Wafer fragment detection device and wafer cleaning equipment
By designing a laser detection system for transmitters and receivers in wafer cleaning equipment, the problem of limited detection range in the prior art is solved, high-precision detection of fine wafer fragments is achieved, and the risk of secondary debris accidents is reduced.
Patent Information
- Application Number
- CN202421815008.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-29
AI Technical Summary
The detection range of existing wafer detection sensors is limited, making it difficult to detect fine wafer fragment residues immediately and accurately, resulting in the neglect of fragmentation problems or delayed discovery, increasing the risk of secondary fragmentation accidents.
A wafer fragment detection device is designed, and a transmitting mechanism and a receiving mechanism are adopted, including a first transmitter and a second transmitter. The transmitter is located at one end of the sink and the receiving mechanism is located at the other end. The laser light emitted by the transmitter is covered in the arrangement direction of the sink, which improves the detection range and accuracy.
By improving the detection range and accuracy, the probability of secondary debris is reduced, the integrity of the wafer surface and the safety of the cleaning equipment are ensured, and maintenance costs and downtime are reduced.
Smart Images
Figure CN222914738U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor equipment, in particular to a wafer fragment detection device and wafer cleaning equipment. Background Art
[0002] In the semiconductor manufacturing process, wafer cleaning is a crucial step that is directly related to the quality and yield of the chip. In order to ensure the smooth progress of the cleaning process and the integrity of the wafer surface, the machine is usually equipped with a wafer detection sensor to monitor the state of the wafer during the cleaning process and prevent debris caused by mechanical collision or improper operation.
[0003] However, although some cleaning machines are equipped with advanced wafer detection sensors, they still face some challenges and problems in practical applications, especially when the wafer is broken. Due to the limited detection range of existing wafer detection sensors, it is often difficult to immediately and accurately detect these tiny fragments, resulting in the fragmentation problem being ignored or delayed, thereby increasing the risk of debris residue. On the other hand, if the debris residue is not discovered and removed in time, the subsequent batches of wafers entering are likely to collide with these residual fragments during the cleaning process, resulting in secondary fragmentation accidents, which will not only further damage the wafer, but also cause damage to the cleaning machine, increasing maintenance costs and downtime.
[0004] Therefore, there is an urgent need for a wafer fragment detection device and a wafer cleaning equipment to improve the above problems. Utility Model Content
[0005] The utility model aims to provide a wafer fragment detection device and a wafer cleaning device, which can improve the detection range and the detection accuracy of small fragments and reduce the probability of secondary fragmentation.
[0006] In a first aspect, the utility model provides a wafer fragment detection device, which is applied to a wafer cleaning device, wherein the cleaning device comprises a water tank having a plurality of slots, wherein the slots are used to insert wafers to be cleaned, and comprises a transmitting mechanism and a receiving mechanism;
[0007] The launching mechanism comprises a first launcher and a second launcher;
[0008] The first transmitter and the second transmitter are located at one end of the water tank, and the receiving mechanism is located at the other end opposite to the water tank, and the first transmitter and the second transmitter are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism;
[0009] The projections of the first emitter and the second emitter in the horizontal direction are located in the lower area of the wafer to be cleaned;
[0010] The first emitter and the second emitter are arranged on opposite sides of the center line of the water tank, and are both inclined toward the center line in the horizontal direction.
[0011] The beneficial effects of the utility model are as follows: by setting a transmitting mechanism and a receiving mechanism; the transmitting mechanism includes a first transmitter and a second transmitter; the first transmitter and the second transmitter are located at one end of the water tank, the receiving mechanism is located at the other end opposite to the water tank, and the first transmitter and the second transmitter are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism; the projections of the first transmitter and the second transmitter in the horizontal direction are located in the lower area of the wafer to be cleaned; the first transmitter and the second transmitter are arranged on opposite sides of the center line of the water tank, and both are inclined toward the center line in the horizontal direction. By arranging the two transmitters in the lower area of the wafer to be cleaned, and arranging the two transmitters on opposite sides of the center line of the water tank, and both are inclined toward the center line in the horizontal direction, the lasers emitted by the two transmitters can cover from one end of the water tank to the other end along the arrangement direction of the slots, and the distance between the two laser lines at one end of the water tank is large, and as the laser line moves away from the transmitter and is finally received by the receiving mechanism, the distance between the two laser lines gradually decreases, which not only improves the detection range, but also improves the detection accuracy of small fragments, and reduces the probability of secondary fragments. Moreover, only two sets of emitters are required to realize low-cost detection of small debris.
[0012] Optionally, the distance between the point in the lower region and the horizontal line where the center point of the wafer is located is 3 / 5R to R, where R is the radius of the wafer 2. The beneficial effect is that when the wafer is broken, the fragments usually fall to the bottom of the water tank, and by setting the height of the first transmitter and the second transmitter to be located in the lower region of 3 / 5R to R of the wafer to be cleaned, it is beneficial to detect the fragments remaining at the bottom of the water tank, thereby more thoroughly removing the tiny wafer fragments and improving safety.
[0013] Optionally, the angle between the first emitter in the horizontal direction and the straight line where the center line is located is 10-15°; and / or the angle between the second emitter in the horizontal direction and the straight line where the center line is located is 10-15°. The beneficial effect is that by setting the first / second emitter to be inclined toward the straight line where the center line is located, the accuracy and efficiency of the detection device for detecting small debris can be improved.
[0014] Optionally, the first launcher is tilted upward or downward in the vertical direction, and / or when the first launcher is tilted, the angle between the first launcher in the vertical direction and the perpendicular line of the center line in the vertical direction is 80-85°;
[0015] And / or the second emitter is tilted upward or downward in the vertical direction, and / or when the second emitter is tilted, the angle between the second emitter in the vertical direction and the vertical line of the center line is 80-85°. Its beneficial effect is that by setting the first / second emitter to tilt upward or downward, it is possible to detect wafer fragments of different heights; and by setting the angle between the first / second emitter in the vertical direction and the vertical line of the center line to be 80-85, the detection accuracy of small fragments can be better guaranteed.
[0016] Optionally, the receiving mechanism is a first reflecting plate and a second reflecting plate arranged in parallel, the first reflecting plate is used to receive the laser emitted by the first emitter, and the second reflecting plate is used to receive the laser emitted by the second emitter;
[0017] Or the receiving mechanism is an integrally formed reflector plate for receiving the lasers emitted by the first emitter and the second emitter. The beneficial effect is that the scope of application can be improved by arranging two reflectors in parallel or using an integrally formed reflector plate.
[0018] Optionally, it further includes a first fixing bracket and a second fixing bracket;
[0019] The first transmitter is mounted on the first fixed bracket, the second transmitter is mounted on the second fixed bracket, and the heights of the first transmitter and the second transmitter are adjustable. The beneficial effect is that by setting two fixed brackets and mounting the transmitter on the fixed brackets, the height of the transmitter is adjustable, which can meet the different precisions of different wafer fragments, making the detection more detailed and comprehensive.
[0020] Optionally, the first transmitter is detachably mounted on the first fixing bracket, the second transmitter is detachably mounted on the second fixing bracket, and the mounting heights of the first transmitter and the second transmitter are adjustable.
[0021] Optionally, the first transmitter is fixedly mounted on the first fixed bracket, the second transmitter is fixedly mounted on the second fixed bracket, the first fixed bracket and the second fixed bracket are both telescopic brackets, and the heights of the first transmitter and the second transmitter are adjustable via the telescopic brackets.
[0022] Optionally, it also includes a controller and an alarm;
[0023] The first transmitter, the second transmitter and the alarm are electrically connected to the controller respectively;
[0024] The first transmitter and the second transmitter are arranged in parallel;
[0025] The controller is used to control the alarm to sound an alarm when any transmitter detects wafer fragments. The beneficial effect is that by setting the controller and the alarm, automatic and quantitative monitoring and management of the wafer status in the cleaning equipment can be achieved.
[0026] In a second aspect, the utility model further provides a wafer cleaning device, comprising a detection device of any possible combination of the first aspect and a water tank having a plurality of slots, wherein the slots are used to insert wafers to be cleaned;
[0027] The transmitting mechanism of the detection device includes a first transmitter and a second transmitter;
[0028] The first transmitter and the second transmitter are located at one end of the water tank, and the receiving mechanism is located at the other end opposite to the water tank, and the first transmitter and the second transmitter are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism of the detection device;
[0029] The projections of the first emitter and the second emitter in the horizontal direction are located in the lower area of the wafer to be cleaned;
[0030] The first emitter and the second emitter are arranged on opposite sides of the center line of the water tank, and are both inclined toward the center line in the horizontal direction.
[0031] For the beneficial effects of the second aspect, reference may be made to the description of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 A top view of a wafer fragment detection device provided by an embodiment of the utility model;
[0033] Figure 2 A front view of a wafer fragment detection device provided by an embodiment of the utility model;
[0034] Figure 3 A side view of a wafer fragment detection device provided by an embodiment of the utility model;
[0035] Figure 4 A schematic diagram of the relative positions of a wafer and a launching mechanism provided in an embodiment of the utility model;
[0036] Figure 5 A schematic diagram of the principle of a wafer fragment detection device provided in an embodiment of the utility model.
[0037] Description of reference numerals:
[0038] 1. Water tank; 2. Wafer; 3. Transmitting mechanism; 4. Receiving mechanism; 5. Center line; 6. First fixed bracket; 7. Second fixed bracket; 8. First supporting point; 9. Second supporting point; 10. Controller; 11. Alarm; 12. Reference line;
[0039] 31. First transmitter; 32. Second transmitter;
[0040] 311, first laser; 321, second laser;
[0041] 41. A first reflector; 42. A second reflector. DETAILED DESCRIPTION
[0042] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work belong to the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the utility model belongs. The technical solutions in the embodiments of the utility model are described below in conjunction with the drawings in the embodiments of the utility model. Among them, in the description of the embodiments of the utility model, the terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to be used as limitations on the utility model. As used in the specification of the utility model and the attached claims, the singular expressions "a", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear indication to the contrary in the context. It should also be understood that in the following embodiments of the utility model, "at least one", "one or more" refer to one or more (including two). The term "and / or" is used to describe the association relationship of associated objects, indicating that there can be three relationships; for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.
[0043] Reference to "one embodiment" or "some embodiments" described in this specification means that one or more embodiments of the utility model include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the sentences "in one embodiment", "in some embodiments", "in some other embodiments", and "in some other embodiments" that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. The term "connection" includes direct connection and indirect connection, unless otherwise specified. "First" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
[0044] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the embodiments of the present utility model, "exemplarily" or "for example" is used to indicate an example, illustration or explanation. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present utility model should not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Specifically, the use of "exemplarily" or "for example" is intended to present related concepts in a concrete way.
[0045] In view of the problems existing in the existing technology, such as Figure 1 and Figure 2 As shown, the utility model provides a wafer fragment detection device, which is applied to a wafer 2 cleaning device, wherein the cleaning device comprises a water tank 1 having a plurality of slots, wherein the slots are used to insert a wafer 2 to be cleaned, and comprises a transmitting mechanism 3 and a receiving mechanism 4; the transmitting mechanism 3 comprises a first transmitter 31 and a second transmitter 32; the first transmitter 31 and the second transmitter 32 are located at the lower end of the water tank 1, and the receiving mechanism 4 is located at the upper end of the water tank 1, and the first transmitter 31 and the second transmitter 32 are used to respectively transmit lasers (i.e., a first laser 311 and a second laser 321) for detecting wafer fragments to the receiving mechanism 4; the projections of the first transmitter 31 and the second transmitter 32 in the horizontal direction are located at the lower area of the wafer 2 to be cleaned (e.g., Figure 2As shown, when the wafer 2 is placed vertically, the lower area refers to the bottom area of the wafer 2 close to the horizontal plane); the first emitter 31 and the second emitter 32 are arranged on the left and right sides of the center line 5 of the water tank 1, and are both inclined toward the center line 5 in the horizontal direction, so that the lasers emitted by the two emitters can cover from the lower end to the upper end of the water tank 1 along the arrangement direction of the slots, and the distance between the two laser lines at the lower end of the water tank 1 is large, and as the laser line moves away from the emitter and is finally received by the receiving mechanism 4, the distance between the two laser lines gradually decreases, which not only improves the detection range, but also improves the detection accuracy of small fragments and reduces the probability of secondary fragments. Moreover, only two groups of emitters (such as photoelectric sensors) are set to achieve low-cost detection of small fragments. Among them, the number of slots can be adjusted according to actual needs. In addition, it is worth noting that the light emitted by the emitter can be infrared light or other suitable light sources in addition to laser.
[0046] In some embodiments, the broken fragments of the wafer 2 usually fall to the bottom of the water tank 1. In order to facilitate the detection of the fragments remaining at the bottom of the water tank 1 and improve safety, the distance between the point in the lower area and the horizontal line where the center point of the wafer 2 is located is 3 / 5R to R, where R is the radius of the wafer 2. For example, Figure 4 As shown, the distance between the line between the two supporting points (i.e., the first supporting point 8 and the second supporting point 9) where the wafer 2 and the tank 1 are in contact and the center of the wafer 2 is 3 / 5R. At this time, the lower part of the line connecting the two supporting points is the lower area of the wafer. Therefore, the height of the first launcher 31 and the second launcher 32 is below the line connecting the two supporting points. It should be understood that the first launcher 31 and the second launcher 32 need to be arranged on both sides of the center line 5, so the two cannot be arranged on the bottom edge of the wafer 2 at the same time, that is, when the distance between the point in the lower area and the horizontal line where the center point of the wafer 2 is located is R, the endpoint value is not included, and when the distance between the point in the lower area and the horizontal line where the center point of the wafer 2 is located is 3 / 5R, the endpoint value is included.
[0047] In some embodiments, in order to improve the accuracy and efficiency of the detection device for detecting small debris, such as Figure 1 As shown, the angle between the first emitter 31 in the horizontal direction and the straight line where the center line 5 is located is 10-15°; and / or the angle between the second emitter 32 in the horizontal direction and the straight line where the center line 5 is located is 10-15°. The laser line emitted by any emitter, the center line 5 and the reference line 12 can form a right triangle, and the center line 2 and the reference line 12 are perpendicular to each other. According to the sum of the interior angles of the triangle being 180°, it can be known that the angle is actually equal to 90° minus the angle K. In addition, the center line 5 and the reference line 12 are only used to illustrate the content of the utility model and do not actually exist.
[0048] In some embodiments, in order to detect wafer fragments of different heights and ensure the detection accuracy of small fragments, Figure 2 As shown, the first launcher 31 is tilted upward or downward in the vertical direction, and / or when the first launcher 31 is tilted, the angle between the first launcher 31 in the vertical direction and the vertical line of the center line 5 in the vertical direction is 80-85°; and / or the second launcher 32 is tilted downward, and / or when the second launcher 32 is tilted upward or downward in the vertical direction, the angle between the second launcher 32 in the vertical direction and the vertical line of the center line 5 in the vertical direction is 80-85°. It is worth noting that the first launcher 31 and the second launcher 32 can not only be set to tilt upward at the same time, but also can be set to tilt downward at the same time, and one of the launchers can be set to tilt upward and the other launcher can be set to tilt downward. It is worth noting that when the two transmitters are tilted in different directions, cross-detection can be performed on the wafer fragments remaining at the bottom of the water tank 1. When any transmitter detects wafer fragments, it is considered that there are wafer fragments and they need to be cleaned, thereby further increasing the detection accuracy of small fragments and avoiding the problem of detection failure due to the tilt of small fragments.
[0049] In some embodiments, in order to improve the scope of application, such as Figure 1 As shown, the receiving mechanism 4 is a first reflecting plate 41 and a second reflecting plate 42 arranged in parallel, the first reflecting plate 41 is used to receive the laser emitted by the first emitter 31, and the second reflecting plate 42 is used to receive the laser emitted by the second emitter 32; or the receiving mechanism 4 is an integrally formed reflecting plate, used to receive the laser emitted by the first emitter 31 and the second emitter 32.
[0050] In some embodiments, in order to make the height of the transmitter adjustable, it can meet the different precisions of different wafer fragments, making the detection more detailed and comprehensive, such as Figure 3As shown, the detection device also includes a first fixed bracket 6 and a second fixed bracket 7; the first emitter 31 is mounted on the first fixed bracket 6 (such as by a fixed connection method such as welding or integral molding, or by a detachable connection method such as threading or snap-fitting), and the second emitter 32 is mounted on the second fixed bracket 7 (such as by a fixed connection method such as welding or integral molding, or by a detachable connection method such as threading or snap-fitting), and the heights of the first emitter 31 and the second emitter 32 are adjustable. In some specific embodiments, the first emitter 31 is detachably mounted on the first fixed bracket 6 (such as by a detachable connection method such as threading or snap-fitting), and the second emitter 32 is detachably mounted on the second fixed bracket 7 (such as by a detachable connection method such as threading or snap-fitting), and the installation heights of the first emitter 31 and the second emitter 32 are adjustable. In other specific embodiments, the first launcher 31 is fixedly installed (such as by a fixed connection method such as welding or one-piece molding, or by a detachable connection method such as threading or snap-fitting) on the first fixed bracket 6, and the second launcher 32 is fixedly installed (such as by a fixed connection method such as welding or one-piece molding, or by a detachable connection method such as threading or snap-fitting) on the second fixed bracket 7. Both the first fixed bracket 6 and the second fixed bracket 7 are telescopic brackets, and the heights of the first launcher 31 and the second launcher 32 are adjustable through the telescopic brackets.
[0051] In some embodiments, in order to realize automatic and quantitative monitoring and management of the wafer 2 status in the cleaning equipment, as Figure 5 As shown, the detection device also includes a controller 10 and an alarm 11 (such as a buzzer); the first transmitter 31, the second transmitter 32 and the alarm 11 are electrically connected to the controller 10 respectively; the first transmitter 31 and the second transmitter 32 are arranged in parallel; the controller 10 is used to control the alarm 11 to alarm when any transmitter detects wafer fragments.
[0052] Based on the above wafer fragment detection device, Figure 1 and Figure 2As shown, a wafer 2 cleaning device comprises the above-mentioned detection device and a water tank 1 with multiple slots, wherein the slots are used to insert the wafer 2 to be cleaned; the transmitting mechanism 3 of the detection device comprises a first transmitter 31 and a second transmitter 32; the first transmitter 31 and the second transmitter 32 are located at the lower end of the water tank 1, and the receiving mechanism 4 is located at the upper end of the water tank 1, and the first transmitter 31 and the second transmitter 32 are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism 4 of the detection device; the projections of the first transmitter 31 and the second transmitter 32 in the horizontal direction are located at The lower area of the wafer 2 to be cleaned; the first emitter 31 and the second emitter 32 are arranged on opposite sides of the center line 5 of the water tank 1, and are both inclined toward the center line 5 in the horizontal direction, so that the lasers emitted by the two emitters can cover from the lower end to the upper end of the water tank 1 along the arrangement direction of the slots, and the distance between the two laser lines at the lower end of the water tank 1 is large, and as the laser line moves away from the emitter and is finally received by the receiving mechanism 4, the distance between the two laser lines gradually decreases, which not only improves the detection range, but also improves the detection accuracy of small fragments and reduces the probability of secondary fragments. Moreover, only two sets of emitters (such as photoelectric sensors) are set to achieve low-cost detection of small fragments, which will not only not affect the basic structure of the original cleaning equipment, but also the original cleaning equipment does not have the risk of reduced yield, and the emission mechanism and cleaning. In some specific embodiments, the cleaning equipment also includes a manipulator (such as a transmission manipulator or a wafer receiving arm) for picking and placing the wafers on the slots of the water tank 1, and before and after picking and placing, two sets of emitters can also be used to detect whether there are wafer fragments on the manipulator. It should be understood that, in addition to being used in NAURA cleaning machines, the debris detection device can also be used in other scenarios in the semiconductor field where wafer debris detection is required.
[0053] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.
Claims
1. A wafer fragment detection device, applied to a wafer cleaning device, wherein the cleaning device comprises a water tank having a plurality of slots, wherein the slots are used to insert wafers to be cleaned, wherein: It includes a transmitting mechanism and a receiving mechanism; The launching mechanism comprises a first launcher and a second launcher; The first transmitter and the second transmitter are located at one end of the water tank, and the receiving mechanism is located at the other end opposite to the water tank, and the first transmitter and the second transmitter are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism; The projections of the first emitter and the second emitter in the horizontal direction are located in the lower area of the wafer to be cleaned; The first emitter and the second emitter are arranged on opposite sides of the center line of the water tank, and are both inclined toward the center line in the horizontal direction.
2. The detection device according to claim 1, characterized in that: The distance between the point in the lower area and the horizontal line where the center point of the wafer is located is 3 / 5R to R, where R is the radius of the wafer.
3. The detection device according to claim 1, characterized in that: The angle between the horizontal direction of the first emitter and the straight line where the center line is located is 10-15°; and / or the angle between the horizontal direction of the second emitter and the straight line where the center line is located is 10-15°.
4. The detection device according to claim 1, characterized in that: The first launcher is tilted upward or downward in the vertical direction, and / or when the first launcher is tilted, the angle between the first launcher in the vertical direction and the perpendicular line of the center line in the vertical direction is 80-85°; And / or the second launcher is tilted upward or downward in the vertical direction, and / or when the second launcher is tilted, the angle between the second launcher in the vertical direction and the vertical perpendicular to the center line is 80-85°.
5. The detection device according to claim 1, characterized in that: The receiving mechanism is a first reflecting plate and a second reflecting plate arranged in parallel, the first reflecting plate is used to receive the laser emitted by the first emitter, and the second reflecting plate is used to receive the laser emitted by the second emitter; Or the receiving mechanism is an integrally formed reflecting plate for receiving the lasers emitted by the first emitter and the second emitter.
6. The detection device according to claim 1, characterized in that: Also included is a first fixing bracket and a second fixing bracket; The first transmitter is mounted on the first fixing bracket, and the second transmitter is mounted on the second fixing bracket. The heights of the first transmitter and the second transmitter are adjustable.
7. The detection device according to claim 6, characterized in that: The first transmitter is detachably mounted on the first fixing bracket, the second transmitter is detachably mounted on the second fixing bracket, and the mounting heights of the first transmitter and the second transmitter are adjustable.
8. The detection device according to claim 6, characterized in that: The first transmitter is fixedly mounted on the first fixed bracket, and the second transmitter is fixedly mounted on the second fixed bracket. Both the first fixed bracket and the second fixed bracket are telescopic brackets, and the heights of the first transmitter and the second transmitter are adjustable through the telescopic brackets.
9. The detection device according to any one of claims 1 to 8, characterized in that: Also includes controller and alarm; The first transmitter, the second transmitter and the alarm are electrically connected to the controller respectively; The first transmitter and the second transmitter are arranged in parallel; The controller is used to control the alarm to sound an alarm when any transmitter detects wafer fragments.
10. A wafer cleaning device, characterized in that: It comprises a detection device as claimed in any one of claims 1 to 9 and a water tank having a plurality of slots, wherein the slots are used to insert wafers to be cleaned; The transmitting mechanism of the detection device includes a first transmitter and a second transmitter; The first transmitter and the second transmitter are located at one end of the water tank, and the receiving mechanism is located at the other end opposite to the water tank, and the first transmitter and the second transmitter are used to respectively transmit lasers for detecting wafer fragments to the receiving mechanism of the detection device; The projections of the first emitter and the second emitter in the horizontal direction are located in the lower area of the wafer to be cleaned; The first emitter and the second emitter are arranged on opposite sides of the center line of the water tank, and are both inclined toward the center line in the horizontal direction.