Sublimate detection device

Abstract

The utility model discloses a sublimate detection device which is characterized in that a silicon wafer to be detected is fixed by utilizing a first mounting table, a sublimate collection component is fixed by utilizing a second mounting table, and the first mounting table and the second mounting table are detachably arranged. The second mounting table for fixing the sublimate collecting assembly is arranged above the first mounting table for fixing the silicon wafer to be detected, when the silicon wafer to be detected is heated and arranged above the second mounting table, the sublimate is condensed on the sublimate collecting assembly and can be used for further detection and analysis, and the device is simple in structure, reasonable in design and capable of effectively achieving sublimate detection.

Description

Technical Field

[0001] The utility model belongs to the technical field of photoresist performance detection and relates to a sublimation detection device. Background Art

[0002] The crucial role of photoresist in microfabrication of microelectronics technology is indeed inseparable from the development of large-scale and very large-scale integrated circuits. As a photosensitive material, also known as photoresist, its solubility changes under the irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc., so as to realize the transfer of patterns from the mask to the substrate to be processed. This property makes photoresist crucial in microelectronics manufacturing, especially in the process of manufacturing semiconductor circuits of chips. The sublimates during the baking of photoresist condensing on the substrate or the fork sensor will bring a series of problems, such as poor quality, malfunction of the exhaust switch, and even abnormal downtime may occur. These problems undoubtedly pose higher monitoring requirements for the enterprises using photoresist. Therefore, enterprises using photoresist have very strict monitoring of sublimates. To monitor sublimates, it is necessary to master the performance of sublimates.

[0003] Currently, the devices for sublimation detection mainly include a sublimation quadrupole instrument, a sublimation microscope, and a thermogravimetric analyzer. Among them, the sublimation quadrupole instrument is a key instrument commonly used in sublimation experiments, mainly used to test parameters such as the sublimation temperature range and sublimation rate of materials at different temperatures. When in use, the sample to be tested needs to be placed on the sample platform, and the sample is heated to a certain temperature through the heating system, then the sublimation situation of the sample is observed under high vacuum conditions, and relevant data is recorded. The sublimation microscope is used to observe the morphological and structural changes of the sample during the sublimation process. The sample to be tested is placed on the sample holder, and the microscope is aligned with the sample for observation. At the same time, the sample needs to be heated to a certain temperature to observe and record the morphological and structural changes of the sample during the sublimation process. The thermogravimetric analyzer can test parameters such as the weight loss of the sample during the sublimation process and the weight change before and after sublimation. The sample is placed in the sample pan and heated to a certain temperature through the heating system, and the weight loss and weight change of the sample are measured under a high vacuum environment. Although the current methods can all evaluate the thermal stability of the object to be tested to a certain extent, the operations are all complex, the equipment is all relatively expensive, the structures are also relatively complex, and even professional operators are required, which severely limits their applications. Summary of the Utility Model

[0004] Aiming at the problems existing in the prior art, the utility model provides a sublimation detection device, thereby solving the technical problem that the sublimates of photoresist cannot be effectively detected in the prior art.

[0005] The utility model is realized through the following technical solutions:

[0006] A sublimation detection device includes a first mounting table and a second mounting table detachably connected to the first mounting table;

[0007] A first mounting position is provided on the first mounting table, and the first mounting position is detachably cooperated with the silicon wafer to be tested;

[0008] A sublimation collection assembly is provided on the second mounting table.

[0009] Preferably, the first mounting position includes a first mounting groove and a second mounting groove, and a first limiting shoulder is provided between the first mounting groove and the second mounting groove.

[0010] Preferably, a chamfer is provided at the edge of the first mounting groove.

[0011] Preferably, the first mounting groove is in clearance fit with the silicon wafer to be tested.

[0012] Preferably, a second mounting position is provided on the second mounting table, and the sublimation collection assembly is in clearance fit with the second mounting position.

[0013] Preferably, the second mounting position includes a third mounting groove and a fourth mounting groove, and a second limiting shoulder is provided between the third mounting groove and the fourth mounting groove.

[0014] Preferably, the third mounting groove is in clearance fit with the sublimation collection assembly.

[0015] Preferably, a plurality of connecting members are provided between the first mounting table and the second mounting table, and the plurality of connecting members are detachably provided with the first mounting table and the second mounting table.

[0016] Preferably, the connecting member is threadedly connected to the first mounting table, and the connecting member is snap-fitted with the second mounting table.

[0017] Preferably, the vertical distance between the first mounting table and the second mounting table is 10 mm to 30 mm.

[0018] Compared with the prior art, the present utility model has the following beneficial technical effects:

[0019] The present utility model discloses a sublimation detection device, which uses the first mounting table to fix the silicon wafer to be tested, and uses the second mounting table to fix the sublimation collection assembly. In addition, the first mounting table and the second mounting table are detachably arranged. During use, the second mounting table for fixing the sublimation collection assembly is arranged above the first mounting table for fixing the silicon wafer to be tested. When the silicon wafer to be tested is heated, when it is arranged above it, the sublimated substance condenses on the sublimation collection assembly and can be used for further detection and analysis. The device has a simple structure and a reasonable design, and can effectively realize the detection of sublimated substances.

[0020] Further, the first mounting position includes a first mounting groove and a second mounting groove, and a first limiting shoulder is provided between the first mounting groove and the second mounting groove. The setting of the first limiting shoulder facilitates the placement and fixation of the silicon wafer to be tested.

[0021] Further, a chamfer is provided at the edge of the first mounting groove, which facilitates the installation and disassembly of the silicon wafer to be tested.

[0022] Further, the first mounting groove is in clearance fit with the silicon wafer to be tested, which facilitates the installation and disassembly of the silicon wafer to be tested.

[0023] Further, a second mounting position is provided on the second mounting table, and the sublimation product collection assembly is in clearance fit with the second mounting position, which facilitates the installation and disassembly of the sublimation product collection assembly.

[0024] Further, the second mounting position includes a third mounting groove and a fourth mounting groove, and a second limiting shoulder is provided between the third mounting groove and the fourth mounting groove. The setting of the second limiting shoulder facilitates the installation and fixation of the sublimation product collection assembly.

[0025] Further, the third mounting groove is in clearance fit with the sublimation product collection assembly, which facilitates the installation and disassembly of the sublimation product collection assembly.

[0026] Further, the connecting member is threadedly connected to the first mounting table, and the connecting member is snap-connected to the second mounting table, making the disassembly of the first mounting table and the second mounting table more convenient.

[0027] Further, the vertical distance between the first mounting table and the second mounting table is 10 mm to 30 mm, which can make the test data more conform to the actual working conditions and the test results more representative. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is the front view of a sublimation product detection device in the present invention;

[0030] Figure 2 It is the side view of a sublimation product detection device in the present invention;

[0031] Figure 3 It is the top view of the first mounting table in the present invention;

[0032] Figure 4 It is the side view of the first mounting table in the present utility model;

[0033] Figure 5 It is the side view of the second mounting table in the present utility model;

[0034] Figure 6 It is the side view of the second mounting table in the present utility model.

[0035] Wherein: 1. First mounting table, 2. Second mounting table, 11. First mounting position, 21. Sublimate collection component, 111. First mounting groove, 112. Second mounting groove, 113. First limiting shoulder, 22. Second mounting position, 221. Third mounting groove, 222. Fourth mounting groove, 223. Second limiting shoulder, 3. Connecting piece. Specific embodiments

[0036] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. Generally, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0038] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0039] In the description of the embodiments of the present utility model, it should be noted that if terms such as "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this utility model is usually placed during use, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0040] In addition, when the term "horizontal" appears, it does not mean that the component is required to be absolutely horizontal, but it can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure must be completely horizontal, but it can be slightly inclined.

[0041] In the description of the embodiments of the present invention, it should also be noted that unless otherwise clearly specified and limited, when the terms "arranged", "installed", "connected", and "coupled" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0042] The present invention will be further described in detail below with reference to the accompanying drawings:

[0043] Embodiment 1

[0044] As Figures 1 - 2 shown, the present invention discloses a sublimation detection device, including a first mounting table 1 and a second mounting table 2 detachably connected to the first mounting table 1. Among them, the second mounting table 2 is arranged above the first mounting table 1, and a first mounting position 11 is provided on the first mounting table 1, and the first mounting position 11 is detachably cooperated with the silicon wafer to be measured; a sublimation collection component 21 is provided on the second mounting table 2.

[0045] Preferably, as Figure 3 shown, the first mounting position 11 can be circular to match the shape of the silicon wafer to be measured.

[0046] In a preferred embodiment, as Figure 4 shown, the first mounting position 11 includes a first mounting groove 111 and a second mounting groove 112, and a first limiting shoulder 113 is provided between the first mounting groove 111 and the second mounting groove 112. The setting of the first limiting shoulder 113 facilitates the placement and fixation of the silicon wafer to be measured.

[0047] On the other hand, in order to improve the convenience of use, a chamfer is provided at the edge of the first mounting groove 111. The chamfer here refers to the machining process of cutting the edges of the workpiece into a certain inclined plane in mechanical manufacturing. The setting of the chamfer makes the clamping process smoother, reduces the assembly difficulty, helps the smooth transition between parts, and avoids scratches or damages caused by sharp edges during assembly.

[0048] Meanwhile, to facilitate the installation and removal of the silicon wafer to be measured, the first installation groove 111 is in clearance fit with the silicon wafer to be measured, and this clearance fit results in a small, predetermined gap between the first installation groove 111 and the silicon wafer to be measured. The clearance fit can ensure that the silicon wafer to be measured maintains a certain positional accuracy in the installation groove 111. Despite the gap, reasonable design can ensure that the silicon wafer is stably supported in the required position and orientation. Additionally, due to material and temperature changes, objects may undergo thermal expansion. The clearance fit can allow for such minor changes and prevent stress or damage caused by thermal expansion. At the same time, the clearance fit makes it easier to install the silicon wafer into the installation groove and remove it easily when needed. This is particularly important for testing or manufacturing processes that require frequent replacement or adjustment of the silicon wafer. By reducing the direct contact area between the silicon wafer and the installation groove, the clearance fit can reduce wear and friction, thereby extending the service life of the equipment and the silicon wafer. Meanwhile, the clearance fit can reduce the contact between the silicon wafer and the installation groove and lower the risk of contamination. Additionally, the clearance fit can provide sufficient space to achieve fine adjustment of the position or angle of the silicon wafer.

[0049] In a preferred solution, as Figure 5 shown, the second mounting table 2 is provided with a second mounting position 22, and the second mounting position 22 can also be circular to match the installation of the sublimation product collection component 21, so as to keep the shape of the sublimation product collection component 21 consistent with the shape of the silicon wafer to be measured.

[0050] The sublimation product collection component 21 is in clearance fit with the second mounting position 22, which also makes the installation and removal of the sublimation product collection component more convenient. More preferably, as Figure 6 shown, the second mounting position 22 includes a third installation groove 221 and a fourth installation groove 222, and a second limiting shoulder 223 is provided between the third installation groove 221 and the fourth installation groove 222. The limiting shoulder has a good supporting effect and at the same time limits the axial displacement of the object to be supported, playing an effective axial fixing role.

[0051] In another preferred embodiment, the third installation groove 221 is in clearance fit with the sublimation product collection component 21 to facilitate the installation and removal of the sublimation product collection component.

[0052] As Figure 2 shown, a plurality of connecting members 3 are provided between the first mounting table 1 and the second mounting table 2, and the plurality of connecting members 3 are detachably arranged with both the first mounting table 1 and the second mounting table 2. The plurality of connecting members 3 can be small cylinders.

[0053] In a preferred embodiment, the connecting member 3 is threadedly connected to the first mounting table 1, and the connecting member 3 is snap-fitted to the second mounting table 2. When in use, the connecting member 3 can be first fixed to the first mounting table 1 by threading, and then the second mounting table 2 is fixed to the connecting member 3. There can be four connecting members 3, which are symmetrically arranged on the first mounting table 1. The first mounting table 1 and the second mounting table 2 can both be rectangular, and the four connecting members 3 are symmetrically arranged at the four corners of the first mounting table 1 and the second mounting table 2.

[0054] A sublimation detection device in the present utility model, especially a device for testing photoresist sublimation, includes a lower base, i.e., the first mounting table 1, a silicon wafer clamping groove, i.e., the first mounting position 11, an upper base, i.e., the second mounting table 2, a quartz glass clamping groove, i.e., the second mounting position 22, and a support column, i.e., the connecting member 3. That is, the sublimation collection component 21 can be quartz glass.

[0055] Wherein, the vertical distance between the first mounting table 1 and the second mounting table 2 is 10 mm to 30 mm, preferably 20 mm. The above-mentioned first mounting position 11 and second mounting position 22 can respectively place a 4-inch wafer and a 4-inch quartz glass.

[0056] Embodiment 2

[0057] The usage method of the present utility model is to use the above-mentioned device to test photoresist sublimation, including the following steps:

[0058] S1: Place the silicon wafer coated with photoresist or resin as the sample to be tested into the first mounting position 11;

[0059] S2: Place the blank quartz glass wafer into the second mounting position 22;

[0060] S3: Place the device into a vacuum drying oven at a certain temperature for heat treatment. The heat treatment temperature is 130 °C and the time is 130 sec;

[0061] S4: Use a stopwatch to time, and prepare to test the transmittance and whiteness of the quartz glass. The transmittance and whiteness are measured by a transmittance meter and a whiteness tester respectively.

[0062] This method verifies whether there is sublimation during baking by testing the transmittance and whiteness, and verifies the feasibility of photoresist introduction by testing whether sublimation occurs.

[0063] Embodiment 3

[0064] To further illustrate the use of the device of the present utility model, the following embodiments are used for elaboration:

[0065] Prepare two glass slides, one for comparative testing. Then place the silicon wafer coated with photoresist in the first mounting table 1 of this device, place a blank quartz glass slide in the second mounting position 22, and then place the entire device in a vacuum drying oven and bake it at 130 °C for 130 seconds. Then conduct transmittance testing and whiteness testing, and the test results are shown in Table 1 and Table 2 as follows:

[0066] Table 1 Transmittance test results in Example 3

[0067] Transmittance test Blank glass slide Photoresist sample 1 Photoresist sample 2 Visual inspection Colorless and transparent Colorless and transparent Colorless and transparent Transmittance test 92.81％ 92.81％ 92.81％

[0068] Table 2 Whiteness test results in Example 3

[0069]

[0070] Example 4

[0071] To further illustrate the use of the device of the present utility model, the following examples are used for elaboration:

[0072] Prepare two glass slides, one for comparative testing. Then place the silicon wafer coated with resin in the first mounting table 1, place a blank quartz glass slide in the second mounting position 22, and then place the entire device in a vacuum drying oven and bake it at 130 °C for 130 seconds. Then conduct transmittance testing and whiteness testing, and the test results are shown in Table 3 and Table 4 as follows:

[0073] Table 3 Transmittance test results in Example 4

[0074] Transmittance test Blank glass slide Resin sample 1 Resin sample 2 Visual inspection Colorless and transparent Colorless and transparent Colorless and transparent Transmittance test 92.80％ 92.80％ 92.80％

[0075] Table 4 Whiteness test results in Example 4

[0076]

[0077]

[0078] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A sublimation detection device, characterized in that: It comprises a first mounting platform (1), and a second mounting platform (2) detachably connected to the first mounting platform (1); The first mounting platform (1) is provided with a first mounting position (11), and the first mounting position (11) is detachably matched with the silicon wafer to be tested; The second mounting platform (2) is provided with a sublimate collecting assembly (21).

2. A sublimation detection device according to claim 1, characterized in that: The first mounting position (11) comprises a first mounting groove (111) and a second mounting groove (112), and a first limiting shaft shoulder (113) is provided between the first mounting groove (111) and the second mounting groove (112).

3. A sublimation detection device according to claim 2, characterized in that: The edge of the first mounting groove (111) is chamfered.

4. A sublimation detection device according to claim 2, characterized in that: The first mounting groove (111) is clearance-matched with the silicon wafer to be tested.

5. A sublimation detection device according to claim 1, characterized in that: The second mounting platform (2) is provided with a second mounting position (22), and the sublimate collecting assembly (21) is clearance-matched with the second mounting position (22).

6. A sublimation detection device according to claim 5, characterized in that: The second mounting position (22) comprises a third mounting groove (221) and a fourth mounting groove (222), and a second limiting shaft shoulder (223) is provided between the third mounting groove (221) and the fourth mounting groove (222).

7. A sublimation detection device according to claim 6, characterized in that: The third installation groove (221) is clearance-matched with the sublimate collecting assembly (21).

8. A sublimation detection device according to claim 1, characterized in that: A plurality of connecting members (3) are provided between the first mounting platform (1) and the second mounting platform (2); the plurality of connecting members (3) and the first mounting platform (1) and the second mounting platform (2) are all detachable.

9. A sublimation detection device according to claim 8, characterized in that: The connecting piece (3) is threadedly connected to the first mounting platform (1), and the connecting piece (3) is clamped to the second mounting platform (2).

10. A sublimation detection device according to claim 1, characterized in that: The vertical distance between the first mounting platform (1) and the second mounting platform (2) is 10 mm to 30 mm.

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