Immersed phase change liquid cooling characterization device

Abstract

The utility model discloses an immersed phase change liquid cooling characterization device, which comprises a boiling pool, the inside of the boiling pool is used for accommodating a liquid working medium, a metal back plate on one side of the boiling pool is provided with a test sample mounting port and ensures that a boiling heat exchange surface of a test sample is vertically oriented, and the periphery of the test sample is provided with a turbulent flow prevention frame; the boiling pool integrates a temperature control unit and a cooling unit, the temperature control unit is used for liquid working medium temperature control, and the cooling unit is used for steam condensation and working medium liquid level constancy; the analog chip heat source is composed of a copper heat conduction module and a heat insulation packaging module and is arranged on one side of the boiling pool, and the analog chip heat source, the thermal interface and the test sample piece are mechanically connected with a metal fixing frame on the outer side of the boiling pool through a metal push plate and a long-strip screw. According to the utility model, by comprehensively adopting measures such as the limiting support frame, the anti-turbulent flow frame and the aerogel coating heat insulation, the data reproducibility is good when the immersed phase change liquid cooling performance test is carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of boiling heat transfer testing, in particular to an immersion type phase change liquid cooling characterization device. Background Art

[0002] In recent years, the rapid development of digital economy such as 5G, big data, artificial intelligence, and the Internet of Everything has put forward higher and higher requirements for the construction and computing power of my country's data centers. The development and system integration of high-power chips have posed huge challenges to the heat dissipation of high heat flux in confined spaces. Compared with traditional air cooling, liquid cooling technology has become the standard for new data centers due to its advantages such as high cooling efficiency, low energy consumption, and low noise. Data centers have officially entered the "liquid cooling era". It is reported that the power usage efficiency PUE (Power Usage Effectiveness) of traditional air cooling is mostly above 1.5, the PUE of cold plate liquid cooling can be less than 1.2, and the PUE of immersion phase change liquid cooling can be as low as 1.04. Immersion phase change liquid cooling has attracted great attention from academia and industry due to its excellent energy-saving and consumption-reducing capabilities. Immersion phase change liquid cooling is achieved by directly immersing the chip or the chip with a metal heat sink in an electrically insulating fluoride liquid. The fluoride liquid undergoes a violent liquid-vapor phase change on the surface of the chip or the surface of the metal heat sink, thereby taking away the heat and achieving efficient cooling of the chip.

[0003] With the development and application of high-power electronic chips, how to design and develop copper-based immersion phase change liquid cooling radiators with better performance has become a technical problem that needs to be solved urgently. However, there is no commercial characterization device to support the performance evaluation of immersion phase change liquid cooling radiators. So far, the self-developed devices used for immersion phase change liquid cooling (fluorinated liquid pool boiling heat transfer) research in existing literature can almost only support the horizontal orientation of the phase change heat transfer surface of the test sample, which is inconsistent with the actual application scenario of immersion phase change liquid cooling in data centers. In principle, the difference between the horizontal and vertical orientations of the phase change heat transfer surface of the radiator sample will inevitably lead to differences in the boiling bubble mass transfer and heat transfer process of the heat exchange surface, which will inevitably affect the reliability of the performance test of the immersion phase change liquid cooling radiator. It should also be pointed out that in actual application scenarios, the chip heat source is usually connected to the metal heat sink using thermal interfaces such as thermal grease and indium sheets, while the literature will directly connect the simulated chip heat source to the metal heat sink by welding or in-situ process the micro-nano structure on the surface of the simulated chip heat source to study how to enhance the boiling heat transfer performance, which is obviously inconsistent with the actual application scenario. If you want to do your work well, you must first sharpen your tools. Therefore, in order to develop commercial immersion phase change liquid cooling radiators, it is necessary to design and develop immersion phase change liquid cooling characterization devices that meet actual application scenarios. Utility Model Content

[0004] The main purpose of the utility model is to provide an immersion-type phase-change liquid-cooling characterization device to overcome the deficiencies in the prior art.

[0005] To achieve the foregoing utility model objectives, the technical solutions adopted by the present utility model include:

[0006] An embodiment of the present utility model provides an immersion phase change liquid cooling characterization device, comprising:

[0007] A boiling pool, inside which there is a square test chamber for accommodating a liquid working medium. One side of the square test chamber is provided with a test sample mounting port located on a metal backplane for mounting a radiator sample and ensuring that the phase change heat transfer surface of the radiator sample is vertically oriented. The metal backplane is disposed opposite to a square glass viewing window. The metal backplane and the square glass viewing window are detachably connected, and other components forming the test chamber are integrally formed. A metal fixing frame is installed outside the metal backplane, and the metal fixing frame has a plurality of screw holes for mechanically and tightly fitting a simulated chip heat source, a thermal interface, and the radiator sample. The square test chamber is integrated with a temperature control unit for heating the liquid working medium. The top of the boiling pool is integrated with a circulating constant temperature water bath for steam condensation and maintaining a constant liquid level in the boiling pool.

[0008] The simulated chip heat source includes a copper heat conduction module and a heat insulation encapsulation module; the simulated chip heat source is arranged outside the installation opening of the boiling pool test specimen; at the end of the copper heat conduction module away from the boiling pool, a first heat insulation block is installed, and after a second heat insulation block and a third heat insulation block are sequentially installed on the part facing the boiling pool, it is arranged on an I-shaped support frame; the simulated chip heat source, the thermal interface, and the radiator specimen are mechanically connected to the metal fixing frame outside the boiling pool through the metal push plate on the outermost side of the first heat insulation block and the long strip screw; the copper heat conduction module is sequentially provided with a first heat conduction block and a second heat conduction block in the direction towards the boiling pool, and the first heat conduction block and the second heat conduction block are integrally arranged or separately arranged; multiple electric heating rods are embedded at the end of the first heat conduction block away from the boiling pool; the second heat conduction block is provided with a plurality of equally spaced jacks located at the axial center in the direction adjacent to the boiling pool, and the jacks are used for installing thermocouples, and the thermocouples are connected to a data collector for real-time monitoring of the temperature inside the simulated chip heat source; the end face of the second heat conduction block on the side facing the installation opening of the test specimen is the surface of the simulated chip heat source, and is connected to the back of the base of the radiator specimen through the thermal interface; the heat insulation encapsulation module includes the first heat insulation block, the second heat insulation block, and the third heat insulation block; the first heat insulation block is provided with an electrical connection hole, and the wires of the electric heating rods pass through the electrical connection hole and are connected to a DC power supply; both the second heat insulation block and the third heat insulation block are of hollow structures; the first heat conduction block is installed inside the second heat insulation block; the second heat conduction block is installed inside the third heat insulation block to ensure that the heat flow inside the second heat conduction block follows the one-dimensional heat conduction principle; the third heat insulation block is provided with a jack corresponding to the thermocouple jack of the second heat conduction block; on the side of the third heat insulation block adjacent to the installation opening of the test specimen, a first step structure is provided, and the first step structure is used to embed the third heat insulation block into the installation opening of the test specimen on the metal back plate of the boiling pool; an annular hollow inner groove is provided on the end face of the first step structure adjacent to the boiling pool for placing the base of the radiator specimen.

[0009] Compared with the prior art, the advantages of the present utility model include:

[0010] The immersion phase change liquid cooling characterization device provided by the embodiment of the present utility model adopts a modular design, with a simple and reasonable structure, convenient assembly, and low cost;

[0011] The simulated chip heat source in the immersion phase change liquid cooling characterization device provided by the embodiment of the present utility model is integrated outside the boiling pool and horizontally oriented for installation. It is not only connected to the radiator specimen through the thermal interface, but also ensures that the boiling heat transfer surface of the radiator test specimen is vertically oriented, which is in line with the actual application scenario;

[0012] The immersion - type phase - change liquid - cooling characterization device provided by the embodiment of the present utility model comprehensively adopts measures such as anti - turbulence frames, multiple heat - insulation blocks, limit support frames, and aerogel - coating heat insulation, which not only ensure that the heat flow inside the second heat - conducting block of the simulated chip heat source follows one - dimensional steady - state heat conduction, but also ensure good reproducibility of the test data of the radiator's immersion - type phase - change liquid - cooling performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 It is a schematic diagram of the overall structure of an immersion - type phase - change liquid - cooling characterization device provided in a typical embodiment of the present utility model;

[0015] Figure 2 It is a schematic diagram of the external structure of the assembly of the simulated chip heat source and the boiling pool in a typical embodiment of the present utility model;

[0016] Figure 3 It is a schematic cross - sectional structure diagram of the assembly of the simulated chip heat source and the boiling pool in a typical embodiment of the present utility model

[0017] Figure 4 It is a schematic cross - sectional structure diagram of a simulated chip heat source provided in a typical embodiment of the present utility model;

[0018] Figure 5 It is evidence that the heat flow inside the simulated chip heat source follows one - dimensional steady - state heat conduction in a typical embodiment of the present utility model;

[0019] Figure 6 It is the boiling heat - transfer curve of the radiator sample in a typical embodiment of the present utility model. DETAILED IMPLEMENTATION MANNER

[0020] In view of the deficiencies in the prior art, the inventor of this case, through long - term research and a large number of practices, has proposed the technical solution of the present utility model. The following will further explain the technical solution, its implementation process, principle, etc.

[0021] The embodiment of the present utility model provides an immersion - type phase - change liquid - cooling characterization device, including:

[0022] Boiling pool, inside which there is a square test chamber for accommodating a liquid working medium. One side of the square test chamber is provided with a test specimen mounting opening located on a metal backplane for mounting a radiator specimen and ensuring that the phase change heat transfer surface of the radiator specimen is vertically oriented. The metal backplane is arranged opposite to a square glass viewing window. The metal backplane and the square glass viewing window are detachably connected, and other components forming the test chamber are integrally formed. A metal fixing frame is installed outside the metal backplane, and the metal fixing frame has a plurality of screw holes for mechanically tightly fitting a simulated chip heat source, a thermal interface, and the radiator specimen. The square test chamber is integrated with a temperature control unit for heating the liquid working medium. The top of the boiling pool is integrated with a circulating constant temperature water bath for steam condensation and maintaining a constant liquid level in the boiling pool.

[0023] The simulated chip heat source includes a copper heat conduction module and a heat insulation encapsulation module; the simulated chip heat source is arranged outside the installation opening of the boiling pool test specimen; at the end of the copper heat conduction module away from the boiling pool, a first heat insulation block is installed, and after a second heat insulation block and a third heat insulation block are successively installed on the part facing the boiling pool, it is arranged on an I-shaped support frame; the simulated chip heat source, the thermal interface, and the radiator specimen are mechanically connected to the metal fixing frame outside the boiling pool through the metal push plate on the outermost side of the first heat insulation block and the long strip screw; the copper heat conduction module is successively provided with a first heat conduction block and a second heat conduction block in the direction towards the boiling pool, and the first heat conduction block and the second heat conduction block are integrally arranged or separately arranged; multiple electric heating rods are embedded at the end of the first heat conduction block away from the boiling pool; the second heat conduction block is provided with a plurality of equally spaced jacks located at the axial center in the direction adjacent to the boiling pool, and the jacks are used for installing thermocouples, and the thermocouples are connected to a data collector for real-time monitoring of the temperature inside the simulated chip heat source; the end face of the second heat conduction block on the side facing the test specimen installation opening is the surface of the simulated chip heat source, and is connected to the back of the base of the radiator specimen through the thermal interface; the heat insulation encapsulation module includes the first heat insulation block, the second heat insulation block, and the third heat insulation block; the first heat insulation block is provided with an electrical connection hole, and the wires of the electric heating rods pass through the electrical connection hole and are connected to a DC power supply; both the second heat insulation block and the third heat insulation block are of a hollow structure; the first heat conduction block is installed inside the second heat insulation block; the second heat conduction block is installed inside the third heat insulation block to ensure that the heat flow inside the second heat conduction block follows the one-dimensional heat conduction principle; the third heat insulation block is provided with a jack corresponding to the thermocouple jack of the second heat conduction block; on one side of the third heat insulation block adjacent to the test specimen installation opening, there is a first stepped structure, and the first stepped structure is used to embed the third heat insulation block into the test specimen installation opening on the metal back plate of the boiling pool; an annular hollow inner groove is provided on the end face of the first stepped structure adjacent to the boiling pool for placing the base of the radiator specimen.

[0024] Further, a Teflon coating is provided on the surface of the metal components of the boiling pool to reduce heat loss.

[0025] Further, at least one of the outer surface of the second heat insulation block, the outer surface of the third heat insulation block, and the outer metal surface constituting the boiling pool is coated with an aerogel coating to reduce heat loss.

[0026] Further, anti-turbulence frames are installed around the test specimens inside the square test chamber to prevent the random startup of the heating rods of the temperature control unit in the boiling pool during the test from causing uncontrollable turbulence of the liquid working medium and affecting the boiling mass transfer and heat transfer on the surface of the specimens.

[0027] Further, the flatness of the surface of the heat source of the analog chip is ≤ 0.3 mm to reduce the interfacial thermal resistance of the analog chip heat source / thermal interface / heatsink sample.

[0028] Further, the flatness of the back surface of the base of the heatsink sample is ≤ 0.3 mm to reduce the interfacial thermal resistance of the analog chip heat source / thermal interface / heatsink sample.

[0029] Further, the third heat insulation block is disposed on the limiting support frame at the outer part of the test sample mounting opening, so that the central axes of the heatsink sample, the second heat conducting block, and the first heat conducting block are on the same straight line, to avoid warping deformation of the first step structure and its hollow inner groove on the side of the third heat insulation block adjacent to the test sample mounting opening, thereby reducing the interfacial thermal resistance of the analog chip heat source / thermal interface / heatsink sample.

[0030] Further, the immersion phase change liquid cooling characterization device further includes a liquid working medium cooling and recycling unit, and the liquid working medium cooling and recycling unit is connected to the boiling pool for quickly cooling and recycling the liquid working medium.

[0031] The technical solution, its implementation process and principle, etc. will be further explained below in conjunction with the drawings and specific implementation cases. Unless otherwise specified, the functional mechanisms involved in the following embodiments are known to those skilled in the art, and they can all be obtained through commercial purchase or known processes.

[0032] Embodiment

[0033] Please refer to Figure 1 , an immersion phase change liquid cooling characterization device, including: a boiling pool 100, an analog chip heat source 200, a condensation unit 300, a data acquisition unit 400, an auxiliary heating rod 510 of the temperature control unit, a thermocouple 520 of the temperature control unit, an image acquisition unit 600, a power supply 700, and a heatsink sample 800.

[0034] In this embodiment, the boiling pool 100 includes a housing 110 and a square test chamber 120 formed by enclosing the housing 110. The square test chamber is used to accommodate electronic fluorinated liquid (i.e., the aforementioned liquid working medium, for example, FCM-47). Please refer to Figure 2 and Figure 3 , the housing 110 mainly includes a stainless steel circular interface 111, a stainless steel back plate 112, and a square glass viewing window 113; an aluminum fixing frame 114 is installed outside the stainless steel back plate 112, and the aluminum fixing frame 114 has a plurality of screw holes for mechanically fitting the analog chip heat source 200, the thermal interface 250, and the heatsink sample 800; a test sample mounting opening 130 is opened in the area of the stainless steel back plate 112 near the lower side; the condenser 310 is integrated on the top of the stainless steel circular interface 111;

[0035] In this embodiment, the stainless-steel circular interface 111, the stainless-steel back plate 112, the square glass viewing window 113, etc. that make up the housing 110 need to ensure a sealed connection with each other.

[0036] In this embodiment, the radiator sample 800 to be tested is fixed at the test sample mounting port 130. The phase change heat transfer surface of the radiator sample 800 is arranged in the square test chamber 120 and immersed in the liquid working medium. The phase change heat transfer surface of the radiator sample 800 is vertically oriented. The base of the radiator sample 800 is arranged outside the square test chamber 120. The simulated chip heat source 200 is arranged along the first direction on one side of the boiling pool 100. The simulated chip heat source 200 can be connected to the base of the radiator sample 800 mounted on the housing 110 through the thermal interface 250 to heat the radiator sample 800. The condensing unit 300 includes a condenser 310 and a circulating constant-temperature water bath 320. The condenser 310 and the circulating constant-temperature water bath 320 are connected. The condenser 310 is mounted on the stainless-steel circular interface 111 and arranged along the second direction on the top of the boiling pool 100. The cooling unit 300 is used to condense the steam in the square test chamber 120 to keep the liquid level of the working medium constant. The data acquisition unit 400 includes three thermocouples, and all three thermocouples are arranged inside the simulated chip heat source 200 to monitor the temperature of the simulated chip heat source 200. The auxiliary heating rod 510 of the temperature control unit and the thermocouple 520 of the temperature control unit are arranged in the square test chamber 120. The image acquisition unit 600 is used to collect the boiling bubble dynamics on the surface of the radiator sample 800 in the square test chamber 120. The liquid working medium cooling and recovery unit is connected to the boiling pool 100 and is used to quickly cool and recover the liquid working medium in the boiling pool 100.

[0037] It should be noted that the first direction and the second direction are perpendicular to each other. When the immersion type phase change liquid cooling characterization device is in the working state, the second direction is the gravity direction, and the phase change heat transfer surface of the radiator sample 800 is vertically oriented in the square test chamber.

[0038] In this embodiment, as Figure 2 shown, a rectangular through hole is also provided in the edge area of one side of the housing of the boiling pool to correspond to the first two thermocouple jacks of the simulated chip heat source 200 for T 1 and T 2 monitoring; a φ7mm through hole is drilled in the side wall of the aluminum fixed frame 114 adjacent to the rectangular through hole to correspond to the third thermocouple jack of the simulated chip heat source 200 for T 3 monitoring.

[0039] In this embodiment, to reduce the heat loss of the liquid working medium in the boiling pool, the stainless-steel backplate 112 includes a first Teflon coating, a stainless-steel plate, a second Teflon coating, and an aerogel layer that are sequentially arranged in the direction away from the square test chamber. The thicknesses of the first Teflon coating and the second Teflon coating are generally 0.3 mm, and the thickness of the aerogel layer can be 3 mm.

[0040] In this embodiment, due to the inevitable heat leakage of the stainless-steel frame and the square glass viewing window of the boiling pool, the auxiliary heating rod 510 of the temperature control unit will randomly start during the test and bring uncontrollable turbulence to the liquid working medium, which will inevitably have an uncontrollable impact on the mass transfer and heat transfer processes on the surface of the radiator sample 800. To avoid this negative impact and ensure the reproducibility of the test data, it is necessary to set a stainless-steel anti-turbulence frame 140 around the radiator sample 800.

[0041] In this embodiment, on the side of the stainless-steel backplate 112 facing away from the square test chamber 120, a first stepped structure for assembling the simulated chip heat source 200 is also provided, and the first stepped structure surrounds the test sample mounting opening 130.

[0042] In this embodiment, the design of the test sample mounting opening 130 and the stepped structure that cooperates with it is based on the following considerations: ① The opening size of the test sample mounting opening 130 should be slightly larger than the phase change heat transfer surface area of the radiator sample 800 (for example, 30 mm × 30 mm) for easy installation. Exemplarily, the size of the test sample mounting opening 130 is 31 mm × 31 mm; ② The lower edge of the test sample mounting opening 130 is at a certain height (25 mm) from the bottom of the boiling pool to facilitate the installation of the anti-turbulence frame 140; ③ The designed thickness of the inner four sides of the test sample mounting opening 130 is 3 mm. A thinner thickness is prone to bending and deformation, resulting in liquid leakage or poor reproducibility of test data; a thicker thickness will inevitably increase the accumulation of boiling bubbles on the upper edge inside the test sample mounting opening 130; ④ The designed opening size on the outside of the test sample mounting opening 130 is the same as the size of the third heat insulation block of the simulated chip heat source 200 (the former has a positive tolerance and the latter has a negative tolerance) to ensure that the central axes of the test sample mounting opening 130, the radiator sample 800, and the simulated chip heat source 200 are on the same straight line.

[0043] Please refer to Figure 4 In this embodiment, to ensure the coincidence of the central axis positions of the simulated chip heat source 200 and the radiator sample 800, a limit support frame 150 is also provided on the aluminum fixing frame 114, and the third heat insulation block 213 is arranged on the limit support frame 150. Exemplarily, the limit support frame 150 can be a U-shaped limit support frame or the like.

[0044] In this embodiment, the simulated chip heat source 200 includes a first heat insulation block 211, a second heat insulation block 212, a third heat insulation block 213, a first heat conduction block 221, a second heat conduction block 222, four electric heating rods, and a stainless steel cover plate 230. The second heat insulation block 212 is disposed between the first heat insulation block 211 and the third heat insulation block 213 along a selected direction. The first heat conduction block 221 and the second heat conduction block 222 are sequentially disposed along the selected direction. The first heat conduction block 221 and the second heat conduction block 222 are of an integral structure. The stainless steel cover plate 230 is fixedly connected to the first heat conduction block 221. The four electric heating rods are fixed between the stainless steel cover plate 230 and the first heat conduction block 221, and the four electric heating rods are in close contact with the first heat conduction block 221. The first heat insulation block 211, the second heat insulation block 212, and the third heat insulation block 213 are all hollow. The stainless steel cover plate 230, the first heat conduction block 221, and the four electric heating rods are integrally embedded inside the second heat insulation block 212. The second heat conduction block 222 is embedded inside the third heat insulation block 213 to ensure that the heat flow inside the second heat conduction block 222 follows the one-dimensional heat conduction principle, and its heat flux density and surface temperature can be adjusted by the heating power of the power supply 700. The specific values can be obtained by calculating the temperatures T 1 , T 2 and T 3 monitored in real time by equally spaced thermocouples; One end of the third heat insulation block 213 is provided with an assembly port. The selected end face of the second heat conduction block 222 facing away from the first heat conduction block 221 is exposed inside the assembly port. The assembly port is matched with the base of the radiator sample 800. The selected end face of the second heat conduction block 222 can be connected to the base of the radiator sample 800 provided at the assembly port with a thermal interface material. The electrical connection wires 241 of the four electric heating rods pass through the first heat insulation block 211 and are led out. The electrical connection wires 241 of the four electric heating rods are used to connect to the power supply 700.

[0045] Specifically, the third heat insulation block 213 and the second heat conduction block 222 inside it are also provided with thermocouple jacks for installing thermocouples, and the thermocouple jacks on the third heat insulation block 213 and the second heat conduction block 222 are in one-to-one correspondence. In this embodiment, by way of example, the first heat insulation block 211 may be a titanium alloy heat insulation block, the second heat insulation block 212 may be a cement fiber heat insulation block, and the third heat insulation block 213 may be a polyether ether ketone heat insulation block. Both the first heat conduction block 221 and the second heat conduction block 222 are copper blocks.

[0046] In this embodiment, to reduce the interfacial thermal resistance between the second heat conduction block 222 of the simulated chip heat source 200 and the back surface of the radiator sample 800, the flatness of the selected end face of the second heat conduction block 222 is ≤0.02 mm. In this embodiment, a thermal grease coating 250 is further provided on the selected end face, and the thermal grease coating 250 is in contact with the base of the radiator sample 800.

[0047] In this embodiment, a first stepped structure is provided on one side of the third heat insulation block 213 adjacent to the test sample mounting opening 130, and the first stepped structure is used to embed the third heat insulation block 213 into the test sample mounting opening 130; an annular hollow inner groove is provided on the end face of the first stepped structure adjacent to the boiling pool for placing the base of the radiator sample 800.

[0048] In this embodiment, a groove-like structure is further provided on the stainless steel cover plate 230 and / or the first heat conducting block 221, and four heating rods are embedded in the groove-like structure.

[0049] In this embodiment, the first heat conducting block 221, four heating rods, the first heat insulation block 211, the second heat insulation block 212, and the stainless steel cover plate 230 as a whole serve as an electric heating functional structure, and the third heat insulation block 213 and the second heat conducting block 222 inside it serve as a functional structure for providing an actual heat load. Exemplarily, the stainless steel cover plate 230 may include two cover plates, and the two cover plates are respectively arranged on both sides of the first heat conducting block 221 and fixedly connected to the first heat conducting block 221.

[0050] In this embodiment, the structures of the condenser 310 and the circulating constant temperature water bath 320 included in the condensation unit 300 and its working principle, etc. are all known to those skilled in the art. The thermocouples, the auxiliary heating rod 510 of the temperature control unit, the thermocouple 520 of the temperature control unit, etc. included in the data acquisition unit 400 are also known to those skilled in the art, and will not be elaborated here.

[0051] In this embodiment, the image acquisition unit 600 may include a CCD camera, etc. The image acquisition unit 600 and the data acquisition unit 400 may be connected to a computer with an image and data acquisition and processing system. In this embodiment, the power supply 700 may be a DC power supply, etc. In this embodiment, the liquid working medium cooling and recovery unit may include a collection container, a peristaltic pump, etc. The collection container and the boiling pool are connected by a pipeline and the liquid working medium is exported by a peristaltic pump.

[0052] In this embodiment, the radiator sample 800 is a copper bare board, with its length, width and thickness being 38 mm, 38 mm and 2 mm respectively. The areas of the phase change heat transfer surface and the surface of the simulated chip heat source are both 30 mm × 30 mm, and an atmospheric pressure saturated pool boiling test is carried out using the FCM-47 fluorinated liquid, as Figure 5 shown. The three tests all prove that the internal heat flow in the simulated chip heat source 200 follows one-dimensional steady-state heat conduction; as Figure 6 shown, the three boiling heat transfer curves of the radiator sample 800 have good reproducibility.

[0053] It should be understood that the above embodiments are only used to illustrate the technical concept and features of the present utility model. The purpose is to enable those skilled in the art to understand the content of the present utility model and implement it accordingly, and it should not be used to limit the protection scope of the present utility model. Any equivalent changes or modifications made according to the spirit of the present utility model should be covered within the protection scope of the present utility model.

Claims

1. An immersion phase change liquid cooling characterization device, characterized in that: include: A boiling pool, wherein a square test chamber is provided inside the boiling pool, wherein the square test chamber is used to accommodate liquid working fluid, a test sample installation port is provided on one side of the square test chamber, wherein the test sample installation port is located on a metal back plate, and is used to install a radiator sample and ensure that the phase change heat transfer surface of the radiator sample is vertically oriented; the metal back plate is arranged opposite to a square glass visual window; the metal back plate and the square glass visual window are detachably connected, and the other components constituting the test chamber are integrally formed; a metal fixing frame is installed on the outer side of the metal back plate, and the metal fixing frame has a plurality of screw holes, which are used to mechanically fit the heat source, thermal interface and the radiator sample of the simulation chip; the square test chamber is integrated with a temperature control unit for heating the liquid working fluid; a circulating constant temperature water bath is integrated on the top of the boiling pool for steam condensation and maintaining a constant liquid level in the boiling pool; The simulated chip heat source includes a copper heat conduction module and a heat insulation packaging module; the simulated chip heat source is arranged on the outside of the boiling pool test sample installation port; the copper heat conduction module is installed with a first insulation block at the end away from the boiling pool, and the second insulation block and the third insulation block are installed in sequence on the part facing the boiling pool and then arranged on an I-shaped support frame; the simulated chip heat source, the thermal interface and the heat sink sample are mechanically connected to the metal fixing frame on the outside of the boiling pool through the outermost metal push plate and the long screw of the first insulation block; the copper heat conduction module is sequentially provided with a first heat conduction block and a second heat conduction block toward the boiling pool, and the first heat conduction block and the second heat conduction block are integrally arranged or separately arranged; a plurality of electric heating rods are embedded in the end of the first heat conduction block away from the boiling pool; the second heat conduction block is adjacent to the boiling pool and is provided with a plurality of equally spaced sockets located in the axial center, the sockets are used to install thermocouples, and the thermocouples are connected to a data collector for real-time monitoring of the temperature inside the simulated chip heat source; the second heat conduction block is directed toward The end surface on the side of the test sample installation port is the surface of the simulated chip heat source, and is connected to the back of the heat sink sample base through the thermal interface; the thermal insulation packaging module includes the first thermal insulation block, the second thermal insulation block and the third thermal insulation block; the first thermal insulation block is provided with an electrical connection hole, and the wire of the electric heating rod passes through the electrical connection hole to connect with the DC power supply; the second thermal insulation block and the third thermal insulation block are both hollow structures; the first thermal conductive block is installed in the second thermal insulation block; the second thermal conductive block is installed in the third thermal insulation block to ensure that the heat flow inside the second thermal conductive block follows the one-dimensional heat conduction principle; the third thermal insulation block is provided with a socket corresponding to the thermocouple socket of the second thermal conductive block; the third thermal insulation block is provided with a first step structure on the side adjacent to the test sample installation port, and the first step structure is used to embed the third thermal insulation block into the test sample installation port on the metal back plate of the boiling pool; the first step structure is provided with an annular hollow inner groove on the end surface adjacent to the boiling pool for placing the base of the heat sink sample.

2. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: The metal surface constituting the test chamber is provided with a Teflon coating.

3. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: At least one of the outer surface of the second insulation block, the outer surface of the third insulation block, and the metal outer surface constituting the boiling pool is coated with an aerogel coating.

4. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: Anti-turbine frames are installed around the test sample in the square test chamber.

5. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: The flatness of the simulated chip heat source surface is ≤0.3 mm.

6. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: The flatness of the back side of the base of the radiator sample is ≤0.3mm.

7. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: The outer portion of the third heat insulating block located at the test sample installation opening is arranged on a limiting support frame so that the central axes of the heat sink sample, the second heat conductive block and the first heat conductive block are on the same straight line.

8. The immersion phase change liquid cooling characterization device according to claim 1, characterized in that: It also includes a liquid working medium cooling and recovery unit, which is connected to the boiling pool and is used to quickly cool and recover the liquid working medium.

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