BGA (ball grid array) solder ball flattening machine for IC (integrated circuit) support plate

Abstract

The utility model discloses an IC (integrated circuit) support plate BGA (ball grid array) solder ball flatting machine, which comprises a rack, a flatting feeding and discharging conveying mechanism, a CCD (charge coupled device) detection alignment mechanism and a solder ball heating and flatting mechanism, and the flatting feeding and discharging conveying mechanism can comprise a first flatting feeding and discharging conveying mechanism and / or a second flatting feeding and discharging conveying mechanism. A feeding and discharging material box positioning mechanism, a carrier plate feeding and discharging box carrying mechanism and a transferring mechanical arm mechanism can be additionally arranged on the feeding side of the first flattening feeding and discharging conveying mechanism. A series of automatic operations such as automatic loading of the support plate, automatic detection of the position of the solder ball, automatic hot pressing and leveling of the solder ball and automatic unloading and boxing of the support plate can be completed, the operation is stable and reliable, the automation degree is high, the yield and the production efficiency of the production process can be improved, the production cost is reduced, and the high-precision production requirement is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of IC carrier board processing equipment, and more specifically, to an IC carrier board BGA solder ball flattening machine. Background Art

[0002] IC carrier board is a technology developed with the continuous progress of semiconductor packaging technology. In the field of high - order packaging, the IC carrier board not only provides support, heat dissipation and protection for the chip, but also provides electrical connection between the chip and the PCB motherboard, playing a "connecting the preceding and the following" role. With the rapid development of new packaging technologies such as BGA, CSP, and FC, higher requirements are put forward for aspects such as line width, line pitch, and vias of the packaging substrate. The previous mid - to - low - end wire bonding type carrier boards have been gradually replaced by high - end flip - chip type substrates, and thus developed from wire bonding to the way of direct solder ball through. The solder ball diameter has also developed from more than 100 microns to the current 40 - 60 microns, and the ball pitch is 60 - 80 microns with high precision. In order to ensure reliable conduction for each IO in the packaging of the chip and the carrier board and non - communication between adjacent IOs, higher requirements are placed on the overall flatness and height of the solder balls on the post - ball - planting chip and carrier board. However, the existing solder ball leveling methods, such as the Taiwan, China patent number I223373, usually first form solder ball bumps on the flip - chip carrier board through the reflow oven process, and then use a metal weight to apply pressure of nearly 1500 kilograms on the flip - chip carrier board to flatten the solder ball bumps. However, this method is likely to damage the flip - chip carrier board during the pressure application process, and cannot guarantee the precision requirements, resulting in a high production process scrap rate, low yield, and high cost. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the above - mentioned defects in the prior art, and provide an IC carrier board BGA solder ball flattening machine that can complete a series of automated operations such as automatic loading of the carrier board, automatic detection of the solder ball position, automatic hot - press flattening of the solder balls, and automatic unloading of the carrier board, and can solve the problem of the flatness requirement of the solder balls in the packaging of IC chips and carrier boards.

[0004] To achieve the above object, the present utility model provides an IC carrier BGA solder ball flattening machine, which includes a frame, a flattening station for conveying the IC carrier to the solder ball heating and flattening mechanism, and a flattening in-out transportation mechanism for outputting the IC carrier after flattening treatment to the outside of the solder ball heating and flattening mechanism, a CCD detection and alignment mechanism for performing target alignment on the IC carrier conveyed by the flattening in-out transportation mechanism, and a solder ball heating and flattening mechanism for flattening the solder balls on the IC carrier. The flattening in-out transportation mechanism and the solder ball heating and flattening mechanism are respectively arranged inside the frame. The flattening in-out transportation mechanism includes a first flattening in-out transportation mechanism and / or a second flattening in-out transportation mechanism. One end of the first flattening in-out transportation mechanism and / or the second flattening in-out transportation mechanism extends into the inside of the solder ball heating and flattening mechanism. The CCD detection and alignment mechanism is installed above the first flattening in-out transportation mechanism and / or the second flattening in-out transportation mechanism.

[0005] Preferably, a carrier in-out cartridge handling mechanism for taking out the IC carrier in the loading magazine cartridge and sending the IC carrier after flattening treatment into the unloading magazine cartridge, and an upper and lower material cartridge positioning mechanism for performing hierarchical positioning on the full-loaded IC carrier loading magazine cartridge and the empty unloading magazine cartridge are successively arranged on the feeding side of the first flattening in-out transportation mechanism. A transfer manipulator mechanism for transporting the IC carrier taken out by the carrier in-out cartridge handling mechanism to the first flattening in-out transportation mechanism and transporting the IC carrier output by the first flattening in-out transportation mechanism back to the carrier in-out cartridge handling mechanism is arranged above the carrier in-out cartridge handling mechanism and the first flattening in-out transportation mechanism.

[0006] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0007] 1. The structure of the present utility model is reasonably designed, and a series of automated operations such as automatic loading of the carrier, automatic detection of the solder ball position, automatic hot pressing and flattening of the solder balls, and automatic unloading of the carrier can be completed. Its operation is stable and reliable, the degree of automation is high, the yield rate and production efficiency of the production process can be improved, the production cost is reduced, and the high-precision production requirements can be guaranteed.

[0008] 2. The present utility model can automatically adjust the width, can adapt to various different sizes of carriers, and can also be additionally provided with a second flattening in-out transportation mechanism and a second CCD detection and alignment mechanism. The second flattening in-out transportation mechanism can transport large-size carriers that cannot be satisfied by the magazine-type cartridge, greatly improving the compatibility or flexibility of the machine and having high production efficiency. Description of the Drawings

[0009] Figure 1 It is a schematic structural diagram of an IC carrier BGA solder ball flattening machine;

[0010] Figure 2 It is a schematic diagram of the internal structure of the BGA solder ball flattening machine for IC substrates;

[0011] Figure 3 It is a schematic diagram of the structure of the loading and unloading cassette positioning mechanism Figure 1 ;

[0012] Figure 4 It is a schematic diagram of the structure of the loading and unloading cassette positioning mechanism Figure 2 ;

[0013] Figure 5 It is a schematic diagram of the structure of the substrate loading and unloading cassette handling mechanism;

[0014] Figure 6 It is a schematic diagram of the structure of the loading and unloading transfer plate, transfer plate movement driving device and gripper;

[0015] Figure 7 It is a schematic diagram of the structure of the guiding and limiting plate and the limiting plate spacing adjusting device;

[0016] Figure 8 It is a schematic diagram of the structure of the transfer manipulator mechanism;

[0017] Figure 9 It is a schematic diagram of the structure of the gripper part of the transfer manipulator mechanism;

[0018] Figure 10 It is a schematic diagram of the structure of the first flattening feeding and transporting mechanism and the first CCD detection and alignment mechanism;

[0019] Figure 11 It is a schematic diagram of the main part of the first flattening feeding and transporting mechanism Figure 1 ;

[0020] Figure 12 It is an exploded view of the main part of the first flattening feeding and transporting mechanism;

[0021] Figure 13 It is a schematic diagram of the main part of the first flattening feeding and transporting mechanism Figure 2 ;

[0022] Figure 14 It is a schematic diagram of the structure of the first clamping plate device or the second clamping plate device;

[0023] Figure 15 It is a schematic diagram of the structure of the solder ball heating and flattening mechanism;

[0024] Figure 16 It is a schematic diagram of the structure of the die carrier part of the solder ball heating and flattening mechanism;

[0025] Figure 17 It is a schematic diagram of the structure of the upper die part of the solder ball heating and flattening mechanism;

[0026] Figure 18 It is a schematic structural diagram of the lower die part of the solder ball heating and flattening mechanism;

[0027] Figure 19 It is a schematic structural diagram of the second flattening feeding and transporting mechanism and the second CCD detection and alignment mechanism;

[0028] Figure 20 It is a schematic structural diagram of the main body part of the second flattening feeding and transporting mechanism Figure 1 ;

[0029] Figure 21 It is a schematic structural diagram of the main body part of the second flattening feeding and transporting mechanism Figure 2 ;

[0030] Figure 22 It is an exploded view of the main body part of the second flattening feeding and transporting mechanism;

[0031] Figure 23 It is a schematic structural diagram of the third clamping plate device or the fourth clamping plate device. Specific embodiments

[0032] Embodiment 1

[0033] Please refer to Figure 1 and Figure 2 In Embodiment 1 of the present invention, an IC carrier BGA solder ball flattening machine is provided, which includes a frame 1, a loading and unloading cassette positioning mechanism 2, a carrier in-and-out cassette handling mechanism 3, a transfer manipulator mechanism 4, a first flattening feeding and transporting mechanism 5, a first CCD detection and alignment mechanism 6, and a solder ball heating and flattening mechanism 7. The loading and unloading cassette positioning mechanism 2, the carrier in-and-out cassette handling mechanism 3, the first flattening feeding and transporting mechanism 5, and the solder ball heating and flattening mechanism 7 are sequentially arranged inside the frame 1 in sequence. One end of the first flattening feeding and transporting mechanism 5 extends into the inside of the solder ball heating and flattening mechanism 7. The transfer manipulator mechanism 4 is installed above the carrier in-and-out cassette handling mechanism 3 and the first flattening feeding and transporting mechanism 5, and the first CCD detection and alignment mechanism 6 is installed above the first flattening feeding and transporting mechanism 5.

[0034] The following will describe each component of this embodiment in detail with reference to the accompanying drawings.

[0035] As Figure 3 and Figure 4As shown in the figure, the loading and unloading cartridge positioning mechanism 2 may include a lower cartridge support 21, an upper cartridge support 22, and a cartridge positioning device 23. The upper cartridge support 22 is installed on the lower cartridge support 21, and the cartridge positioning device 23 is respectively installed on the lower cartridge support 21 and the upper cartridge support 22. Among them, the upper loading magazine cartridge 100 filled with IC carriers to be processed can be placed on the upper cartridge support 22, and the empty lower loading magazine cartridge 101 can be placed on the lower cartridge support 21.

[0036] Specifically, the two groups of cartridge positioning devices 23 may each include a fixed bottom plate 231, a fixed limit strip 232, an end limit block 233, a moving bottom plate 234, a moving limit strip 235, and a bottom plate transverse movement driving device. The fixed limit strip 232 is fixedly installed on the fixed bottom plate 231. The moving bottom plate 234 is installed in a movable slot opened on the fixed bottom plate 231. The moving limit strip 235 is installed on the moving bottom plate 234 and is parallel to the fixed limit strip 232. The end limit block 233 is installed on the side of the fixed bottom plate 231 and is located between the fixed limit strip 232 and the moving limit strip 235. The end limit block 233 can limit the inlet and outlet ends of the cartridge. The bottom plate transverse movement driving device is in transmission connection with the moving bottom plate 234 and can drive it to move horizontally. The fixed limit strip 232 and the moving limit strip 235 can cooperate to press the tray.

[0037] Furthermore, the bottom plate transverse movement driving device may include a handwheel 236, a bottom plate transverse movement driving lead screw 237, a bottom plate driving lead screw mounting seat 238, and a bottom plate driving lead screw nut seat 239. The bottom plate transverse movement driving lead screw 237 is respectively installed on the lower cartridge support 21 and the upper cartridge support 22 through the bottom plate driving lead screw mounting seat 238. The handwheel 236 is connected to one end of the bottom plate transverse movement driving lead screw 237. The bottom plate transverse movement driving lead screw 237 is in threaded connection with the bottom plate driving lead screw nut seat 239. The upper end of the bottom plate driving lead screw nut seat 239 is connected to the moving bottom plate 234. Of course, in other embodiments, the handwheel 236 is replaced by a motor or other electric or pneumatic driving devices.

[0038] When the upper loading magazine cartridge 100 and the lower loading magazine cartridge 101 are placed on the loading and unloading cartridge positioning mechanism 2, the operator can rotate the handwheel 236 of the bottom plate transverse movement driving device to adjust the position of the moving limit strip 235 to adapt to the pressing and positioning of cartridges with different widths.

[0039] The flattening machine in this embodiment uses magazine-type cartridges to store the carriers in layers, which can ensure that the carrier products are not touched or scratched.

[0040] Such as Figure 5 、 Figure 6 and Figure 7As shown, the carrier board in-and-out box handling mechanism 3 may include a Z-axis lifting drive module 31, a Z-axis lifting seat 32, an in-and-out box advancing and retreating drive module 33, an L-shaped in-and-out loading plate 34, a loading plate moving drive device 35, a gripper 36, a gripper moving and adjusting device 37, a gripper mounting bracket 38, a guiding and limiting plate 310, and a limiting plate spacing adjusting device 39. The Z-axis lifting drive module 31 is in transmission connection with the Z-axis lifting seat 32 and can drive it to move up and down. The in-and-out box advancing and retreating drive module 33 is horizontally installed on the Z-axis lifting seat 32. The in-and-out box advancing and retreating drive module 33 is in transmission connection with the loading plate moving drive device 35 and can drive it to move horizontally. The loading plate moving drive device 35 is in transmission connection with the in-and-out loading plate 34 and can drive it to move horizontally. The gripper moving and adjusting device 37 is installed on the loading plate moving drive device 35 through the gripper mounting bracket 38. The gripper moving and adjusting device 37 is connected to the gripper 36 and can drive it to move horizontally. The clamping part of the gripper 36 is located in the avoidance hole formed on the in-and-out loading plate 34. The gripper 36 can clamp one side part of the carrier board. The guiding and limiting plates 310 are located on both sides of the in-and-out loading plate 34. The guiding and limiting plates 310 can limit and guide both sides of the carrier board to prevent the carrier board from detaching from the in-and-out loading plate 34. The limiting plate spacing adjusting device 39 is installed on the Z-axis lifting seat 32. The limiting plate spacing adjusting device 39 is in transmission connection with the two guiding and limiting plates 310 and can drive the two guiding and limiting plates 310 to move away from or close to each other.

[0041] As Figure 6As shown in the figure, the transfer plate moving drive device 35 may include a drive device bracket 351, a transfer plate drive motor 352, a transfer plate drive synchronous pulley 353, a transfer plate drive synchronous belt 354, a transfer plate drive lead screw 355, a transfer plate drive lead screw mounting seat 356, a transfer plate drive nut seat 357, a transfer plate moving guide rail 358, a transfer plate moving slider 359, a transfer plate drive connecting member 3510, and a transfer plate mounting seat 3511. The transfer plate drive motor 352 is mounted on the in-out cartridge advancing and retreating drive module 33 through the drive device bracket 351. The transfer plate drive lead screw 355 is mounted on the drive device bracket 351 through the transfer plate drive lead screw mounting seat 356. The transfer plate drive motor 352 is in transmission connection with the transfer plate drive lead screw 355 through the transfer plate drive synchronous pulley 353 and the transfer plate drive synchronous belt 354 and drives it to rotate. The transfer plate drive nut seat 357 is mounted on the transfer plate drive lead screw 355. The transfer plate mounting seat 3511 is slidably connected to the transfer plate moving guide rail 358 mounted on the top of the drive device bracket 351 through the transfer plate moving slider 359. The transfer plate drive nut seat 357 is connected to the transfer plate moving slider 359 through the transfer plate drive connecting member 3510. The tail end of the in-out transfer plate 34 is mounted on the transfer plate mounting seat 3511. The transfer plate drive motor 352 can drive the in-out transfer plate 34 on the transfer plate mounting seat 3511 to move into or out of the inside of the magazine through the transfer plate drive synchronous pulley 353, the transfer plate drive synchronous belt 354, the transfer plate drive lead screw 355, and the transfer plate drive connecting member 3510.

[0042] In this embodiment, the gripper moving adjustment device 37 may preferably be set as a gripper moving cylinder. The gripper 36 may preferably be set as a clamping cylinder, and the clamping cylinder is provided with a first clip 361 and a second clip 362.

[0043] As Figure 7As shown in the figure, the limiting plate spacing adjustment device 39 may include a limiting plate adjustment bracket 391, a limiting plate adjustment driving motor 392, a limiting plate adjustment driving lead screw 393, a limiting plate adjustment lead screw mounting seat 394, a first limiting plate adjustment nut seat 395, a second limiting plate adjustment nut seat 396, a limiting plate adjustment synchronous pulley 397 and a limiting plate adjustment synchronous belt 398. The limiting plate adjustment bracket 391 is installed on the Z-axis lifting seat 32. The limiting plate adjustment driving motor 392 is installed on one side surface of the limiting plate adjustment bracket 391. The limiting plate adjustment driving lead screw 393 is installed on one end surface of the limiting plate adjustment bracket 391 through the limiting plate adjustment lead screw mounting seat 394 and is perpendicular to the moving direction of the incoming and outgoing loading plates 34. The limiting plate adjustment driving motor 392 is drivingly connected to the limiting plate adjustment driving lead screw 393 through the limiting plate adjustment synchronous pulley 397 and the limiting plate adjustment synchronous belt 398 and can drive it to rotate. The limiting plate adjustment driving lead screw 393 is provided with two sections of external threads with opposite directions. The first limiting plate adjustment nut seat 395 is installed on the first section of external thread of the limiting plate adjustment driving lead screw 393, and the second limiting plate adjustment nut seat 396 is installed on the second section of external thread of the limiting plate adjustment driving lead screw 393. The guiding limiting plates 310 are respectively installed on the tops of the first limiting plate adjustment nut seat 395 and the second limiting plate adjustment nut seat 396. The limiting plate adjustment driving motor 392 can drive the two guiding limiting plates 310 to move through the limiting plate adjustment driving lead screw 393 to realize the width adjustment function, so that the carrier plate incoming and outgoing box handling mechanism 3 can adapt to more carrier plates with different widths.

[0044] In order to make the movement of the guiding limiting plates 310 smooth and stable, the two guiding limiting plates 310 can be respectively slidably connected to the limiting plate guide rails 312 installed on the top of the limiting plate adjustment bracket 391 through the limiting plate sliders 311.

[0045] Preferably, as Figure 7 shown, the outer side surfaces of the head ends of the two guiding limiting plates 310 are respectively provided with limiting plate lifting driving devices 313. A material taking limiting plate 314 is installed on the limiting plate lifting driving devices 313. The limiting plate lifting driving devices 313 can drive the material taking limiting plate 314 to move up and down. Among them, the limiting plate lifting driving devices 313 can be preferably set as limiting plate lifting cylinders. The material taking limiting plate 314 can limit the carrier plate in the vertical direction.

[0046] When taking the plate, the loading plate movement driving device 35 can drive the incoming and outgoing loading plates 34 to move into the internal part of the loading magazine of the feeding magazine and pull out the specified carrier plate in the direction of the gripper 36. Then, the gripper movement adjustment device 37 drives the gripper 36 to move and grip the carrier plate. The loading plate movement driving device 35 drives the incoming and outgoing loading plates 34 to reset. When the transfer manipulator mechanism 4 moves over to take the material, the gripper 36 releases the carrier plate, and the gripper movement adjustment device 37 drives the gripper 36 to reset. Subsequently, the transfer manipulator mechanism 4 grips and takes away the carrier plate.

[0047] When the transfer manipulator mechanism 4 conveys the processed carrier board, the gripper moving and adjusting device 37 drives the gripper 36 to move and grip the carrier board. The transfer board moving driving device 35 drives the transfer board 34 to move towards the gripper 36. Then, the Z-axis lifting driving module 31 drives the transfer board 34 and the carrier board placed on the transfer board 34 to move downward until it reaches the entrance of the lower blanking magazine. After reaching the position, the gripper 36 releases the carrier board, and the transfer board moving driving device 35 drives the transfer board 34 to convey the carrier board into the interior of the blanking magazine.

[0048] The carrier board in-and-out magazine handling mechanism 3 can stably take out the carrier board from the interior of the loading magazine and can also smoothly convey the processed carrier board to the blanking magazine. It has an online automatic width-adjusting transportation function and can be applicable to carrier board products with different board widths.

[0049] As Figure 8 and Figure 9 shown, the transfer manipulator mechanism 4 may include a transfer lateral movement driving module 41, a transfer lifting driving device 42, a transfer mounting plate 43, a jaw spacing adjusting device 44, a jaw mounting plate 45, and a carrier board jaw 46. The transfer lateral movement driving module 41 is in transmission connection with the transfer lifting driving device 42 and can drive it to move laterally. The transfer lifting driving device 42 is in transmission connection with the transfer mounting plate 43 and can drive it to move up and down. The jaw spacing adjusting device 44 is installed at the bottom of the transfer mounting plate 43. There are two parallel jaw mounting plates 45. The jaw spacing adjusting device 44 is in transmission connection with the two jaw mounting plates 45 and can drive the two jaw mounting plates 45 to approach or move away from each other. A number of carrier board jaws 46 are respectively installed on the two jaw mounting plates 45. At the inner side of the lower end of each carrier board jaw 46, there is a card edge groove 461 for the edge part of the carrier board to be inserted.

[0050] In this embodiment, the transfer lifting driving device 42 may preferably be set as a transfer lifting cylinder.

[0051] As Figure 9As shown in the figure, the jaw spacing adjustment device 44 may include a jaw adjustment drive motor 441, a jaw adjustment drive lead screw 442, a jaw adjustment lead screw mounting seat 443, a first jaw adjustment nut seat 444, and a second jaw adjustment nut seat 445. The jaw adjustment drive motor 441 is installed at the bottom of the transfer mounting plate 43. The jaw adjustment drive lead screw 442 is installed at the bottom of the transfer mounting plate 43 through the jaw adjustment lead screw mounting seat 443. The output shaft of the jaw adjustment drive motor 441 is connected to the jaw adjustment drive lead screw 442 and can drive it to rotate. The jaw adjustment drive lead screw 442 is provided with two sections of external threads with opposite directions. The first jaw adjustment nut seat 444 is installed on the first section of the external thread of the jaw adjustment drive lead screw 442, and the second jaw adjustment nut seat 445 is installed on the second section of the external thread of the jaw adjustment drive lead screw 442. The jaw mounting plate 45 is respectively installed at the bottoms of the first jaw adjustment nut seat 444 and the second jaw adjustment nut seat 445. The jaw spacing adjustment device 44 can adjust the spacing between the two side carrier plate jaws 46 to adapt to carrier plate products with different plate widths.

[0052] Preferably, the first jaw adjustment nut seat 444 and the second jaw adjustment nut seat 445 can be respectively slidably connected to the jaw adjustment guide rail 48 installed at the bottom of the transfer mounting plate 43 through the jaw adjustment slider 47.

[0053] The transfer manipulator mechanism 4 adopts a card-edge type manipulator design, ensuring smooth transfer of the transferred products, as well as anti-slip and anti-loosening functions.

[0054] As Figure 10As shown, the first flattening feeding and discharging transport mechanism 5 may include a first feeding and discharging moving module 51, a first feeding and discharging lifting drive device 52, a first feeding and discharging lifting seat 53, a first angle fine-tuning rotation drive device 54, a first angle fine-tuning mounting plate 55, a first angle fine-tuning arc-shaped guide rail 56, a first angle fine-tuning arc-shaped slider 57, a first X-axis moving plate 58, a first X-axis transverse sliding block 59, a first X-axis transverse guide rail 510, a first X-axis transverse drive device 511, a first Y-axis distance adjustment drive device 512, a first Y-axis distance adjustment moving plate 513, a first Y-axis transverse sliding block 514, a first Y-axis transverse guide rail 515, a first clamping plate device 516 and a second clamping plate device 517. The first feeding and discharging moving module 51 is in transmission connection with the first feeding and discharging lifting drive device 52 and can drive it to move horizontally. The first feeding and discharging lifting drive device 52 is in transmission connection with the first feeding and discharging lifting seat 53 and can drive it to move up and down. The first angle fine-tuning mounting plate 55 is slidably connected to the first angle fine-tuning arc-shaped guide rail 56 installed on the top of the first feeding and discharging lifting seat 53 through the first angle fine-tuning arc-shaped slider 57. The first angle fine-tuning rotation drive device 54 is installed on one side of the first feeding and discharging lifting seat 53. The first angle fine-tuning rotation drive device 54 is in transmission connection with the first angle fine-tuning mounting plate 55 and can drive it to rotate. The first X-axis moving plate 58 is slidably connected to the first X-axis transverse guide rail 510 installed on the first angle fine-tuning mounting plate 55 through the first X-axis transverse sliding block 59. The first X-axis transverse drive device 511 is installed on the first angle fine-tuning mounting plate 55. The first X-axis transverse drive device 511 is in transmission connection with the first X-axis moving plate 58 and can drive it to move along the X-axis direction. The first Y-axis distance adjustment moving plate 513 is slidably connected to the first Y-axis transverse guide rail 515 installed on one side of the first X-axis moving plate 58 through the first Y-axis transverse sliding block 514. The first Y-axis distance adjustment drive device 512 is installed on the first X-axis moving plate 58. The first Y-axis distance adjustment drive device 512 is in transmission connection with the first Y-axis distance adjustment moving plate 513 and can drive it to move along the Y-axis direction. The first clamping plate device 516 is installed on one side surface of the first Y-axis distance adjustment moving plate 513. The second clamping plate device 517 is installed on the other side surface of the first X-axis moving plate 58. The first clamping plate device 516 and the second clamping plate device 517 are on the same side and symmetrically arranged. The first clamping plate device 516 and the second clamping plate device 517 can clamp both sides of the carrier plate.

[0055] As Figure 12 and Figure 13As shown, the first loading and unloading lifting drive device 52 may include a first loading and unloading lifting bottom plate 521, a first loading and unloading lifting motor 522, a first loading and unloading lifting drive lead screw 523, a first loading and unloading lifting lead screw mounting seat 524, a first loading and unloading lifting threaded seat 525, a first loading and unloading lifting synchronous pulley 526, and a first loading and unloading lifting synchronous belt 527. The first loading and unloading lifting motor 522 is mounted on the first loading and unloading moving module 51 through the first loading and unloading lifting bottom plate 521. The first loading and unloading lifting drive lead screw 523 is mounted on the first loading and unloading lifting bottom plate 521 through the first loading and unloading lifting lead screw mounting seat 524. The first loading and unloading lifting motor 522 is in transmission connection with the first loading and unloading lifting drive lead screw 523 through the first loading and unloading lifting synchronous pulley 526 and the first loading and unloading lifting synchronous belt 527 and can drive it to rotate. The first loading and unloading lifting drive lead screw 523 is connected to the first loading and unloading lifting seat 53 through the first loading and unloading lifting threaded seat 525.

[0056] Preferably, the first loading and unloading lifting seat 53 may be slidably connected to the first loading and unloading lifting guide rail 520 mounted on the first loading and unloading lifting bottom plate 521 through the first loading and unloading lifting slider 519.

[0057] As Figure 12 and Figure 13 shown, the first angle fine-tuning rotation drive device 54 may include a first angle fine-tuning rotation drive electric cylinder 541, a first angle fine-tuning drive block 542, a first floating joint 543, and a first angle fine-tuning rotation connection block 544. The first angle fine-tuning rotation drive electric cylinder 541 is mounted on the first loading and unloading lifting seat 53. The first angle fine-tuning drive block 542 is mounted on the first angle fine-tuning rotation drive electric cylinder 541. The first angle fine-tuning rotation connection block 544 is mounted at the bottom of the first angle fine-tuning mounting plate 55. The first floating joint 543 is connected between the first angle fine-tuning drive block 542 and the first angle fine-tuning rotation connection block 544. During fine-tuning, the first angle fine-tuning rotation drive electric cylinder 541 can drive the first angle fine-tuning drive block 542 to move, so as to drive the first angle fine-tuning mounting plate 55 to rotate a certain angle through the first floating joint 543 and the first angle fine-tuning rotation connection block 544, facilitating the adjustment of the angle position of the solder balls on the carrier plate.

[0058] In this embodiment, the first X-axis transverse movement drive device 511 may preferably be set as a first X-axis transverse movement drive electric cylinder with a stroke. The first Y-axis distance adjustment drive device 512 may preferably be set as a first Y-axis transverse movement drive electric cylinder with a stroke.

[0059] As Figure 14As shown, both the first clamping plate device 516 and the second clamping plate device 517 may include a first clamping plate base plate 5161, a first clamping plate driving cylinder 5162, a first hinge seat 5163, a first V-shaped driving block 5164, a first clamping plate transverse movement plate 5165, a first bearing seat 5166, a first clamping plate transverse movement guide rod 5167, a first clamping plate lifting plate 5168, a first clamping plate lifting slider 5169, a first clamping plate lifting guide rail 5170, a first clamping plate pressing block 5171 and a first clamping plate limiting seat 5172. The first clamping plate driving cylinder 5162 and the first bearing seat 5166 are both installed on the first clamping plate base plate 5161. The first bearing seat 5166 is located on both sides of the first clamping plate driving cylinder 5162. The first clamping plate driving cylinder 5162 is hinged to one end of the first V-shaped driving block 5164 through the first hinge seat 5163. The other end of the first V-shaped driving block 5164 passes through the first clamping plate transverse movement plate 5165 and is hinged to the first clamping plate lifting plate 5168. One end of the first clamping plate transverse movement guide rod 5167 is connected to the first clamping plate transverse movement plate 5165, and the other end of the first clamping plate transverse movement guide rod 5167 is movably installed in the hole position of the first bearing seat 5166. The first clamping plate lifting plate 5168 is slidably connected to the first clamping plate lifting guide rail 5170 installed on the first clamping plate transverse movement plate 5165 through the first clamping plate lifting slider 5169. The first clamping plate pressing block 5171 is installed on the first clamping plate lifting plate 5168. The first clamping plate driving cylinder 5162 can drive the first clamping plate pressing block 5171 to move horizontally and vertically. The first clamping plate limiting seat 5172 is installed on the side of the first clamping plate base plate 5161 and is located below the first clamping plate pressing block 5171. The first clamping plate limiting seat 5172 can limit both sides of the carrier plate, and the first clamping plate driving cylinder 5162 can drive the first clamping plate pressing block 5171 to press the carrier plate for positioning.

[0060] The first flattening loading and unloading transport mechanism has a fine movement and stretching function in the X and Y directions, ensuring that the carrier plate product is flat and free of warping. It is installed on a high-precision transmission module with precise positioning to prevent interference. In addition, the first flattening loading and unloading transport mechanism has a width adjustment function and can adapt to carrier plate products with different widths.

[0061] As Figure 10 shown, the first CCD detection and alignment mechanism 6 may include a first CCD mounting bracket 61, a first CCD camera 62 and a first CCD lens 63. The first CCD camera 62 is installed inside the frame 1 through the first CCD mounting bracket 61, and the first CCD lens 63 is installed on the first CCD camera 62.

[0062] The first CCD detection and alignment mechanism 6 uses a high-resolution camera, which can accurately position and improve the flattening success rate of the IC carrier plate.

[0063] As Figure 15As shown in the figure, the solder ball heating and flattening mechanism 7 may include a hot pressing die carrier 71, a hot pressing driving device 72, a lifting middle plate 73, an upper heat insulation plate 74, an upper heating plate 75, an upper pressing head 76, a gyroscope 77, a lower heat insulation plate 78, a lower heating plate 79, and a lower pressing head 710. The hot pressing driving device 72 is installed on the die carrier top plate 711 of the hot pressing die carrier 71. The output shaft of the hot pressing driving device 72 passes through the die carrier top plate 711 of the hot pressing die carrier 71 and is in transmission connection with the lifting middle plate 73 and can drive it to move up and down. The upper heat insulation plate 74 is installed at the bottom of the lifting middle plate 73. The upper heating plate 75 is installed at the bottom of the upper heat insulation plate 74. The upper pressing head 76 is installed at the bottom of the upper heating plate 75. The gyroscope 77 is installed on the die carrier bottom plate 712 of the hot pressing die carrier 71. The lower heat insulation plate 78 is installed on the top of the gyroscope 77. The lower heating plate 79 is installed on the top of the lower heat insulation plate 78. The lower pressing head 710 is installed on the top of the lower heating plate 79 and is located below the upper pressing head 76.

[0064] In this embodiment, the hot pressing driving device 72 may preferably be set as a hot pressing driving electric cylinder. The gyroscope 77 may preferably be set as an air gyro calibration instrument.

[0065] As Figure 15 and Figure 16 shown in the figure, four bushings 713 may be provided on the die carrier top plate 711 of the hot pressing die carrier 71. Guide posts 714 are respectively provided on each bushing 713. The lower ends of each guide post 714 are respectively connected to the lifting middle plate 73. The upper ends of each guide post 714 respectively pass upward through the bushing 713, and the upper ends of each guide post 714 are respectively connected to a square guide post linkage bracket 715.

[0066] As Figure 17 shown in the figure, the upper pressing head 76 may be installed at the bottom of the upper heating plate 75 through upper pressing head fixing devices 715 located on both sides of it. The upper pressing head fixing devices 715 may include an upper pressing head fixing driving cylinder 7151, a cylinder heat insulation seat 7152, a connecting rod 7153, a connecting rod mounting bracket 7154, and an upper pressing head positioning and fixing block 7155. The upper pressing head fixing driving cylinder 7151 and the connecting rod mounting bracket 7154 are respectively installed at the bottom of the lifting middle plate 73. The upper pressing head fixing driving cylinder 7151 is connected to one end of the connecting rod 7153 through the cylinder heat insulation seat 7152. The other end of the connecting rod 7153 passes through the through hole of the connecting rod mounting bracket 7154 and is connected to the upper pressing head positioning and fixing block 7155. The upper pressing head positioning and fixing block 7155 can contact the bottom side part of the upper pressing head 76, so as to position the upper pressing head 76. The upper pressing head fixing devices 715 can facilitate the installation, fixing, replacement, and maintenance of the upper pressing head.

[0067] As Figure 18As shown in the figure, on the top of the lower heating plate 79, there are lower punch limit seats 716 located on both sides of the lower punch 710. On both side surfaces of the lower punch 710, there are respectively lower punch convex columns 7101. The two lower punch convex columns 7101 are respectively inserted into the limit grooves of the lower punch limit seats 716. On each lower punch limit seat 716, there is respectively a ball screw 717 arranged longitudinally. The lower end of the ball screw 717 can extend into the limit groove of the lower punch limit seat 716 to limit the corresponding lower punch convex column 7101.

[0068] The solder ball heating and flattening mechanism adopts a high-power four-column servo electric cylinder, with stable movement and adjustable and uniform pressure. The punch die is made of high-strength special die steel, with extremely small deformation at high temperatures, and can be controlled by a servo system to achieve precise opening and closing width and smooth operation.

[0069] The working principle of the present utility model is as follows:

[0070] Before work, the operator can respectively place the loading magazine cartridge 100 filled with IC carriers and the empty unloading magazine cartridge 101 on the loading and unloading magazine positioning mechanism 2. During work, the carrier in-and-out magazine handling mechanism 3 takes out the IC carrier in the loading magazine cartridge 100, and the transfer manipulator mechanism 4 transports the IC carrier taken out from the carrier in-and-out magazine handling mechanism 3 to the first flattening in-and-out transport mechanism 5. The first flattening in-and-out transport mechanism 5 transports the IC carrier to the first CCD detection and alignment mechanism 6 for target alignment, and then transports the IC carrier to the flattening station of the solder ball heating and flattening mechanism 7 for hot pressing and leveling operation. When the hot pressing and leveling operation is completed, the first flattening in-and-out transport mechanism 5 outputs the IC carrier after flattening treatment to the outside of the solder ball heating and flattening mechanism 7. The transfer manipulator mechanism 4 transports the IC carrier output by the first flattening in-and-out transport mechanism back to the carrier in-and-out magazine handling mechanism 3, and the carrier in-and-out magazine handling mechanism 3 sends the IC carrier into the unloading magazine cartridge 101.

[0071] Embodiment 2

[0072] Please refer to Figure 1 and Figure 19, Embodiment 2 of the present utility model provides an IC carrier BGA solder ball flattening machine. On the basis of the above Embodiment 1, it may further include a second flattening feeding and discharging transport mechanism 8 for transporting another type of IC carrier to the flattening station of the solder ball heating and flattening mechanism 7 and outputting the flattened another type of IC carrier to the outside of the solder ball heating and flattening mechanism 7, and a second CCD detection and alignment mechanism 9 for performing target alignment on another type of IC carrier transported by the second flattening feeding and discharging transport mechanism 8. The second flattening feeding and discharging transport mechanism 8 and the second CCD detection and alignment mechanism 9 are respectively installed inside the frame 1. The direction of the second flattening feeding and discharging transport mechanism 8 is perpendicular to that of the first flattening feeding and discharging transport mechanism 5. One end of the second flattening feeding and discharging transport mechanism 8 extends into the inside of the solder ball heating and flattening mechanism 7, and the second CCD detection and alignment mechanism 9 is located above the second flattening feeding and discharging transport mechanism 8.

[0073] As Figures 19 to 22 shown, the second flattening feeding and discharging transport mechanism 8 may include a second feeding and discharging moving module 81, a second feeding and discharging lifting driving device 82, a second feeding and discharging lifting seat 83, a second angle fine-tuning rotation driving device 84, a second angle fine-tuning mounting plate 85, a second angle fine-tuning arc-shaped guide rail 86, a second angle fine-tuning arc-shaped slider 87, a second X-axis moving plate 88, a second X-axis transverse sliding block 89, a second X-axis transverse guide rail 810, a second X-axis transverse driving device 811, a third clamping plate device 812 and a fourth clamping plate device 813. The second feeding and discharging moving module 81 is in transmission connection with the second feeding and discharging lifting driving device 82 and can drive it to move horizontally. The second feeding and discharging lifting driving device 82 is in transmission connection with the second feeding and discharging lifting seat 83 and can drive it to move up and down. The second angle fine-tuning mounting plate 85 is slidably connected to the second angle fine-tuning arc-shaped guide rail 86 installed at the top of the second feeding and discharging lifting seat 83 through the second angle fine-tuning arc-shaped slider 87. The second angle fine-tuning rotation driving device 84 is installed on one side of the second feeding and discharging lifting seat 83. The second angle fine-tuning rotation driving device 84 is in transmission connection with the second angle fine-tuning mounting plate 85 and can drive it to rotate. The second X-axis moving plate 88 is slidably connected to the second X-axis transverse guide rail 810 installed on the second angle fine-tuning mounting plate 85 through the second X-axis transverse sliding block 89. The second X-axis transverse driving device 811 is installed on the second angle fine-tuning mounting plate 85. The second X-axis transverse driving device 811 is in transmission connection with the second X-axis moving plate 88 and can drive it to move along the X-axis direction. At least two third clamping plate devices 812 are arranged side by side on one side of the second X-axis moving plate 88, and at least two fourth clamping plate devices 813 are arranged side by side on the other side of the second X-axis moving plate 88. The third clamping plate device 812 and the fourth clamping plate device 813 are symmetrically arranged. The third clamping plate device 812 and the fourth clamping plate device 813 can clamp both sides of the carrier plate.

[0074] AsFigure 22 As shown, the second loading and unloading lifting drive device 82 may include a second loading and unloading lifting bottom plate 821, a second loading and unloading lifting motor 822, a second loading and unloading lifting drive lead screw 823, a second loading and unloading lifting lead screw mounting seat 824, a second loading and unloading lifting thread seat 825, a second loading and unloading lifting synchronous pulley 826, and a second loading and unloading lifting synchronous belt 827. The second loading and unloading lifting motor 822 is mounted on the second loading and unloading moving module 81 through the second loading and unloading lifting bottom plate 821. The second loading and unloading lifting drive lead screw 823 is mounted on the second loading and unloading lifting bottom plate 821 through the second loading and unloading lifting lead screw mounting seat 824. The second loading and unloading lifting motor 822 is drivingly connected to the second loading and unloading lifting drive lead screw 823 through the second loading and unloading lifting synchronous pulley 826 and the second loading and unloading lifting synchronous belt 827 and can drive it to rotate. The second loading and unloading lifting drive lead screw 823 is connected to the second loading and unloading lifting seat 83 through the second loading and unloading lifting thread seat 825.

[0075] Preferably, the second loading and unloading lifting seat 83 may be slidably connected to the second loading and unloading lifting guide rail 815 mounted on the second loading and unloading lifting bottom plate 821 through the second loading and unloading lifting slider 814.

[0076] As Figure 21 and Figure 22 shown, the second angle fine-tuning rotation drive device 84 may include a second angle fine-tuning rotation drive electric cylinder 841, a second angle fine-tuning drive block 842, a second floating joint 843, and a second angle fine-tuning rotation connection block 844. The second angle fine-tuning rotation drive electric cylinder 841 is mounted on the second loading and unloading lifting seat 83. The second angle fine-tuning drive block 842 is mounted on the second angle fine-tuning rotation drive electric cylinder 841. The second angle fine-tuning rotation connection block 844 is mounted at the bottom of the second angle fine-tuning mounting plate 85. The second floating joint 843 is connected between the second angle fine-tuning drive block 842 and the second angle fine-tuning rotation connection block 844.

[0077] In this embodiment, the second X-axis lateral movement drive device 811 may preferably be set as a second X-axis lateral movement drive electric cylinder with a stroke.

[0078] As Figure 23As shown in the figure, both the third clamping plate device 812 and the fourth clamping plate device 813 may include a second clamping plate driving cylinder 8121, a second hinge seat 8122, a second V-shaped driving block 8123, a second clamping plate transverse movement plate 8124, a second bearing seat 8125, a second clamping plate transverse movement guide rod 8126, a second clamping plate lifting plate 8127, a second clamping plate lifting slider 8128, a second clamping plate lifting guide rail 8129, and a second clamping plate pressing block 8130. The second clamping plate driving cylinder 8121 and the second bearing seat 8125 are both installed on the second X-axis moving plate 88. The second bearing seat 8125 is located on both sides of the second clamping plate driving cylinder 8121. The second clamping plate driving cylinder 8121 is hinged to one end of the second V-shaped driving block 8123 through the second hinge seat 8122. The other end of the second V-shaped driving block 8123 passes through the second clamping plate transverse movement plate 8124 and is hinged to the second clamping plate lifting plate 8127. One end of the second clamping plate transverse movement guide rod 8126 is connected to the second clamping plate transverse movement plate 8124, and the other end of the second clamping plate transverse movement guide rod 8126 is movably installed in the hole position of the second bearing seat 8125. The second clamping plate lifting plate 8127 is slidably connected to the second clamping plate lifting guide rail 8129 installed on the second clamping plate transverse movement plate 8124 through the second clamping plate lifting slider 8128. The second clamping plate pressing block 8130 is installed on the second clamping plate lifting plate 8127. The second clamping plate driving cylinder 8121 can drive the second clamping plate pressing block 8130 to move horizontally and vertically. Second clamping plate limiting seats 817 are respectively arranged on both sides of the second X-axis moving plate 88 below the second clamping plate pressing block 8130 of the third clamping plate device 812 and below the second clamping plate pressing block 8130 of the fourth clamping plate device 813.

[0079] It should be noted here that, according to actual needs, the second flattening loading and unloading transportation mechanism 8 of the second embodiment may also be provided with a width adjustment function in the same way as the first flattening loading and unloading transportation mechanism of the first embodiment.

[0080] As Figure 19 shown in the figure, the second CCD detection and alignment mechanism 9 may include a second CCD mounting bracket 91, a second CCD camera 92, and a second CCD lens 93. The second CCD camera 92 is installed inside the frame 1 through the second CCD mounting bracket 91, and the second CCD lens 93 is installed on the second CCD camera 92.

[0081] The second flattening loading and unloading transportation mechanism can transport large-sized carriers that cannot be satisfied by the magazine-type cartridge, greatly improving the compatibility or flexibility of the machine and having high production efficiency.

[0082] The utility model has the following advantages:

[0083] 1. It can complete a series of automated operations such as automatic loading of the carrier board, automatic detection of the solder ball position, automatic hot pressing and leveling of the solder balls, and automatic unloading of the carrier board into the box. It runs stably and reliably, has a high degree of automation, can improve the yield and production efficiency of the production process, reduce production costs, and ensure high-precision production requirements.

[0084] 2. Through sequential control, it uses a PLC to control servo drives, precisely locates through a camera, controls the flattening pressure constantly, and completes the flattening work by synchronously heating the upper and lower temperature zones. The simple operation software ensures convenient use, does not require long-term training, and has no consumables.

[0085] 3. Online adjustable-width transportation system: It can achieve automatic transportation, automatic width adjustment, and automatic positioning of the IC carrier board, eliminating manual placement, further improving work efficiency and safety protection;

[0086] 4. X, Y-axis gantry system: It uses high-precision screw rod guides for positioning and is driven by brand servo motors to further improve the accuracy of the whole machine and further improve the success rate of welding;

[0087] 5. Automatic heating system: It works synchronously with the lower preheating temperature zone, further improving work efficiency, reducing the time consumed, and increasing production efficiency;

[0088] 6. Four-column servo electric cylinder: It works in cooperation with a high-precision air gyro calibration instrument to ensure flattening accuracy;

[0089] 7. CCD camera system: It precisely locates to improve the success rate of flattening the IC carrier board;

[0090] 8. Whole machine control software: Just import the IC carrier board file, set the area to be flattened, the vision system automatically locates, and the manipulator module automatically reaches the area to be flattened to start working, ensuring the stability of product flattening.

Claims

1. An IC substrate BGA solder ball flattening machine, characterized by: It includes a frame, a flattening station for conveying an IC carrier to a solder ball heating and flattening mechanism, a flattening in-and-out material transport mechanism for outputting the flattened IC carrier to the outside of the solder ball heating and flattening mechanism, a CCD detection alignment mechanism for performing target point alignment on the IC carrier conveyed by the flattening in-and-out material transport mechanism, and a solder ball heating and flattening mechanism for flattening the solder balls on the IC carrier, the flattening in-and-out material transport mechanism and the solder ball heating and flattening mechanism are respectively arranged inside the frame, the flattening in-and-out material transport mechanism includes a first flattening in-and-out material transport mechanism and / or a second flattening in-and-out material transport mechanism, one end of the first flattening in-and-out material transport mechanism and / or the second flattening in-and-out material transport mechanism extends into the interior of the solder ball heating and flattening mechanism, and the CCD detection alignment mechanism is installed above the first flattening in-and-out material transport mechanism and / or the second flattening in-and-out material transport mechanism.

2. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: When the flattening inlet and outlet conveying mechanism comprises a first flattening inlet and outlet conveying mechanism and a second flattening inlet and outlet conveying mechanism, the arrangement direction of the first flattening inlet and outlet conveying mechanism is perpendicular to the second flattening inlet and outlet conveying mechanism.

3. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The first flattening feed-in and feed-out transport mechanism comprises a first feed-in and feed-out moving module, a first feed-in and feed-out lifting drive device, a first feed-in and feed-out lifting seat, a first angle fine-tuning rotating drive device, a first angle fine-tuning mounting plate, a first angle fine-tuning arc guide rail, a first angle fine-tuning arc slider, a first X-axis moving plate, a first X-axis transverse sliding slider, a first X-axis transverse sliding guide rail, a first X-axis transverse moving drive device, a first Y-axis distance adjustment drive device, a first Y-axis distance adjustment moving plate, a first Y-axis transverse sliding slider, a first Y-axis transverse sliding guide rail, a first clamping plate device and a second clamping plate device, the first feed-in and feed-out moving module is transmission-connected with the first feed-in and feed-out lifting drive device and can drive it to move laterally, the first feed-in and feed-out lifting drive device is transmission-connected with the first feed-in and feed-out lifting seat and can drive it to move up and down, the first angle fine-tuning mounting plate is slidably connected with the first angle fine-tuning arc guide rail installed on the top of the first feed-in and feed-out lifting seat through the first angle fine-tuning arc slider, and the first angle fine-tuning rotating drive device is installed on one side of the first feed-in and feed-out lifting seat , the first angle fine-tuning rotation drive device is transmission connected to the first angle fine-tuning mounting plate and can drive it to rotate, the first X-axis movable plate is slidably connected to the first X-axis lateral guide rail installed on the first angle fine-tuning mounting plate through the first X-axis lateral sliding block, the first X-axis lateral driving device is installed on the first angle fine-tuning mounting plate, the first X-axis lateral driving device is transmission connected to the first X-axis movable plate and can drive it to move along the X-axis direction, the first Y-axis distance adjustment movable plate is slidably connected to the first Y-axis lateral guide rail installed on one side of the first X-axis movable plate through the first Y-axis lateral sliding block, the first Y-axis distance adjustment driving device is installed on the first X-axis movable plate, the first Y-axis distance adjustment driving device is transmission connected to the first Y-axis distance adjustment movable plate and can drive it to move along the Y-axis direction, the first clamping plate device is installed on one side of the first Y-axis distance adjustment movable plate, and the second clamping plate device is installed on the other side of the first X-axis movable plate, and the first clamping plate device and the second clamping plate device are on the same side and are symmetrically arranged.

4. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The second flattening feed-in and feed-out transport mechanism comprises a second feed-in and feed-out moving module, a second feed-in and feed-out lifting drive device, a second feed-in and feed-out lifting seat, a second angle fine-tuning rotating drive device, a second angle fine-tuning mounting plate, a second angle fine-tuning arc guide rail, a second angle fine-tuning arc slider, a second X-axis moving plate, a second X-axis transverse sliding slider, a second X-axis transverse sliding guide rail, a second X-axis transverse driving device, a third clamping plate device and a fourth clamping plate device; the second feed-in and feed-out moving module is transmission-connected to the second feed-in and feed-out lifting drive device and can drive it to move laterally; the second feed-in and feed-out lifting drive device is transmission-connected to the second feed-in and feed-out lifting seat and can drive it to move up and down; the second angle fine-tuning mounting plate is connected to the second angle fine-tuning arc slider and the second angle fine-tuning arc guide rail installed on the top of the second feed-in and feed-out lifting seat; The second angle fine-tuning rotary drive device is installed on one side of the second material feeding and discharging lifting seat, the second angle fine-tuning rotary drive device is connected to the second angle fine-tuning mounting plate by transmission and can drive it to rotate, the second X-axis movable plate is connected to the second X-axis transverse guide rail installed on the second angle fine-tuning mounting plate by sliding connection through the second X-axis transverse sliding slider, the second X-axis transverse driving device is installed on the second angle fine-tuning mounting plate, the second X-axis transverse driving device is connected to the second X-axis movable plate by transmission and can drive it to move along the X-axis direction, the third clamping plate device is provided with at least two and arranged on one side of the second X-axis movable plate, the fourth clamping plate device is provided with at least two and arranged on the other side of the second X-axis movable plate, and the third clamping plate device and the fourth clamping plate device are symmetrically arranged.

5. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The CCD detection alignment mechanism comprises a CCD mounting bracket, a CCD camera and a CCD lens. The CCD camera is mounted inside a frame through the CCD mounting bracket, and the CCD lens is mounted on the CCD camera.

6. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The solder ball heating and flattening mechanism includes a hot pressing mold frame, a hot pressing drive device, a lifting middle plate, an upper heat insulation plate, an upper heating plate, an upper pressure head, a gyroscope, a lower heat insulation plate, a lower heating plate and a lower pressure head. The hot pressing drive device is installed on the mold frame top plate of the hot pressing mold frame, and the output shaft of the hot pressing drive device passes through the mold frame top plate of the hot pressing mold frame and is transmission-connected to the lifting middle plate and can drive it to move up and down. The upper heat insulation plate is installed at the bottom of the lifting middle plate, the upper heating plate is installed at the bottom of the upper heat insulation plate, the upper pressure head is installed at the bottom of the upper heating plate, the gyroscope is installed on the mold frame bottom plate of the hot pressing mold frame, the lower heat insulation plate is installed on the top of the gyroscope, the lower heating plate is installed on the top of the lower heat insulation plate, and the lower pressure head is installed on the top of the lower heating plate and is located below the upper pressure head.

7. The IC substrate BGA solder ball flattening machine according to claim 1, characterized in that: The feeding side of the first flattening in-and-out material transport mechanism is sequentially provided with a carrier in-and-out box conveying mechanism for taking out the IC carrier in the loading clip box and feeding the flattened IC carrier into the unloading clip box, and an upper and lower material box positioning mechanism for layering the loading clip box full of IC carriers and the empty unloading clip box; a transfer robot mechanism is provided above the carrier in-and-out box conveying mechanism and the first flattening in-and-out material transport mechanism for conveying the IC carrier taken out by the carrier in-and-out box conveying mechanism to the first flattening in-and-out material transport mechanism and conveying the IC carrier output by the first flattening in-and-out material transport mechanism back to the carrier in-and-out box conveying mechanism.

8. The IC substrate BGA solder ball flattening machine according to claim 7, characterized in that: The upper and lower material box positioning mechanism comprises a lower material box bracket, an upper material box bracket and a material box positioning device, the upper material box bracket is installed on the lower material box bracket, and the material box positioning device is respectively installed on the lower material box bracket and the upper material box bracket, and the two groups of material box positioning devices each comprise a fixed bottom plate, a fixed limit strip, an end limit block, a movable bottom plate, a movable limit strip and a bottom plate transverse movement driving device, the fixed limit strip is fixedly installed on the fixed bottom plate, the movable bottom plate is installed in a movable groove opened on the fixed bottom plate, the movable limit strip is installed on the movable bottom plate and is parallel to the fixed limit strip, the end limit block is installed on the side of the fixed bottom plate and is located between the fixed limit strip and the movable limit strip, and the bottom plate transverse movement driving device is transmission connected with the movable bottom plate and can drive it to move laterally.

9. The IC substrate BGA solder ball flattening machine according to claim 7, characterized in that: The carrier in-and-out box handling mechanism includes a Z-axis lifting drive module, a Z-axis lifting seat, an in-and-out box advance and retreat drive module, an L-shaped in-and-out material handling plate, a material handling plate movement drive device, a clamp, a clamp movement adjustment device, a clamp mounting bracket, a guide limit plate and a limit plate spacing adjustment device. The Z-axis lifting drive module is transmission-connected to the Z-axis lifting seat and can drive it to move up and down. The in-and-out box advance and retreat drive module is horizontally installed on the Z-axis lifting seat. The in-and-out box advance and retreat drive module is transmission-connected to the material handling plate movement drive device and can drive it to move horizontally. The material handling plate movement drive The device is transmission connected with the in-and-out material moving plate and can drive it to move laterally. The clamp movement adjustment device is installed on the material moving plate movement drive device through the clamp installation bracket. The clamp movement adjustment device is connected with the clamp and can drive it to move laterally. The clamping part of the clamp is located in the avoidance hole opened on the in-and-out material moving plate. The guide limit plates are located on both sides of the in-and-out material moving plate. The limit plate spacing adjustment device is installed on the Z-axis lifting seat. The limit plate spacing adjustment device is transmission connected with the two guide limit plates and can drive the two guide limit plates to move away from or close to each other.

10. The IC substrate BGA solder ball flattening machine according to claim 7, characterized in that: The transfer robot mechanism includes a transfer transverse driving module, a transfer lifting driving device, a transfer mounting plate, a clamp spacing adjustment device, a clamp mounting plate and a carrier clamp. The transfer transverse driving module is transmission connected to the transfer lifting driving device and can drive it to move horizontally. The transfer lifting driving device is transmission connected to the transfer mounting plate and can drive it to move up and down. The clamp spacing adjustment device is installed at the bottom of the transfer mounting plate. The clamp mounting plates are provided with two pieces and are parallel to each other. The clamp spacing adjustment device is transmission connected to the two clamp mounting plates and can drive the two clamp mounting plates to move closer to or away from each other. A number of carrier clamps are provided and are respectively installed on the two clamp mounting plates. A clamping edge groove is provided on the inner side of the lower end of each carrier clamp.

Images