Wafer guide plate and wafer packaging and loading structure
By providing extensions and through holes on the guide plate, the pollution problem caused by the exposed end of the screw is solved, and the effect of improving production quality is achieved.
Patent Information
- Application Number
- CN202421916348.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-08
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-08
AI Technical Summary
In the existing wafer packaging upper structure, the screw will form an exposed end when it moves downward in the vertical direction, causing lubricating oil to overflow and contact with other components, causing pollution and affecting production quality.
An extension is provided on one side of the guide plate body, and a through hole matching the screw is provided in the extension so that when the machine moves, the exposed end of the screw can be wrapped in the through hole to avoid contact with other components.
It effectively avoids contact between the exposed end of the screw and other components, prevents pollution, and improves production quality.
Smart Images
Figure CN222914743U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer packaging, in particular to a wafer guiding plate and a wafer loading structure for wafer packaging. Background Art
[0002] The wafer loading structure for wafer packaging is a device used for loading wafers and stretching the wafer blue film for subsequent applications. Specifically, as Figure 1 shown, in the prior art, the wafer loading structure for wafer packaging includes a substrate 501, a machine table 601, and wafer guiding plates 101 arranged on both sides of the machine table 601; the machine table 601 is connected to the substrate 501 through a lead screw 701, enabling the machine table 601 to move in the vertical direction; among them, an outward expanding wafer ring 801 is provided on the machine table 601, and a gap for the wafer to pass through is reserved between the outward expanding wafer ring 801 and the machine table 601 to push the wafer onto the surface of the machine table 601; an inward expanding wafer ring 901 is fixed on the substrate 501, and the inward expanding wafer ring 901 is placed inside the machine table 601. When the machine table 601 moves downward in the vertical direction, the wafer blue film is lapped on the inward expanding wafer ring 901 to complete the stretching of the wafer blue film.
[0003] However, through actual application, it is found that the above device has certain defects: when the lead screw 701 runs to drive the machine table 601 to move downward in the vertical direction, one end of the lead screw 701 will protrude outside the machine table 601 to form an exposed end. Since lubricating oil usually needs to be applied to the surface of the lead screw 701 to ensure the stability of operation, there is a situation where the exposed end comes into contact with other components and forms contamination, affecting the production quality.
[0004] Therefore, a wafer guiding plate and a wafer loading structure for wafer packaging are needed to solve the above problems. Summary of the Utility Model
[0005] The utility model aims to solve at least one of the technical problems existing in the prior art; for this purpose, the utility model provides a wafer guiding plate and a wafer loading structure for wafer packaging to avoid the situation that when the machine table moves downward in the vertical direction, one end of the lead screw is exposed on the upper surface of the machine table, resulting in direct contact between the lead screw and other components and forming contamination, ultimately affecting the production quality. The utility model is provided with an extension part on one side of the guiding plate body, and a through hole matching the lead screw is arranged in the extension part, so that when the machine table moves, the exposed end of the lead screw can be wrapped to avoid the situation that the exposed end comes into direct contact with other components and forms contamination.
[0006] To achieve the above object, the first aspect of the utility model provides a wafer guiding plate, which includes a guiding plate body arranged on both sides of the machine table and an extension part;
[0007] The extension part is arranged on the side of the guide plate body facing the wafer, and is formed with a penetrating step groove for the wafer;
[0008] The extension part has a through hole inside, and the through hole is matched with the lead screw built in the machine platform;
[0009] When the lead screw rotates to drive the machine platform to move downward, the exposed end of the lead screw extending to the upper surface of the machine platform is hidden in the through hole.
[0010] Furthermore, the thickness of the extension part is one-third to one-half of the thickness of the guide plate body, and the upper surface of the extension part is flush with the upper surface of the guide plate body to form the step groove.
[0011] Furthermore, the extension part and the guide plate body are integrally formed.
[0012] Furthermore, a plurality of cleaning notches are also arranged inside the extension part, and the cleaning notches are located between the through hole and the guide plate body, for the operator to pass a tool through the cleaning notches to clean the side of the guide plate body facing the wafer.
[0013] Furthermore, a plurality of elastic roller members are slidably mounted on the side of the guide plate body facing the wafer;
[0014] All of the plurality of elastic roller members can move in a direction perpendicular to the wafer input direction.
[0015] Furthermore, the elongation amounts of the plurality of elastic roller members increase sequentially along the wafer input direction.
[0016] Furthermore, the elastic roller member includes a slider and a roller body;
[0017] A groove is arranged on one side of the guide plate body;
[0018] The slider is slidably mounted in the groove and is connected to the inner wall of the groove through a compression spring;
[0019] The roller body is rotatably mounted at one end of the slider extending outside the groove.
[0020] On the other hand, the present invention also provides a wafer encapsulation loading structure, including a substrate with a plurality of lead screws built in, a machine platform, and the wafer guide plate described in the above embodiment;
[0021] The machine platform is threadedly connected to the plurality of lead screws, so that when the lead screws rotate, the machine platform can move in the vertical direction;
[0022] Among them, when the machine moves in the vertical direction towards the substrate, it can pull the wafer blue film located inside the machine to stretch;
[0023] The wafer guide plates are symmetrically arranged on the machine.
[0024] Furthermore, the wafer guide plates are detachably connected to the machine.
[0025] Furthermore, the wafer guide plates are fixedly connected to the machine by bolts.
[0026] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0027] By providing an extension part on one side of the guide plate body, and a through hole matching the lead screw is provided in the extension part, when the machine moves downward in the vertical direction under the driving force of the lead screw and forms an exposed end, the through hole can wrap and cover the exposed end of the lead screw, that is, the exposed end is hidden in the through hole. Therefore, it can effectively avoid the situation that other components are contaminated due to the oil stain on the exposed end, resulting in poor production quality. Description of the Drawings
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 It is a top view of a wafer encapsulation loading structure in the prior art;
[0030] Figure 2 It is a schematic structural diagram of a wafer guide plate in an embodiment of the present utility model;
[0031] Figure 3 It is a top view of a wafer guide plate in an embodiment of the present utility model;
[0032] Figure 4 It is a top view of a wafer guide plate in another embodiment of the present utility model;
[0033] Figure 5 It is a top view of a wafer encapsulation loading structure in an embodiment of the present utility model.
[0034] Reference Numerals in the Drawings:
[0035] 1. Guide plate body; 2. Extension part; 21. Through hole; 22. Cleaning notch; 3. Step groove; 4. Elastic roller member; 41. Slide block; 42. Roller body; 5. Substrate; 6. Machine table; 7. Lead screw. Detailed implementation mode
[0036] The technical solutions of the present utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative work shall fall within the protection scope of the present utility model.
[0037] Embodiment 1
[0038] Please refer to Figure 2 and Figure 3 As shown, the first aspect embodiment of the present utility model provides a wafer guide plate, including a guide plate body 1 and an extension part 2 arranged on both sides of the machine table 6.
[0039] Among them, the extension part 2 is arranged on the side of the guide plate body 1 facing the wafer, and a step groove 3 for the penetration of the wafer is formed, that is, by forming the step groove 3, the existence of the extension part 2 is prevented from interfering with the normal placement of the wafer.
[0040] The extension part 2 has a through hole 21 inside, and the through hole 21 is matched with the lead screw 7 built in the machine table 6. When the lead screw 7 rotates to drive the machine table 6 to move downward, the exposed end of the lead screw 7 extending to the upper surface of the machine table 6 is hidden in the through hole 21.
[0041] In this device, by arranging the extension part 2 on one side of the guide plate body 1, and the through hole 21 matching the lead screw 7 is arranged inside the extension part 2, when the machine table 6 moves downward along the vertical direction under the driving force of the lead screw 7 and forms an exposed end, the through hole 21 can wrap and cover the exposed end of the lead screw 7, that is, the exposed end is hidden in the through hole 21, so it can effectively prevent the pollution of other components caused by the oil stain on the exposed end, resulting in poor production quality.
[0042] In this embodiment, the size of the extension part 2 is further limited to better form the step groove 3 for the penetration of the wafer. Specifically, the thickness of the extension part 2 is one-third to one-half of the thickness of the guide plate body 1, and the upper surface of the extension part 2 is flush with the upper surface of the guide plate body 1 to form the step groove 3.
[0043] Among them, the extension part 2 and the guide plate body 1 are integrally formed, improving stability and connection strength.
[0044] In other embodiments, due to the existence of the extension portion 2 , it is difficult for operators to clean the side of the guide plate body 1 facing the wafer, so the extension portion 2 is further limited herein.
[0045] Specifically, a plurality of cleaning slots 22 are provided inside the extension portion 2, and the cleaning slots 22 are located between the through hole 21 and the guide plate body 1, so that an operator can pass a tool through the cleaning slots 22 to clean the side of the guide plate body 1 facing the wafer.
[0046] The shape of the cleaning slot 22 can be set to a circular hole shape or a key slot shape, and can be selectively set according to needs, which is not limited here.
[0047] Embodiment 2
[0048] like Figure 4 As shown, the difference between this embodiment and the first embodiment is that an elastic roller member 4 is additionally provided to enhance the guiding effect of the guide plate body 1, thereby preventing the wafer from forming a hard contact with the guide plate body 1 due to its own poor placement during the wafer loading process, thereby preventing damage and the like.
[0049] Specifically, a plurality of elastic roller members 4 are slidably mounted on the side of the guide plate body 1 facing the wafer.
[0050] The plurality of elastic roller members 4 are all capable of moving in a direction perpendicular to the wafer input direction, and are used to correct the wafer so that the wafer enters the machine 6 in a specific posture, thereby avoiding the situation where the wafer cannot be loaded due to tilting when entering.
[0051] It should be noted that the elongation of the multiple elastic roller members 4 increases successively along the input direction of the wafer, so an isosceles trapezoidal opening groove is formed between the two wafer guide plates, and the opening of the opening groove gradually increases from the inside to the outside, so that when the wafer enters the machine 6 through the opening groove, it can be squeezed by the elastic roller member 4 and adaptively move closer along the direction of the axis of the opening groove, so as to effectively reduce the number of abnormalities occurring during wafer input.
[0052] The elastic roller member 4 includes a slider 41 and a roller body 42 .
[0053] A groove is provided on one side of the guide plate body 1, and the slider 41 is slidably installed in the groove and connected to the inner wall of the groove through a compression spring. The roller body 42 is rotatably installed on one end of the slider 41 extending to the outside of the groove, so that the roller body 42 can roll and rub against the metal frame of the outer wall of the wafer and can also contract to provide motion compensation perpendicular to the wafer input direction.
[0054] Embodiment 3
[0055] like Figure 5 As shown, this embodiment further proposes a wafer packaging upper chip structure based on the first embodiment, so as to effectively prevent one end of the screw rod 7 from being exposed to the upper surface of the machine table 6 when the machine table 6 moves downward in the vertical direction, thereby causing other components to be easily in direct contact with the screw rod 7 and form contamination.
[0056] Specifically, a wafer packaging upper chip structure includes a substrate 5 with multiple screw rods 7 built in, a machine table 6 and the wafer guide plate described in the first embodiment.
[0057] The platform 6 is threadedly connected to the plurality of screw rods 7 so that when the screw rods 7 rotate, the platform 6 can move in the vertical direction.
[0058] When the platform 6 moves in the vertical direction toward the substrate 5 , the blue film of the wafer in the platform 6 can be pulled to stretch. This is a prior art and will not be described in detail here.
[0059] The wafer guide plates are symmetrically arranged on the platform 6 .
[0060] The device has an extension portion 2 with a through hole 21 inside, and the through hole 21 matches the screw rod 7, so that when the screw rod 7 is exposed, the exposed end of the screw rod 7 can be wrapped, thereby preventing oil stains on the screw rod 7 from contacting other parts and causing contamination, thereby improving subsequent production quality.
[0061] In this embodiment, the wafer guide plate is detachably connected to the platform 6 .
[0062] Specifically, the wafer guide plate is fastened to the platform 6 by bolts.
[0063] The above embodiments are only used to illustrate the technical method of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical method of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the utility model.
Claims
1. A wafer guide plate, characterized in that: It comprises a guide plate body (1) and an extension part (2) arranged on both sides of a machine platform (6); The extension portion (2) is arranged on a side of the guide plate body (1) facing the wafer, and is formed with a step groove (3) for the wafer to penetrate; The extension portion (2) has a through hole (21) inside, and the through hole (21) matches the screw rod (7) built into the machine platform (6); When the screw rod (7) rotates to drive the machine platform (6) to move downward, the exposed end of the screw rod (7) extending to the upper surface of the machine platform (6) is hidden in the through hole (21).
2. The wafer guide plate according to claim 1, characterized in that: The thickness of the extension portion (2) is one third to one half of the thickness of the guide plate body (1), and the upper surface of the extension portion (2) is flush with the upper surface of the guide plate body (1) to form the step groove (3).
3. The wafer guide plate according to claim 2, characterized in that: The extension portion (2) and the guide plate body (1) are integrally formed.
4. The wafer guide plate according to claim 1, characterized in that: A plurality of cleaning slots (22) are also provided inside the extension portion (2), and the cleaning slots (22) are located between the through hole (21) and the guide plate body (1), so that an operator can use a tool to pass through the cleaning slots (22) to clean the side of the guide plate body (1) facing the wafer.
5. The wafer guide plate according to claim 1, characterized in that: A plurality of elastic roller components (4) are slidably mounted on one side of the guide plate body (1) facing the wafer; The plurality of elastic roller components (4) are all capable of moving in a direction perpendicular to the wafer input direction.
6. The wafer guide plate according to claim 5, characterized in that: The elongation of the plurality of elastic roller components (4) increases sequentially along the input direction of the wafer.
7. The wafer guide plate according to claim 5, characterized in that: The elastic roller member (4) comprises a slider (41) and a roller body (42); A groove is provided on one side of the guide plate body (1); The slider (41) is slidably mounted in the groove and connected to the inner wall of the groove via a compression spring; The roller body (42) is rotatably mounted on one end of the slider (41) extending to the outside of the groove.
8. A wafer packaging chip structure, characterized in that: It comprises a substrate (5) with a plurality of screw rods (7) built therein, a machine table (6) and a wafer guide plate as claimed in any one of claims 1 to 7; The machine platform (6) is threadably connected to the plurality of screw rods (7), so that when the screw rods (7) rotate, the machine platform (6) can move in the vertical direction; When the platform (6) moves in a vertical direction toward the substrate (5), the blue film of the wafer located in the platform (6) can be stretched; The wafer guide plates are symmetrically arranged on the machine platform (6).
9. The wafer package upper chip structure according to claim 8, characterized in that: The wafer guide plate is detachably connected to the machine platform (6).
10. The wafer package upper chip structure according to claim 9, characterized in that: The wafer guide plate is fastened to the machine platform (6) by means of bolts.