Integrated circuit packaging shell

Abstract

The utility model discloses an integrated circuit packaging housing, and relates to the technical field of integrated circuits, the integrated circuit packaging housing comprises a lower housing, the upper end of the lower housing is provided with an upper housing, the left end and the right end between the lower housing and the upper housing are provided with fast assembly mechanisms, and the fast assembly mechanisms are used for the fixed connection between the lower housing and the upper housing; and the quick mounting mechanism comprises clamping blocks connected to the left end and the right end of the lower portion of the upper shell, grooves are formed in the sides, away from the vertical central axis of the upper shell, of the clamping blocks, and first springs are connected into the grooves at equal intervals. According to the integrated circuit packaging shell disclosed by the utility model, the clamping blocks are embedded into the clamping grooves, and the limiting blocks are clamped into the limiting grooves, so that the connection between the lower shell and the upper shell is realized, and the problem that the firmness degree of the circuit packaging shell is influenced by rusting caused by bolt fixation can be prevented through the connection mode; meanwhile, the lower shell and the upper shell are convenient to disassemble and assemble, operation is simple, and therefore production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit package housing. Background Art

[0002] An integrated circuit is a circuit with specific functions that integrates a certain number of common electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components through semiconductor processes. The integrated circuit has the advantages of small size, light weight, few lead-out wires and welding points, long service life, high reliability, good performance, etc. At the same time, the cost is low and it is convenient for large-scale production. The integrated circuit package housing, as the carrier of the chip, not only plays the role of electrically connecting the bonding points inside the chip with the external circuit, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip.

[0003] The existing integrated circuit package housing is usually fixed by bolts, which is complex in operation, reduces work efficiency, and the places fixed by bolts are prone to rust, affecting the firmness of the circuit package housing. In view of the above problems, we have developed an integrated circuit package housing. Summary of the Utility Model

[0004] The utility model discloses an integrated circuit package housing, aiming at the technical problems that the existing integrated circuit package housing is usually fixed by bolts, which is complex in operation, reduces work efficiency, and the places fixed by bolts are prone to rust, affecting the firmness of the circuit package housing.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] An integrated circuit package housing includes a lower housing, an upper housing is installed at the upper end of the lower housing, and quick-installation mechanisms are arranged at the left and right ends between the lower housing and the upper housing. The quick-installation mechanisms are used for the fixed connection between the lower housing and the upper housing; the quick-installation mechanisms include blocks connected to the left and right ends below the upper housing. A groove is opened on one side of the block away from the vertical central axis of the upper housing. A first spring is connected at equal intervals inside the groove. One end of the first spring away from the vertical central axis of the upper housing is connected with a limiting block. Slots are opened at the left and right ends above the lower housing, and a limiting groove is opened on one side of the lower end inside the slot away from the vertical central axis of the lower housing.

[0007] In a preferred scheme, an integrated circuit body is placed inside the upper end of the lower housing. A plurality of groups of pins are installed at equal intervals at the front and rear ends of the integrated circuit body, and a plurality of groups of placement grooves are opened at equal intervals at the front and rear ends of the upper end of the lower housing.

[0008] The initial fixation of the integrated circuit body is achieved by clamping the pins in the placement grooves.

[0009] In a preferred embodiment, the limiting block is slidably connected to the groove, and the lower end corner of the limiting block is set as an arc surface.

[0010] By setting the lower end corner of the limiting block as an arc surface, it is convenient for the limiting block to slide and contract into the groove when it contacts the inner wall of the card slot.

[0011] In a preferred embodiment, fixing plates are installed at the left and right ends inside the lower housing. One side of the fixing plate close to the integrated circuit body is connected with a telescopic rod, and a second spring is wound around the outer surface of the telescopic rod.

[0012] By providing the telescopic rod and the second spring, it is convenient for the second spring to reset its position after the position of the clamping plate moves.

[0013] In a preferred embodiment, one end of the telescopic rod close to the integrated circuit body is connected with a clamping plate, and rubber pads are arranged at the upper and lower ends inside the clamping plate.

[0014] By arranging rubber pads inside the clamping plate, while the clamping plate clamps and fixes the integrated circuit body, the rubber pads can play a corresponding protective role to prevent the clamping plate from scratching the integrated circuit body.

[0015] In a preferred embodiment, a first wedge-shaped block is connected to one side of the clamping plate away from the integrated circuit body, and second wedge-shaped blocks are connected to the left and right ends below the upper housing.

[0016] By providing the second wedge-shaped blocks on the upper housing, when the upper housing is docked with the lower housing, it is convenient for the second wedge-shaped blocks to squeeze the first wedge-shaped blocks, prompting the first wedge-shaped blocks to move.

[0017] The present utility model hereby provides an integrated circuit package housing through improvement. Compared with the prior art, it has the following improvements and advantages:

[0018] Firstly: For an integrated circuit package housing, the connection between the lower housing and the upper housing is realized by inserting the card block into the card slot and clamping the limiting block inside the limiting slot. Through this connection method, it is possible to prevent the problem that the firmness of the circuit package housing is affected by corrosion due to bolt fixation. At the same time, the disassembly and assembly between the lower housing and the upper housing are convenient and the operation is simple, thereby improving production efficiency.

[0019] Secondly: For an integrated circuit package housing, by squeezing the first wedge-shaped block with the second wedge-shaped block, the clamping plate is displaced to clamp the integrated circuit body. Thus, while the upper housing and the lower housing are docked and covered, the position of the integrated circuit body is fixed to prevent the integrated circuit body from shaking inside the package housing. Description of the Drawings

[0020] Figure 1 Schematic diagram of the overall structure of an integrated circuit package housing proposed by the present utility model;

[0021] Figure 2 Schematic diagram of the top view structure of the lower housing of an integrated circuit package housing proposed by the present utility model;

[0022] Figure 3 Schematic diagram of the bottom view structure of the upper housing of an integrated circuit package housing proposed by the present utility model;

[0023] Figure 4 Schematic diagram of the clamping plate structure of an integrated circuit package housing proposed by the present utility model.

[0024] In the drawings: 1. Lower housing; 2. Upper housing; 3. Quick installation mechanism; 301. Block; 302. Groove; 303. First spring; 304. Limit block; 305. Card slot; 306. Limit groove; 4. Placing groove; 5. Integrated circuit body; 6. Pin; 7. Fixed plate; 8. Telescopic rod; 9. Second spring; 10. Clamping plate; 11. Rubber pad; 12. First wedge-shaped block; 13. Second wedge-shaped block. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0026] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0027] An integrated circuit package housing disclosed by the present utility model is mainly applied to the scenario of integrated circuit housing packaging.

[0028] Refer to Figure 1 、 Figure 2 and Figure 3, an integrated circuit package housing, comprising a lower housing 1, an upper housing 2 is installed at the upper end of the lower housing 1, and quick installation mechanisms 3 are arranged at the left and right ends between the lower housing 1 and the upper housing 2. The quick installation mechanisms 3 are used for the fixed connection between the lower housing 1 and the upper housing 2; the quick installation mechanisms 3 include clamping blocks 301 connected to the left and right ends below the upper housing 2. A groove 302 is formed on one side of the clamping block 301 away from the vertical central axis of the upper housing 2. A first spring 303 is connected at equal intervals inside the groove 302. One end of the first spring 303 away from the vertical central axis of the upper housing 2 is connected with a limiting block 304. Slots 305 are formed at the left and right ends above the lower housing 1. A limiting groove 306 is formed on one side of the lower end inside the slot 305 away from the vertical central axis of the lower housing 1. The limiting block 304 is slidably connected with the groove 302. The lower end corner of the limiting block 304 is set as an arc surface. An integrated circuit body 5 is placed inside the upper end of the lower housing 1;

[0029] In this embodiment: when packaging the integrated circuit body 5, after placing the integrated circuit body 5 in the lower housing 1, the upper housing 2 and the lower housing 1 are docked. The clamping blocks 301 on the upper housing 2 are snapped into the slots 305 of the lower housing 1. When the limiting blocks 304 on the clamping blocks 301 contact the inner wall of the slot 305, they contract. The limiting blocks 304 are squeezed and contracted into the groove 302. After the clamping blocks 301 are completely embedded in the slots 305, the limiting blocks 304 pop into the limiting grooves 306 under the action of the first spring 303, thus forming a snap connection between the lower housing 1 and the upper housing 2. When it is necessary to open the package of the integrated circuit body 5, by pressing the limiting blocks 304 on the left and right sides, after the limiting blocks 304 are embedded in the groove 302, the upper housing 2 is lifted upward, and the clamping blocks 301 slide out of the slots 305, thereby realizing the opening of the package. Therefore, through this connection method, the problem of rust caused by bolt fixation and affecting the firmness of the circuit package housing can be prevented. At the same time, the disassembly and assembly between the lower housing 1 and the upper housing 2 are convenient, and the operation is simple, thus improving the production efficiency.

[0030] Referring to Figure 1 and Figure 2 , in a preferred embodiment, a plurality of groups of pins 6 are installed at equal intervals at the front and rear ends of the integrated circuit body 5, and a plurality of groups of placement grooves 4 are formed at equal intervals at the front and rear ends of the upper end of the lower housing 1;

[0031] In this embodiment: when installing the integrated circuit body 5, first, a plurality of groups of pins 6 connected to the integrated circuit body 5 are snapped into the placement grooves 4 formed on the lower housing 1 to initially limit the positions of the pins 6, thereby realizing the initial fixation of the position of the integrated circuit body 5.

[0032] Referring to Figure 2 and Figure 4, in a preferred embodiment, fixing plates 7 are installed at the left and right ends inside the lower housing 1. One side of the fixing plate 7 close to the integrated circuit body 5 is connected with a telescopic rod 8. A second spring 9 is wound around the outer surface of the telescopic rod 8. One end of the telescopic rod 8 close to the integrated circuit body 5 is connected with a clamping plate 10. Rubber pads 11 are arranged at the upper and lower ends inside the clamping plate 10. One side of the clamping plate 10 far from the integrated circuit body 5 is connected with a first wedge-shaped block 12. Second wedge-shaped blocks 13 are connected to the left and right ends below the upper housing 2;

[0033] In this embodiment: During the docking process between the upper housing 2 and the lower housing 1, the second wedge-shaped block 13 on the upper housing 2 moves downward, squeezing the first wedge-shaped block 12 on the lower housing 1, prompting the two first wedge-shaped blocks 12 to carry the clamping plate 10 to move towards the middle of the lower housing 1. The telescopic rod 8 and the second spring 9 extend and stretch. After the two clamping plates 10 move inward, they wrap and clamp the side surface of the integrated circuit body 5. The rubber pad 11 on the clamping plate 10 contacts the surface of the integrated circuit body 5 to prevent damage to the surface of the integrated circuit body 5. Thus, while docking and covering between the upper housing 2 and the lower housing 1, the position of the integrated circuit body 5 is fixed to prevent the integrated circuit body 5 from shaking inside the upper housing 2 and the lower housing 1. When the upper housing 2 is opened from the lower housing 1, the extrusion of the second wedge-shaped block 13 on the first wedge-shaped block 12 is released, and the clamping plate 10 contracts and resets under the action of the second spring 9. At this time, the integrated circuit body 5 can be removed.

[0034] Working principle: When in use, when packaging the integrated circuit body 5, after placing the integrated circuit body 5 in the lower housing 1, dock the upper housing 2 and the lower housing 1. The clamping block 301 on the upper housing 2 is inserted into the card slot 305 of the lower housing 1. When the limiting block 304 on the clamping block 301 contacts the inner wall of the card slot 305, it contracts. The limiting block 304 is squeezed and contracted into the groove 302. After the clamping block 301 is completely embedded in the card slot 305, the limiting block 304 pops into the limiting slot 306 under the action of the first spring 303, thus forming a snap connection between the housing 1 and the upper housing 2. When it is necessary to open the package of the integrated circuit body 5, by pressing the limiting blocks 304 on the left and right sides, after the limiting blocks 304 are inserted into the groove 302, lift the upper housing 2 upward, and the clamping block 301 slides out of the card slot 305, thus realizing the opening of the package. Therefore, through this connection method, it is possible to prevent the problem of rust caused by bolt fixation, which affects the firmness of the circuit packaging shell. At the same time, the disassembly and assembly between the lower housing 1 and the upper housing 2 are convenient and the operation is simple, thereby improving production efficiency.

[0035] As mentioned above, it is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. The substitution may be the substitution of part of the structure, device, method steps, or a complete technical solution. Any equivalent substitution or change made according to the technical solution of the present utility model and its inventive concept shall be covered within the protection scope of the present utility model.

Claims

1. An integrated circuit package housing, comprising a lower housing (1), characterized in that: The upper end of the lower shell (1) is mounted with an upper shell (2); a quick-install mechanism (3) is provided at left and right ends between the lower shell (1) and the upper shell (2); the quick-install mechanism (3) is used for fixed connection between the lower shell (1) and the upper shell (2); the quick-install mechanism (3) comprises a clamping block (301) connected to the left and right ends of the lower part of the upper shell (2); a groove (302) is provided on the side of the clamping block (301) away from the vertical center axis of the upper shell (2); a first spring (303) is equidistantly connected inside the groove (302); one end of the first spring (303) away from the vertical center axis of the upper shell (2) is connected to a limiting block (304); a clamping groove (305) is provided at the left and right ends of the upper part of the lower shell (1); a limiting groove (306) is provided inside the lower end of the clamping groove (305) away from the vertical center axis of the lower shell (1).

2. The integrated circuit package shell according to claim 1, characterized in that: An integrated circuit body (5) is placed inside the upper end of the lower shell (1), and multiple groups of pins (6) are installed at equal distances at the front and rear ends of the integrated circuit body (5). Multiple groups of placement slots (4) are opened at equal distances at the front and rear ends of the upper end of the lower shell (1).

3. The integrated circuit package shell according to claim 1, characterized in that: The limiting block (304) is slidably connected to the groove (302), and the lower end angle of the limiting block (304) is configured as an arc surface.

4. The integrated circuit package shell according to claim 2, characterized in that: Fixed plates (7) are installed at the left and right ends of the lower housing (1), a telescopic rod (8) is connected to the side of the fixed plate (7) close to the integrated circuit body (5), and a second spring (9) is wound around the outer surface of the telescopic rod (8).

5. The integrated circuit package shell according to claim 4, characterized in that: One end of the telescopic rod (8) close to the integrated circuit body (5) is connected to a clamping plate (10), and rubber pads (11) are arranged at the upper and lower ends of the clamping plate (10).

6. The integrated circuit package shell according to claim 5, characterized in that: A first wedge-shaped block (12) is connected to a side of the clamping plate (10) away from the integrated circuit body (5), and second wedge-shaped blocks (13) are connected to the left and right ends at the lower side of the upper housing (2).

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