Automatic carrying platform for wafer point measuring machine

Abstract

The utility model relates to the technical field of automatic carrying tables of wafer point measuring machines, in particular to an automatic carrying table for a wafer point measuring machine, which comprises an electrostatic chuck, a heating device is arranged at the bottom of the electrostatic chuck, a plurality of mounting grooves with different lengths are formed in the top of the electrostatic chuck, and temperature sensors are arranged in the mounting grooves. A temperature sensor is arranged on the top of the electrostatic chuck, the detection end of the temperature sensor and the top of the electrostatic chuck are located on the same horizontal plane, the temperature sensor is connected with a PLC through a wire, an infrared transmitter and an infrared receiver which are symmetrically arranged are arranged above the electrostatic chuck, and the infrared transmitter and the infrared receiver are both connected with the PLC through wires. According to the scheme, the plurality of temperature sensors are arranged on the electrostatic chuck of the spot measuring machine, so that the wafer can be conveniently tested without separating the temperature sensors from the wafer, and the operation convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automatic carriers for wafer probing machines, and particularly relates to an automatic carrier for a wafer probing machine. Background Art

[0002] The carrier of the wafer probing machine is used to place and support the wafer. At the same time, the carrier can also heat the wafer. Since the resistivity of the transistors in the wafer will decrease at high temperatures, the high-temperature test of the wafer can simulate the performance of the chip in different working environments. In this way, during actual use, the chip can operate normally and maintain its performance. When the wafer is heated to 45°C - 150°C, due to the different heat in different regions on the surface of the wafer affected by heat and gas in the prior art, the wafer needs to reach the required temperature on all surfaces before the wafer can be tested. In the prior art, an external temperature sensor is usually used to contact the wafer for temperature measurement. Therefore, after the temperature measurement of the wafer is completed, the temperature sensor needs to be removed from the wafer. Repeating the above operations each time will increase the labor burden of the staff. Summary of the Utility Model

[0003] The purpose of the utility model is to solve the defects existing in the prior art, and to propose an automatic carrier for a wafer probing machine.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is: an automatic carrier for a wafer probing machine, including an electrostatic chuck. A heating device is arranged at the bottom of the electrostatic chuck. A plurality of installation grooves with different lengths are opened at the top of the electrostatic chuck. Temperature sensors are arranged inside the installation grooves. The detection ends of the temperature sensors are on the same horizontal plane as the top of the electrostatic chuck. The temperature sensors are connected to a PLC controller through wires. An infrared emitter and an infrared receiver are symmetrically arranged above the electrostatic chuck. Both the infrared emitter and the infrared receiver are connected to the PLC controller through wires.

[0005] Preferably, the heating device is a heating patch, and the heating patch is bonded to the bottom of the electrostatic chuck.

[0006] Preferably, a heat preservation and heat insulation board is arranged at the bottom of the heating patch, and the top of the heat preservation and heat insulation board is bonded to the bottom of the electrostatic chuck.

[0007] Preferably, a circular ring part is fixedly sleeved on the arc side surface of the electrostatic chuck. A plurality of fixing blocks are installed on the top of the circular ring part through screws. The positions of the fixing blocks correspond to those of the installation grooves. A lead screw is penetrated and installed on the side surface of the fixing block. One end of the lead screw is bonded to the side surface of the temperature sensor. Two nuts are threadedly sleeved on the surface of the lead screw. The ends of the nuts are in contact with two symmetric side surfaces of the fixing block.

[0008] Preferably, a wire hole corresponding to the position of the installation groove is formed in the side surface of the fixing block.

[0009] Preferably, two mounting blocks are mounted on the side surface of the ring member through screws. One end of each of the two mounting blocks extends above the electrostatic chuck, and the infrared emitter and the infrared receiver are respectively bonded to one end of each of the two mounting blocks.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] In this solution, a plurality of temperature sensors are arranged on the electrostatic chuck of the probe machine, and the temperature sensors are located at different positions on the electrostatic chuck. Since the wafer is placed on the electrostatic chuck, it is convenient for the plurality of temperature sensors to measure the temperature of different positions at the bottom of the wafer. Compared with the disadvantage in the prior art that the temperature measuring device needs to be separated from the wafer after each wafer temperature measurement, in this solution, the temperature sensors are directly arranged on the electrostatic chuck supporting the wafer, and the wafer can be conveniently tested without separating the temperature sensors from the wafer, improving the convenience of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is an axonometric view of an automatic stage for a wafer probe machine of the utility model;

[0013] Figure 2 is a schematic connection structure diagram of an electrostatic chuck and a heating device of an automatic stage for a wafer probe machine of the utility model;

[0014] Figure 3 is a schematic structure diagram of a heating device of an automatic stage for a wafer probe machine of the utility model;

[0015] Figure 4 is a schematic connection structure diagram of a ring member, an infrared emitter and an infrared receiver of an automatic stage for a wafer probe machine of the utility model;

[0016] Figure 5 is a schematic connection structure diagram of a temperature sensor, a lead screw and a nut of an automatic stage for a wafer probe machine of the utility model;

[0017] Figure 6 is a system block diagram of an automatic stage for a wafer probe machine of the utility model.

[0018] In the figure: rotary shaft 1, support block 2, PLC controller 3, ring member 4, installation groove 5, mounting block 6, infrared emitter 7, lead screw 8, electrostatic chuck 9, heat preservation and heat insulation board 10, heating patch 11, infrared receiver 12, temperature sensor 13, nut 14, wire hole 15, fixing block 16. DETAILED DESCRIPTION OF THE INVENTION

[0019] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations.

[0020] As Figures 1-6 An automatic stage for a wafer prober shown, includes an electrostatic chuck 9. A plurality of support blocks 2 are installed at the bottom of the electrostatic chuck 9 by screws. The plurality of support blocks 2 are installed at the top of a rotating shaft 1 by screws. The rotating shaft 1 is a component in the wafer prober. The rotating shaft 1 can drive the electrostatic chuck 9 to perform circular arc motion, thereby facilitating the probe in the wafer prober to test transistors at different positions on the wafer. The PLC controller 3 is installed on the side of the rotating shaft 1 by screws.

[0021] A heating device is provided at the bottom of the electrostatic chuck 9. The heating device is a heating patch 11. The heating patch 11 is bonded to the bottom of the electrostatic chuck 9. The heating patch 11 is a PI heating sheet, and its maximum heating temperature is 280 °C, which is used to heat the wafer.

[0022] A plurality of mounting grooves 5 with different lengths are formed at the top of the electrostatic chuck 9. The mounting grooves 5 can accommodate the temperature sensors 13, and at the same time avoid the defect that the temperature sensors 13 placed on the top of the electrostatic chuck 9 cause the wafer to be unable to be placed on the top of the electrostatic chuck 9, thereby facilitating the placement of the wafer on the top of the electrostatic chuck 9.

[0023] Temperature sensors 13 are provided inside the mounting grooves 5. The detection ends of the temperature sensors 13 are at the same horizontal plane as the top of the electrostatic chuck 9. The temperature sensors 13 are used to measure the temperature of the wafer.

[0024] The temperature sensors 13 are connected to the PLC controller 3 through wires. An infrared emitter 7 and an infrared receiver 12 are symmetrically arranged above the electrostatic chuck 9. Both the infrared emitter 7 and the infrared receiver 12 are connected to the PLC controller 3 through wires. The PLC controller 3 receives the signals sent by the temperature sensors 13, the infrared emitter 7 and the infrared receiver 12 respectively, and controls the on-off of the heating patch 11 according to the feedback of the signals, playing an automatic control role.

[0025] The temperature sensors 13 are PT100 temperature measurement wires. The model of the infrared emitter 7 is LTE-3271T infrared receiver, and the model of the infrared receiver 12 is TSOP1738 infrared receiving head.

[0026] A heat preservation and heat insulation board 10 is provided at the bottom of the heating patch 11. The top of the heat preservation and heat insulation board 10 is bonded to the bottom of the electrostatic chuck 9. The heat preservation and heat insulation board 10 is a glass wool board, which plays a heat insulation role, reduces the heat dissipation, and makes the heat evenly heat the electrostatic chuck 9 in the direction of the electrostatic chuck 9, improving the uniformity of the electrostatic chuck 9 being heated and making the wafer heated evenly.

[0027] A circular ring part 4 is fixedly sleeved on the arc side surface of the electrostatic chuck 9. A plurality of fixing blocks 16 are installed on the top of the circular ring part 4 through screws. The positions of the fixing blocks 16 correspond to those of the installation grooves 5. A lead screw 8 is installed through the side surface of the fixing block 16. One end of the lead screw 8 is adhered to the side surface of the temperature sensor 13. Two nuts 14 are sleeved on the surface of the lead screw 8 by threads. The ends of the nuts 14 are in contact with the two symmetrical side surfaces of the fixing block 16. By rotating the nuts 14, the two nuts 14 rotate by threads on the surface of the lead screw 8. After the ends of the two nuts 14 are in contact with the two symmetrical side surfaces of the fixing block 16, it is used to fix the position of the lead screw 8, improving the stability of the temperature sensor 13 in the installation groove 5. By rotating the two nuts 14 to different positions on the lead screw 8, the length of the lead screw 8 in the installation groove 5 can be adjusted, and then the position of the temperature sensor 13 in the installation groove 5 can be adjusted. After taking out the temperature sensor 13 from the installation groove 5, only need to take out the screws on the circular ring part 4, and then the circular ring part 4 can be pulled upward. The circular ring part 4 drives the temperature sensor 13 to move out of the installation groove 5 through the lead screw 8.

[0028] A wire hole 15 corresponding to the position of the installation groove 5 is opened on the side surface of the fixing block 16, and the wire hole 15 can be passed through by the wire connecting the temperature sensor 13.

[0029] Two installation blocks 6 are installed on the side surface of the circular ring part 4 through screws. One end of the two installation blocks 6 extends above the electrostatic chuck 9. The infrared emitter 7 and the infrared receiver 12 are respectively adhered to one end of the two installation blocks 6. The two installation blocks 6 play a role in fixing and supporting the infrared emitter 7 and the infrared receiver 12, improving the stability of the positions of the infrared emitter 7 and the infrared receiver 12 on the electrostatic chuck 9.

[0030] Working principle: After the wafer is placed on the top of the electrostatic chuck 9, the wafer blocks the infrared light emitted by the infrared emitter 7 from irradiating on the infrared receiver 12. The infrared receiver 12 feeds back the signal of not receiving infrared rays to the PLC controller 3. The PLC controller 3 controls the heating patch 11 to be energized and generate heat. The heat is transferred to the surface of the wafer through the electrostatic chuck 9. The temperature sensors 13 at different positions on the electrostatic chuck 9 measure the temperatures of different positions on the surface of the wafer. After the temperatures at multiple different positions of the wafer reach the thresholds set by the temperature sensors 13, the signals can be fed back to the PLC controller 3. The PLC controller 3 then controls the heating patch 11 to cut off the power supply, which is used to complete the automatic heating operation of the electrostatic chuck 9 for the wafer.

[0031] The basic principle, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present utility model. Without departing from the spirit and scope of the present utility model, various changes and improvements will occur to the present utility model, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection required by the present utility model is defined by the appended claims and their equivalents.

Claims

1. An automatic stage for a wafer spot measuring machine, comprising an electrostatic chuck (9), characterized in that: A heating device is provided at the bottom of the electrostatic chuck (9), a plurality of mounting grooves (5) of different lengths are provided at the top of the electrostatic chuck (9), a temperature sensor (13) is provided inside each of the mounting grooves (5), a detection end of the temperature sensor (13) is located at the same horizontal plane as the top of the electrostatic chuck (9), the temperature sensor (13) is connected to a PLC controller (3) via a wire, and a symmetrically arranged infrared transmitter (7) and an infrared receiver (12) are provided above the electrostatic chuck (9), the infrared transmitter (7) and the infrared receiver (12) are both connected to the PLC controller (3) via a wire.

2. The automatic stage for wafer spot measuring machine according to claim 1, characterized in that: The heating device is a heating patch (11), and the heating patch (11) is bonded to the bottom of the electrostatic chuck (9).

3. The automatic stage for wafer spot measuring machine according to claim 2, characterized in that: A heat preservation and insulation board (10) is provided at the bottom of the heating patch (11), and the top of the heat preservation and insulation board (10) is bonded to the bottom of the electrostatic chuck (9).

4. The automatic stage for wafer spot measuring machine according to claim 1, characterized in that: The circular arc side fixing sleeve of the electrostatic chuck (9) is provided with a circular ring member (4), and a plurality of fixing blocks (16) are installed on the top of the circular ring member (4) by means of screws, and the positions of the fixing blocks (16) and the mounting grooves (5) correspond to each other. A screw rod (8) is installed through the side of the fixing block (16), and one end of the screw rod (8) is bonded to the side of the temperature sensor (13). Two nuts (14) are provided on the surface of the screw rod (8), and the ends of the nuts (14) are in contact with two symmetrical side surfaces of the fixing block (16).

5. The automatic stage for wafer spot measuring machine according to claim 4, characterized in that: A wire hole (15) corresponding to the position of the installation slot (5) is provided on the side surface of the fixing block (16).

6. The automatic stage for wafer spot measuring machine according to claim 4, characterized in that: Two mounting blocks (6) are mounted on the side of the circular ring (4) by means of screws, one end of the two mounting blocks (6) extends above the electrostatic chuck (9), and the infrared transmitter (7) and the infrared receiver (12) are respectively bonded to one end of the two mounting blocks (6).

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