Wafer conveying device

Abstract

The utility model discloses a wafer conveying device. The wafer conveying device comprises a lifting module, a conveying module and a conveying assembly. The conveying assembly comprises a plurality of conveying frames and a plurality of manipulators, the conveying frames and the manipulators are the same in number and are in one-to-one correspondence, the manipulators are arranged on the conveying frames, the manipulators are sequentially arranged from bottom to top, and the manipulators are used for bearing the wafers; the conveying frame is connected with the conveying module, the conveying module can drive the conveying frame to move in the horizontal direction, the conveying module is connected with the lifting module, and the lifting module can drive the conveying module to drive the conveying frame to ascend and descend. When the wafer conveying device is applied, more than two wafers can be conveyed at one time, the conveying frequency can be reduced, the conveying time can be shortened, and the production efficiency can be correspondingly improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a wafer transfer device. Background Art

[0002] The semiconductor manufacturing process mainly involves multiple exposure and development, etching, and film deposition on wafers to form semiconductor devices with various structures. Among them, the diffusion furnace is one of the important process equipment in the front process of the semiconductor production line, and is usually used for processes such as diffusion, oxidation, annealing, and alloying, such as the formation of gate oxide, thermal annealing of the silicon wafer surface after ion implantation, and thin film deposition. Currently, the most widely used furnace tube equipment is the vertical diffusion furnace, where the quartz boat is perpendicular to the horizontal plane, which is more conducive to the transfer of silicon wafers by the manipulator, and the in-wafer process parameter consistency is better.

[0003] The general process of the existing furnace tube equipment for transferring wafers is as follows: AMHS overhead crane system → load port of the machine tool → FIMS scans the number and position of wafers in the wafer cassette → buffer wafer cassette storage area → FIMS transfers the wafers to the boat → boat → FIMS transfers the wafers back to the wafer cassette → buffer wafer cassette storage area → unload port of the machine tool → AMHS overhead crane system. Specifically, after FIMS scans the number and position of wafers in the wafer cassette, the transfer control system will feedback the information of the placement position and number of wafers in the wafer cassette to the manipulator of the wafer transfer system. The manipulator transfers the wafers from the wafer cassette to the boat, and then returns along the original path when transferring the wafers back from the boat to the wafer cassette. The existing wafer transfer system generally has multiple manipulators arranged from bottom to top. For example, there are 5 manipulators. The first manipulator is controlled by one moving axis, and the second to fifth manipulators are controlled by another moving axis. To ensure the continuity of wafer placement in the boat, only 1 wafer or 5 consecutive wafers can be transferred each time. If the number of consecutive wafers placed in the wafer cassette is less than the number of manipulators, that is, not 5 consecutive wafers placed together, for example, 2 - 4 consecutive wafers placed together, each wafer needs to be transferred, resulting in a large number of transfer times, a long transfer time, and low production efficiency.

[0004] Therefore, how to provide a solution to overcome or alleviate the above defects is still a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Utility Model

[0005] The purpose of this application is to provide a wafer transfer device to reduce the number of transfers, shorten the transfer time, and improve production efficiency.

[0006] To solve the above technical problems, this application provides a wafer transfer device, including a lifting module, a transfer module, and a transfer component;

[0007] The transfer component includes a plurality of transfer racks and a plurality of manipulators. The number of the transfer racks is the same as that of the manipulators and they are in one-to-one correspondence. The manipulators are arranged on the transfer racks. The plurality of manipulators are arranged in sequence from bottom to top. The manipulators are used to carry wafers.

[0008] The transfer rack is connected to the transfer module. The transfer module can drive the transfer rack to move in the horizontal direction. The transfer module is connected to the lifting module. The lifting module can drive the transfer module to drive the transfer rack to lift and lower.

[0009] Optionally, the transfer module includes a transfer base and a plurality of horizontal transfer guide rails.

[0010] The transfer base is connected to the lifting module. The plurality of transfer guide rails are arranged in parallel on the top of the transfer base. The number of the transfer guide rails is the same as that of the transfer racks and they are in one-to-one correspondence. The transfer rack is slidably arranged on the transfer guide rail and can move along the transfer guide rail.

[0011] Optionally, the transfer rack has a downward opening, and the sizes of the openings of the transfer racks corresponding to the plurality of transfer guide rails increase in sequence.

[0012] Optionally, the opening is rectangular or a circular arc arched upward.

[0013] Optionally, the transfer module further includes a plurality of transfer driving components.

[0014] The number of the transfer driving components is the same as that of the transfer racks and they are in one-to-one correspondence. The transfer driving components are connected to the transfer racks, and the transfer driving components can drive the transfer racks to move along the transfer guide rails.

[0015] Optionally, the transfer driving components are servo motors, cylinders or oil cylinders.

[0016] Optionally, it further includes a mounting base.

[0017] The transfer module is connected to the mounting base. The mounting base is connected to the lifting module. The lifting module can drive the mounting base to drive the transfer module to lift and lower.

[0018] Optionally, it further includes an in-position sensor.

[0019] The installation base includes an installation seat and an installation frame. The installation frame is arranged on the top of the installation seat. The transfer module is connected to the installation seat, and the installation seat is connected to the lifting module. The in-position sensor is arranged on one side of the installation frame facing the transfer component. The number of in-position sensors is the same as that of the transfer racks and they are in one-to-one correspondence. The in-position sensor is used to detect whether the transfer rack is at the initial position of movement.

[0020] Optionally, it further includes a rotating base;

[0021] The transfer module is arranged on the top of the rotating base. The rotating base is connected to the installation base, and the rotating base can drive the transfer module to drive the transfer rack to rotate in the horizontal plane.

[0022] Optionally, the lifting module includes a lifting frame, a lifting guide rail and a lifting drive component;

[0023] The lifting guide rail is vertically arranged on the lifting frame. The lifting drive component is arranged on the lifting frame. The transfer module is slidably connected to the lifting guide rail. The output end of the lifting drive component is connected to the transfer module, and the lifting drive component can drive the transfer module to move along the lifting guide rail.

[0024] The wafer transfer device provided by the present application is provided with a lifting module, a transfer module and a transfer component. The transfer component includes a plurality of transfer racks and a plurality of manipulators. The number of transfer racks is the same as that of the manipulators and they are in one-to-one correspondence. The manipulators are arranged on the transfer racks. The plurality of manipulators are arranged in sequence from bottom to top. The transfer rack is connected to the transfer module, and the transfer module can drive the transfer rack to move in the horizontal direction. The transfer module is connected to the lifting module, and the lifting module can drive the transfer module to drive the transfer rack to lift. When in use, if the number of wafers continuously placed in the wafer cassette is less than the total number of manipulators, the transfer racks corresponding to two or more consecutive manipulators from bottom to top can be controlled to move, so as to realize the transfer of more than two wafers at a time, reduce the transfer times, shorten the transfer time, and correspondingly improve the production efficiency. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of the wafer transfer device according to the embodiment provided by the present application;

[0026] Figure 2 is Figure 1 a top view schematic diagram of;

[0027] Figure 3 It is a schematic structural diagram of the wafer transfer device according to the embodiment provided by the present application when transferring two consecutive wafers;

[0028] Figure 4 is Figure 3 a top view schematic diagram of.

[0029] The reference numerals in the above-mentioned drawings are explained as follows:

[0030] 1 - Lifting module, 11 - Lifting frame, 12 - Lifting guide rail;

[0031] 2 - Installation base, 21 - Installation seat, 22 - Installation frame;

[0032] 3 - Rotating base;

[0033] 4 - Conveying module, 41 - Conveying base, 42 - Conveying guide rail;

[0034] 5 - Conveying component, 51 - Conveying rack, 52 - Manipulator;

[0035] 6 - In - position sensor;

[0036] 7 - Wafer position detection component. Detailed implementation manners

[0037] In order to enable those skilled in the art to better understand the solution of this application, the following further detailed description of this application will be given in conjunction with the drawings and specific implementation manners.

[0038] It should be specifically noted that: the term "a plurality of" as used in this application means more than three.

[0039] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a communication connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meaning of the above terms in this application can be understood according to specific circumstances.

[0040] Please refer to Figures 1 to 2 , Figure 1 which is the structural schematic diagram of the wafer transfer device according to the embodiment provided by this application, Figure 2 and Figure 1 is the top - view schematic diagram of

[0041] In the embodiment provided by this application, the wafer transfer device is used for a vertical furnace tube, specifically for transferring wafers between a wafer cassette and a susceptor, that is, for transferring wafers from the wafer cassette to the susceptor or from the susceptor to the wafer cassette. It includes a lifting module 1, a conveying module 4, and a conveying component 5. Please combine Figure 1 and Figure 2It is understood that the transfer component 5 includes a plurality of transfer racks 51 and a plurality of manipulators 52. The number of transfer racks 51 is the same as that of the manipulators 52 and they correspond one by one. The manipulators 52 are arranged on the transfer racks 51. The plurality of manipulators 52 are arranged in sequence from bottom to top. The manipulators 52 are used to carry wafers. The transfer racks 51 are connected to the transfer module 4. The transfer module 4 can drive the transfer racks 51 to move in the horizontal direction. The transfer module 4 is connected to the lifting module 1. The lifting module 1 can drive the transfer module 4 to drive the transfer racks 51 to lift. Among them, in the wafer transfer device provided in this application, there are a plurality of transfer racks 51, and the specific number is denoted as N, N≥3. Accordingly, the number of manipulators 52 is also N, and the N manipulators 52 are arranged in sequence from bottom to top.

[0042] In this way, not only can the first transfer rack 51 from bottom to top be controlled to move to use the first manipulator 52 to transfer one wafer, but also the first to the nth (1 < n ≤ N) transfer racks 51 from bottom to top can be controlled to move to use the first to the nth manipulators 52 to transfer n wafers placed continuously. Therefore, when the number of wafers placed continuously in the wafer cassette is less than the total number of manipulators, the transfer racks 51 corresponding to two or more consecutive manipulators 52 from bottom to top can be controlled to move, so as to transfer more than two wafers at a time, which can reduce the transfer times, shorten the transfer time, and correspondingly improve the production efficiency.

[0043] In actual setting, the number N of the transfer racks 51 is not limited.

[0044] In the embodiment provided in this application, N = 5, that is, there are five groups of transfer racks 51 and manipulators 52. A wafer cassette can usually store up to 25 wafers at most. Taking the transfer of wafers from the wafer cassette to the susceptor as an example, under different placement conditions of the wafers in the wafer cassette, the transfer methods, transfer times of the prior art wafer transfer system that can only transfer 1 or 5 wafers at a time and the wafer transfer device in the embodiment of this application that can transfer 1 - 5 wafers at a time, and the transfer times that can be saved by this application are shown in Table 1 below:

[0045] Table 1

[0046]

[0047]

[0048] As can be seen from Table 1 above, a wafer cassette can store 1 to 25 wafers. When using the wafer transfer system in the prior art to transfer wafers from the wafer cassette to the susceptor, at least 1 transfer is required and at most 20 transfers are required. Each transfer takes 30 seconds. With a relatively large number of transfers and a long transfer time, the production efficiency is low. However, when using the wafer transfer device provided in the embodiments of the present application, at least 1 transfer is required and at most 5 transfers are required. The number of transfers can be reduced by 0 to 15 times, and the transfer time can be shortened by 0 to 450 seconds. The transfer efficiency of a single cassette Foup can be increased by 75%.

[0049] Similarly, when performing wafer transfer from the susceptor to the wafer cassette, a susceptor can usually carry 0 to 125 wafers. Using the wafer transfer device provided in the embodiments of the present application can save the transfer time by 0 to 2250 seconds, and can greatly improve the transfer efficiency.

[0050] In actual setting, the structural form of the transfer module 4 is not limited.

[0051] Please combine Figure 1 It should be understood that in the embodiments provided in the present application, the transfer module 4 includes a transfer base 41 and a plurality of horizontal transfer guide rails 42; the transfer base 41 is connected to the lifting module 1, and the plurality of transfer guide rails 42 are arranged in parallel on the top of the transfer base 41. The number of transfer guide rails 42 is the same as that of the transfer racks 51 and they correspond one by one. The transfer racks 51 are slidably arranged on the transfer guide rails 42, and the transfer racks 51 can move along the transfer guide rails 42. In this way, each transfer guide rail 42 can respectively provide guidance for the movement of each transfer rack 51 in the horizontal direction, making the forward and backward processes of the manipulator 52 smoother, thereby improving the stability of the wafer transfer process and ensuring the wafer transfer efficiency.

[0052] In actual setting, the specific structures of the transfer rack 51 and the transfer guide rail 42 are not limited.

[0053] Please combine Figure 1 and Figure 2It is understood that in the embodiments provided in the present application, the transfer rack 51 has a downward opening. In the horizontal direction perpendicular to the moving direction of the transfer rack 51, the sizes of the openings of the transfer racks 51 corresponding to the multiple transfer guide rails 42 increase in sequence. The transfer rack 51 corresponding to the larger-sized opening straddles the transfer rack 51 corresponding to the smaller-sized opening. Specifically, the horizontal direction perpendicular to the moving direction of the transfer rack 51 is defined as the arrangement direction. In the arrangement direction, the first to the Nth transfer guide rails 42 are arranged in sequence. The nth transfer guide rail 42 corresponds to the nth transfer rack 51. The sizes of the openings of the first to the Nth transfer racks 51 increase in sequence. This size specifically includes the length of the opening in the arrangement direction and the height in the vertical direction. At least a part of the (n - 1)th transfer rack 51 is disposed within the opening of the nth transfer rack 51. Among them, the transfer guide rail 42 may have two sliding grooves. The two sliding grooves of the nth transfer guide rail 42 may be respectively located outside the two sliding grooves of the (n - 1)th transfer guide rail 42. The part of the transfer rack 51 where the opening is provided is defined as the lower part, and the part above the opening is defined as the upper part. The lower part of the transfer rack 51 can be slidably disposed on the corresponding two sliding grooves respectively on both sides of the opening. The manipulator 52 can be disposed on the upper part of the transfer rack 51. In this way, the non-interfering movement of each transfer rack 51 in the horizontal direction and the parallel arrangement of each manipulator 52 from bottom to top are cleverly realized, which can further improve the stability of the wafer transfer process. Moreover, each transfer rack 51 is compactly integrated into the transfer base 41, making the structure of the entire wafer transfer device compact and occupying a smaller space.

[0054] In an embodiment not shown in the present application, the transfer guide rail 42 may have one sliding groove, and the bottom parts of the respective transfer racks 51 are slidably disposed on the corresponding sliding grooves. Obviously, Figure 1 The way that the bottom of the shown transfer rack 51 is provided with an opening and is slidably disposed on the two sliding grooves respectively on both sides of the opening has a better effect.

[0055] When specifically setting, the shape of the opening of the transfer rack 51 is not limited. For example, it can be rectangular or can be an upward-arching circular arc.

[0056] It should be noted that the sliding grooves of the respective transfer guide rails 42 may be located on the same horizontal plane, so that the installation points at the bottom of each transfer rack 51 are located on the same horizontal plane, thereby relatively ensuring the consistency of the reference positions of the respective manipulators 52.

[0057] In the embodiments provided in the present application, the transfer module 4 further includes a plurality of transfer driving components (not shown in the figure); the number of transfer driving components is the same as that of the transfer racks 51 and they correspond one by one. The transfer driving components are connected to the transfer racks 51, and the transfer driving components can drive the transfer racks 51 to move. In this way, each transfer driving component can respectively drive each transfer rack 51 to move along the corresponding transfer guide rail 42. The movement control of each transfer rack 51 is simpler and easier, and the efficiency of wafer transfer can be improved.

[0058] When specifically set, the structural form of the transfer driving component is not limited. For example, it can be a servo motor, a cylinder, or an oil cylinder. The connection method between the transfer rack 51 and the output end of the transfer driving component is also not limited. For example, it can be a gear-rack meshing method, a belt drive method, or a lead screw drive method, as long as it can drive the transfer rack 51 to move stably along the transfer guide rail 42.

[0059] Please combine Figure 1 and Figure 2 Understand that in the embodiment provided in the present application, the wafer transfer device further includes a mounting base 2; the transfer module 4 is connected to the mounting base 2, and the mounting base 2 is connected to the lifting module 1. Specifically, the transfer base 41 of the transfer module 4 can be connected to the mounting base 2, so that the transfer base 41 is indirectly connected to the lifting module 1 through the mounting base 2. The lifting module 1 can drive the mounting base 2 to drive the transfer module 4 to lift. In this way, the lifting process of the transfer module 4 can be made stable and reliable, which is beneficial to improving the stability of the lifting process of the manipulator 52.

[0060] When specifically set, the structure of the mounting base 2 is not limited.

[0061] As Figure 1 shown, in the embodiment provided in the present application, the wafer transfer device further includes an in-position sensor 6. The mounting base 2 includes a mounting seat 21 and a mounting frame 22. The mounting frame 22 is provided on the top of the mounting seat 21. The transfer module 4 is connected to the mounting seat 21, and the mounting seat 21 is connected to the lifting module 1. Specifically, the transfer base 41 of the transfer module 4 can be provided on the side of the mounting seat 21 away from the lifting module 1, so that the transfer base 41 is indirectly connected to the lifting module 1 through the mounting seat 21. The in-position sensor 6 is provided on the side of the mounting frame 22 facing the transfer component 5. The number of in-position sensors 6 is the same as that of the transfer racks 51 and they are in one-to-one correspondence. The in-position sensor 6 is used to detect whether the transfer rack 51 is located at the initial position of movement.

[0062] It is not difficult to understand that the initial position of the movement of the transfer rack 51 is its position when it is not working, specifically, it can be the position where one end of the transfer guide rail 42 close to the mounting frame 22 is located. When it is necessary to transfer the wafer, the transfer rack 51 moves along the transfer guide rail 42 and leaves the initial position. The setting of the in-position sensor 6 can detect whether the transfer rack 51 is located at the initial position, so as to accurately control the working state of each transfer rack 51 and improve the efficiency of wafer transfer.

[0063] In the embodiments provided by this application, the wafer transfer device further includes a rotating base 3; a transfer module 4 is disposed on the top of the rotating base 3, and the rotating base 3 is connected to the mounting base 2. Specifically, a transfer base 41 can be disposed on the top of the rotating base 3, and the rotating base 3 can be disposed on one side of the mounting seat 21 away from the lifting module 1. Thus, the transfer base 41 is indirectly connected to the mounting seat 21 through the rotating base 3, and the rotating base 3 can drive the transfer module 4 to drive the transfer rack 51 to rotate in the horizontal plane. In this way, the orientation of each manipulator 52 can be controlled by the rotating base 3 to pick and place wafers more precisely.

[0064] In actual setting, the structural form of the lifting module 1 is not limited.

[0065] Please refer to Figure 1 and Figure 2 Understand that in the embodiments of this application, the lifting module 1 includes a lifting frame 11, a lifting guide rail 12, and a lifting drive component (not shown in the figure); the lifting guide rail 12 is vertically arranged on the lifting frame 11, the lifting drive component is disposed on the lifting frame 11, the transfer module 4 is slidably connected to the lifting guide rail 12, the output end of the lifting drive component is connected to the transfer module 4, and the lifting drive component can drive the transfer module 4 to move along the lifting guide rail 12. In this way, the lifting guide rail 12 can provide guidance for the lifting of the transfer module 4, making the lifting process of the transfer module 4 more stable and reliable, which is beneficial to further improving the stability of the wafer transfer process.

[0066] In the embodiments provided by this application, the transfer module 4 is indirectly slidably connected to the lifting guide rail 12 through the mounting seat 21 of the mounting base 2, that is, the mounting seat 21 can be slidably connected to the lifting guide rail 12. More specifically, the mounting seat 21 can be provided with a slider, and the slider can be slidably disposed in the chute of the lifting guide rail 12. The lifting drive component is specifically connected to the mounting seat 21, and the lifting drive component drives the mounting seat 21 to lift, so as to drive the rotating base 3, the transfer base 41, the transfer rack 51, and the manipulator 52 to lift.

[0067] When specifically setting, the structural form of the lifting drive component is not limited. For example, it can be a servo motor, a cylinder, or an oil cylinder. The connection method between the mounting seat 21 and the output end of the lifting drive component is also not limited. For example, it can be a gear-rack meshing method, a belt drive method, or a lead screw drive method, as long as it can drive the stable lifting of the mounting seat 21.

[0068] Please refer to Figure 1 and Figure 2 Understand that in the embodiments provided by this application, the wafer transfer device further includes a wafer position detection component 7. The wafer position detection component 7 can be disposed on the rotating base 3, and the wafer position detection component 7 can be used to detect the number and position of wafers in the wafer cassette, so as to provide data for the calculation of the wafer transfer method.

[0069] It is not difficult to understand that the wafer transfer device may further include a controller, which can be connected to the wafer position detection component 7, each in-position sensor 6, each transfer drive component, the rotating base 3, and each lifting drive component. During use, based on the number and position information of the wafers in the wafer cassette fed back by the wafer position detection component 7, the optimal transfer scheme and the corresponding number of transfer times can be calculated, and the corresponding transfer drive component can be controlled to start according to the optimal transfer scheme to control the movement of the corresponding manipulator 52.

[0070] Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic structural diagram of the wafer transfer device provided by the embodiment of the present application when transferring two consecutive wafers, Figure 4 is Figure 3 a top view schematic diagram of

[0071] The following takes the example of two wafers placed consecutively in a wafer cassette and transferring these two wafers from the wafer cassette to a susceptor to illustrate the working process of the wafer transfer device provided by the embodiment of the present application:

[0072] First, the wafer position detection component 7 detects the position and number information of the wafers in the wafer cassette, and transmits the position and number information of the wafers to the controller. The controller calculates the optimal transfer method as using the first and second manipulators 52 simultaneously to transfer these two wafers according to the position and number information of the wafers, and the optimal number of transfer times is 1 time;

[0073] Then, the controller controls the lifting drive component of the lifting module 1 to start, driving the mounting seat 21 of the mounting base 2 to lift along the lifting guide rail 12, so that the first and second manipulators 52 rise to a preset height;

[0074] Then, the controller controls the rotating base 3 to start, driving the transfer base 41, the transfer rack 51 and the manipulator 52 thereon to rotate to a preset angle;

[0075] Next, the controller controls the first and second transfer drive components to start, simultaneously driving the first and second manipulators 52 to move along the corresponding transfer guide rails 42 to the side away from the lifting guide rail 12 until they respectively move to directly below the two wafers in the wafer cassette;

[0076] Immediately afterwards, the controller controls the lifting drive component to act, driving the mounting base 2 to rise, so that the first and second manipulators 52 rise to lift the two wafers in the wafer cassette;

[0077] Subsequently, the controller controls the first and second transfer drive assemblies to drive the first and second manipulators 52 back to the initial positions corresponding to the transfer guide rails 42 respectively, controls the rotating base 3 to drive the first and second manipulators 52 to rotate to the wafer placement stations in the susceptor, then controls the first and second transfer drive assemblies to drive the first and second manipulators 52 to transfer the wafers to above the corresponding wafer placement stations respectively, and finally controls the lifting drive assembly to drive the first and second manipulators 52 to move downward to place the wafers in the corresponding wafer placement stations, thus completing the transfer of the two continuously placed wafers from the wafer cassette to the susceptor.

[0078] The process of transferring the wafers in the susceptor to the wafer cassette is opposite to the above process and the specific operation process is similar, so it will not be elaborated here.

[0079] As can be seen from the above process, when two wafers are continuously placed in the wafer cassette, the prior art can only transfer one wafer at a time and needs to be transferred in two times. However, since the wafer transfer device provided by the embodiment of the present application is provided with multiple transfer racks 51, and each transfer rack 51 is provided with a manipulator 52 and equipped with a corresponding transfer drive assembly, it is possible to control two consecutive transfer racks 51 to move simultaneously to drive two consecutive manipulators 52 to complete the transfer of the two continuously placed wafers at the same time, so that only one transfer is required, reducing the number of transfers, saving the transfer time and improving the production efficiency.

[0080] In this article, specific examples are used to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the device of the present application and its core idea. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A wafer conveying device, characterized in that: It comprises a lifting module (1), a transmission module (4) and a transmission component (5); The conveying assembly (5) comprises a plurality of conveying racks (51) and a plurality of manipulators (52), the conveying racks (51) and the manipulators (52) are of the same number and correspond one to one, the manipulators (52) are arranged on the conveying racks (51), the plurality of manipulators (52) are arranged in sequence from bottom to top, and the manipulators (52) are used to carry wafers; The conveying frame (51) is connected to the conveying module (4), and the conveying module (4) can drive the conveying frame (51) to move in a horizontal direction. The conveying module (4) is connected to the lifting module (1), and the lifting module (1) can drive the conveying module (4) to drive the conveying frame (51) to move up and down.

2. The wafer conveying device according to claim 1, characterized in that: The conveying module (4) comprises a conveying base (41) and a plurality of horizontal conveying guide rails (42); The conveying base (41) is connected to the lifting module (1); a plurality of conveying guide rails (42) are arranged in parallel on the top of the conveying base (41); the conveying guide rails (42) and the conveying racks (51) are of the same number and correspond one to one; the conveying racks (51) are slidably arranged on the conveying guide rails (42); and the conveying racks (51) are capable of moving along the conveying guide rails (42).

3. The wafer conveying device according to claim 2, characterized in that: The conveying rack (51) has an opening facing downward, and the sizes of the openings of the conveying rack (51) corresponding to the plurality of conveying guide rails (42) increase sequentially.

4. The wafer conveying device according to claim 3, characterized in that: The opening is rectangular or in the shape of an upwardly arched arc.

5. The wafer conveying device according to any one of claims 2 to 4, characterized in that: The transmission module (4) also includes a plurality of transmission drive components; The conveying drive components and the conveying racks (51) are of the same number and correspond one to one. The conveying drive components and the conveying racks (51) are connected, and the conveying drive components can drive the conveying racks (51) to move along the conveying guide rails (42).

6. The wafer conveying device according to claim 5, characterized in that: The transmission drive component is a servo motor or a pneumatic cylinder or a hydraulic cylinder.

7. The wafer conveying device according to any one of claims 1 to 4, characterized in that: Also included is a mounting base (2); The conveying module (4) is connected to the mounting base (2), and the mounting base (2) is connected to the lifting module (1), and the lifting module (1) can drive the mounting base (2) to drive the conveying module (4) to rise and fall.

8. The wafer conveying device according to claim 7, characterized in that: Also includes a presence sensor (6); The mounting base (2) comprises a mounting base (21) and a mounting frame (22), wherein the mounting frame (22) is arranged on the top of the mounting base (21), the conveying module (4) is connected to the mounting base (21), and the mounting base (21) is connected to the lifting module (1), and the in-position sensor (6) is arranged on a side of the mounting frame (22) facing the conveying component (5), the in-position sensors (6) and the conveying frames (51) are the same in number and have a one-to-one correspondence, and the in-position sensors (6) are used to detect whether the conveying frame (51) is located at the initial position of the movement.

9. The wafer conveying device according to claim 7, characterized in that: Also includes a rotating base (3); The conveying module (4) is arranged on the top of the rotating base (3); the rotating base (3) is connected to the mounting base (2); and the rotating base (3) can drive the conveying module (4) to drive the conveying frame (51) to rotate in a horizontal plane.

10. The wafer conveying device according to any one of claims 1 to 4, characterized in that: The lifting module (1) comprises a lifting frame (11), a lifting guide rail (12) and a lifting drive assembly; The lifting guide rail (12) is vertically arranged on the lifting frame (11), the lifting drive assembly is arranged on the lifting frame (11), the conveying module (4) and the lifting guide rail (12) are slidably connected, the output end of the lifting drive assembly is connected to the conveying module (4), and the lifting drive assembly can drive the conveying module (4) to move along the lifting guide rail (12).

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