Wafer double-swing-arm arranging device

Abstract

The utility model provides a double-swing-arm wafer arranging device, which comprises a fine arranging platform, a first swing arm mechanism, an angle correcting platform, a second swing arm mechanism and a feeding platform which are sequentially arranged along the X-axis direction of a plane, and positioning cameras are respectively arranged above the fine arranging platform, the angle correcting platform and the feeding platform; x-Y motion modules capable of driving the X-Y motion modules to move along an X-Y plane are respectively arranged above the first swing arm mechanism and below the feeding platform; the fine arranging platform and the angle correcting platform are located in the working range of the first swing arm mechanism, and the angle correcting platform and the feeding platform are located in the working range of the second swing arm mechanism. According to the utility model, the angle of the wafer is adjusted through the angle correction platform, and the X-Y motion module drives the first swing arm mechanism to pick up the wafer from the angle correction platform and place the wafer on a corresponding vacancy on the fine arrangement platform, thereby realizing angle adjustment of the wafer and accurate arrangement of X-Y coordinates.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer precise placement and sheet arranging devices, and particularly relates to a wafer double swing arm sheet arranging device. Background Art

[0002] In the latter half of the IC semiconductor chip manufacturing process, a sheet arranging device is required to precisely reorder the inspected wafers, remove the wafers from the original film, and precisely re-arrange and place them on a new film to achieve high-precision sheet arranging and high-precision sticking of semiconductor wafers.

[0003] Currently, there are mainly the following two types of sheet arranging devices:

[0004] A single swing arm sheet arranging device includes two X-Y worktables and a swing arm mechanism. The first X-Y worktable drives the wafers to move to the coordinate origin of the swing arm mechanism in sequence. After the swing arm mechanism sucks the wafers, it rotates 180° to the coordinate end point. The second X-Y worktable drives the vacancies on the film to move to the coordinate end point of the swing arm mechanism in sequence, and the swing arm mechanism places the wafers down. However, this device cannot perform rotational adjustment on the wafers, and the wafers are prone to displacement or rotation when being pulled away from the film, resulting in inaccurate positions after displacement placement.

[0005] A double swing arm sheet arranging device adds an X-Y-θ worktable and a swing arm mechanism between two X-Y worktables. The first swing arm mechanism sucks the wafers and places them on the X-Y-θ worktable. The X-Y-θ worktable performs planar position and rotation adjustment, and then the second swing arm mechanism sucks the wafers and places them on the second X-Y worktable. This device requires more X-Y modules, resulting in high equipment manufacturing and maintenance costs and complex maintenance. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is: how to reduce costs and achieve angle adjustment and precise X-Y coordinate sheet arranging for wafers.

[0007] The technical solution for the utility model to solve the above technical problem is as follows:

[0008] The utility model provides a wafer double swing arm sheet arranging device, which includes a precise arrangement platform, a first swing arm mechanism, an angle correction platform, a second swing arm mechanism, and a loading platform arranged in sequence along the X-axis direction of the plane. Positioning cameras are respectively arranged above the precise arrangement platform, above the angle correction platform, and above the loading platform; X-Y motion modules capable of driving themselves to move along the X-Y plane are respectively arranged above the first swing arm mechanism and below the loading platform; the precise arrangement platform and the angle correction platform are within the working range of the first swing arm mechanism, and the angle correction platform and the loading platform are within the working range of the second swing arm mechanism.

[0009] The beneficial effects of the present utility model are as follows:

[0010] By adopting the present utility model, the angle of the wafer is adjusted through the angle correction platform, and the X-Y motion module drives the first swing arm mechanism to pick up the wafer from the angle correction platform and place it in the corresponding empty position on the fine alignment platform, realizing the angle adjustment of the wafer and the accurate X-Y coordinate wafer placement; only two X-Y motion modules are required, with less quantity, reduced cost, and convenient maintenance.

[0011] On the basis of the above technical solution, the present utility model can also be improved as follows.

[0012] Further, limit posts are respectively provided on the starting side and the ending side of the first swing arm mechanism, and on the starting side and the ending side of the second swing arm mechanism; the limit posts are distributed along the X-axis direction and can restrict the first swing arm mechanism and the second swing arm mechanism to rotate within their respective ranges of 0° to 180°.

[0013] The starting point and the ending point of the first swing arm mechanism and the second swing arm mechanism are 180° apart. Through the limit posts, it is ensured that the first swing arm mechanism and the second swing arm mechanism can accurately stop at the starting point or the ending point, improving the accuracy of the stopping position and reducing the wafer placement error.

[0014] Further, buffer springs and magnets horizontally extend along the limit posts. The buffer springs and magnets on both sides of the first swing arm mechanism are at the same height as the first swing arm mechanism, and the buffer springs and magnets on both sides of the second swing arm mechanism are at the same height as the second swing arm mechanism.

[0015] When the first swing arm mechanism and the second swing arm mechanism rotate to the starting point or the ending point, the buffer springs first abut against their swing arms, reducing the kinetic energy, minimizing the impact, avoiding the wafer from shaking off, and extending the service life; subsequently, the magnets adsorb their swing arms, improving the stability.

[0016] Further, the magnet is located inside the buffer spring.

[0017] It is convenient to make full use of the space, reducing the space occupation and having a compact structure.

[0018] Further, the magnet is an electromagnet.

[0019] When the first swing arm mechanism and the second swing arm mechanism start to swing, the driving force and the elastic force of the buffer spring jointly drive the swing arm to move; at this time, the power supply of the electromagnet can be cut off to eliminate the magnetic force, reducing the driving resistance and having a fast motion response speed.

[0020] Further, both the first swing arm mechanism and the second swing arm mechanism include a base and a swing arm. A first servo motor is provided inside the base. One end of the swing arm is provided with a mounting cylinder. The output shaft of the first servo motor extends into the mounting cylinder and is in transmission connection with the mounting cylinder. The outside of the mounting cylinder is connected to the base through at least two bearings; the other end of the swing arm is provided with a wafer suction component.

[0021] The mounting cylinder and the base are mutually limited. The two bearings ensure that the mounting cylinder and the swing arm rotate horizontally relative to the base with small error; and the resistance is small and the smoothness is good; driven by the first servo motor, the rotation of the swing arm is realized, and the operation is convenient.

[0022] Further, the wafer suction component includes a telescopic rod. The fixed end of the telescopic rod is fixed on the swing arm. The movable end of the telescopic rod faces downward and is provided with a vacuum suction nozzle. The vacuum suction nozzle is connected with a pneumatic pipeline.

[0023] The pneumatic pipeline can be used to connect equipment such as a vacuum pump, which is convenient for controlling the suction and release actions of the vacuum suction nozzle; the telescopic rod drives the vacuum suction nozzle to suck / place the wafer downward and pick up the wafer upward, and the operation is convenient.

[0024] Further, the pneumatic pipeline extends along the side surface of the swing arm to the outside of the base. Both the side surface of the swing arm and the outside of the base are provided with a plurality of pipe clamps for the pneumatic pipeline.

[0025] It is convenient to lay out the pneumatic pipeline, avoid the pneumatic pipeline being messy, and occupy little space.

[0026] Further, the X-Y motion module includes an X-axis linear module and a Y-axis linear module. The fixed end of the X-axis linear module is fixed on an external entity structure. The movable end of the X-axis linear module is connected to the fixed end of the Y-axis linear module; the movable end of the Y-axis linear module is connected to the corresponding first swing arm mechanism or the loading platform.

[0027] The X-axis linear module drives the Y-axis linear module to move along the X-axis. The movable end of the Y-axis linear module can move along the Y-axis, so as to superimpose the XY plane motion, drive the corresponding first swing arm mechanism or the loading platform to adjust the plane coordinates, and realize that the swing arm mechanism can accurately pick up and place the wafer.

[0028] Further, the angle correction platform includes a second servo motor. The output shaft of the second servo motor faces upward and is connected to a wafer platform.

[0029] The second servo motor drives the wafer platform to rotate, so as to adjust the angle of the wafer on the wafer platform, and the operation is convenient. Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of the present utility model.

[0031] Figure 2 For Figure 1 the A-A view.

[0032] Figure 3 It is a schematic structural view of the first and second swing arm mechanisms.

[0033] In the attached drawings, the technical features represented by each reference numeral are as follows:

[0034] 1 - Fine alignment platform; 2 - First swing arm mechanism; 3 - Angle correction platform; 4 - Second swing arm mechanism; 5 - Loading platform; 6 - Positioning camera; 7 - X-Y motion module; 8 - Limit post; 9 - Buffer spring; 10 - Magnet; 11 - Base; 12 - Swing arm; 13 - First servo motor; 14 - Mounting cylinder; 15 - Telescopic rod; 16 - Vacuum suction nozzle; 17 - Pneumatic pipeline; 18 - Pipe clamp; 19 - X-axis linear module; 20 - Y-axis linear module; 21 - Second servo motor; 22 - Wafer platform. Detailed implementation mode

[0035] The principles and features of the present invention will be described below in conjunction with the attached drawings. The examples given are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0036] The present invention is shown in Figures 1-3 .

[0037] The present invention provides a wafer double swing arm sheet arranging device, which includes a fine alignment platform 1, a first swing arm mechanism 2, an angle correction platform 3, a second swing arm mechanism 4, and a loading platform 5 arranged in sequence along the X-axis direction of the plane. Positioning cameras 6 are respectively arranged above the fine alignment platform 1, above the angle correction platform 3, and above the loading platform 5; X-Y motion modules 7 capable of driving themselves to move along the X-Y plane are respectively arranged above the first swing arm mechanism 2 and below the loading platform 5; the fine alignment platform 1 and the angle correction platform 3 are within the working range of the first swing arm mechanism 2, and the angle correction platform 3 and the loading platform 5 are within the working range of the second swing arm mechanism 4.

[0038] Principle:

[0039] The swing arms 12 of the first swing arm mechanism 2 and the second swing arm mechanism 4 can rotate 180° horizontally. A suction nozzle is provided at the extending end of the self swing arm 12, and the suction nozzle is used to suck the wafer; when the swing arm 12 points to the X-axis direction, the position where the suction nozzle is located is recorded as the coordinate origin of the swing arm mechanism; when the swing arm 12 rotates 180° to point to the opposite direction of the X-axis, the position where the suction nozzle is located is recorded as the coordinate end point of the swing arm mechanism. Structures such as suction nozzles for sucking wafers are prior art.

[0040] When arranging the wafers, the original wafer film is fixed to the loading platform 5, and a new film is fixed to the fine alignment platform 1. The X-Y motion module 7 under the loading platform 5 drives the loading platform 5 to move. The first positioning camera 6 captures the wafer coordinates on the loading platform 5, so that the nth wafer moves to the coordinate origin of the second swing arm mechanism 4. After the second swing arm mechanism 4 sucks the wafer, it rotates 180°, and places the wafer on the angle correction platform 3. The second positioning camera 6 captures the wafer angle on the angle correction platform 3, and the angle correction platform 3 rotates to precisely adjust the wafer angle. The X-Y motion module 7 above the first swing arm mechanism 2 drives the first swing arm mechanism 2 to move. The second positioning camera 6 captures the wafer coordinates on the angle correction platform 3, so that the coordinate origin of the first swing arm mechanism 2 is directly opposite to the wafer on the angle correction platform 3. After the first swing arm mechanism 2 sucks the wafer, it rotates 180°, and the X-Y motion module 7 below drives the first swing arm mechanism 2 to move. The third positioning camera 6 captures the vacancy coordinates on the fine alignment platform 1, so that the coordinate end point of the first swing arm mechanism 2 is directly opposite to the nth vacancy on the fine alignment platform 1. Finally, the first swing arm mechanism 2 places the wafer on the fine alignment platform 1 to complete the precise wafer arrangement. Among them, n is a positive integer representing the order of transferring the wafers.

[0041] In summary, by adopting the present utility model, the angle of the wafer is adjusted by the angle correction platform 3, and the X-Y motion module 7 drives the first swing arm mechanism 2 to pick up the wafer from the angle correction platform 3 and place it in the corresponding vacancy on the fine alignment platform 1, realizing the angle adjustment of the wafer and the precise wafer arrangement in X-Y coordinates; only two X-Y motion modules 7 are needed, with less quantity, lower cost and convenient maintenance.

[0042] Further, as Figures 1-2 shown: Limiting columns 8 are respectively arranged on the starting side and the ending side of the first swing arm mechanism 2, and on the starting side and the ending side of the second swing arm mechanism 4; the limiting columns 8 are distributed along the X-axis direction, and can restrict the first swing arm mechanism 2 and the second swing arm mechanism 4 to rotate respectively within their own ranges of 0° to 180°.

[0043] The starting point and the ending point of the first swing arm mechanism 2 and the second swing arm mechanism 4 are 180° apart. Through the limiting columns 8, it is ensured that the first swing arm mechanism 2 and the second swing arm mechanism 4 can accurately stop at the starting point or the ending point, improving the accuracy of the stopping position and reducing the wafer arrangement error.

[0044] Further, buffer springs 9 and magnets 10 horizontally extend along the limiting columns 8. The buffer springs 9 and magnets 10 on both sides of the first swing arm mechanism 2 are at the same height as the first swing arm mechanism 2, and the buffer springs 9 and magnets 10 on both sides of the second swing arm mechanism 4 are at the same height as the second swing arm mechanism 4.

[0045] When the first swing arm mechanism 2 and the second swing arm mechanism 4 rotate to the starting point or the end point, the buffer spring 9 first abuts against the swing arm 12 to reduce kinetic energy, reduce impact, avoid wafer shaking off, and extend service life; then the magnet 10 absorbs the swing arm 12 to improve stability.

[0046] Furthermore, the magnet 10 is located inside the buffer spring 9 .

[0047] It is convenient to make full use of space, reduce space occupancy and has a compact structure.

[0048] Furthermore, the magnet 10 is an electromagnet.

[0049] When the first swing arm mechanism 2 and the second swing arm mechanism 4 begin to swing, the driving force and the elastic force of the buffer spring 9 jointly drive the swing arm 12 to move; at this time, the electromagnet power supply can be cut off to eliminate the magnetic force, reduce the driving resistance, and the movement response speed is fast.

[0050] Further, such as Figure 3 As shown: the first swing arm mechanism 2 and the second swing arm mechanism 4 both include a base 11 and a swing arm 12, a first servo motor 13 is provided in the base 11, a mounting tube 14 is provided at one end of the swing arm 12, an output shaft of the first servo motor 13 extends into the mounting tube 14 and is transmission-connected with the mounting tube 14, and the outer side of the mounting tube 14 is connected to the base 11 through at least two bearings; a wafer suction component is provided at the other end of the swing arm 12.

[0051] Note: The transmission connection can be connected by spline connection or key connection. During installation, the base 11 of the first swing arm mechanism 2 is fixed on the corresponding XY motion module 7, and the base 11 of the second swing arm mechanism 4 is fixed on an external fixed entity structure.

[0052] The mounting tube 14 and the base 11 are mutually limited, and two bearings ensure that the mounting tube 14 and the swing arm 12 rotate horizontally relative to the base 11 with small error, small resistance and good smoothness. The swing arm 12 is driven by the first servo motor 13 to realize the rotation of the swing arm 12, which is easy to operate.

[0053] Furthermore, the wafer suction component includes a telescopic rod 15 , the fixed end of the telescopic rod 15 is fixed on the swing arm 12 , the movable end of the telescopic rod 15 is downward and is provided with a vacuum suction nozzle 16 , and the vacuum suction nozzle 16 is connected to a pneumatic pipeline 17 .

[0054] The pneumatic pipeline 17 can be used to connect a vacuum pump and other equipment to facilitate the control of the suction and release action of the vacuum suction nozzle 16; the vacuum suction nozzle 16 is driven by the telescopic rod 15 to suck / place the wafer downward and pick up the wafer upward, which is easy to operate.

[0055] Further, the pneumatic pipeline 17 extends along the side surface of the swing arm 12 to the outside of the base 11, and a plurality of pipe clamps 18 for the pneumatic pipeline 17 are provided on the side surface of the swing arm 12 and the outside of the base 11.

[0056] Note: At the transition position between the base 11 and the swing arm 12, the pneumatic pipeline 17 has a surplus length to facilitate adapting to the rotation of the swing arm 12.

[0057] It is convenient to lay out the pneumatic pipeline 17, avoid the chaos of the pneumatic pipeline 17, and occupy a small space.

[0058] Further, as Figures 1-2 shown: The X-Y motion module 7 includes an X-axis linear module 19 and a Y-axis linear module 20. The fixed end of the X-axis linear module 19 is fixed to an external entity structure, and the moving end of the X-axis linear module 19 is connected to the fixed end of the Y-axis linear module 20; the moving end of the Y-axis linear module 20 is connected to the corresponding first swing arm mechanism 2 or the loading platform 5.

[0059] Note: The linear module is a prior art product and can adopt a linear motor or a lead screw pair; when adopting a linear motor, the linear motor guide rail is its fixed end, and the slider part is its moving end; when adopting a lead screw pair, the mounting seats at both ends of the lead screw are its fixed ends, and the slider threadedly connected to the lead screw is its moving end. The X-axis and Y-axis are its direction definitions.

[0060] The X-axis linear module 19 drives the Y-axis linear module 20 to move along the X-axis, and the moving end of the Y-axis linear module 20 can move along the Y-axis, so as to superimpose the XY plane motion, drive the corresponding first swing arm mechanism 2 or the loading platform 5 to adjust the plane coordinates, and realize that the swing arm mechanism can accurately pick up and place wafers.

[0061] Further, the angle correction platform 3 includes a second servo motor 21, and the output shaft of the second servo motor 21 is upward and connected to a wafer platform 22.

[0062] The second servo motor 21 drives the wafer platform 22 to rotate, thereby adjusting the angle of the wafer on the wafer platform 22, which is convenient to operate.

[0063] In the description of the present utility model, it should be understood that if descriptive terms indicating orientation, direction or positional relationship appear, such as: "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of understanding the present utility model and simplifying the description, rather than indicating or implying that the part, element or whole referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0064] In addition, if descriptive terms indicating order appear, such as: "first", "second", etc., their use in this specification is for the convenience of understanding or simplifying the description. For example, in order to distinguish multiple technical features of the same type or function and having to be mentioned separately, this specification may use the method of prefixing or suffixing order descriptive terms to distinguish them. Therefore, it should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0065] In the present utility model, if descriptive terms indicating the relationship between structure and function are used, such as: "mount", "connect", "join", "fix", etc., unless otherwise clearly specified and defined, they should be understood in a broad sense. For example, "mount", "connect", "join", etc. can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements; "fix" can be a fixed connection forming an integral body, or a detachable fixation through fasteners; it can be a direct fixation or a fixation through an intermediate medium. For those of ordinary skill in the art, the specific meaning of the above descriptive terms in the present utility model can be understood according to specific circumstances, the context, the coherence of the context before and after, etc.

[0066] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments, examples, and the features of different embodiments and examples described in this specification, and these combinations or combinations should fall within the scope summarized by the present utility model.

[0067] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Within the scope of information available to those of ordinary skill in the art through public channels, and in combination with the technical inspiration given in this application document, the changes, modifications, substitutions, and variations made to the above embodiments can still be covered by the protection scope of this application.

Claims

1. A wafer double swing arm arrangement device, characterized in that: The invention comprises a precision arrangement platform (1), a first swing arm mechanism (2), an angle correction platform (3), a second swing arm mechanism (4), and a loading platform (5) which are sequentially arranged along the X-axis direction of a plane; positioning cameras (6) are respectively arranged above the precision arrangement platform (1), above the angle correction platform (3), and above the loading platform (5); an XY motion module (7) capable of driving itself to move along an XY plane is respectively arranged above the first swing arm mechanism (2) and below the loading platform (5); the precision arrangement platform (1) and the angle correction platform (3) are located within the working range of the first swing arm mechanism (2), and the angle correction platform (3) and the loading platform (5) are located within the working range of the second swing arm mechanism (4).

2. The wafer double-swing arm wafer arrangement device according to claim 1, characterized in that: Limiting columns (8) are respectively provided on the starting point side and the end point side of the first swing arm mechanism (2) and the starting point side and the end point side of the second swing arm mechanism (4); the limiting columns (8) are distributed along the X-axis direction and can constrain the first swing arm mechanism (2) and the second swing arm mechanism (4) to rotate within the range of 0° to 180° respectively.

3. The wafer double-swing arm wafer arrangement device according to claim 2, characterized in that: A buffer spring (9) and a magnet (10) extend horizontally from the upper edge of the limit column (8); the buffer springs (9) and the magnet (10) on both sides of the first swing arm mechanism (2) are at the same height as the first swing arm mechanism (2); and the buffer springs (9) and the magnet (10) on both sides of the second swing arm mechanism (4) are at the same height as the second swing arm mechanism (4).

4. The wafer double-swing arm wafer arrangement device according to claim 3, characterized in that: The magnet (10) is located inside the buffer spring (9).

5. The wafer double-swing arm wafer arrangement device according to claim 3, characterized in that: The magnet (10) is an electromagnet.

6. The wafer double-swing arm wafer arrangement device according to claim 1, characterized in that: The first swing arm mechanism (2) and the second swing arm mechanism (4) both comprise a base (11) and a swing arm (12); a first servo motor (13) is arranged inside the base (11); a mounting tube (14) is arranged at one end of the swing arm (12); an output shaft of the first servo motor (13) extends into the mounting tube (14) and is transmission-connected to the mounting tube (14); the outer side of the mounting tube (14) is connected to the base (11) via at least two bearings; a wafer suction component is arranged at the other end of the swing arm (12).

7. The wafer double-swing arm wafer arrangement device according to claim 6, characterized in that: The wafer suction component comprises a telescopic rod (15), the fixed end of the telescopic rod (15) is fixed on the swing arm (12), the movable end of the telescopic rod (15) is downward and is provided with a vacuum suction nozzle (16), and the vacuum suction nozzle (16) is connected to a pneumatic pipeline (17).

8. The wafer double-swing arm wafer arrangement device according to claim 7, characterized in that: The pneumatic pipeline (17) extends along the side of the swing arm (12) to the outside of the base (11), and a plurality of pipe clamps (18) for the pneumatic pipeline (17) are provided on the side of the swing arm (12) and the outside of the base (11).

9. The wafer double-swing arm wafer arrangement device according to claim 1, characterized in that: The XY motion module (7) comprises an X-axis linear module (19) and a Y-axis linear module (20); the fixed end of the X-axis linear module (19) is fixed to an external entity structure, the movable end of the X-axis linear module (19) is connected to the fixed end of the Y-axis linear module (20); and the movable end of the Y-axis linear module (20) is connected to the corresponding first swing arm mechanism (2) or the loading platform (5).

10. The wafer double-swing arm wafer arrangement device according to claim 1, characterized in that: The angle correction platform (3) comprises a second servo motor (21), the output shaft of the second servo motor (21) is upward and connected to the wafer platform (22).

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