NFC (Near Field Communication) electronic tag with high-temperature-resistant function

Abstract

The utility model discloses an NFC electronic tag with a high temperature resistant function, and particularly relates to the technical field of NFC electronic tags, comprising an NFC electronic tag which comprises an FPC substrate, an NFC chip arranged on the surface of the FPC substrate, a high temperature resistant layer wrapped outside the NFC chip, a waterproof layer arranged on the top of the high temperature resistant layer, and a wear resistant layer arranged on the top of the waterproof layer. A mounting structure is arranged outside the NFC electronic tag, the mounting structure comprises a mounting plate, an identification port is formed in the surface of the mounting plate, slots are formed in the two inner walls of the identification port, and the two ends of the NFC electronic tag are inserted into the identification port formed in the mounting plate through the slots. The NFC electronic tag provided by the utility model has the advantages of good high temperature resistance, waterproofness, wear resistance and difficult dust adsorption, the use effect of the NFC electronic tag is improved, and an operator can conveniently disassemble and assemble the NFC electronic tag.

Description

Technical Field

[0001] The utility model relates to the technical field of NFC electronic tags, and more specifically, the utility model relates to an NFC electronic tag with a high-temperature resistant function. Background Art

[0002] In the context of the rapid development of current technology, due to its convenience and security, NFC technology has been widely used in many fields. As an important part of NFC technology, the market demand for NFC electronic tags is increasing day by day. However, with the diversification of application scenarios, especially the increasing application requirements in high-temperature environments, traditional NFC electronic tags face many challenges.

[0003] Traditional NFC electronic tags are usually encapsulated with ordinary plastic or paper materials. These materials can maintain good performance at normal temperature, but in high-temperature environments, these traditional materials often suffer from problems such as deformation, aging, and even failure, seriously affecting the stability and service life of NFC electronic tags.

[0004] After retrieval, the Chinese patent with the publication number CN219122713U discloses a high-temperature resistant and waterproof flexible NFC electronic tag. The substrate of the NFC electronic tag of this structure is an FPC board, which has heat-resistant characteristics and certain flexibility, and can be pasted on different object surfaces for use. The chip is wrapped and sealed by a heat-resistant adhesive layer, effectively increasing the heat-resistant performance of the chip, so that the NFC electronic tag body will not be damaged when used in a high-temperature environment.

[0005] However, in actual use, the NFC electronic tag of this structure is pasted on the surface of an object with an adhesive layer, and it is difficult to remove the NFC electronic tag after installation, which easily causes the phenomenon of residual glue on the surface of the object. In addition, the surface wear resistance of the NFC electronic tag is not good, and when it is in contact for a long time, the surface will be worn, affecting the use effect. In view of this, the utility model proposes an NFC electronic tag with a high-temperature resistant function. Summary of the Utility Model

[0006] In order to overcome the above-mentioned defects of the prior art, the utility model provides an NFC electronic tag with a high-temperature resistant function to solve the problems raised in the above background art.

[0007] To achieve the above object, the present utility model provides the following technical solution: An NFC electronic tag with a high-temperature resistance function, including an NFC electronic tag, the NFC electronic tag includes an FPC substrate, an NFC chip is disposed on the surface of the FPC substrate, the outside of the NFC chip is wrapped with a high-temperature resistant layer, a waterproof layer is disposed on the top of the high-temperature resistant layer, and a wear-resistant layer is disposed on the top of the waterproof layer. The FPC substrate, the NFC chip, the high-temperature resistant layer, the waterproof layer, and the wear-resistant layer form the NFC electronic tag. The high-temperature resistant layer is made of ultra-high molecular weight polyethylene material, the waterproof layer is a TPU film, the wear-resistant layer is made of polytetrafluoroethylene material, the NFC chip is encapsulated on the surface of the FPC substrate by a COB encapsulation method, and the high-temperature resistant layer completely wraps the outside of the NFC chip.

[0008] It can be seen that in the above structure, the NFC electronic tag composed of the FPC substrate, the NFC chip, the high-temperature resistant layer, the waterproof layer, and the wear-resistant layer has good high-temperature resistance, waterproofness, wear resistance, and the effect of not being easily adsorbed with dust, improving the use effect of the NFC electronic tag.

[0009] To facilitate the disassembly and assembly operation of the NFC electronic tag, preferably, an installation structure is disposed outside the NFC electronic tag. The installation structure includes an installation plate. The installation plate is outside the NFC electronic tag. The installation plate is made of ultra-high molecular weight polyethylene material. An identification opening is provided on the surface of the installation plate. Slots are provided on both inner walls of the identification opening. Both ends of the NFC electronic tag are inserted into the identification opening provided on the installation plate through the slots. Installation holes are provided at the four corners of the installation plate, and bolts are threadedly installed in the plurality of installation holes.

[0010] To reduce the friction force during the disassembly and assembly process of the NFC electronic tag, preferably, an elastic pad is installed on the inner wall of the slot. A plurality of circular grooves are provided on the surface of the elastic pad, and balls are installed in the plurality of circular grooves. The elastic pad is made of polyurethane material. One side of the ball is rotatably connected inside the circular groove, and the other side is attached to the surface of the NFC electronic tag.

[0011] The technical effects and advantages of the present utility model:

[0012] 1. By setting up the installation structure, the mounting plate is installed on the surface of the object through bolts. The two ends of the NFC electronic tag are inserted into the inside of the recognition port opened on the mounting plate through the corresponding slots. At this time, the reading and writing of the NFC electronic tag can be operated through the recognition port. Similarly, when the NFC tag needs to be removed, by sliding the NFC electronic tag upwards, the NFC electronic tag can be detached from the recognition port opened on the mounting plate, thus completing the removal of the NFC electronic tag. Compared with the way of connection using glue, the installation is reliable and convenient to remove, reducing the phenomenon of residual glue on the surface of the object;

[0013] 2. The elastic pad inside the slot can better fit the inside of the slot when installing the NFC electronic tag. In addition, by the rotation of multiple balls inside the corresponding circular grooves, the friction during the installation and removal of the NFC electronic tag can be reduced, avoiding the surface of the NFC electronic tag from being worn, and facilitating the operation of the operator for installation and use;

[0014] 3. The outside of the NFC chip is wrapped by a high-temperature resistant layer made of ultra-high molecular weight polyethylene material, which can ensure that the NFC electronic tag has good high-temperature resistant performance. The waterproof layer composed of TPU film is on the surface of the high-temperature resistant layer, making the NFC electronic tag have a certain waterproof effect, avoiding water from entering the inside of the NFC chip and causing an impact. The wear-resistant layer made of polytetrafluoroethylene material is on the surface of the waterproof layer, which is used to contact the outside world for a long time and fit with related equipment to realize data reading. It can improve the wear-resistant effect of the NFC electronic tag, extend the service life of the NFC electronic tag, and is not easy to adsorb dust, reducing the impact of dust on the data reading and writing of the NFC electronic tag. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0016] Figure 2 Of the present utility model Figure 1 The enlarged schematic diagram of part A.

[0017] Figure 3 It is a schematic diagram of the NFC electronic tag structure of the present utility model.

[0018] Figure 4 It is a schematic diagram of the surface structure of the elastic pad of the present utility model.

[0019] Reference numerals are: 1, NFC electronic tag; 100, FPC substrate; 101, NFC chip; 102, high-temperature resistant layer; 103, waterproof layer; 104, wear-resistant layer; 2, mounting plate; 3, recognition port; 4, slot; 5, elastic pad; 6, circular groove; 7, ball; 8, bolt. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] As shown in the attached Figures 1-4 An NFC electronic tag with high-temperature resistance function, including the NFC electronic tag 1. The NFC electronic tag 1 includes an FPC substrate 100. An NFC chip 101 is arranged on the surface of the FPC substrate 100. The outside of the NFC chip 101 is wrapped with a high-temperature resistant layer 102. A waterproof layer 103 is arranged on the top of the high-temperature resistant layer 102. A wear-resistant layer 104 is arranged on the top of the waterproof layer 103. The FPC substrate 100, the NFC chip 101, the high-temperature resistant layer 102, the waterproof layer 103 and the wear-resistant layer 104 form the NFC electronic tag 1. The high-temperature resistant layer 102 is made of ultra-high molecular weight polyethylene material. The waterproof layer 103 is a TPU film. The wear-resistant layer 104 is made of polytetrafluoroethylene material. The NFC chip 101 is encapsulated on the surface of the FPC substrate 100 by the COB encapsulation method. The high-temperature resistant layer 102 completely wraps the outside of the NFC chip 101.

[0022] Specifically, it can be understood that in the above structure, first, the NFC electronic tag 1 is composed of an FPC substrate 100, an NFC chip 101, a high-temperature resistant layer 102, a waterproof layer 103 and a wear-resistant layer 104;

[0023] The NFC chip 101 is installed on the FPC substrate 100, and the outside of the NFC chip 101 is wrapped with a high-temperature resistant layer 102 made of ultra-high molecular weight polyethylene material, so as to ensure that the NFC electronic tag 1 has good high-temperature resistance performance;

[0024] And the waterproof layer 103 composed of TPU film is on the surface of the high-temperature resistant layer 102, so that the NFC electronic tag 1 has a certain waterproof effect, avoiding water from entering the inside of the NFC chip 101 and causing influence;

[0025] In addition, the wear-resistant layer 104 made of polytetrafluoroethylene material is on the surface of the waterproof layer 103, which is used to contact the outside world for a long time and contact with relevant equipment to realize data reading. It can improve the wear-resistant effect of the NFC electronic tag 1, extend the service life of the NFC electronic tag 1, and is not easy to adsorb dust, reducing the influence of dust on the data reading and writing of the NFC electronic tag 1.

[0026] In a specific embodiment, as shown in the attachedFigure 1 , 2 , as shown in Figure 4, an installation structure is provided outside the NFC electronic tag 1. The installation structure includes an installation plate 2, which is located outside the NFC electronic tag 1. The installation plate 2 is made of ultra-high molecular weight polyethylene. An identification opening 3 is provided on the surface of the installation plate 2. Slots 4 are provided on both inner walls of the identification opening 3. Both ends of the NFC electronic tag 1 are inserted into the identification opening 3 provided on the installation plate 2 through the slots 4. Installation holes are provided at the four corners of the installation plate 2, and bolts 8 are threadedly installed inside the multiple installation holes.

[0027] Specifically, in this structure, in order to facilitate the installation of the NFC electronic tag 1 on the surface of an object and facilitate its removal, first, the installation plate 2 can be installed on the surface of the object through the bolts 8. Both ends of the NFC electronic tag 1 are inserted into the identification opening 3 provided on the installation plate 2 through the corresponding slots 4. At this time, the reading and writing of the NFC electronic tag 1 can be operated through the identification opening 3.

[0028] In the same way, by sliding the NFC electronic tag 1 upwards, the NFC electronic tag 1 can be disengaged from the identification opening 3 provided on the installation plate 2, and thus the removal of the NFC electronic tag 1 can be completed. Compared with the method of connecting with glue, the installation is reliable and the removal is convenient, reducing the phenomenon of residual glue on the surface of the object.

[0029] In a specific embodiment, as shown in the attached Figure 2 , 4 , an elastic pad 5 is installed on the inner wall of the slot 4. Multiple circular grooves 6 are provided on the surface of the elastic pad 5. Ball bearings 7 are installed inside the multiple circular grooves 6. The elastic pad 5 is made of polyurethane. One side of the ball bearing 7 is rotatably connected inside the circular groove 6, and the other side is attached to the surface of the NFC electronic tag 1.

[0030] Specifically, in this structure, the elastic pad 5 inside the slot 4 is made of polyurethane and has a certain elasticity, which can better fit inside the slot 4 when installing the NFC electronic tag 1. In addition, in order to reduce the friction force during the installation and removal of the NFC electronic tag 1, the multiple ball bearings 7 can rotate inside the corresponding circular grooves 6, reducing the friction force during the plugging and unplugging process, avoiding abrasion on the surface of the NFC electronic tag 1, and facilitating the operation of the operator for installation and use.

[0031] The working principle of the present utility model:

[0032] When the above structure is specifically used, first, the mounting plate 2 is installed on the surface of an object through bolts 8. The two ends of the NFC electronic tag 1 are inserted into the inside of the recognition port 3 opened on the mounting plate 2 through the corresponding slots 4. At this time, the reading and writing of the NFC electronic tag 1 can be operated through the recognition port 3. Similarly, when the NFC tag needs to be removed, by sliding the NFC electronic tag 1 upward, the NFC electronic tag 1 can be detached from the recognition port 3 opened on the mounting plate 2, and thus the removal of the NFC electronic tag 1 can be completed.

[0033] The NFC electronic tag 1 is composed of an FPC substrate 100, an NFC chip 101, a high-temperature resistant layer 102, a waterproof layer 103 and a wear-resistant layer 104. The high-temperature resistant layer 102 made of ultra-high molecular weight polyethylene material wraps the outside of the NFC chip 101, so as to ensure that the NFC electronic tag 1 has good high-temperature resistance. The waterproof layer 103 composed of a TPU film is on the surface of the high-temperature resistant layer 102, making the NFC electronic tag 1 have a certain waterproof effect and preventing water from entering the inside of the NFC chip 101 and causing an impact. The wear-resistant layer 104 made of polytetrafluoroethylene material is on the surface of the waterproof layer 103, which is used to contact the outside world for a long time and fit with relevant devices to realize data reading. It can improve the wear resistance of the NFC electronic tag 1, extend the service life of the NFC electronic tag 1, and is not easy to adsorb dust, reducing the impact of dust on the data reading and writing of the NFC electronic tag 1.

[0034] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An NFC electronic tag with high temperature resistance function, comprising an NFC electronic tag (1), characterized in that: The NFC electronic tag (1) comprises an FPC substrate (100), an NFC chip (101) is arranged on the surface of the FPC substrate (100), the outside of the NFC chip (101) is wrapped with a high temperature resistant layer (102), a waterproof layer (103) is arranged on the top of the high temperature resistant layer (102), a wear-resistant layer (104) is arranged on the top of the waterproof layer (103), and a mounting structure is arranged on the outside of the NFC electronic tag (1); The mounting structure comprises a mounting plate (2), the mounting plate (2) being located outside the NFC electronic tag (1), an identification port (3) being provided on the surface of the mounting plate (2), slots (4) being provided on both inner walls of the identification port (3), and both ends of the NFC electronic tag (1) being plugged into the inside of the identification port (3) provided on the mounting plate (2) through the slots (4); An elastic pad (5) is installed on the inner wall of the slot (4), a plurality of circular grooves (6) are provided on the surface of the elastic pad (5), and balls (7) are installed inside the plurality of circular grooves (6).

2. The NFC electronic tag with high temperature resistance function according to claim 1, characterized in that: The FPC substrate (100), the NFC chip (101), the high temperature resistant layer (102), the waterproof layer (103) and the wear-resistant layer (104) form the NFC electronic tag (1).

3. The NFC electronic tag with high temperature resistance function according to claim 1, characterized in that: The high temperature resistant layer (102) and the mounting plate (2) are both made of ultra-high molecular weight polyethylene, the waterproof layer (103) is a TPU film, and the wear-resistant layer (104) is made of polytetrafluoroethylene.

4. The NFC electronic tag with high temperature resistance function according to claim 1, characterized in that: The four corners of the mounting plate (2) are provided with mounting holes, and bolts (8) are installed in the internal threads of a plurality of the mounting holes.

5. The NFC electronic tag with high temperature resistance function according to claim 1, characterized in that: The elastic pad (5) is made of polyurethane material, one side of the ball (7) is rollingly connected inside the circular groove (6), and the other side is attached to the surface of the NFC electronic tag (1).

6. The NFC electronic tag with high temperature resistance function according to claim 1, characterized in that: The NFC chip (101) is packaged on the surface of the FPC substrate (100) in a COB packaging manner, and the high temperature resistant layer (102) completely wraps the outside of the NFC chip (101).

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