Circuit board hole-filling electroplating device with leakage-proof function

Abstract

The utility model discloses a circuit board hole-filling electroplating device with a leakage-proof function, which comprises an operation table, a mounting seat, a hole-filling bottom plate, an air cylinder, a lifting frame, press-fit battens, a scraping plate, a mechanical arm and a hole-filling mechanism, a circuit board is placed on the hole-filling bottom plate, two sides of the circuit board are pressed and fixed through the two press-fit battens which are arranged in parallel, and the hole-filling mechanism is arranged in the hole-filling bottom plate. The feeding pipe is communicated with a feeding pipe of molten resin, the resin enters the long-strip conveying bin through the feeding pipe and the connecting pipe and then is discharged from the long-strip discharging port through the long-strip conveying bin, and the hole filling mechanism is driven by the mechanical arm to move from one end of the circuit board to the other end of the circuit board so that the resin can be smeared on the surface of the circuit board. The flowability of resin can be ensured by arranging the long-strip conveying bin and the long-strip discharging port, bubbles are prevented from appearing in the resin when the resin is discharged from the long-strip discharging port, the resin on the surface of the circuit board is evenly smeared through the hole filling scraping plate, meanwhile, the resin in the through hole of the circuit board is compacted, and bubbles existing in the resin in the through hole are eliminated.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, and particularly relates to a circuit board via filling electroplating device with a leakage prevention function. Background Art

[0002] With the continuous update of electronic product technology, the structure and installation method of electronic chips are also constantly improved and changed. Its development is basically from components with plug-in pins to highly integrated integrated circuit modules using ball grid array solder joints, thus extending the POFV process, which uses resin to plug through holes; the process of resin plugging through holes has been more and more widely used in the PCB industry in recent years, especially in some products with high number of layers and large board thickness. People hope to use resin plugging through holes to solve a series of problems that cannot be solved by using green oil plugging through holes or resin filling during lamination.

[0003] The existing Chinese patent with the authorized announcement number of CN219514293U discloses a resin plugging through hole structure of a PCB printed circuit board, including a main board part. The main board part includes substrate coppers arranged in parallel, and a curing sheet is arranged between adjacent two substrate copper layers. Small-aperture through holes and large-aperture through holes are vertically penetrated through the main board part. Electroplated copper layers are arranged on the upper and lower surfaces of the main board part and the inner surfaces of the small-aperture through holes and the large-aperture through holes. A barrier film is arranged under the main board part, and the barrier film is used to support resin columns in the small-aperture through holes and the large-aperture through holes. Ventilation holes are arranged in the barrier film corresponding to the positions of the small-aperture through holes and the large-aperture through holes, which can solve the problem of surface resin adhesion during plugging of dense small holes and the problem that resin outflow during plugging of large-aperture through holes causes inability to plug holes.

[0004] The deficiencies of the above existing technical solutions are as follows: when resin plugging is carried out on large-aperture through holes, residual bubbles in the resin are likely to cause gaps between the resin and the pipe wall, which is likely to cause tin leakage during welding and lead to backside short circuit. Content of the Utility Model

[0005] The purpose of the utility model is to provide a circuit board via filling electroplating device with a leakage prevention function, so as to solve the technical problem that when resin plugging is carried out on large-aperture through holes in the prior art, residual bubbles in the resin are likely to cause gaps between the resin and the pipe wall, which is likely to cause tin leakage during welding and lead to backside short circuit.

[0006] The technical problem to be solved by the utility model can be realized through the following technical solutions:

[0007] A circuit board via filling electroplating device with a leakage prevention function includes:

[0008] Operating table, an installation base is fixedly connected to the operating table, a hole-filling bottom plate is fixedly connected to the installation base, a feeding bottom plate is fixedly connected to one side end face of the hole-filling bottom plate, a circuit board is arranged on the hole-filling bottom plate, a liftable pressing strip plate is arranged above the circuit board, a column is arranged at one side end of the hole-filling bottom plate, a mounting plate is fixedly connected to the column, a robotic arm is fixedly installed on the mounting plate, and a mounting bracket is fixedly connected to the end effector of the robotic arm;

[0009] Hole-filling mechanism, including a mechanism connecting seat, the mechanism connecting seat is fixedly installed on the mounting bracket, a feeding pipe is fixedly connected to the mechanism connecting seat, a vertically arranged connecting pipe is fixedly connected to the lower end face of the mechanism connecting seat, a horizontally arranged long strip feeding bin is fixedly connected to the lower end of the connecting pipe, a long strip discharge port is fixedly connected to the lower end of the long strip feeding bin, a mechanism connecting plate is fixedly connected to the side end face of the long strip feeding bin, and a hole-filling scraper is fixedly connected to the mechanism connecting plate.

[0010] As a further scheme of the present utility model: the long strip feeding bin is a long strip-shaped member, the long strip discharge port is arranged along the length direction of the long strip feeding bin, the feeding pipe is communicated with the connecting pipe, the connecting pipe is communicated with the inside of the long strip feeding bin, and the long strip discharge port is communicated with the inside of the long strip feeding bin.

[0011] As a further scheme of the present utility model: a lifting frame is fixedly connected to the hole-filling bottom plate, a mounting frame is fixedly connected to the upper end of the lifting frame, a cylinder is fixedly connected to the mounting frame, the driving end of the cylinder is arranged downward, a telescopic rod is fixedly connected to the driving end of the cylinder, and a lifting frame is fixedly connected to the telescopic rod.

[0012] As a further scheme of the present utility model: the pressing strip plate is fixedly connected to the lifting frame, a reinforcing member is fixedly connected between the pressing strip plate and the lifting frame, there are two pressing strip plates, and the two pressing strip plates are arranged in parallel.

[0013] As a further scheme of the present utility model: a collection groove is fixedly connected to one side end face of the hole-filling bottom plate, and a scraper is fixedly connected to the notch of the collection groove.

[0014] As a further scheme of the present utility model: a support frame is fixedly connected to the bottom surface of the operating table.

[0015] The beneficial effects of the present utility model:

[0016] 1. When the utility model is in use, place the circuit board on the hole-filling bottom plate, press and fix both sides of the circuit board through two parallelly arranged pressing strip plates, connect the feeding pipe with the feeding pipe of the molten resin, the resin enters the long strip feeding bin through the feeding pipe and the connecting pipe, and then is discharged from the long strip discharging port through the long strip feeding bin. Drive the hole-filling mechanism by the robotic arm to move from one end of the circuit board to the other end to apply the resin on the surface of the circuit board. By setting the long strip feeding bin and the long strip discharging port, the fluidity of the resin can be ensured, and bubbles inside the resin can be prevented from appearing when the resin is discharged from the long strip discharging port;

[0017] 2. When applying the resin on the circuit board, drive the hole-filling mechanism by the robotic arm to move from one end of the circuit board to the other end, smear the resin on the surface of the circuit board evenly through the hole-filling scraper, and at the same time compact the resin in the through holes of the circuit board to eliminate the bubbles existing in the resin in the through holes. A collecting groove is fixedly connected to one side end face of the hole-filling bottom plate, and a scraper is fixedly connected at the notch of the collecting groove. Drive the hole-filling mechanism by the robotic arm to move to the scraper to scrape the resin on the hole-filling scraper onto the scraper, and the resin on the scraper flows into the collecting groove, thereby completing the collection of the redundant resin, avoiding the waste of the resin, and saving the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following further describes the present utility model with reference to the drawings.

[0019] Figure 1 is the three-dimensional structure schematic diagram of the present utility model;

[0020] Figure 2 is the three-dimensional structure schematic diagram of the present utility model after removing the robotic arm, the hole-filling mechanism and the mounting bracket;

[0021] Figure 3 is the three-dimensional structure schematic diagram of the connection relationship among the hole-filling bottom plate, the feeding bottom plate, the lifting frame, the mounting frame, the air cylinder, the lifting frame, the pressing strip plate, the reinforcing member, the collecting groove and the scraper of the present utility model;

[0022] Figure 4 is the three-dimensional structure schematic diagram of the connection relationship among the robotic arm, the hole-filling mechanism and the mounting bracket of the present utility model Figure 1 ;

[0023] Figure 5 is the three-dimensional structure schematic diagram of the connection relationship among the robotic arm, the hole-filling mechanism and the mounting bracket of the present utility model Figure 2 ;

[0024] Figure 6 is the present utility model Figure 4 The enlarged structure schematic diagram at A in;

[0025] Figure 7 is the present utility model Figure 5Schematic diagram of the enlarged structure at B in the [Chinese context].

[0026] In the figure: 1, operating table; 2, support frame; 3, mounting seat; 4, hole filling bottom plate; 5, material conveying bottom plate; 6, lifting frame; 7, mounting frame; 8, cylinder; 9, lifting frame; 10, pressing strip plate; 11, strengthening member; 12, collection trough; 13, scraper; 14, column; 15, mounting plate; 16, robotic arm; 17, hole filling mechanism; 171, mechanism connecting seat; 172, feed pipe; 173, connecting pipe; 174, long strip material conveying bin; 175, mechanism connecting plate; 176, hole filling scraper; 177, long strip discharge port; 18, mounting bracket. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0028] As Figures 1 - 7 shown, a circuit board hole filling electroplating device with a leak prevention function includes:

[0029] An operating table 1, on which a mounting seat 3 is fixedly connected. On the mounting seat 3, a hole filling bottom plate 4 is fixedly connected. On one end face of the hole filling bottom plate 4, a material conveying bottom plate 5 is fixedly connected. A circuit board is arranged on the hole filling bottom plate 4. Above the circuit board, a liftable pressing strip plate 10 is arranged. On one side end of the hole filling bottom plate 4, a column 14 is arranged. On the column 14, a mounting plate 15 is fixedly connected. On the mounting plate 15, a robotic arm 16 is fixedly installed. The end effector of the robotic arm 16 is fixedly connected with a mounting bracket 18;

[0030] A hole filling mechanism 17, including a mechanism connecting seat 171, which is fixedly installed on the mounting bracket 18. On the mechanism connecting seat 171, a feed pipe 172 is fixedly connected. On the lower end face of the mechanism connecting seat 171, a vertically arranged connecting pipe 173 is fixedly connected. The lower end of the connecting pipe 173 is fixedly connected with a horizontally arranged long strip material conveying bin 174. The lower end of the long strip material conveying bin 174 is fixedly connected with a long strip discharge port 177. On the side end face of the long strip material conveying bin 174, a mechanism connecting plate 175 is fixedly connected. On the mechanism connecting plate 175, a hole filling scraper 176 is fixedly connected.

[0031] The long strip material feeding bin 174 is a long strip-shaped part. The long strip discharge port 177 is arranged along the length direction of the long strip material feeding bin 174. The feeding pipe 172 is communicated with the connecting pipe 173. The connecting pipe 173 is communicated with the inside of the long strip material feeding bin 174. The long strip discharge port 177 is communicated with the inside of the long strip material feeding bin 174.

[0032] A lifting frame 6 is fixedly connected to the filling hole bottom plate 4. The upper end of the lifting frame 6 is fixedly connected with a mounting frame 7. A cylinder 8 is fixedly connected to the mounting frame 7. The driving end of the cylinder 8 is arranged downward. A telescopic rod is fixedly connected to the driving end of the cylinder 8. A lifting frame 9 is fixedly connected to the telescopic rod. A pressing strip plate 10 is fixedly connected to the lifting frame 9. A reinforcing member 11 is fixedly connected between the pressing strip plate 10 and the lifting frame 9. There are two pressing strip plates 10, and the two pressing strip plates 10 are arranged in parallel.

[0033] A collecting groove 12 is fixedly connected to one side end face of the filling hole bottom plate 4. A scraping plate 13 is fixedly connected to the notch of the collecting groove 12.

[0034] In some specific implementation schemes, a support frame 2 is fixedly connected to the bottom surface of the operating table 1.

[0035] To facilitate the understanding of this solution embodiment by those skilled in the art, the working principle of this solution will be briefly described below in combination with a specific application scenario:

[0036] During use, place the circuit board on the filling hole bottom plate 4. Press and fix both sides of the circuit board through the two parallel pressing strip plates 10. Connect the feeding pipe 172 to the feeding pipe of the molten resin. The resin enters the long strip material feeding bin 174 through the feeding pipe 172 and the connecting pipe 173, and then is discharged from the long strip discharge port 177 through the long strip material feeding bin 174. The robotic arm 16 drives the filling hole mechanism 17 to move from one end of the circuit board to the other end to apply the resin on the surface of the circuit board. By setting the long strip material feeding bin 174 and the long strip discharge port 177, the fluidity of the resin can be ensured, and bubbles in the resin can be prevented from appearing when the resin is discharged from the long strip discharge port 177. When applying the resin on the circuit board, the robotic arm 16 drives the filling hole mechanism 17 to move from one end of the circuit board to the other end. The filling hole scraping plate 176 spreads the resin on the surface of the circuit board evenly, and at the same time compacts the resin in the through holes of the circuit board to eliminate the bubbles in the resin in the through holes. A collecting groove 12 is fixedly connected to one side end face of the filling hole bottom plate 4. A scraping plate 13 is fixedly connected to the notch of the collecting groove 12. The robotic arm 16 drives the filling hole mechanism 17 to move to the position of the scraping plate 13, and scrapes the resin on the filling hole scraping plate 176 onto the scraping plate 13. The resin on the scraping plate 13 flows into the collecting groove 12, thereby completing the collection of the excess resin, avoiding the waste of resin, and saving production costs.

[0037] The above has described several embodiments of the present utility model in detail, but the embodiments of the present utility model are not limited thereto and should not be considered as defining the scope of implementation of the present utility model. All equivalent changes and improvements made within the scope of the application of the present utility model should still fall within the scope covered by the patent of the present utility model.

Claims

1. A circuit board hole filling electroplating device with leak-proof function, characterized in that: include: An operating table (1), wherein a mounting seat (3) is fixedly connected to the operating table (1), a hole-filling bottom plate (4) is fixedly connected to the mounting seat (3), a feeding bottom plate (5) is fixedly connected to one end surface of the hole-filling bottom plate (4), a circuit board is arranged on the hole-filling bottom plate (4), a lifting and lowering pressing strip plate (10) is arranged above the circuit board, a column (14) is arranged at one end of the hole-filling bottom plate (4), a mounting plate (15) is fixedly connected to the column (14), a mechanical arm (16) is fixedly installed on the mounting plate (15), and a mounting bracket (18) is fixedly connected to the end effector of the mechanical arm (16); The hole filling mechanism (17) comprises a mechanism connecting seat (171), the mechanism connecting seat (171) is fixedly mounted on the mounting bracket (18), a feed pipe (172) is fixedly connected to the mechanism connecting seat (171), a vertically arranged connecting pipe (173) is fixedly connected to the lower end surface of the mechanism connecting seat (171), a horizontally arranged long strip feeding bin (174) is fixedly connected to the lower end of the connecting pipe (173), a long strip feeding port (177) is fixedly connected to the lower end of the long strip feeding bin (174), a mechanism connecting plate (175) is fixedly connected to the side end surface of the long strip feeding bin (174), and a hole filling scraper (176) is fixedly connected to the mechanism connecting plate (175).

2. A circuit board hole filling electroplating device with leakage prevention function according to claim 1, characterized in that: The long strip material conveying bin (174) is a long strip-shaped member, and the long strip material discharge port (177) is arranged along the length direction of the long strip material conveying bin (174). The feed pipe (172) is connected to the connecting pipe (173), the connecting pipe (173) is connected to the inside of the long strip material conveying bin (174), and the long strip material discharge port (177) is connected to the inside of the long strip material conveying bin (174).

3. A circuit board hole filling electroplating device with leakage prevention function according to claim 1, characterized in that: A lifting frame (6) is fixedly connected to the hole filling bottom plate (4), a mounting frame (7) is fixedly connected to the upper end of the lifting frame (6), a cylinder (8) is fixedly connected to the mounting frame (7), a driving end of the cylinder (8) is arranged downward, a telescopic rod is fixedly connected to the driving end of the cylinder (8), and a lifting frame (9) is fixedly connected to the telescopic rod.

4. A circuit board hole filling electroplating device with leakage prevention function according to claim 3, characterized in that: The pressing strip (10) is fixedly connected to the lifting frame (9), a reinforcing member (11) is fixedly connected between the pressing strip (10) and the lifting frame (9), two pressing strips (10) are provided, and the two pressing strips (10) are arranged in parallel.

5. A circuit board hole filling electroplating device with leakage prevention function according to claim 1, characterized in that: A collecting groove (12) is fixedly connected to one end surface of the hole filling bottom plate (4), and a scraper (13) is fixedly connected to the notch of the collecting groove (12).

6. A circuit board hole filling electroplating device with leakage prevention function according to claim 1, characterized in that: The bottom surface of the operating table (1) is fixedly connected with a support frame (2).

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