column 5 drives the blocking block 24 to reciprocate left and right through the adjustment assembly, so that the first feeding port 22 and the second feeding port 23 are alternately opened, and the outlet of the added grinding liquid is changed, so that the grinding liquid is added at different positions; S5. When the first material discharge port 22 and the second material discharge port 23 are opened, the blocking block 24 moves reciprocally left and right, enabling the air supply chamber 38 to supply air to the first material discharge port 22 and the second material discharge port 23. Using the principle of gas-liquid mixing, the abrasive liquid becomes more dispersed during the falling process until the wafer grinding is completed, and then the wafer is removed. S6. Perform subsequent dicing, mounting, bonding, and encapsulation processes on the wafer to complete the encapsulation of the integrated circuit. In this technical solution, during wafer grinding, by increasing the range of the abrasive liquid added to the grinding disk 2 and using the combined effect of gas and liquid, the degree of dispersion of the abrasive liquid is increased, enabling the abrasive liquid to fall more evenly onto the grinding disk 2, thereby enhancing the grinding effect of the wafer.

[0044] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0045] The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. An integrated circuit packaging device, comprising a fixed base (1), a grinding disc (2) is rotatably arranged on the fixed base (1), and a positioning mechanism (3) for fixing a wafer is arranged on the grinding disc (2), and is characterized in that: A support frame (4) is fixed on the fixed base (1), and a feeding column (5) for adding grinding fluid to the grinding disc (2) is slidably arranged on the support frame (4); A rotating shaft (6) is rotatably arranged on the fixed base (1), the end of the rotating shaft (6) is fixed to the grinding disc (2), a disc (7) is fixed on the circumference of the rotating shaft (6), an annular chute (8) is formed in the disc (7), a lifting rod (9) is slidably arranged in the annular chute (8), the lifting rod (9) is lifted and lowered by sliding in the annular chute (8), and the feeding column (5) reciprocates left and right along the support frame (4) by the lifting and lowering of the lifting rod (9).

2. The integrated circuit packaging device according to claim 1, wherein: A first hydraulic oil tank (10) is formed inside the fixed base (1), a first piston plate (11) is elastically arranged inside the first hydraulic oil tank (10), the first piston plate (11) is fixed to the end of the lifting rod (9), a second hydraulic oil tank (12) is formed inside the support frame (4), an oil delivery tank (13) is communicated between the second hydraulic oil tank (12) and the first hydraulic oil tank (10), a second piston plate (14) is slidably arranged inside the second hydraulic oil tank (12), a movable rod (15) is fixed to the surface of the second piston plate (14), a movable block (16) is fixed to the end of the movable rod (15), and the end of the feeding column (5) is fixed to the movable block (16).

3. The integrated circuit packaging device according to claim 2, wherein: A first spring (17) is fixed between the second piston plate (14) and the inner wall of the first hydraulic oil tank (10), a second spring (18) is fixed between the movable block (16) and the inner wall of the support frame (4), and the second spring (18) is sleeved on the circumference of the movable rod (15).

4. The integrated circuit packaging device according to claim 1, characterized in that: A first sliding protrusion (19) is fixed to the end of the lifting rod (9), a first track groove (20) for the first sliding protrusion (19) to slide is formed in the inner wall of the annular chute (8), and the first track groove (20) includes a rising part (201) and a falling part (202) which are communicated in sequence.

5. The integrated circuit packaging device according to claim 1, wherein: A feeding pipe (21) communicated with a feeding pipe (56) is arranged inside the feeding column (5), a first discharging port (22) and a second discharging port (23) are formed inside the feeding column (5), a blocking block (24) is arranged inside the feeding column (5), one end of the feeding pipe (21) is communicated with the blocking block (24), first through grooves (25) and second through grooves (26) are respectively formed at both ends of the blocking block (24), the blocking block (24) alternately opens the first discharging port (22) and the second discharging port (23) by reciprocating left and right, a side plate (27) is fixed to the lower surface of the support frame (4), a longitudinal plate (28) is fixed to the surface of the blocking block (24), and an adjusting assembly for driving the blocking block (24) to move is arranged between the longitudinal plate (28) and the side plate (27).

6. The integrated circuit packaging device according to claim 5, wherein: The adjusting assembly includes a strip-shaped sliding groove (29) formed in the side plate (27). A first sliding rod (30) is fixed to the surface of the longitudinal plate (28). The end of the first sliding rod (30) is slidably disposed in the strip-shaped sliding groove (29). A second sliding protrusion (31) is fixed to the surface of the first sliding rod (30). A second track groove (32) for the second sliding protrusion (31) to slide is formed in the inner wall of the strip-shaped sliding groove (29). The second track groove (32) includes a rightward movement portion (321) and a leftward movement portion (322) which are connected in sequence.

7. The integrated circuit packaging device according to claim 5, wherein: The adjusting assembly includes a wavy sliding groove (33) formed in the side plate (27). A second sliding rod (34) is fixed to the surface of the longitudinal plate (28). A positioning piece (35) is fixed to the surface of the second sliding rod (34). A third spring (36) is fixed between the positioning piece (35) and the outer surface of the feeding column (5). The third spring (36) is movably sleeved on the circumference of the second sliding rod (34).

8. The integrated circuit packaging device according to claim 5, wherein: A gas supply seat (37) is fixed to the outer surface of the feeding column (5). A gas supply cavity (38) is formed inside the gas supply seat (37). A third piston plate (39) is elastically disposed in the gas supply cavity (38). A connecting rod (40) is fixed to the surface of the third piston plate (39). A jacking rod (41) is fixed to the end of the connecting rod (40). A sliding groove (42) for the jacking rod (41) to slide is formed in the longitudinal plate (28). A third sliding protrusion (43) is fixed to the end of the jacking rod (41). A third track groove (44) for the third sliding protrusion (43) to slide is formed in the inner wall of the sliding groove (42).

9. The integrated circuit packaging device according to claim 8, wherein: A fourth spring (45) is fixed between the third piston plate (39) and the inner wall of the gas supply seat (37). The third track groove (44) includes a jacking portion (441), a release portion (442), and a translation portion (443) which are connected in sequence. A rotating baffle (444) is elastically disposed between the connection of the jacking portion (441) and the translation portion (443).

10. An integrated circuit packaging process, characterized in that: The integrated circuit packaging device according to any one of claims 1-9 includes the following steps: S1. Fix the wafer to be polished through the positioning mechanism (3), place the positioning mechanism (3) on the polishing disk (2), so that the wafer is located between the polishing disk (2) and the positioning mechanism (3), and the polishing surface of the wafer contacts the polishing disk (2); S2. Drive the polishing disk (2) to rotate by the rotating shaft (6) to polish the wafer. At the same time, supply polishing liquid to the feeding column (5) through the feeding pipe (56), and add the polishing liquid to the polishing disk (2); S3. While the rotating shaft (6) rotates, it drives the disc (7) to rotate. The rotation of the disc (7) causes the lifting rod (9) to slide inside the annular chute (8), enabling the lifting rod (9) to perform a lifting motion. The motion of the lifting rod (9) drives the movable rod (15) to perform a reciprocating left - right motion, causing the movable rod (15) to drive the feeding column (5) to perform a reciprocating left - right motion, so that the feeding column (5) adds the grinding liquid to the grinding disc (2) from the outside to the inside and then from the inside to the outside; S4. When the feeding column (5) performs a reciprocating left - right motion, the feeding column (5) drives the plugging block (24) to perform a reciprocating left - right motion through the adjusting assembly, causing the first discharge port (22) and the second discharge port (23) to be alternately opened, changing the outlet for adding the grinding liquid, so that the grinding liquid is added at different positions; S5. When the first discharge port (22) and the second discharge port (23) are opened, the reciprocating left - right motion of the plugging block (24) enables the air supply chamber (38) to supply air to the first discharge port (22) and the second discharge port (23). Using the principle of gas - liquid mixing, the grinding liquid is more dispersed during the falling process until the wafer grinding is completed, and then the wafer is removed; S6. Perform subsequent dicing, mounting, bonding, and encapsulation processes on the wafer to complete the encapsulation of the integrated circuit.

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