Bearing device and biomolecule detection system

Abstract

The utility model discloses a bearing device and a biomolecule detection system. The bearing device comprises a bearing table, a thermoelectric cooler, a first temperature control switch and a relay, and the bearing table is used for bearing a to-be-tested sample; the thermoelectric cooler is connected with the bearing table and is used for adjusting the temperature of the bearing table; the relay is electrically connected with the first temperature control switch and the thermoelectric cooler, and the first temperature control switch is used for detecting the temperature of at least one of the bearing table, the sample to be detected and the thermoelectric cooler and is switched off when detecting that the temperature is abnormal, so that the relay controls the thermoelectric cooler to be powered off. Thus, when the first temperature control switch detects that the temperature is abnormal, the first temperature control switch is switched off, so that the relay controls the thermoelectric cooler to be powered off, the temperature of the to-be-detected sample does not rise any more, and the temperature abnormality protection effect of the sample is achieved; in addition, the relay is beneficial to improving the temperature increasing and decreasing speed of the bearing table, and the requirement for rapid temperature increasing and decreasing of the bearing device is met.

Description

Technical Field

[0001] The utility model relates to the technical field of biomolecule detection systems, and particularly relates to a carrying device and a biomolecule detection system. Background Art

[0002] In the process of detecting and analyzing biomolecules, it may be necessary to adjust the temperature of the sample. In the related art, a thermoelectric cooler (TEC) is widely used in gene testers, PCR instruments, and nucleic acid fragment analyzers because it can both cool and heat, and has a small volume and small thermal inertia to achieve control of the reaction temperature. To prevent damage to the equipment and the sample due to over-temperature, a temperature control switch is usually connected in series to the circuit of the TEC for over-temperature protection. As a reaction to abnormal temperature changes, once an over-temperature state is detected, the temperature control switch will immediately cut off the power supply.

[0003] For gene testers, PCR instruments, or nucleic acid fragment analyzers with rapid temperature rise and fall, the selected current of the TEC is generally large. Since the TEC is connected in series with the temperature control switch, the selected current of the temperature control switch is also large, and the corresponding size is also large. To ensure the installation stability of the temperature control switch and the heating performance of the equipment, the size of the carrying platform cooperating with the temperature control switch needs to be designed larger, which results in a decrease in the heat conduction efficiency of the carrying platform to the sample, and further reduces the temperature rise and fall rate of the sample, making it difficult to meet the requirements of rapid temperature rise and fall of the equipment. Therefore, how to achieve temperature anomaly protection of the sample and meet the requirements of rapid temperature rise and fall of the equipment has become a technical problem to be solved. Summary of the Utility Model

[0004] The utility model provides a carrying device and a biomolecule detection system for solving the problem that it is difficult to simultaneously achieve temperature anomaly protection of the sample and rapid temperature rise and fall of the equipment.

[0005] The utility model proposes a carrying device, comprising:

[0006] A carrying platform for carrying a sample to be tested;

[0007] A thermoelectric cooler, which is connected to the carrying platform and is used to adjust the temperature of the carrying platform;

[0008] A first temperature control switch and a relay, the relay is electrically connected to the first temperature control switch and the thermoelectric cooler respectively, the first temperature control switch is used to detect the temperature of at least one of the carrying platform, the sample to be tested and the thermoelectric cooler, and disconnect when the temperature is detected to be abnormal, so that the relay controls the thermoelectric cooler to cut off the power supply.

[0009] In the loading device according to the embodiments of the present application, the first temperature control switch is used to detect the temperature of at least one of the loading platform, the sample to be tested, and the thermoelectric cooler, and disconnect when the detected temperature is abnormal, so that the relay controls the power-off of the thermoelectric cooler, preventing the temperature of the sample to be tested from rising further, achieving the effect of protecting the sample from abnormal temperature; in addition, the relay is respectively connected to the first temperature control switch and the thermoelectric cooler. Therefore, the current of the first temperature control switch has no direct connection with the current of the thermoelectric cooler, and a smaller-sized model of the first temperature control switch can be selected, so that the first temperature control switch occupies a smaller volume of the loading device, which is beneficial to improving the heating and cooling rate of the loading platform and meeting the requirement of rapid heating and cooling of the loading device.

[0010] In some embodiments, the first temperature control switch is connected in series with the input end of the relay, and the output end of the relay is connected in series with the thermoelectric cooler.

[0011] In some embodiments, the number of the first temperature control switches is multiple, and the multiple first temperature control switches are connected in series.

[0012] In some embodiments, the input end of the relay includes a first input port and a second input port. The first end of the first temperature control switch is connected to the first input port, the second end of the first temperature control switch is used to be connected to the first end of the first power supply, and the second input port is used to be connected to the second end of the first power supply;

[0013] The output end of the relay includes a first output port and a second output port. The first end of the thermoelectric cooler is connected to the first output port, the second end of the thermoelectric cooler is used to be connected to the first end of the second power supply, and the second output port is used to be connected to the second end of the second power supply.

[0014] In some embodiments, the relay is separately arranged from the thermoelectric cooler and the loading platform.

[0015] In some embodiments, the first temperature control switch is arranged on the loading platform and is used to detect the temperature of the loading platform.

[0016] In some embodiments, at least part of the first temperature control switch is arranged in the loading platform.

[0017] In some embodiments, the loading platform has an opposite connection surface and a loading surface. The connection surface faces the thermoelectric cooler, a receiving groove is formed on the connection surface, at least part of the first temperature control switch is arranged in the receiving groove, and the loading surface is used to load the sample to be tested.

[0018] In some embodiments, the carrier table includes a side surface respectively connected to the connection surface and the bearing surface, the accommodation groove extends along the width direction of the carrier table to the side surface, and the first temperature control switch penetrates through the side surface.

[0019] In some embodiments, adsorption channels are concavely provided on the bearing surface, the adsorption channels are evenly distributed on the bearing surface, and the adsorption channels are connected to an external vacuum system.

[0020] In some embodiments, the adsorption channels include at least one first channel and at least one second channel, and the first channel is communicated with the second channel;

[0021] Optionally, the first channel and the second channel are arranged in a cross shape;

[0022] Optionally, the number of the first channels is multiple, and the multiple first channels are arranged at intervals and in parallel, the number of the second channels is multiple, and the multiple second channels are arranged at intervals and in parallel, and the first channels and the second channels are perpendicular to each other.

[0023] In some embodiments, the bearing device includes a heat dissipation structure, the heat dissipation structure is arranged on a side of the thermoelectric cooler facing away from the carrier table, and the heat dissipation structure is used for performing heat exchange with the thermoelectric cooler.

[0024] In some embodiments, the heat dissipation structure includes a heat dissipation cover plate and a body, a heat dissipation flow channel is arranged inside the body, the heat dissipation cover plate is detachably connected to the body and covers the heat dissipation flow channel, the heat dissipation flow channel is used for conveying a coolant and conducting heat, and a liquid inlet hole and a liquid outlet hole respectively communicated with the heat dissipation flow channel are formed in the heat dissipation cover plate;

[0025] Optionally, the heat dissipation flow channel includes a first flow channel, an intermediate flow channel and a second flow channel, the first flow channel is communicated with the liquid inlet hole; the intermediate flow channel is communicated with the first flow channel and is located on one side of the first flow channel; the second flow channel is respectively communicated with the intermediate flow channel and the liquid outlet hole, and the second flow channel is located on a side of the intermediate flow channel facing the first flow channel; wherein, the liquid inlet hole and the liquid outlet hole are respectively arranged on the same side of the heat dissipation structure, and the first flow channel and the second flow channel are symmetrically arranged;

[0026] Optionally, the orthographic projection of the heat dissipation flow channel on the heat dissipation structure is evenly distributed in the heat dissipation structure;

[0027] Optionally, the intermediate flow channel includes at least one bent section, and the bent section is bent and arranged in the heat dissipation structure so that the intermediate flow channel forms a comb-shaped flow channel inside the heat dissipation structure;

[0028] Optionally, the intermediate flow channel further includes a connecting section, one end of the connecting section communicates with the bent section, the other end of the connecting section communicates with the first flow channel or the second flow channel, and the connecting section is arranged in a straight line direction and is located on one side of the bent section;

[0029] Optionally, the first flow channel and the second flow channel are centrosymmetric about the midpoint of the line connecting the liquid inlet hole and the liquid outlet hole, and the first flow channel and the second flow channel are respectively communicated with the intermediate flow channel;

[0030] Optionally, the intermediate flow channel includes at least one bent section and a connecting section, and the connecting section is connected between the second flow channel or the first flow channel and the bent section;

[0031] Optionally, the first flow channel and the second flow channel are symmetrically arranged, and the first flow channel and the second flow channel respectively surround the liquid inlet hole and the liquid outlet hole, and the intermediate flow channel includes at least two bent sections that are attached to each other;

[0032] Optionally, at least a part of the first flow channel is bent, and at least a part of the orthographic projection of the liquid inlet hole on the heat dissipation structure is located in the first flow channel; and / or at least a part of the second flow channel is bent, and at least a part of the orthographic projection of the liquid outlet hole on the heat dissipation structure is located in the second flow channel.

[0033] In some embodiments, the number of the liquid inlet holes is one, the number of the liquid outlet holes is two, and the liquid inlet hole is located between the two liquid outlet holes.

[0034] In some embodiments, a second temperature control switch is provided on the heat dissipation cover plate, the second temperature control switch is connected to the thermoelectric cooler, and the second temperature control switch is used to detect the temperature of the heat dissipation cover plate and disconnect when the temperature of the heat dissipation cover plate is detected to be abnormal, so as to cut off the power supply of the thermoelectric cooler.

[0035] The present invention also provides a biomolecule detection system, including the carrying device according to any one of the above embodiments.

[0036] Additional aspects and advantages of the present invention will be given in part in the following description, will become apparent in part from the following description, or will be understood through the practice of the present invention. Description of the Drawings

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0038] Among them:

[0039] Figure 1 is a three-dimensional schematic diagram of the bearing device in the embodiment of the present invention;

[0040] Figure 2 is an exploded schematic diagram of the bearing device in the embodiment of the present invention;

[0041] Figure 3 is a partial structural schematic diagram of the bearing device in the embodiment of the present invention;

[0042] Figure 4 is a schematic diagram of the cooperation between the bearing platform and the first temperature control switch in the embodiment of the present invention;

[0043] Figure 5 is an exploded schematic diagram of the heat dissipation structure in the embodiment of the present invention;

[0044] Figure 6 is a structural schematic diagram of the body in some embodiments of the present invention;

[0045] Figure 7 is a three-dimensional schematic diagram of the bearing device in some embodiments of the present invention.

[0046] Explanation of reference numerals:

[0047] 10. Bearing device; 100. Base structure; 110. Relay; 111. First input port; 112. Second input port; 113. First output port; 114. Second output port; 210. Bearing platform; 211. Bearing surface; 2111. Adsorption channel; 21111. First channel; 21112. Second channel; 212. Connection surface; 2121. Accommodation groove; 213. Side surface; 310. Thermoelectric cooler; 320. Heat dissipation structure; 321. Heat dissipation cover plate; 3211. Liquid inlet hole; 3212. Liquid outlet hole; 322. Body; 3221. Heat dissipation flow channel; 32211. First flow channel; 32212. Intermediate flow channel; 322121. Bending section; 322122. Connection section; 32213. Second flow channel; 322141. First partition; 322142. Second partition; 322143. Flow channel partition; 323. Sealing ring; 340. First temperature control switch; 350. Second temperature control switch; 2. Chip. Detailed implementation manners

[0048] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below with reference to the accompanying drawings in the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0049] Please refer to Figures 1 - 3 , the loading device 10 of the embodiment of the present application includes a relay 110, a loading platform 210, a thermoelectric cooler 310 and a first temperature control switch 340. The loading platform 210 is for the sample to be tested. The thermoelectric cooler 310 is connected to the loading platform 210 and is used to adjust the temperature of the loading platform 210. The relay 110 is electrically connected to the first temperature control switch 340 and the thermoelectric cooler 310 respectively. The first temperature control switch 340 is used to detect the temperature of at least one of the loading platform 210, the sample to be tested and the thermoelectric cooler 310, and disconnect when an abnormal temperature is detected, so that the relay 110 controls the thermoelectric cooler 310 to cut off the power supply.

[0050] In the loading device 10 of the embodiment of the present application, the first temperature control switch 340 is used to detect the temperature of at least one of the loading platform 210, the sample to be tested and the thermoelectric cooler 310, and disconnect when an abnormal temperature is detected, so that the relay 110 controls the thermoelectric cooler 310 to cut off the power supply, so that the temperature of the sample to be tested no longer rises, realizing the temperature abnormal protection effect of the sample. In addition, the relay 110 is connected to the first temperature control switch 340 and the thermoelectric cooler 310 respectively. Therefore, the current of the first temperature control switch 340 has no direct connection with the current of the thermoelectric cooler 310. The first temperature control switch 340 can select a smaller model, so that the first temperature control switch 340 occupies a smaller volume of the loading device 10, which is beneficial to improving the heating and cooling rate of the loading platform 210 and meeting the requirement of rapid heating and cooling of the loading device 10.

[0051] Specifically, the sample to be tested can be a reagent such as a nucleic acid sample. The sample to be tested can be arranged in the chip 2. The loading platform 210 can be used to carry the chip 2, so as to carry the sample to be tested. The loading platform 210 is made of a heat-conducting material. For example, the loading platform 210 can be made of an aluminum alloy material to transfer the heat or cold of the thermoelectric cooler 310 to the chip 2, realize the temperature adjustment of the chip 2, and further realize the temperature adjustment of the sample to be tested.

[0052] The thermoelectric cooler 310 can also be called a semiconductor cooler. When the thermoelectric cooler 310 is powered on, one side can generate heat and the other side can cool, so as to meet different temperature adjustment requirements. Due to the small size of the thermoelectric cooler 310, the volume of the carrying device 10 has the characteristic of miniaturization.

[0053] The thermoelectric cooler 310 can be in contact connection with the carrying platform 210 or indirectly connected. The thermoelectric cooler 310 can exchange heat with the carrying platform 210, thereby adjusting the temperature of the carrying platform 210. The number of thermoelectric coolers 310 can be one or multiple. The present application does not limit the number of thermoelectric coolers 310. It can be connected. The number of the thermoelectric coolers 310 and the relays 110 can correspond one by one, so that one relay 110 can control the power on and off of the corresponding thermoelectric cooler 310.

[0054] In the embodiment of the present application, the first temperature control switch 340 can be a normally closed switch. For example, when the temperature of the first temperature control switch 340 is less than the preset temperature, the first temperature control switch 340 is in a closed state and conducts current; when the temperature of the first temperature control switch 340 is greater than or equal to the preset temperature, the first temperature control switch 340 is in an open state and cuts off the current.

[0055] The relay 110 is an electrical control device, which can control a large current with a small current. Generally, the current input to the input end of the relay 110 is small, and the current output from the output end of the relay 110 is large. The relay 110 controls the on and off of the output end through the input end, thereby realizing the power on and off function of the thermoelectric cooler 310.

[0056] Please refer to Figure 3 , in some embodiments, the first temperature control switch 340 is connected in series with the input end of the relay 110, and the output end of the relay 110 is connected in series with the thermoelectric cooler 310.

[0057] In this way, the first temperature control switch 340 is connected in series with the input end of the relay 110, and the output end of the relay 110 is connected in series with the thermoelectric cooler 310, so that the first temperature control switch 340 can be disconnected or closed according to the detected temperature, thereby controlling the disconnection or closure of the output end of the relay 110, and further controlling the power on and off of the thermoelectric cooler 310.

[0058] Exemplarily, when the temperature of the first temperature control switch 340 is too high, the first temperature control switch 340 disconnects. At this time, the input end of the relay 110 is in a power-off state, so that the output end of the relay 110 is also in a power-off state. Since the output end of the relay 110 is connected in series with the thermoelectric cooler 310, the thermoelectric cooler 310 is also powered off, thereby preventing the thermoelectric cooler 310 from continuously heating the carrier 210 and damaging the sample.

[0059] After the temperature of the first temperature control switch 340 decreases, the first temperature control switch 340 closes. At this time, the input end of the relay 110 is in a powered-on state, so that the output end of the relay 110 is also in a powered-on state. Since the output end of the relay 110 is connected in series with the thermoelectric cooler 310, the thermoelectric cooler 310 is also powered on, so that the thermoelectric cooler 310 can continue to heat the carrier 210 to heat the sample.

[0060] Please refer to Figure 3 , in some embodiments, the input end of the relay 110 includes a first input port 111 and a second input port 112. The first end of the first temperature control switch 340 is connected to the first input port 111. The second end of the first temperature control switch 340 is used to be connected to the first end of a first power supply (not shown in the figure). The second input port 112 is used to be connected to the second end of the first power supply;

[0061] The output end of the relay 110 includes a first output port 113 and a second output port 114. The first end of the thermoelectric cooler 310 is connected to the first output port 113. The second end of the thermoelectric cooler 310 is used to be connected to the first end of a second power supply (not shown in the figure). The second output port 114 is used to be connected to the second end of the second power supply.

[0062] In this way, by connecting the ports of the relay 110 to the first temperature control switch 340 and the thermoelectric cooler 310 respectively, the on-off of the relay 110 is controlled according to the temperature detected by the first temperature control switch 340, and then the working state of the thermoelectric cooler 310 is controlled.

[0063] Specifically, the first power supply is a power supply for supplying power to the relay 110, and the second power supply is a power supply for supplying power to the thermoelectric cooler 310. The output voltage of the first power supply is less than the output voltage of the second power supply. The first end of the first power supply can be one of the positive electrode and the negative electrode, and the second end of the first power supply can be the other of the positive electrode and the negative electrode. The first end of the second power supply can be one of the positive electrode and the negative electrode, and the second end of the second power supply can be the other of the positive electrode and the negative electrode.

[0064] In some embodiments, the number of the first temperature control switches 340 is multiple, and the multiple first temperature control switches 340 are connected in series. After the multiple first temperature control switches 340 are connected in series, they are further connected in series to the input end of the relay 110. In this way, the multiple first temperature control switches 340 can detect the temperatures at different positions, improving the protection effect against abnormal temperature of the sample.

[0065] Specifically, the multiple first temperature control switches 340 can detect the temperatures of different parts, or can also detect the temperature of the same part. In one example, the number of the first temperature control switches 340 is at least three. The at least three first temperature control switches 340 can detect the temperatures of the sample to be measured, the carrier table 210, and the thermoelectric cooler. When the temperature of at least one of the sample to be measured, the carrier table 210, and the thermoelectric cooler is abnormal, at least one first temperature control switch 340 is turned off, so that the relay 110 controls the thermoelectric cooler 310 to cut off the power supply.

[0066] In another example, the multiple first temperature control switches 340 are respectively distributed at different positions of the carrier table 210. The multiple first temperature control switches 340 can detect the temperatures at different positions of the carrier table 210. When the temperature at any position of the carrier table 210 is abnormal, the first temperature control switch 340 is turned off, so that the relay 110 controls the thermoelectric cooler 310 to cut off the power supply.

[0067] In some embodiments, the relay 110 is separately arranged from the thermoelectric cooler 310 and the carrier table 210 respectively. In this way, the relay 110 can be respectively installed at different positions from the thermoelectric cooler 310 and the carrier table 210. The thermoelectric cooler 310 and the carrier table 210 can both be in non-contact with the relay 110, reducing the probability of interference between the thermoelectric cooler 310, the carrier table 210 and the relay 110 respectively, making the cooperation between the thermoelectric cooler 310 and the carrier table 210 more compact, and being conducive to the thermoelectric cooler 310 adjusting the temperature of the carrier table 210.

[0068] In some embodiments, the carrying device 10 may include a heat-conducting medium (not shown in the figure), and the heat-conducting medium connects the carrier table 210 and the thermoelectric cooler 310. In this way, the heat-conducting medium can improve the heat exchange efficiency between the carrier table 210 and the thermoelectric cooler 310. Specifically, the heat-conducting medium is, for example, heat-conducting silicone grease. Since the heat-conducting silicone grease is in a paste state, the contact areas of the heat-conducting silicone grease with the carrier table 210 and the thermoelectric cooler 310 respectively are larger, thus being conducive to the heat exchange between the thermoelectric cooler 310 and the carrier table 210.

[0069] Please refer to Figure 4, in some embodiments, the first temperature control switch 340 is disposed on the carrier 210 and is used to detect the temperature of the carrier 210. Thus, the first temperature control switch 340 can be turned off or on according to the detected temperature of the carrier 210, so that the relay 110 controls the thermoelectric cooler 310 to be powered on or off.

[0070] Specifically, the first temperature control switch 340 being disposed on the carrier 210 means that the first temperature control switch 340 has a connection relationship with the carrier 210. The first temperature control switch 340 can be installed at any position of the carrier 210 as long as the first temperature control switch 340 can exchange heat with the carrier 210 to detect the temperature of the carrier 210. Exemplarily, the first temperature control switch 340 can be fixed to the carrier 210 by thermal conductive glue, so that the first temperature control switch 340 is not only fixed in position, but also can exchange heat with the carrier 210 through the thermal conductive glue.

[0071] Please refer to Figure 4 , in some embodiments, the first temperature control switch 340 is at least partially disposed in the carrier 210. Thus, the first temperature control switch 340 and the carrier 210 are more tightly fitted, which is beneficial to the miniaturization of the loading device 10. In addition, the relative area between the first temperature control switch 340 and the carrier 210 is larger, which is beneficial to the heat exchange between the first temperature control switch 340 and the carrier 210, so that the first temperature control switch 340 can quickly be basically consistent with the temperature of the carrier 210, and the response rate of the first temperature control switch 340 is improved.

[0072] Please refer to Figure 2 and Figure 4 , in some embodiments, the carrier 210 has a carrying surface 211 and a connecting surface 212 opposite to each other. The connecting surface 212 faces the thermoelectric cooler 310, and a receiving groove 2121 is formed in the connecting surface 212. The first temperature control switch 340 is at least partially disposed in the receiving groove 2121, and the carrying surface 211 is used to carry the sample to be measured.

[0073] Since the connecting surface 212 is connected to the thermoelectric cooler 310, the temperature rise of the connecting surface 212 is faster. A receiving groove 2121 is formed in the connecting surface 212, and the first temperature control switch 340 is at least partially disposed in the receiving groove 2121, so that the first temperature control switch 340 can respond more quickly according to the temperature of the carrier 210, and the probability of the sample to be measured in the chip 2 being damaged is reduced.

[0074] Specifically, the shape of the accommodation groove 2121 can match the shape of the first temperature control switch 340, so that the accommodation groove 2121 and the first temperature control switch 340 are more closely matched. For example, both the first temperature control switch 340 and the accommodation groove 2121 can be in the shape of a cuboid. The first temperature control switch 340 can be completely accommodated in the accommodation groove 2121, so that the first temperature control switch 340 and the carrier 210 are more compactly matched.

[0075] It should be noted that the first temperature control switch 340 is arranged in the accommodation groove 2121, which means that the main body of the first temperature control switch 340 is arranged in the accommodation groove 2121. The main body of the first temperature control switch 340 is the part formed by encapsulating the temperature sensing material into one body. If the first temperature control switch 340 has conductivity, the wire of the first temperature control switch 340 can extend outside the accommodation groove 2121 to connect the first temperature control switch 340 to the circuit.

[0076] Please refer to Figure 2 and Figure 4 , in some embodiments, the carrier 210 includes a side surface 213 respectively connected to the connection surface 212 and the bearing surface 211. The accommodation groove 2121 extends along the width direction of the carrier 210 to the side surface 213, and the first temperature control switch 340 penetrates through the side surface 213. In this way, the accommodation groove 2121 extends along the width direction of the carrier 210 to the side surface 213, and the first temperature control switch 340 penetrates through the side surface 213, which makes it more convenient to wire the first temperature control switch 340 and the relay 110.

[0077] In some embodiments, the side surface 213 forms the length direction of the carrier 210, and the accommodation groove 2121 is located at the middle position in the length direction of the carrier 210. Since the temperature at different positions of the carrier 210 may be different, therefore, the accommodation groove 2121 is located at the middle position in the length direction of the carrier 210, so that the difference in temperature detected by the first temperature control switch 340 on the carrier 210 is smaller, and the first temperature control switch 340 responds more accurately according to the temperature of the carrier 210.

[0078] Please refer to again Figure 2 , in some embodiments, an adsorption channel 2111 is recessed on the bearing surface 211. The adsorption channels 2111 are evenly distributed on the bearing surface 211, and the adsorption channels 2111 are connected to an external vacuum system.

[0079] In this way, by setting the bearing surface 211 with the adsorption channels 2111 to cooperate with the chip 2 and connecting the adsorption channels 2111 to an external vacuum system, a negative pressure can be generated at the opening of the adsorption channels 2111 on the bearing surface 211, so that the chip 2 can be fixed on the carrier 210. The fixing effect is good, and it can effectively solve the problem of damage to the chip 2 caused by the existing gene detector when fixing the chip by the buckle method.

[0080] Specifically, referring to Figure 2 As shown, the adsorption channel 2111 includes at least one first channel 21111 and at least one second channel 21112, and the first channel 21111 communicates with the second channel 21112.

[0081] By setting at least one first channel 21111 to communicate with at least one second channel 21112, a plurality of openings can be formed on the bearing surface 211 for adsorbing the chip 2; when at least one of the first channel 21111 and the second channel 21112 is plural in number, the adsorption range of the adsorption channel 2111 can be further increased, thereby improving the stability of the bearing device 10 in adsorbing the chip 2.

[0082] In one embodiment, the first channel 21111 and the second channel 21112 are arranged crosswise.

[0083] By arranging the first channel 21111 and the second channel 21112 in a crosswise manner, the coverage range of the two on the bearing surface 211 can be increased, which can be applicable to chips 2 of different sizes and improve the adsorption effect of the bearing device 10.

[0084] Specifically, the number of the first channels 21111 is plural, and the plural first channels 21111 are arranged at intervals and in parallel; the number of the second channels 21112 is plural, and the plural second channels 21112 are arranged at intervals and in parallel, and the first channel 21111 is perpendicular to the second channel 21112.

[0085] In this embodiment, the plural first channels 21111 and the plural second channels 21112 are arranged perpendicular to each other in a crosswise manner, so that the adsorption channel 2111 can form openings in a mesh layout on the bearing surface 211. When the chip 2 is placed on the bearing surface 211, the chip 2 can be adsorbed and fixed by generating negative pressure at the openings of the adsorption channel 2111.

[0086] In one embodiment, the bearing surface 211 is used to bear the chip 2, and the chip 2 is detachably connected to the bearing table 210. It can be understood that in the above embodiment, the chip 2 is fixed to the bearing surface 211 by vacuum adsorption. In other embodiments, the bearing chip 2 and the bearing surface 211 can also be fixed by detachable connection methods such as magnetic attraction, adhesion, and snap connection.

[0087] Specifically, referring to Figure 2 and Figure 5As shown, the carrying device 10 includes a heat dissipation structure 320. The heat dissipation structure 320 is disposed on the side of the thermoelectric cooler 310 facing away from the carrying platform 210. The heat dissipation structure 320 is used for heat exchange with the thermoelectric cooler 310. Thus, the heat dissipation structure 320 can improve the heat dissipation speed of the thermoelectric cooler 310, thereby improving the working efficiency of the thermoelectric cooler 310.

[0088] Specifically, referring to Figure 2 and Figure 5 As shown, the heat dissipation structure 320 includes a heat dissipation cover plate 321 and a body 322. A heat dissipation flow channel 3221 is provided inside the body 322. The heat dissipation cover plate 321 is detachably connected to the body 322 and covers the heat dissipation flow channel 3221. The heat dissipation flow channel 3221 is used for conveying a coolant and conducting heat, and a liquid inlet hole 3211 and a liquid outlet hole 3212 that are respectively communicated with the heat dissipation flow channel 3221 are formed on the heat dissipation cover plate 321.

[0089] When assembling the heat dissipation structure 320 of this embodiment, the heat dissipation cover plate 321 and the body 322 can be hermetically connected by means such as bonding, screw connection, welding, etc. And since the two are combined in a detachable connection manner, it is convenient for processing the heat dissipation flow channel 3221 on the body 322; when after-sales maintenance is required, only the heat dissipation cover plate 321 or the body 322 can be replaced separately, thereby reducing the use cost.

[0090] Specifically, referring to Figure 2 、 Figure 5 and Figure 6 As shown, the heat dissipation structure 320 is provided with a liquid inlet hole 3211 and a liquid outlet hole 3212 that are respectively communicated with the heat dissipation flow channel 3221; specifically, the heat dissipation flow channel 3221 includes a first flow channel 32211, an intermediate flow channel 32212, and a second flow channel 32213; the first flow channel 32211 is communicated with the liquid inlet hole 3211; the intermediate flow channel 32212 is communicated with the first flow channel 32211 and is located on one side of the first flow channel 32211; the second flow channel 32213 is respectively communicated with the intermediate flow channel 32212 and the liquid outlet hole 3212, and the second flow channel 32213 is located on the side of the intermediate flow channel 32212 facing the first flow channel 32211; wherein, the liquid inlet hole 3211 and the liquid outlet hole 3212 are respectively disposed on the same side of the heat dissipation structure 320, the first flow channel 32211 and the second flow channel 32213 are symmetrically arranged, and the orthographic projections of the heat dissipation flow channel 3221 on the heat dissipation structure 320 are uniformly distributed within the heat dissipation structure 320.

[0091] In the heat dissipation structure 320 of this embodiment, by arranging the first flow channel 32211 and the second flow channel 32213 on the same side of the intermediate flow channel 32212, the flowing length of the cooling liquid in the heat dissipation flow channel 3221 can be increased as much as possible to improve the heat absorption amount of the cooling liquid, thereby improving the heat dissipation effect of the heat dissipation structure 320. At the same time, by arranging the liquid inlet hole 3211 and the liquid outlet hole 3212 on the same side of the heat dissipation structure 320, the overall structural layout of the heat dissipation structure 320 can be facilitated.

[0092] In one embodiment, the intermediate flow channel 32212 includes at least one bending section 322121, and the bending section 322121 is arranged in a bent manner within the heat dissipation structure 320, so that the intermediate flow channel 32212 forms a comb-shaped flow channel inside the heat dissipation structure 320.

[0093] In this embodiment, the bending section 322121 is in an arch shape and is repeatedly bent, so that the internal structure of the heat dissipation structure 320 forms an interlaced blocking structure. Through the cooperation of the blocking structure and the intermediate flow channel 32212, a comb-shaped structure flow channel is formed inside the heat dissipation structure 320. Such a setting can increase the coverage rate of the heat dissipation flow channel 3221 on the orthographic projection of the heat dissipation structure 320, thereby improving the heat dissipation efficiency of the heat dissipation structure 320.

[0094] In another embodiment, the intermediate flow channel 32212 further includes a connecting section 322122. One end of the connecting section 322122 communicates with the bending section 322121, and the other end of the connecting section 322122 communicates with the first flow channel 32211 or the second flow channel 32213. The connecting section 322122 is arranged along a straight line direction and adheres to one side of the bending section 322121.

[0095] In this embodiment, by arranging the connecting section 322122 to be connected to the bending section 322121, the flow rate of the cooling liquid flowing in the connecting section 322122 can be increased, so that the heat inside the heat dissipation structure 320 can be conducted to other low-temperature parts of the heat dissipation structure 320 faster and more evenly, thereby improving the heat conduction effect of the heat dissipation structure 320.

[0096] In yet another embodiment, at least a part of the first flow channel 32211 is bent, and the orthographic projection of the liquid inlet hole 3211 on the heat dissipation structure 320 is at least partially located inside the first flow channel 32211; and / or at least a part of the second flow channel 32213 is bent, and the orthographic projection of the liquid inlet hole 3211 on the heat dissipation structure 320 is at least partially located inside the second flow channel 32213.

[0097] By arranging the first flow channel 32211 to at least partially surround the liquid inlet hole 3211, when the heat dissipation structure 320 conducts heat with an external heat source (i.e., the object to be cooled), after the coolant enters the first flow channel 32211 through the liquid inlet hole 3211, the flow path length of the coolant in the first flow channel 32211 can be increased to increase the heat received by the coolant. And since the first flow channel 32211 is arranged to surround the liquid inlet hole 3211, the overlapping area between the orthographic projection of the first flow channel 32211 on the heat dissipation structure 320 and the external heat source can be increased, thereby further improving the heat conduction effect and heat dissipation effect of the heat dissipation structure 320. At the same time, by arranging the first flow channel 32211 to at least partially surround the liquid inlet hole 3211, the overall structure of the first flow channel 32211 and the liquid inlet hole 3211 can be made more compact, facilitating the compact design requirements of the heat dissipation structure 320. Similarly, by arranging the second flow channel 32213 to surround the liquid outlet hole 3212, the flow path length of the coolant in the second flow channel 32213 can be increased to increase the heat output by the coolant. At the same time, the overlapping area between the second flow channel 32213 and the external heat source can be increased, and the overall structure of the second flow channel 32213 and the liquid outlet hole 3212 can be made compact, which will not be elaborated here.

[0098] It should be noted that the "orthographic projection" here in the present application refers to the orthographic projection of the heat dissipation flow channel on the heat dissipation structure 100 in the direction perpendicular to the hot surface of the heat dissipation structure 100, that is Figure 6 the projection method shown. In this embodiment, the heat dissipation structure 100 has a flat surface and is used to contact with an external component to achieve a heat dissipation effect. By arranging at least part of the orthographic projection of the liquid inlet hole 3211 on the heat dissipation structure 320 inside the first flow channel 32211 and at least part of the orthographic projection of the liquid outlet hole 3212 on the heat dissipation structure 320 inside the second flow channel 32213, the heat dissipation flow channel can have a longer path to surround the liquid inlet hole 3211 and the liquid outlet hole 3212, so as to increase the heat exchange amount between the coolant and the heat dissipation structure 100, thereby improving the heat dissipation effect of the heat dissipation structure.

[0099] Specifically, referring to Figure 6 (a) As shown, in the first embodiment, the intermediate flow channel 32212 includes at least two bending segments 322121, and the two bending segments 322121 are attached to each other and are respectively connected to the first flow channel 32211 and the second flow channel 32213, so that the two bending segments 322121 are combined to form a comb-shaped bending flow channel structure. When the coolant is conveyed inside the intermediate flow channel 32212, it can pass through the two bending segments 322121 in sequence to extend the flow path length of the coolant. By setting like this, the heat dissipation and heat conduction effects of the heat dissipation structure 320 can be improved, and the overall structure of the heat dissipation structure 320 is compact, facilitating the miniaturization of the heat dissipation structure 320.

[0100] Refer to Figure 6 (as shown in (b)), in the second embodiment, the intermediate flow channel 32212 includes at least one bending section 322121 and a connecting section 322122. The connecting section 322122 is connected between the second flow channel 32213 (the first flow channel 32211) and the bending section 322121. With such a setting, when the first flow channel 32211 in this embodiment serves as the liquid inlet flow channel, the coolant can be quickly discharged through the connecting section 322122 by the second flow channel 32213 after passing through the bending section 322121, thereby reducing the accumulation amount of heat inside the heat dissipation structure 320 and improving the heat dissipation effect of the heat dissipation structure 320.

[0101] Refer to Figure 6 (as shown in (c)), in the third embodiment, the first flow channel 32211 and the second flow channel 32213 are symmetrically arranged, and the first flow channel 32211 and the second flow channel 32213 respectively surround the liquid inlet hole 3211 and the liquid outlet hole 3212, and the intermediate flow channel 32212 includes at least two bending sections 322121 that are attached to each other. With such a setting, heat can be evenly distributed on the surface of the heat dissipation structure 320, thereby improving the heat dissipation effect of the heat dissipation structure 320.

[0102] It should be noted that the length dimension of the heat dissipation structure 320 in the first embodiment and the second embodiment can be half of that of the heat dissipation structure 320 in the third embodiment. With such a setting, when it is necessary to replace the heat dissipation structure 320 in the third embodiment with the heat dissipation structure 320 in the first embodiment and / or the second embodiment, two heat dissipation structures 320 in the first embodiment or the second embodiment can be arranged side by side to enable it to cover the surface of the external heat source as much as possible; in other embodiments, the corresponding number of heat dissipation structures 320 can also be selected according to actual usage requirements so that the heat dissipation structure 320 fully covers the surface of the external heat source. Specifically, in this embodiment, the thermoelectric cooler 200 is a semiconductor thermoelectric cooler, and the external heat source can be the hot end of the thermoelectric cooler 200.

[0103] Refer to Figure 6 (as shown in (d)), in the fourth embodiment, the first flow channel 32211 and the second flow channel 32213 are centrosymmetric about the midpoint of the line connecting the liquid inlet hole 3211 and the liquid outlet hole 3212, and the first flow channel 32211 and the second flow channel 32213 are respectively communicated with the intermediate flow channel 32212.

[0104] The partition structure includes a first partition 322141, a second partition 322142, and a flow channel partition 322143. The first partition 322141 and the second partition 322142 are used to separate the liquid inlet hole 3211 and the intermediate flow channel 32212, and enable the first flow channel 32211 to be arranged around the liquid inlet hole 3211 to extend the path length of the coolant in the heat dissipation structure 320. At the same time, by arranging multiple flow channel partitions 322143 in a staggered manner, an intermediate flow channel 32212 with multiple bending segments 322121 can be formed, thereby improving the heat dissipation effect of the heat dissipation structure 320.

[0105] Further, as Figure 5 shown, the heat dissipation structure 320 further includes a sealing ring 323. The sealing ring 323 is arranged between the heat dissipation cover 321 and the body 322, and the sealing ring 323 surrounds the heat dissipation flow channel 3221 and is used to seal the gap between the heat dissipation cover 321 and the body 322.

[0106] With this arrangement, when assembling the heat dissipation cover 321 and the body 322, the gap between the two can be sealed by the sealing ring 323, which can further improve the sealing effect of the heat dissipation structure 320; in one embodiment, a slot for accommodating the sealing ring 323 can be opened on one side of the inner side of the heat dissipation cover 321 and / or the body 322. The slot surrounds the heat dissipation flow channel 3221. During assembly, the slot can be used in cooperation with the sealing ring 323 to position the installation of the sealing ring 323. At the same time, when the heat dissipation cover 321 and the body 322 are combined, the sealing ring 323 can be extruded to deform and fill the slot; specifically, the sealing ring 323 includes, but is not limited to, a rubber sealing ring 323, a silica gel sealing ring 323, and sealant.

[0107] Please refer to again Figure 1 and Figure 2 , in some embodiments, the carrier device 10 may further include a base structure 100, and the thermoelectric cooler 310 is installed on the base 100. In this way, the base structure 100 can provide support for the thermoelectric cooler 310, making the installation of the thermoelectric cooler 310 more stable.

[0108] Please refer to Figure 5 , in some embodiments, the number of both the liquid inlet hole 3211 and the liquid outlet hole 3212 is one, and the number of thermoelectric coolers 310 is two. The liquid inlet hole 3211 and the liquid outlet hole 3212 are arranged at corresponding positions of one of the thermoelectric coolers 310.

[0109] Please refer to Figure 7, in some embodiments, the number of the liquid inlet holes 3211 is one, the number of the liquid outlet holes 3212 is two, the number of the thermoelectric coolers 310 is two, the liquid inlet hole 3211 is located between the two liquid outlet holes 3212, and the liquid inlet hole 3211 and the liquid outlet holes 3212 are arranged between the two thermoelectric coolers 310. In this way, the liquid inlet hole 3211 being located between the two liquid outlet holes 3212 can optimize the uniform heat dissipation of the heat dissipation flow channel 3221 and avoid heat accumulation.

[0110] Please refer to Figure 7 , in some embodiments, a second temperature control switch 350 is provided on the heat dissipation cover plate 321. The second temperature control switch 350 is connected to the thermoelectric cooler 310. The second temperature control switch 350 is used to detect the temperature of the heat dissipation cover plate 321 and disconnect when the temperature of the heat dissipation cover plate 321 is detected to be abnormal, so as to cut off the power supply of the thermoelectric cooler 310.

[0111] In the case of the water pump stopping pumping or the pipe being blocked, the heat dissipation structure 320 cannot effectively dissipate heat. The second temperature control switch 350 disconnects when the temperature of the heat dissipation cover plate 321 is detected to be abnormal, so as to cut off the power supply of the thermoelectric cooler 310. This can prevent the temperature of the heat dissipation structure 320 from being too high, so as to avoid the adverse effect that the pipeline connected to the heat dissipation structure 320 bursts due to high temperature and the coolant leaks.

[0112] The present utility model further provides a biomolecule detection system, which includes the carrying device 10 in any one of the above embodiments.

[0113] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the embodiments of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0114] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific situations.

[0115] In the embodiments of the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0116] In the description of this specification, the description of reference terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A loading device, characterized in that, it includes: a loading platform for loading a sample to be tested; a thermoelectric cooler, which is connected to the loading platform and is used to adjust the temperature of the loading platform; a first temperature control switch and a relay, the relay is electrically connected to the first temperature control switch and the thermoelectric cooler respectively, the first temperature control switch is used to detect the temperature of at least one of the loading platform, the sample to be tested and the thermoelectric cooler, and disconnect when the detected temperature is abnormal, so that the relay controls the thermoelectric cooler to cut off the power.

2. The loading device according to claim 1, characterized in that, the first temperature control switch is connected in series with the input end of the relay, and the output end of the relay is connected in series with the thermoelectric cooler.

3. The loading device according to claim 2, characterized in that, the number of the first temperature control switches is multiple, and the multiple first temperature control switches are connected in series.

4. The loading device according to claim 2, characterized in that, the input end of the relay includes a first input port and a second input port, the first end of the first temperature control switch is connected to the first input port, the second end of the first temperature control switch is used to be connected to the first end of a first power supply, and the second input port is used to be connected to the second end of the first power supply; the output end of the relay includes a first output port and a second output port, the first end of the thermoelectric cooler is connected to the first output port, the second end of the thermoelectric cooler is used to be connected to the first end of a second power supply, and the second output port is used to be connected to the second end of the second power supply.

5. The loading device according to any one of claims 1 to 4, characterized in that, the relay is separately arranged from the thermoelectric cooler and the loading platform.

6. The loading device according to any one of claims 1 to 4, characterized in that, the first temperature control switch is arranged on the loading platform and is used to detect the temperature of the loading platform.

7. The loading device according to claim 6, characterized in that, at least part of the first temperature control switch is arranged in the loading platform.

8. The loading device according to claim 7, characterized in that, the loading platform has a connection surface and a loading surface opposite to each other, the connection surface faces the thermoelectric cooler, a receiving groove is formed on the connection surface, at least part of the first temperature control switch is arranged in the receiving groove, and the loading surface is used to load the sample to be tested.

9. The loading device according to claim 8, characterized in that, the loading platform includes a side surface connected to the connection surface and the loading surface respectively, the receiving groove extends along the width direction of the loading platform to the side surface, and the first temperature control switch penetrates through the side surface.

10. The loading device according to claim 8, characterized in that, an adsorption channel is recessed on the loading surface, the adsorption channels are evenly distributed on the loading surface, and the adsorption channels are connected to an external vacuum system.

11. The loading device according to claim 10, characterized in that, The adsorption channel includes at least one first channel and at least one second channel, and the first channel is connected to the second channel.

12. The carrying device according to claim 11, It is characterized in that The first groove and the second groove are arranged crosswise.

13. The carrying device according to claim 11, It is characterized in that There are multiple first grooves, and the multiple first grooves are arranged in parallel and at intervals. There are multiple second grooves, and the multiple second grooves are arranged in parallel and at intervals. The first grooves and the second grooves are perpendicular to each other.

14. The carrying device according to any one of claims 1 to 4, It is characterized in that The carrying device comprises a heat dissipation structure, which is arranged on a side of the thermoelectric cooler away from the carrying platform, and is used for heat exchange with the thermoelectric cooler.

15. The carrying device according to claim 14, It is characterized in that The heat dissipation structure includes a heat dissipation cover plate and a main body, a heat dissipation channel is arranged inside the main body, the heat dissipation cover plate is detachably connected to the main body and covers the heat dissipation channel, the heat dissipation channel is used to transport coolant and conduct heat, and the heat dissipation cover plate is provided with a liquid inlet hole and a liquid outlet hole respectively connected to the heat dissipation channel.

16. The carrying device according to claim 15, It is characterized in that The number of the liquid inlet hole is one, the number of the liquid outlet holes is two, and the liquid inlet hole is located between the two liquid outlet holes.

17. The carrying device according to claim 15, It is characterized in that The heat dissipation channel includes a first channel, an intermediate channel and a second channel, the first channel is connected to the liquid inlet hole; the intermediate channel is connected to the first channel and is located on one side of the first channel; the second channel is respectively connected to the intermediate channel and the liquid outlet hole, and the second channel is located on the side of the intermediate channel facing the first channel; wherein the liquid inlet hole and the liquid outlet hole are respectively arranged on the same side of the heat dissipation structure, and the first channel and the second channel are symmetrically arranged.

18. The carrying device according to claim 17, It is characterized in that The orthographic projections of the heat dissipation channels on the heat dissipation structure are uniformly distributed within the heat dissipation structure.

19. The carrying device according to claim 17, It is characterized in that The intermediate flow channel includes at least one curved section, and the curved sections are arranged in a curved manner within the heat dissipation structure, so that the intermediate flow channel forms a comb-shaped flow channel inside the heat dissipation structure.

20. The carrying device according to claim 19, It is characterized in that The intermediate flow channel also includes a connecting section, one end of which is connected to the curved section, and the other end of which is connected to the first flow channel or the second flow channel. The connecting section is arranged in a straight line and is located on one side of the curved section.

21. The carrying device according to claim 17, It is characterized in that The first flow channel and the second flow channel are centrally symmetrical along the midpoint of the line connecting the liquid inlet and the liquid outlet, and the first flow channel and the second flow channel are respectively connected to the middle flow channel.

22. The carrier device according to claim 17, wherein, the intermediate flow channel includes at least one bent section and a connecting section, and the connecting section is connected between the second flow channel or between the first flow channel and the bent section.

23. The carrier device according to claim 22, wherein, the first flow channel and the second flow channel are symmetrically arranged, and the first flow channel and the second flow channel respectively surround the liquid inlet hole and the liquid outlet hole, and the intermediate flow channel includes at least two bent sections arranged in contact with each other.

24. The carrier device according to claim 17, wherein, at least a part of the first flow channel is bent, and at least a part of the orthographic projection of the liquid inlet hole on the heat dissipation structure is located within the first flow channel; and / or at least a part of the second flow channel is bent, and at least a part of the orthographic projection of the liquid outlet hole on the heat dissipation structure is located within the second flow channel.

25. The carrier device according to any one of claims 15 - 24, wherein, a second temperature control switch is provided on the heat dissipation cover plate, the second temperature control switch is connected to the thermoelectric cooler, and the second temperature control switch is used to detect the temperature of the heat dissipation cover plate and disconnect when the temperature of the heat dissipation cover plate is detected to be abnormal, so that the thermoelectric cooler is powered off.

26. A biomolecule detection system, wherein, it includes the carrier device according to any one of claims 1 - 25.

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