Circuit board structure

Abstract

The utility model provides a circuit board structure which comprises a circuit board body. The circuit board body sequentially comprises a first heat dissipation ink layer, a first green oil layer, a first circuit layer, a first core board, a second circuit layer, a first prepreg layer, a second prepreg layer, a heat conduction metal layer, a third prepreg layer, a fourth prepreg layer, a third circuit layer, a second core board, a fourth circuit layer and a second green oil layer from top to bottom. A plurality of strip-shaped heat conduction grooves are correspondingly formed in the positions, above and below the heat conduction metal layer, of the circuit board body, and the inner side walls of the upper strip-shaped heat conduction groove and the lower strip-shaped heat conduction groove are covered with insulating heat conduction layers; the upper surface and the lower surface, located in the strip-shaped heat conduction groove, of the heat conduction metal layer are both covered with insulating ink layers. And the heat dissipation efficiency is directly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board structure. Background Art

[0002] Chinese authorized publication number CN221202844U, with the authorization publication date of June 21, 2024, specifically relates to a printed circuit board and an electronic device. The printed circuit board includes: an insulating substrate, at least one internal circuit layer, at least one surface circuit layer, and at least one groove. The internal circuit layer is disposed within the insulating substrate, and the surface circuit layer is disposed on the surface of the insulating substrate; wherein, both the internal circuit layer and the surface circuit layer are copper foils, the inner wall of the groove is covered with a first heat-conducting layer and is in contact with the internal circuit layer through the first heat-conducting layer, so that the circuit layer inside the insulating substrate can be in direct contact with air through the groove, without the need to transfer heat through the insulating substrate to its top layer or bottom layer, thereby reducing the thermal resistance and accelerating the heat dissipation efficiency, and improving the heat dissipation effect of the printed circuit board. The defect of this prior art is that only the inner wall of the groove is covered with a first heat-conducting layer and is in contact with the internal circuit layer through the first heat-conducting layer, so that the circuit layer inside the insulating substrate can be in direct contact with air through the groove to achieve heat dissipation. Since circuit boards are generally installed inside devices and the air fluidity is generally weak, therefore, the efficiency of air heat exchange in a sealed environment is still relatively low. In view of this situation, it is urgent to improve. Summary of the Utility Model

[0003] Based on this, the purpose of the utility model is to provide a circuit board structure to directly improve the heat dissipation efficiency.

[0004] The utility model provides a circuit board structure, including a circuit board body. The circuit board body successively includes a first heat-dissipating ink layer, a first solder mask layer, a first circuit layer, a first core board, a second circuit layer, a first prepreg layer, a second prepreg layer, a heat-conducting metal layer, a third prepreg layer, a fourth prepreg layer, a third circuit layer, a second core board, a fourth circuit layer, a second solder mask layer, and a second heat-dissipating ink layer from top to bottom. The circuit board body is correspondingly provided with a plurality of strip-shaped heat-conducting grooves above and below the heat-conducting metal layer. The inner side walls of the upper and lower strip-shaped heat-conducting grooves are both covered with an insulating heat-conducting layer, and the upper surface and the lower surface of the heat-conducting metal layer located within the strip-shaped heat-conducting grooves are both covered with an insulating ink layer.

[0005] Preferably, the thicknesses of both the first core board and the second core board are set to 30um.

[0006] Preferably, the thicknesses of the first prepreg layer and the fourth prepreg layer are set to 120um.

[0007] Preferably, the thicknesses of the second and third prepreg layers are set to 350 um.

[0008] Preferably, the thicknesses of the first and second heat dissipation ink layers are set to 10 um.

[0009] The beneficial effects of the present utility model are as follows: A heat-conducting metal layer is provided, and a plurality of strip-shaped heat-conducting grooves are correspondingly formed above and below the circuit board body and located in the heat-conducting metal layer. The inner side walls of the upper and lower strip-shaped heat-conducting grooves are both covered with an insulating heat-conducting layer. On the one hand, the heat-conducting metal layer absorbs heat inside the circuit board, and the heat can be dissipated through the strip-shaped heat-conducting grooves. In addition, the insulating heat-conducting layer cooperates with the heat-conducting metal layer to dissipate heat from the internal circuit layer. The heat forms a space in contact with the air in the strip-shaped heat-conducting grooves, thereby improving the heat dissipation efficiency. Together with the first and second heat dissipation ink layers, the overall heat dissipation efficiency of the circuit board is further improved. Description of the Drawings

[0010] Figure 1 is a cross-sectional view of the present utility model.

[0011] The reference numerals are: the first heat dissipation ink layer 27, the first solder mask layer 15, the first circuit layer 14, the first core board 13, the second circuit layer 24, the first prepreg layer 12, the second prepreg layer 11, the heat-conducting metal layer 10, the third prepreg layer 16, the fourth prepreg layer 17, the third circuit layer 25, the second core board 18, the fourth circuit layer 19, the second solder mask layer 20, the second heat dissipation ink layer 26, the strip-shaped heat-conducting groove 21, the insulating heat-conducting layer 22, and the insulating ink layer 23. Detailed Embodiments

[0012] In order to further understand the features, technical means, specific purposes, and functions achieved by the present utility model, the present utility model will be further described in detail below in conjunction with the detailed embodiments and the drawings.

[0013] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0014] Please refer to Figure 1As shown in the figure, the utility model provides a circuit board structure, which includes a circuit board body. The circuit board body sequentially includes a first heat dissipation ink layer 27, a first solder mask layer 15, a first circuit layer 14, a first core board 13, a second circuit layer 24, a first prepreg layer 12, a second prepreg layer 11, a heat-conducting metal layer 10, a third prepreg layer 16, a fourth prepreg layer 17, a third circuit layer 25, a second core board 18, a fourth circuit layer 19, a second solder mask layer 20, and a second heat dissipation ink layer 26 from top to bottom. A plurality of strip-shaped heat-conducting grooves 21 are correspondingly provided above and below the heat-conducting metal layer 10 of the circuit board body. The inner side walls of the upper and lower strip-shaped heat-conducting grooves 21 are both covered with an insulating heat-conducting layer 22. The upper surface and the lower surface of the heat-conducting metal layer 10 located in the strip-shaped heat-conducting grooves 21 are both covered with an insulating ink layer 23.

[0015] As a preferred embodiment, the thicknesses of the first core board 13 and the second core board 18 are both set to 30um.

[0016] As a preferred embodiment, the thicknesses of the first prepreg layer 12 and the fourth prepreg layer 17 are set to 120um.

[0017] As a preferred embodiment, the thicknesses of the second prepreg layer 11 and the third prepreg layer 16 are set to 350um.

[0018] As a preferred embodiment, the thicknesses of the first heat dissipation ink layer 27 and the second heat dissipation ink layer 26 are set to 10um.

[0019] In this embodiment, a heat-conducting metal layer is provided. A plurality of strip-shaped heat-conducting grooves are correspondingly provided above and below the heat-conducting metal layer of the circuit board body. The inner side walls of the upper and lower strip-shaped heat-conducting grooves are both covered with an insulating heat-conducting layer. On the one hand, the heat-conducting metal layer absorbs heat inside the circuit board, and the heat can be dissipated through the strip-shaped heat-conducting grooves. In addition, the insulating heat-conducting layer cooperates with the heat-conducting metal layer to dissipate heat from the internal circuit layer. The heat forms a space in contact with the air in the strip-shaped heat-conducting grooves, thereby improving the heat dissipation efficiency. Together with the first heat dissipation ink layer and the second heat dissipation ink layer, the overall heat dissipation efficiency of the circuit board is further improved.

[0020] The above-described embodiments only represent one implementation manner of the utility model, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A circuit board structure, comprising a circuit board body, characterized in that: The circuit board body comprises, from top to bottom, a first heat dissipation ink layer (27), a first green oil layer (15), a first circuit layer (14), a first core board (13), a second circuit layer (24), a first prepreg layer (12), a second prepreg layer (11), a heat conductive metal layer (10), a third prepreg layer (16), a fourth prepreg layer (17), a third circuit layer (25), a second core board (18), a fourth circuit layer (19), a second green oil layer (20), and a second heat dissipation ink layer (26); the circuit board body is provided with a plurality of strip-shaped heat conductive grooves (21) correspondingly above and below the heat conductive metal layer (10); the inner side walls of the upper and lower strip-shaped heat conductive grooves (21) are both covered with an insulating heat conductive layer (22); and the upper surface and the lower surface of the heat conductive metal layer (10) located in the strip-shaped heat conductive grooves (21) are both covered with an insulating ink layer (23).

2. A circuit board structure according to claim 1, characterized in that: The thickness of the first core plate (13) and the second core plate (18) are both set to 30 um.

3. A circuit board structure according to claim 1, characterized in that: The thickness of the first prepreg layer (12) and the fourth prepreg layer (17) is set to 120 um.

4. A circuit board structure according to claim 1, characterized in that: The thickness of the second prepreg layer (11) and the third prepreg layer (16) is set to 350 um.

5. A circuit board structure according to claim 1, characterized in that: The thickness of the first heat dissipation ink layer (27) and the second heat dissipation ink layer (26) is set to 10 um.

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