Wafer carrying disc placing device

Abstract

The utility model provides a wafer carrying disc placing device which comprises a box body, the box body comprises two oppositely arranged fixing plates, the inner side face of each fixing plate is provided with a plurality of fixing grooves which extend in the height direction of the fixing plate and are arranged at intervals in the length direction of the fixing plate, and the positions of the fixing grooves in the two fixing plates are in one-to-one correspondence. Every two fixing grooves with the corresponding positions are arranged in one set, and the two ends of one wafer carrying disc can be inserted into one set of fixing grooves. The wafer carrying disc placing device provided by the utility model has the advantages that the wafer carrying discs placed in each group of fixing grooves are not in contact with one another, so that the wafer carrying discs can be conveniently and sequentially taken and placed into the coating machine, and meanwhile, the phenomenon that extra particles are generated due to friction between the carrying discs in the taking process is avoided; and the quality of wafer deposition is ensured.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor storage, and particularly to a wafer carrier placement device. Background Art

[0002] The compound patterned sapphire substrate is formed by depositing a certain thickness of SiO on the surface of the sapphire substrate, and then through two process steps of PSS yellow light and etching to form a compound patterned substrate composed of Al 2 O 2 O 3 and SiO 2 The compound substrate, compared with the traditional patterned sapphire substrate, has a faster etching speed, can significantly improve the etching productivity, and the epitaxial brightness can be increased by about 5%. It has become one of the mainstream processing methods of the current patterned sapphire substrate.

[0003] When producing the compound patterned sapphire substrate, a coating machine is usually used to deposit SiO on the surface of the sapphire substrate. 2 In this production process, strict requirements are imposed on the production environment and operation methods to control the generation of particles. Therefore, corresponding preparatory work needs to be carried out before the coating machine starts working, including the wafer loading process. The wafer loading process refers to sucking and placing the wafer into the carrier slot through a vacuum suction pen. After the wafer loading process, multiple carriers carrying wafers are stored together, transported to the coating machine, and then the carriers are sequentially placed into the coating machine.

[0004] Currently, the carriers carrying wafers are all stored in a stacked manner. This storage method is very inconvenient during the process of sequentially taking the carriers and placing them into the coating machine, and it is easy to cause friction between the upper and lower carriers during the taking process, generating additional particles and affecting the quality of the wafer deposition by the coating machine.

[0005] Therefore, it is necessary to manufacture a placement device for the wafer carrier. Summary of the Utility Model

[0006] Based on the above problems, the purpose of the present disclosure is to provide a wafer carrier placement device.

[0007] To achieve the above purpose, the present disclosure provides a wafer carrier placement device, including a box body. The box body includes two oppositely arranged fixing plates. The inner side surface of each fixing plate is provided with a plurality of fixing grooves extending along the height direction of the fixing plate and spaced apart from each other along the length direction of the fixing plate. The positions of the fixing grooves on the two fixing plates correspond one by one, and two fixing grooves with corresponding positions are set as a group. One group of fixing grooves is for the two ends of a wafer carrier to be inserted.

[0008] In some embodiments, the bottom surface of the fixing groove includes a straight surface extending in the height direction and an inclined surface extending inward and downward from the lower end of the straight surface. The inclined surface is arranged to support the wafer carrier inserted into the fixing groove to limit its position.

[0009] In some embodiments, the fixing groove includes two opposite first side surfaces and two opposite second side surfaces respectively arranged below the two first side surfaces. The first side surfaces are arranged to extend in the height direction, and the second side surfaces are arranged to extend inward and downward from the lower ends of the first side surfaces. The first side surfaces are correspondingly connected to the straight surface, and the second side surfaces are correspondingly connected to the inclined surface.

[0010] In some embodiments, the two first side surfaces and the two second side surfaces are symmetric about the central plane of the fixing groove. The first side surfaces extend obliquely outward from the straight surface in the direction of the groove depth of the fixing groove, and the second side surfaces extend obliquely inward from the inclined surface in the direction of the groove depth of the fixing groove.

[0011] In some embodiments, the box body includes two oppositely arranged support plates, and the two support plates are respectively detachably connected to the two ends of the two fixing plates.

[0012] In some embodiments, through holes for the connecting pieces to pass through are provided on the support plates, and connecting holes for connecting with the connecting pieces are provided on the end faces of the fixing plates.

[0013] In some embodiments, a positioning groove adapted to the shape of the end face of the fixing plate is provided on one side of the support plate connected to the fixing plate. The positioning groove is used to define the relative positions of the centers of the through holes and the connecting holes.

[0014] In some embodiments, the upper end faces of the support plates are flush with the upper end faces of the fixing plates, and the lower end faces of the support plates are lower than the lowest ends of the wafer carriers fixed on the fixing plates.

[0015] In some embodiments, handles are provided on the support plates.

[0016] In some embodiments, through grooves are formed on the support plates, and the handles are formed by the parts of the support plates located above the through grooves.

[0017] Through the above technical solutions, multiple groups of fixing grooves are provided in the wafer carrier placement device provided by the present disclosure. One group of fixing grooves is for the two ends of a wafer carrier to be vertically inserted, so as to fix the wafer carrier in the device. Moreover, there are intervals between each group of fixing grooves. Therefore, the wafer carriers placed in each group of fixing grooves do not contact each other, which facilitates taking the wafer carriers in sequence and placing them into the coating machine. At the same time, it avoids the generation of additional particles due to friction between the carriers during the taking process, ensuring the quality of wafer deposition. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 is a perspective view of the wafer carrier placing device according to an embodiment of the present disclosure;

[0020] Figure 2 is an exploded view of the structure of the wafer carrier placing device according to an embodiment of the present disclosure;

[0021] Figure 3 is a front view of the wafer carrier placing device according to an embodiment of the present disclosure;

[0022] Figure 4 is Figure 3 the A-A cross-sectional view of the wafer carrier placing device in

[0023] Explanation of reference numerals:

[0024] 1, fixing plate; 101, fixing groove; 102, connection hole; 103, first side; 104, second side; 105, straight surface; 106, inclined surface; 2, connecting member; 3, support plate; 301, through groove; 302, through hole; 303, support foot; 304, positioning groove; 305, handle; 4, wafer carrier. Detailed implementation manners

[0025] The following will further describe in detail the implementation manners of the present disclosure in conjunction with the drawings and embodiments. The detailed description and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms, not limited to the specific embodiments disclosed in the text, but including all technical solutions falling within the scope of the claims.

[0026] The present disclosure provides a wafer carrier placing device, as Figure 1 shown, the wafer carrier placing device includes a box body, the box body includes two oppositely arranged fixing plates 1, and each inner side of the fixing plate 1 is provided with a plurality of fixing grooves 101 extending along the height direction of the fixing plate 1 and spaced from each other along the length direction of the fixing plate 1. The positions of the fixing grooves 101 on the two fixing plates 1 correspond one by one, and the two fixing grooves 101 with corresponding positions are set as a group. A group of fixing grooves 101 is used for inserting both ends of a wafer carrier 4.

[0027] Therefore, as Figure 3As shown, the wafer carriers 4 placed in each set of fixed slots 101 do not contact each other, which facilitates the sequential picking up of the wafer carriers 4 and placing them into the coating machine. At the same time, it avoids the generation of additional particulate matter due to friction between the carriers during the picking process, ensuring the quality of wafer deposition.

[0028] In the present disclosure, the fixed slot 101 can be of any suitable shape, for example Figure 4 In the illustrated embodiment, the bottom surface of the fixed slot 101 may include a straight surface 105 extending along the height direction of the fixed slot 101 and an inclined surface 106 extending inward and downward from the lower end of the straight surface 105. The two obliquely approaching inclined surfaces 106 in a set of fixed slots 101 hold the two ends of the wafer carrier 4 inserted into the fixed slot 101, thereby limiting the position of the wafer carrier 4 and preventing it from falling out of the fixed slot 101.

[0029] As Figure 2 shown, the fixed slot 101 includes two opposing first side surfaces 103 and two opposing second side surfaces 104 respectively disposed below the two first side surfaces 103. The first side surface 103 extends along the height direction of the fixed slot 101, is correspondingly connected to the straight surface 105, and extends obliquely outward from the straight surface 105 in the direction of the slot depth of the fixed slot 101, making it easier for the two ends of the wafer carrier 4 to be inserted from the first side surface 103 into the straight surface 105.

[0030] The second side surface 104 extends inward and downward from the lower end of the first side surface 103, is correspondingly connected to the inclined surface 106, and extends obliquely inward from the inclined surface 106 in the direction of the slot depth of the fixed slot 101, so that the two ends of the wafer carrier 4 in each set of fixed slots 101 do not shift relative to the horizontal direction of the fixed slot 101.

[0031] In the present disclosure, the box body may further include two oppositely disposed support plates 3, as Figure 2 shown, the two support plates 3 are respectively detachably connected to the two ends of the fixing plate 1, so that when a certain plate of the wafer carrier placement device is damaged, only the damaged plate needs to be replaced separately. Of course, in other embodiments, the wafer carrier placement device can be made by an integral molding method, and the present disclosure will not elaborate too much here.

[0032] As Figure 2 shown, the connecting member 2 is connected to the connecting hole 102 on the fixing plate 1 through the through hole 302 on the support plate 3, thereby detachably connecting the two support plates 3 to the two ends of the two fixing plates 1. In some other embodiments, the connection method between the support plate 3 and the fixing plate 1 can adopt a snap-fit.

[0033] In some embodiments, as Figure 2As shown, a positioning groove 304 adapted to the end face shape of the fixing plate 1 may also be provided on the support plate 3. The end face of the fixing plate 1 is inserted into the positioning groove 304, thereby defining the relative position between the center of the through hole 302 and the center of the connection hole 102.

[0034] The upper end face of the support plate 3 is flush with the upper end face of the fixing plate 1. At the same time, the height of the support plate 3 is greater than the height of the fixing plate 1. The part of each support plate 3 exceeding the fixing plate 1 is divided into two support feet 303 for stably supporting the box body on a plane. The empty part between the two support feet 303 can reduce the weight of the box body. Of course, the support feet 303 of the present disclosure can also be any other suitable structure.

[0035] As Figure 3 shown, the lower end face of the support foot 303 is lower than the lowest point of the wafer carrier 4 fixed on the fixing plate 1, so that the part of the wafer carrier 4 exceeding the fixing plate 1 is in a suspended state, avoiding the phenomenon of bumping during handling. In some other embodiments, while keeping the fixing groove 101 unchanged, only the height of the fixing plate 1 can be extended so that the bottom end face of the fixing plate 1 is flush with the bottom end face of the support plate 3 and lower than the lowest point of the wafer carrier to form a fence surrounding the lowest point of the wafer carrier.

[0036] In some embodiments, a handle 305 may also be provided on the support plate 3 to facilitate the movement of the box body. The handle 305 can have any suitable structure. For example, it can be a grip provided on the outer side face of the support plate 3.

[0037] In some embodiments, as Figure 1 and Figure 2 shown, a through groove 301 may be formed on the support plate 3. In this case, the handle 305 can be formed by the part of the support plate 3 located above the through groove 301. The user can pass the palm through the through groove 301 and hold the upper side of the through groove 301 to carry the box body. In addition, the setting of the through groove 301 can also reduce the weight of the box body.

[0038] In some embodiments, the box body can be set as a box body without a top surface but with a bottom. The bottom surface of the box body can be used to support the wafer carrier 4. It should be noted that this embodiment does not absolutely require the fixing groove 101 to have the effect of supporting the wafer carrier 4; it is also possible to set the bottom surface of the box body lower than the lowest point of the wafer carrier 4 inside the box body, so as to surround a part of the wafer carrier 4 entering the box body.

[0039] So far, the embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details well known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed here based on the above description.

[0040] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or equivalent substitutions can be made for some technical features without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A wafer carrier placement device, characterized in that: The invention comprises a box body, wherein the box body comprises two oppositely arranged fixing plates (1), wherein the inner side surface of each fixing plate (1) is provided with a plurality of fixing grooves (101) extending along the height direction of the fixing plate (1) and arranged at intervals along the length direction of the fixing plate (1), wherein the fixing grooves (101) on the two fixing plates (1) correspond to each other in position, and two fixing grooves (101) corresponding in position are arranged as a group, and a group of the fixing grooves (101) is used for inserting two ends of a wafer carrier (4).

2. The wafer carrier placement device according to claim 1, characterized in that: The bottom surface of the fixing groove (101) comprises a straight surface (105) extending along the height direction and an inclined surface (106) extending inwardly and downwardly from the lower end of the straight surface (105), and the inclined surface (106) is configured to support the wafer carrier (4) inserted into the fixing groove (101) to limit its position.

3. The wafer carrier placement device according to claim 2, characterized in that: The fixing groove (101) comprises two opposite first side surfaces (103) and two opposite second side surfaces (104) respectively arranged below the two first side surfaces (103); the first side surfaces (103) are arranged to extend along the height direction; the second side surfaces (104) are arranged to extend inwardly and downwardly from the bottom end of the first side surfaces (103); the first side surfaces (103) are correspondingly connected to the straight surface (105); and the second side surfaces (104) are correspondingly connected to the inclined surface (106).

4. The wafer carrier placement device according to claim 3, characterized in that: The two first side surfaces (103) and the two second side surfaces (104) are symmetrical about the central plane of the fixing groove (101); the first side surfaces (103) extend obliquely outwardly from the straight surface (105) relative to the groove depth direction of the fixing groove (101); and the second side surfaces (104) extend obliquely inwardly from the inclined surface (106) relative to the groove depth direction of the fixing groove (101).

5. The wafer carrier placement device according to claim 1, characterized in that: The box body comprises two support plates (3) arranged opposite to each other, and the two support plates (3) are respectively detachably connected to two ends of the two fixing plates (1).

6. The wafer carrier placement device according to claim 5, characterized in that: The support plate (3) is provided with a through hole (302) for the connecting member (2) to pass through, and the end surface of the fixing plate (1) is provided with a connecting hole (102) for the connecting member (2) to be connected.

7. The wafer carrier placement device according to claim 6, characterized in that: A positioning groove (304) adapted to the end face shape of the fixing plate (1) is provided on one side of the support plate (3) connected to the fixing plate (1), and the positioning groove (304) is used to define the relative position of the center of the through hole (302) and the center of the connecting hole (102).

8. The wafer carrier placement device according to claim 5, characterized in that: The upper end surface of the support plate (3) is flush with the upper end surface of the fixing plate (1), and the bottom end surface of the support plate (3) is lower than the lowest end of the wafer carrier (4) fixed on the fixing plate (1).

9. The wafer carrier placement device according to claim 5, characterized in that: The support plate (3) is provided with a handle (305).

10. The wafer carrier placement device according to claim 9, characterized in that: The support plate (3) is provided with a through slot (301), and the handle (305) is formed by a portion of the support plate (3) located above the through slot (301).

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