Anti-crosstalk layered array type flexible sensor based on 3D printing

Abstract

The utility model provides an anti-crosstalk layered array type flexible sensor based on 3D printing, which relates to the technical field of sensors and comprises an upper insulating layer, an upper piezoelectric layer, a middle insulating layer, a lower piezoelectric layer and a lower insulating layer which are sequentially arranged from top to bottom. The upper piezoelectric layer comprises a plurality of upper electrode assemblies which are distributed in an array mode; the lower piezoelectric layer comprises a plurality of lower piezoelectric assemblies which are distributed in an array mode; the upper electrode assembly comprises an upper electrode plate and an upper piezoelectric material layer which are sequentially arranged from top to bottom; the lower piezoelectric component comprises a lower piezoelectric material layer and a lower electrode plate which are sequentially arranged from top to bottom; the upper electrode plates and the lower electrode plates are in one-to-one correspondence in upper and lower positions, and the upper electrode plates and the lower electrode plates are electrically connected with an external circuit; the flexible sensor is simple in structure, the large array density of the sensor is guaranteed, the output performance of the flexible sensor is effectively improved, and crosstalk among the elements is isolated.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible sensors, and more specifically, to a 3D printing-based anti-crosstalk hierarchical array flexible sensor. Background Art

[0002] A flexible sensor is a sensor made of flexible materials, which has excellent flexibility and ductility, and can even be freely bent and folded. According to the working principle, it can be mainly divided into three types: resistive, capacitive, and piezoelectric. Among them, the piezoelectric sensor has the multi-touch function of the capacitive type and supports the touch of any object like the resistive type.

[0003] Currently, the array density of flexible array piezoelectric sensors is one of the parameters that researchers are extremely concerned about. For example, a patent with the publication number CN217953733U discloses an array piezoelectric sensor, and the designed sensor has achieved a relatively large array density. However, while optimizing this parameter, problems such as large crosstalk between array units and complex manufacturing processes will inevitably arise. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to overcome the above-mentioned defects of the prior art. The utility model provides a 3D printing-based anti-crosstalk hierarchical array flexible sensor, which has a simple structure, effectively improves the output performance of the flexible sensor while ensuring a large array density, and isolates the crosstalk between components.

[0005] The utility model provides a 3D printing-based anti-crosstalk hierarchical array flexible sensor, which includes an upper insulating layer, an upper piezoelectric layer, a middle insulating layer, a lower piezoelectric layer, and a lower insulating layer arranged in sequence from top to bottom; the upper piezoelectric layer includes a plurality of upper electrode assemblies arranged in an array; the lower piezoelectric layer includes a plurality of lower piezoelectric assemblies arranged in an array; the upper electrode assembly includes an upper electrode sheet and an upper piezoelectric material layer arranged in sequence from top to bottom; the lower piezoelectric assembly includes a lower piezoelectric material layer and a lower electrode sheet arranged in sequence from top to bottom; the upper electrode sheet and the lower electrode sheet are in one-to-one correspondence in the up-and-down position, and both the upper electrode sheet and the lower electrode sheet are used for electrical connection with an external circuit.

[0006] Compared with the prior art, the present application has the following advantages: Since the upper electrode assembly and the lower piezoelectric assembly are both arranged in an array, the upper electrode sheets and the lower electrode sheets are relatively uniform, and when being extruded, the force is more uniform, which is convenient for an external force to be applied at any position to make the sensor sense when worn; the middle insulating layer prevents the upper piezoelectric layer and the lower piezoelectric layer from contacting to form a short circuit; the one-to-one correspondence between the upper electrode sheets and the lower electrode sheets facilitates the formation of a circuit; in addition, by providing the upper piezoelectric layer and the lower piezoelectric layer, the number of the upper electrode sheets and the lower electrode sheets can be denser, while ensuring a large array density of the sensor, effectively improving the output performance of the flexible sensor, and isolating the crosstalk between the components.

[0007] In a possible implementation manner, a first groove for placing the upper piezoelectric material layer to form a limit is provided on the lower surface of each upper electrode sheet; a second groove for placing the lower piezoelectric material layer to form a limit is provided on the upper surface of each lower electrode sheet.

[0008] Compared with the prior art, adopting the above technical solution can fix the upper piezoelectric material layer and the lower piezoelectric material layer, save space and facilitate miniaturization.

[0009] In a possible implementation manner, each upper electrode assembly and each lower piezoelectric assembly are both N-row matrices, and N is a positive even number; in each upper electrode assembly of the upper piezoelectric layer, the upper electrode sheets from the first row to the N / 2-th row are respectively electrically connected to an external circuit through a first electrode wire, and the upper electrode sheets from the (N / 2 + 1)-th row to the N-th row are respectively electrically connected to the external circuit through a second electrode wire; in each lower piezoelectric assembly of the lower piezoelectric layer, the lower electrode sheets from the first row to the N / 2-th row are respectively electrically connected to the external circuit through a third electrode wire, and the lower electrode sheets from the (N / 2 + 1)-th row to the N-th row are respectively electrically connected to the external circuit through a fourth electrode wire.

[0010] Compared with the prior art, adopting the above technical solution can make the distribution and wiring between half of the upper electrode sheets and the other half of the upper electrode sheets in the upper piezoelectric layer more reasonable, which is convenient for large-area arrangement, and in the lower piezoelectric layer, the distribution and wiring between half of the lower electrode sheets and the other half of the lower electrode sheets are more reasonable, which is convenient for large-area arrangement.

[0011] In a possible implementation manner, each first electrode wire extends upward on one side of the upper piezoelectric layer, and each second electrode wire extends upward on the other side of the upper piezoelectric layer; each third electrode wire extends downward on one side of the lower piezoelectric layer, and each fourth electrode wire extends downward on the other side of the lower piezoelectric layer.

[0012] Compared with the prior art, adopting the above technical solution can make the first electrode wires and the second electrode wires not interfere with each other, and the third electrode wires and the fourth electrode wires not interfere with each other, with clear wiring, preventing crosstalk from affecting the sensitivity.

[0013] In a possible implementation, the upper insulating layer, the middle insulating layer, and the lower insulating layer are all made of PI film.

[0014] Compared with the prior art, the above technical solution can have better insulation performance, and has better flexibility, which can protect the internal structure.

[0015] In a possible implementation, each upper piezoelectric material layer and each lower piezoelectric material layer are all made by 3D printing.

[0016] Compared with the prior art, the above technical solution is simple to prepare and convenient for production.

[0017] In a possible implementation, each upper electrode sheet and each lower electrode sheet are all made by 3D printing.

[0018] Compared with the prior art, the above technical solution is simple to prepare and convenient for production.

[0019] In a possible implementation, each upper electrode assembly and each lower piezoelectric assembly are both in a cylindrical structure.

[0020] Compared with the prior art, the above technical solution can enable each upper electrode assembly and each lower piezoelectric assembly to withstand extrusion forces in the up and down directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is an overall exploded view of the present utility model;

[0022] Figure 2 It is a schematic diagram of the array distribution of the lower piezoelectric assemblies of the present utility model;

[0023] Figure 3 It is a schematic diagram of disassembling one of the lower piezoelectric assemblies of the present utility model;

[0024] Figure 4 It is a schematic diagram of disassembling one of the upper electrode assemblies of the present utility model;

[0025] Figure 5 It is a schematic diagram of the wiring of each upper electrode sheet of the upper piezoelectric layer of the present utility model;

[0026] Figure 6 It is a schematic diagram of the wiring of each lower electrode sheet of the lower piezoelectric layer of the present utility model;

[0027] Description of the reference numerals:

[0028] 1 - Upper insulating layer, 2 - Upper piezoelectric layer, 3 - Middle insulating layer, 4 - Lower piezoelectric layer, 5 - Lower insulating layer, 10 - First electrode line, 11 - Second electrode line, 12 - Third electrode line, 13 - Fourth electrode line, 21 - Upper electrode assembly, 41 - Lower piezoelectric assembly, 211 - Upper electrode plate, 211.1 - First groove, 212 - Upper piezoelectric material layer, 411 - Lower piezoelectric material layer, 412 - Lower electrode plate, 412.1 - Second groove. Detailed implementation manners

[0029] First of all, those skilled in the art should understand that these implementation manners are only used to explain the technical principles of the embodiments of the present application, and are not intended to limit the protection scope of the embodiments of the present application. Those skilled in the art can make adjustments according to needs to adapt to specific application scenarios.

[0030] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0031] In the embodiments of the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0032] The following further describes the present application in detail with reference to the drawings and specific embodiments.

[0033] See Figure 1, an embodiment of the present application discloses a crosstalk-resistant hierarchical array flexible sensor based on 3D printing, including an upper insulating layer 1, an upper piezoelectric layer 2, a middle insulating layer 3, a lower piezoelectric layer 4, and a lower insulating layer 5 arranged in sequence from top to bottom; the upper piezoelectric layer 2 includes a plurality of upper electrode assemblies 21 arranged in an array; the lower piezoelectric layer 4 includes a plurality of lower piezoelectric assemblies 41 arranged in an array; the upper electrode assembly 21 includes an upper electrode sheet 211 and an upper piezoelectric material layer 212 arranged in sequence from top to bottom; the lower piezoelectric assembly 41 includes a lower piezoelectric material layer 411 and a lower electrode sheet 412 arranged in sequence from top to bottom; the upper electrode sheet 211 and the lower electrode sheet 412 are in one-to-one correspondence in the vertical position, and both the upper electrode sheet 211 and the lower electrode sheet 412 are used for electrical connection with an external circuit.

[0034] In this embodiment, for the sake of simplicity of description, the schematic diagram of the array distribution of the upper electrode assembly 21 is omitted in the drawings because the schematic diagram of the array distribution of the upper electrode assembly 21 is consistent with the Figure 2 schematic diagram of the array distribution of the lower piezoelectric assembly 41 attached, and the only difference is that the upper piezoelectric material layer 212 of the upper electrode assembly 21 is arranged downward; 7 wt% of three-dimensional polypyrrole can be added to the upper piezoelectric material layer 212 and the lower piezoelectric material layer 411 to increase the conductivity; and the upper piezoelectric material layer 212, the upper electrode sheet 211, the lower piezoelectric material layer 411, and the lower electrode sheet 412 can all be made by 3D printing; the one-to-one correspondence between the upper electrode sheet 211 and the lower electrode sheet 412 can facilitate the formation of a separate circuit between each upper electrode sheet 211 and the corresponding lower electrode sheet 412 through positive and negative currents; since both the upper electrode assembly 21 and the lower piezoelectric assembly 41 are arranged in an array, the upper piezoelectric layer 2 and the lower piezoelectric layer 4 are both relatively uniform, and when being squeezed, the force is more uniform, which is convenient for an external force to be applied at any position so that the sensor can perceive when worn; the middle insulating layer 3 prevents the upper piezoelectric layer 2 and the lower piezoelectric layer 4 from contacting to form a short circuit; in addition, by setting the upper piezoelectric layer 2 and the lower piezoelectric layer 4, the number of the upper electrode sheet 211 and the lower electrode sheet 412 can be made denser, while ensuring a large array density of the sensor, effectively improving the output performance of the flexible sensor, isolating the crosstalk between each component, thereby improving the accuracy and sensitivity, and not increasing the area, which is convenient for miniaturization.

[0035] See Figure 2 and Figure 3 , in some embodiments, a first groove 211.1 for placing the upper piezoelectric material layer 212 to form a limit is provided on the lower surface of each upper electrode sheet 211; a second groove 412.1 for placing the lower piezoelectric material layer 411 to form a limit is provided on the upper surface of each lower electrode sheet 412. It can make the upper piezoelectric material layer 212 and the lower piezoelectric material layer 411 fixed, save space, and be convenient for miniaturization.

[0036] See Figure 5 andFigure 6 , in some embodiments, each upper electrode assembly 21 and each lower piezoelectric assembly 41 are both N-row matrices, where N is a positive even number; among the upper electrode assemblies 21 of the upper piezoelectric layer 2, the upper electrode plates 211 of the first row to the N / 2-th row are respectively electrically connected to an external circuit through a first electrode line 10, and the upper electrode plates 211 of the (N / 2 + 1)-th row to the N-th row are respectively electrically connected to an external circuit through a second electrode line 11; among the lower piezoelectric assemblies 41 of the lower piezoelectric layer 4, the lower electrode plates 412 of the first row to the N / 2-th row are respectively electrically connected to an external circuit through a third electrode line 12, and the lower electrode plates 412 of the (N / 2 + 1)-th row to the N-th row are respectively electrically connected to an external circuit through a fourth electrode line 13.

[0037] In this embodiment, each upper electrode assembly 21 and each lower piezoelectric assembly 41 are both 6-row and 6-column matrices. It should be noted that the number of upper electrode assemblies 21 and lower piezoelectric assemblies 41 is flexibly adjusted according to the actual situation, that is, the size of the matrix is flexibly adjusted, but the number of rows must be even to ensure uniform distribution and clear wiring; in this embodiment, among the upper electrode assemblies 21 of the upper piezoelectric layer 2, the upper electrode plates 211 of the first row to the third row are respectively electrically connected to an external circuit through a first electrode line 10; the upper electrode plates 211 of the fourth row to the sixth row are respectively electrically connected to an external circuit through a second electrode line 11; among the lower piezoelectric assemblies 41 of the lower piezoelectric layer 4, the lower electrode plates 412 of the first row to the third row are respectively electrically connected to an external circuit through a third electrode line 12, and the lower electrode plates 412 of the fourth row to the sixth row are respectively electrically connected to an external circuit through a fourth electrode line 13.

[0038] See Figure 5 and Figure 6 , in some embodiments, each first electrode line 10 extends upward on one side of the upper piezoelectric layer 2, and each second electrode line 11 extends upward on the other side of the upper piezoelectric layer 2; each third electrode line 12 extends downward on one side of the lower piezoelectric layer 4, and each fourth electrode line 13 extends downward on the other side of the lower piezoelectric layer 4.

[0039] In this embodiment, each first electrode line 10 extends upward on the upper side of the upper electrode plate 211, and each second electrode line 11 extends upward on the lower side of the upper electrode plate 211; each third electrode line 12 extends downward on the upper side of the lower electrode plate 412, and each fourth electrode line 13 extends downward on the lower side of the lower electrode plate 412; this makes the first electrode lines 10 and the second electrode lines 11 not interfere with each other, and the third electrode lines 12 and the fourth electrode lines 13 not interfere with each other, with clear wiring and preventing crosstalk from affecting the sensitivity.

[0040] See Figure 3, in some embodiments, the upper insulating layer 1, the middle insulating layer 3, and the lower insulating layer 5 are all made of PI film. The PI film has good insulating properties and good flexibility, and can protect the internal structure.

[0041] See Figure 3 , in some embodiments, each upper piezoelectric material layer 212 and each lower piezoelectric material layer 411 are made of a mixed solution of PDMS and perovskite by 3D printing technology. The PDMS material itself has good flexibility. After adding perovskite, its piezoelectric performance is greatly improved, and it has good corrosion resistance, chemical resistance, and high temperature resistance, and has high mechanical strength.

[0042] See Figure 3 , in some embodiments, each upper electrode sheet 211 and each lower electrode sheet 412 are made of silver paste by 3D printing technology. Silver has better conductivity, making the conductivity of each upper electrode sheet 211 and each lower electrode sheet 412 higher.

[0043] See Figure 3 , in some embodiments, each upper electrode assembly 21 and each lower piezoelectric assembly 41 are in a cylindrical structure. This enables each upper electrode assembly 21 and each lower piezoelectric assembly 41 to withstand extrusion forces in the up and down directions, and facilitates the large-area arrangement of each upper electrode assembly 21 and each lower piezoelectric assembly 41.

[0044] In the description of the embodiments of the present application, it should be noted that in the description of the present application, the terms "inner", "outer", etc. indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for convenience of description, rather than indicating or implying that the device or component must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present application.

[0045] In the description of the present application, the description with reference to terms such as "one embodiment", "some embodiments", "in this embodiment", "specific example", or "some examples" means that the specific features, mechanisms, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, mechanisms, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0046] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A 3D-printed anti-crosstalk layered array flexible sensor, characterized in that: The invention comprises an upper insulating layer (1), an upper piezoelectric layer (2), a middle insulating layer (3), a lower piezoelectric layer (4) and a lower insulating layer (5) which are arranged in sequence from top to bottom; the upper piezoelectric layer (2) comprises a plurality of upper electrode components (21) which are distributed in an array; the lower piezoelectric layer (4) comprises a plurality of lower piezoelectric components (41) which are distributed in an array; the upper electrode component (21) comprises an upper electrode sheet (211) and an upper piezoelectric material layer (212) which are arranged in sequence from top to bottom; the lower piezoelectric component (41) comprises a lower piezoelectric material layer (411) and a lower electrode sheet (412) which are arranged in sequence from top to bottom; the upper and lower positions of the upper electrode sheet (211) and the lower electrode sheet (412) correspond one to one, and the upper electrode sheet (211) and the lower electrode sheet (412) are both used for being electrically connected to an external circuit.

2. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1, characterized in that: The lower surface of each upper electrode sheet (211) is provided with a first groove (211.1) for the upper piezoelectric material layer (212) to be placed in to form a limit; the upper surface of each lower electrode sheet (412) is provided with a second groove (412.1) for the lower piezoelectric material layer (411) to be placed in to form a limit.

3. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1 or 2, characterized in that: Each of the upper electrode components (21) and each of the lower piezoelectric components (41) is an N-row matrix, where N is a positive even number; in each of the upper electrode components (21) of the upper piezoelectric layer (2), each of the upper electrode sheets (211) in the first row to the N / 2th row is electrically connected to an external circuit via a first electrode line (10), and each of the upper electrode sheets (211) in the N / 2+1th row to the Nth row is electrically connected to an external circuit via a second electrode line (11); in each of the lower piezoelectric components (41) of the lower piezoelectric layer (4), each of the lower electrode sheets (412) in the first row to the N / 2th row is electrically connected to an external circuit via a third electrode line (12), and each of the lower electrode sheets (412) in the N / 2+1th row to the Nth row is electrically connected to an external circuit via a fourth electrode line (13).

4. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 3, characterized in that: Each of the first electrode lines (10) is extended toward one side of the upper piezoelectric layer (2), and each of the second electrode lines (11) is extended toward the other side of the upper piezoelectric layer (2); each of the third electrode lines (12) is extended toward one side of the lower piezoelectric layer (4), and each of the fourth electrode lines (13) is extended toward the other side of the lower piezoelectric layer (4).

5. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1, 2 or 4, characterized in that: The upper insulating layer (1), the middle insulating layer (3) and the lower insulating layer (5) are all made of pi film.

6. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1, 2 or 4, characterized in that: Each of the upper piezoelectric material layers (212) and each of the lower piezoelectric material layers (411) are made by 3D printing.

7. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1, 2 or 4, characterized in that: Each of the upper electrode sheets (211) and each of the lower electrode sheets (412) are made by 3D printing.

8. The 3D printing-based crosstalk-resistant layered array flexible sensor according to claim 1, 2 or 4, characterized in that: Each of the upper electrode components (21) and each of the lower piezoelectric components (41) is a cylindrical structure.

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