Circuit trimming tin penetration structure and circuit module

Abstract

The utility model discloses a circuit trimming tin penetration structure and a circuit module, comprising a pedestal, a circuit unit provided with a support hole group, and a circuit support structure arranged on the pedestal and supporting the circuit unit to suspend above the pedestal. The circuit supporting structure comprises a supporting unit matched with the supporting hole set to support the circuit unit, the first end of the supporting unit and the base are preformed into a whole, and the second end of the supporting unit supports the circuit unit and is provided with a supporting tin penetrating part. And the first support projection of the support tin penetration part on the horizontal plane is partially overlapped with the second support projection of the support hole group on the horizontal plane. Compared with the prior art, the circuit trimming tin penetration structure can perform rapid visual inspection on the tin penetration rate, does not need inspection equipment, and is convenient and rapid.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit modules, in particular to a circuit trimming and tin-penetrating structure and a circuit module. Background Art

[0002] Integrated circuits are the foundation of modern electronic technology and are widely used in fields such as computers, communications, consumer electronics, medical, and automotive. With the development of emerging technologies such as artificial intelligence, the Internet of Things, and 5G, the demand for integrated circuits is also constantly increasing. With the progress of microelectronics technology, electronic systems are gradually developing from mechanization and informatization to networking, and the demand for small-size, low-weight, high-reliability, and high-performance integrated circuits is becoming more and more urgent. Especially in the aerospace field, with the expansion of the application scope of the whole machine system and the improvement of the overall performance, the requirements for the reliability and stability of such circuits are also getting higher and higher, and higher requirements are put forward for the indicators and long-term working reliability of the corresponding integrated circuits. Among them, the improvement of mechanical reliability is of utmost importance.

[0003] For integrated circuits, to achieve high density, high reliability, high performance, and extremely high mechanical reliability, it can only be achieved by improving the circuit structure on the basis of ensuring the electrical performance of the circuit. The housing of the hexahedron structure circuit can provide good protection for the internal circuit, and the metal housing has the highest strength and the best protection among all materials. Therefore, high-reliability hybrid integrated circuits all adopt a metal hexahedron structure. However, limited by factors such as the substrate material, the ceramic substrate used in hybrid integrated circuits can only achieve single-sided assembly, and the assembly technology is limited to surface mount technology (SMT), and the cost is relatively high. Printed circuit boards (PCBs) have low costs and mature technologies, can be double-sided assembled, and can use through-hole insertion technology (THT) in addition to surface mount technology (SMT). Therefore, how to improve the reliability of printed circuit boards to meet the development requirements of current integrated circuits is an urgent problem that the industry needs to solve.

[0004] The most common current metal hexahedron circuit is composed of a pentahedron metal base and a flat cover plate. Although this structure can increase steps in the inner cavity of the package to place the printed circuit board for double-sided assembled components, it cannot improve its reliability. Instead, it will bring quality hazards due to circuit structure limitations. This is because in order to meet the overcurrent demand, the interconnection between the internal circuit board and the package pins can only adopt the process of through-hole welding. First, the shell of the traditional pentahedron metal base will have a great impact on the welding near the edge of the package, increasing the welding difficulty and even making it impossible to weld due to insufficient space. Second, the tin penetration IPC standard for through-hole welding requires not less than 75% of the aperture height (board thickness), and for circuits with high reliability requirements, the tin penetration rate GJB even requires 100%. After the traditional pentahedron metal base is welded, the tin penetration of the pins cannot be visually inspected due to the occlusion of the shell, and only large-scale detection equipment such as X-ray can be used for judgment. In addition to the problems of the weldability and quality control of the welding itself, the original structure also has the problem that the metal residues such as tin beads, tin skins, and tin dross splashed during welding will fall into the bottom space and cannot be removed. These metal residues will cause short circuits between components and directly cause circuit failure. Utility Model Content

[0005] In view of this, the purpose of the present utility model is to provide a circuit edge cutting tin penetration structure and a circuit module to solve the problems of low circuit reliability, large welding difficulty, and inability to visually inspect the welding quality in the prior art.

[0006] To achieve the above object, a technical solution of the present utility model provides a circuit edge cutting tin penetration structure, including a base, a circuit unit provided with a support hole group, and a circuit support structure provided on the base and supporting the circuit unit to hang above the base. The circuit support structure includes a support unit that cooperates with the support hole group to support the circuit unit. The first end of the support unit is preformed integrally with the base, and the second end of the support unit supports the circuit unit and is provided with a support tin penetration part. The first support projection of the support tin penetration part on the horizontal plane partially coincides with the second support projection of the support hole group on the horizontal plane.

[0007] Furthermore, the support unit further includes a support seat body preformed on the base and integrally provided with the support tin penetration part, and a welding part integrally extending from the end of the support tin penetration part away from the support seat body. The welding part is welded and fixed in the support hole group.

[0008] Further, the support hole group is defined as through holes penetrating the circuit unit along the thickness direction of the circuit unit. The inner diameter of the support hole group is larger than the diameter of the welding part and smaller than the diameter of the support solder-penetrating part. A support step surface is formed at one end of the support solder-penetrating part adjacent to the welding part. When the support unit and the circuit unit are assembled in place, the welding part is spacedly inserted into the support hole group, and the support step surface supports the corresponding side surface of the circuit unit to support the circuit unit.

[0009] Further, an axially extending support solder-penetrating cutting surface is formed on the outer peripheral surface of the support solder-penetrating part. The axially first end of the support solder-penetrating cutting surface is connected to the support step surface. The radial dimension from the axis of the support solder-penetrating part to the support solder-penetrating cutting surface is smaller than the inner diameter of the support hole group, so that the first support projection of the support solder-penetrating part on the horizontal plane and the second support projection of the support hole group on the horizontal plane partially overlap.

[0010] To achieve the above object, another technical solution of the present invention provides a circuit module, including a shell having an installation cavity and a packaging opening communicating with the installation cavity, and the circuit edge solder-penetrating structure as described above. The base covers the packaging opening and closes the installation cavity. The circuit support structure supports the circuit unit to be suspended in the installation cavity and corresponding to the upper side of the base.

[0011] Further, the circuit unit includes a circuit unit suspended in the installation cavity and having a first side surface and a second side surface arranged oppositely, a first component mounted on the first side surface of the circuit unit, and a second component mounted on the second side surface of the circuit unit. The support hole group is formed on the circuit board and penetrates the first side surface and the second side surface of the circuit board.

[0012] Further, screw mounting holes for external connection and fixation are further provided on the outer surface of the shell.

[0013] Further, a packaging step is formed at one end edge of the shell corresponding to the packaging opening. A mating step complementary to the packaging step is provided on one side of the edge of the base corresponding to the packaging opening. When the base covers the packaging opening, the mating step abuts against the packaging step.

[0014] Further, it further includes a plastic package filled in the installation cavity and covering the circuit unit. A potting hole for forming the plastic package is provided on the base.

[0015] Further, it further includes an electrical interconnection structure disposed on the base and connected to the circuit unit. The electrical interconnection structure includes a first interconnection unit and / or a second interconnection unit. A first interconnection hole group for electrically contacting with the first interconnection unit and / or a second interconnection hole group for electrically contacting with the second interconnection unit are also disposed on the circuit unit. The first ends of the first interconnection unit and the second interconnection unit are correspondingly connected to the base. The second end of the first interconnection unit penetrates through the first interconnection hole group and is electrically contacted with the circuit unit. The second end of the second interconnection unit abuts within the first interconnection hole group and is electrically contacted with the circuit unit.

[0016] In the present utility model, a solder-penetrating part is disposed at a corresponding position of the support unit, and a corresponding solder-penetrating section is disposed on the solder-penetrating part to form a ventilation channel between the support unit and the corresponding support hole group, facilitating soldering and solder penetration during the soldering process, enabling the solder penetration rate of the circuit to meet the requirements, and being able to quickly visually inspect the soldering quality after soldering is completed to ensure the packaging quality of the circuit module, thereby meeting the development requirements of high density, high reliability, and high performance of integrated circuits. In addition, in the present utility model, the circuit support structure is preformed on the base, then the circuit board is assembled and soldered with the circuit support structure, and finally the assembled base and circuit unit are packaged with the package. The circuit unit is supported and fixed by the circuit support structure. The circuit unit does not need to be soldered to the package, which can effectively reduce the assembly and soldering difficulty between the circuit unit and the package, is beneficial to improving the packaging efficiency. At the same time, it can also avoid the problem that the soldering waste slag falls into the bottom space and is difficult to remove, ensuring that the circuit will not fail due to short-circuiting of the soldering waste slag, thereby improving the safety and reliability of the circuit module in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of an embodiment of a highly reliable metal hexahedron circuit module of the present utility model.

[0018] Figure 2 is Figure 1 An internal cross-sectional view at the circuit support structure and the electrical interconnection structure.

[0019] Figure 3 It is a schematic structural diagram of the package.

[0020] Figure 4 It is a schematic structural diagram of the base.

[0021] Figure 5 It is a schematic structural diagram of the circuit unit.

[0022] Figure 6 is Figure 4 A schematic structural diagram at position A in

[0023] Figure 7It is a schematic structural diagram of the first interconnection unit.

[0024] Figure 8 It is a schematic structural diagram of the second interconnection unit.

[0025] Figure 9 It is Figure 2 an enlarged view of position B in

[0026] Figure 10 It is a schematic structural diagram of another embodiment of the highly reliable metal hexahedron circuit module of the present utility model.

[0027] Figure 11 It is a schematic structural diagram of yet another embodiment of the highly reliable metal hexahedron circuit module of the present utility model.

[0028] Figure 12 It is a schematic structural diagram of yet another embodiment of the highly reliable metal hexahedron circuit module of the present utility model.

[0029] The reference numerals in the specification drawings are as follows:

[0030] housing 100, mounting cavity 110, encapsulation opening 120, encapsulation step 130, screw mounting hole 140;

[0031] base 200, third interconnection hole group 210, mating step 220, potting hole 230;

[0032] circuit unit 300, circuit board 310, support hole group 311, first interconnection hole group 312, full via hole 312a, half via hole 312b, second interconnection hole group 313, full blind hole 313a, half blind hole 313b, first component 320, second component 330;

[0033] circuit support structure 400, support unit 410, support seat body 411, support tin-penetrating part 412, welding part 413, support step surface 414, support tin-penetrating cutting surface 415;

[0034] electrical interconnection structure 500, first interconnection unit 510, first pin part 511, first fixing part 512, first pin part 513, first interconnection tin-penetrating part 514, first interconnection tin-penetrating cutting surface 515, second interconnection unit 520, second pin part 521, second fixing part 522, second pin part 523, second interconnection tin-penetrating part 524, second interconnection tin-penetrating cutting surface 525;

[0035] plastic package 600;

[0036] first fixing post 710, second fixing post 720, fixing flange 730. Detailed implementation manners

[0037] The following is a further detailed description through specific embodiments:

[0038] Embodiment 1

[0039] Please refer to Figure 1 and Figure 2 , the highly reliable metal hexahedron circuit module (hereinafter referred to as "circuit module") of this embodiment includes a package 100, a base 200 covering the package 100, a circuit unit 300 suspended in the package 100 and corresponding to the upper part of the base 200, a circuit support structure 400 arranged on the base 200 and supporting the circuit unit 300, an electrical interconnection structure 500 arranged on the base 200 and connected to the circuit unit 300, and a plastic package 600 filled in the package 100 and covering the circuit unit 300.

[0040] The circuit support structure 400 supports the circuit unit 300 to be suspended in the package 100, so that the circuit unit 300 can arrange electrical components on both sides, improving the integration of the circuit unit 300; the electrical interconnection structure 500 is connected between the circuit unit 300 and the base 200, and can lead out the circuit unit 300 to be connected to an external circuit, realizing signal transmission between the circuit module and the external circuit; specifically, the electrical interconnection structure 500 can also play a role in supporting the circuit unit 300, that is, in some embodiments, the circuit support structure 400 can be omitted, and the support and conduction of the circuit unit 300 can be jointly realized through the electrical interconnection structure 500. In this embodiment, the circuit support structure 400 and the electrical interconnection structure 500 can be preformed on the base 200. Specifically, the circuit support structure 400 can be preformed on the base 200 by riveting, welding or integral processing, while the electrical interconnection structure 500 can be preformed on the base 200 by processes such as sintering and then assembled with the circuit unit 300 and the package 100 to reduce the welding process in the subsequent assembly process, thereby reducing the welding difficulty and the difficulty of cleaning welding residues.

[0041] Please refer to Figure 3, the housing 100 is integrally in a pentahedron structure. There is an installation cavity 110 and a packaging opening 120 communicating with the installation cavity 110 inside the housing 100. The base 200 covers the packaging opening 120 to enclose the installation cavity 110, making the interior of the entire circuit module hollow to suspend the circuit unit 300. The plastic package 600 is filled in the installation cavity 110 and completely wraps the circuit unit 300. On the one hand, it can increase the stress area at the suspended part of the circuit unit 300, reduce the stress at the circuit support structure 400 to prevent deformation and reduce the stress at the electrical interconnection structure 500 to ensure stable circuit connection, thereby improving the mechanical and electrical properties of the circuit module. On the other hand, the circuit unit 300 at the suspended part contacts the plastic package 600, which is beneficial for the components on the circuit unit 300 to dissipate heat through the plastic package 600, so as to further improve the performance of the circuit module. In this embodiment, the housing 100 can be made of metal materials such as stainless steel, iron-nickel alloy, cold-rolled steel, high-quality carbon structural steel, and anti-rust aluminum, so as to improve the mechanical strength of the entire circuit module, prevent the circuit module from deforming after long-term use and affecting the normal use of the whole circuit module, and ensure the safety and reliability of use.

[0042] At one end edge of the housing 100 corresponding to the packaging opening 120, a packaging step 130 is formed for embedding the base 200, so that when the base 200 covers the packaging opening 120, it can be supported on the packaging step 130 to enclose the installation cavity 110. The embedded combination method between the housing 100 and the base 200 can not only quickly position the housing 100 and the base 200 during assembly, but also ensure the bonding strength between the housing 100 and the base 200. Specifically, during implementation, according to the packaging bonding strength, the base 200 can be fixed to the packaging step 130 of the housing 100 by means of parallel seam welding, energy storage seam welding, laser seam welding, tin sealing, bonding, etc. The mating step 220 abuts against the packaging step 130. It can be understood that in some other embodiments, the setting of the packaging step 130 can also be omitted, and the base 200 can be directly placed flat on the packaging opening 120 of the housing 100 and then the above-mentioned packaging method can be used to cap the housing 100 and the base 200.

[0043] On the inner wall of the housing 100 at one end corresponding to the packaging opening 120, there is also a potting mark (not shown in the figure) lower than the packaging step 130. The potting mark is used to indicate the potting amount of the colloid when potting the plastic package 600. During potting, the height of the plastic package 600 is lower than the potting mark to avoid the colloid overflowing during assembly or capping.

[0044] As a preferred embodiment of this example, screw mounting holes 140 are further provided on the outer surface of the shell 100. The screw mounting holes 140 are used to fix to an external structure when using the circuit module, so as to increase the stability of the installation of the circuit module.

[0045] Please refer to Figure 4 , the base 200 as a whole adopts a flat plate structure. The base 200 has a first surface facing the circuit unit 300 and a second surface facing away from the circuit unit 300. At the position corresponding to the electrical interconnection structure 500 on the base 200, a third interconnection hole group 210 is provided. The third interconnection hole group 210 penetrates through the first surface and the second surface of the base 200 to preform the electrical interconnection structure 500 on the base 200. In this example, the base 200 can be made of the same metal materials as the shell 100, such as stainless steel, iron-nickel alloy, cold-rolled steel, high-quality carbon structural steel, and anti-rust aluminum, so as to further improve the mechanical strength of the entire circuit module, prevent the circuit module from deforming after long-term use and affecting the normal use of the whole circuit module, and ensure the safety and reliability of use.

[0046] On one side of the edge of the base 200 corresponding to the encapsulation opening 120, a mating step 220 complementary to the encapsulation step 130 is provided to quickly and stably cover the encapsulation opening 120. It can be understood that in some other embodiments, when the encapsulation step 130 is not provided on the encapsulation opening 120, the base 200 can also omit the setting of the mating step 220 or be set as a mating step 220 matching the encapsulation opening 120, so as to be placed flat on the encapsulation opening 120, and then the base 200 and the shell 100 are capped in a suitable connection manner.

[0047] On the base 200, there is also a potting hole 230 penetrating through the first surface and the second surface of the base 200, which is used to pot a colloid into the encapsulation cavity 110 to form an encapsulation body 600 during encapsulation.

[0048] Please refer to Figure 5 , the circuit unit 300 includes a circuit board 310 suspended in the installation cavity 110 and having a first side and a second side arranged oppositely, a first component 320 mounted on the first side of the circuit unit 300, and a second component 330 mounted on the second side of the circuit unit 300. The circuit board 310 is supported by the circuit support structure 400 and suspended in the installation cavity 110. The first component 320 and the second component 330 are led out through the electrical interconnection structure 500 to be connected to an external circuit.

[0049] A support hole group 311 is provided at a position on the circuit unit 300 corresponding to the circuit support structure 400. One end of the circuit support structure 400 away from the base 200 penetrates into the support hole group 311 to cooperate with the support hole group 311 to support the circuit unit 300. The support hole group 311 is defined as a through hole penetrating the circuit unit 300. The through hole penetrates the first side and the second side of the circuit board 310 along the thickness direction of the circuit board 310, so that the corresponding end of the circuit support structure 400 can penetrate into the support hole group 311, and then the corresponding end of the circuit support structure 400 can be fixed to the support hole group 311 to stably support the circuit unit 300.

[0050] A first interconnection hole group 312 and / or a second interconnection hole group 313 are further provided at a position on the circuit unit 300 corresponding to the electrical interconnection structure 500. One end of the electrical interconnection structure 500 away from the base 200 penetrates into the first interconnection hole group 312 or abuts against the second interconnection hole group 313 to lead out the signals of the first component 320 and the second component 330.

[0051] The first interconnect via group 312 includes full vias 312a and / or half vias 312b. The full vias 312a and / or half vias 312b are each defined as through holes that penetrate through the circuit unit 300 along the circuit unit 300. The full vias 312a and / or half vias 312b each penetrate through the first side and the second side of the circuit board 310 along the thickness direction of the circuit board 310, enabling the corresponding ends of the electrical interconnect structure 500 to penetrate into the full vias 312a or half vias 312b. Furthermore, it is convenient to weld and fix the electrical interconnect structure 500 to the full vias 312a or half vias 312b by means of full-hole soldering, so as to increase the connection stability between the electrical interconnect structure 500 and the circuit board 310, and achieve electrical contact between the electrical interconnect structure 500 and the first component 320 located on the first side of the circuit board 310 and the second component 330 located on the second side of the circuit board 310. Furthermore, the signals of the circuit unit 300 are led out of the base 200 to conduct with an external circuit. In this embodiment, the inner peripheral surface of the full via 312a is defined as a complete circumferential surface that is closed in the circumferential direction. According to the arrangement of the first component 320 and the second component 330, the full via 312a can be arranged at any position on the circuit board 310 to facilitate circuit routing; the inner peripheral surface of the half via 312b is defined as an incomplete circumferential surface that is not closed and communicates with the circumferential side of the circuit unit 300. The half via 312b can be arranged at the edge of the circuit board 310 to minimize the occupied area of the circuit board 310 as much as possible, meet the layout requirements of the first component 320 and the second component 330 on the circuit board 310, improve the circuit integration. When connecting the electrical interconnect structure 500 with the half via 312b, the length of the inner peripheral surface of the half via 312b is greater than half of the circumference, avoiding the electrical interconnect structure 500 detaching from the circuit board 310 from the side, and further improving the connection stability between the electrical interconnect structure 500 and the circuit board 310.

[0052] The second interconnect via group 313 includes full blind vias 313a and / or half blind vias 313b. The full blind vias 313a and / or half blind vias 313b are each defined as blind vias provided on corresponding sides of the circuit unit 300. The full blind vias 313a and / or half blind vias 313b are recessed in the second side of the circuit board 310, enabling corresponding ends of the electrical interconnect structure 500 to extend into the full blind vias 313a or half blind vias 313b and abut against the bottoms of the full blind vias 313a or half blind vias 313b. On the one hand, it is convenient to weld and fix the corresponding ends of the electrical interconnect structure 500 to the full blind vias 313a or half blind vias 313b. On the other hand, the electrical interconnect structure 500 can also play a role in assisting in supporting the circuit unit 300. By defining the full blind vias 313a and / or half blind vias 313b as blind vias recessed on corresponding sides of the circuit unit 300, in this way, the welding and fixing of the electrical interconnect structure 500 and the blind vias only need to be carried out on one side of the opening, which can greatly reduce the occupancy rate of the circuit board 310 by through-hole welding, so as to achieve the purpose of optimizing the circuit layout. In this embodiment, the inner circumferential surface of the full blind via 313a is defined as a complete circumferential surface that is closed in the circumferential direction. Similarly, according to the arrangement of the first element 320 and the second element 330, the full blind via 313a can be arranged at any position on the second side of the circuit board 310 to facilitate circuit routing. The inner circumferential surface of the half blind via 313b is defined as an incomplete circumferential surface that is not closed and communicates with the circumferential side of the circuit unit 300. The half blind via 313b can be arranged at the edge of the circuit board 310 like the half via 312b to minimize the occupied area of the circuit board 310 as much as possible, further optimize the circuit layout, and thus further improve the circuit integration. Similarly, when using the half blind via 313b to connect the electrical interconnect structure 500, the inner circumferential surface length of the half blind via 313b is greater than half of the circumference to prevent the electrical interconnect structure 500 from detaching from the circuit board 310 from the side, thereby improving the connection stability between the electrical interconnect structure 500 and the circuit board 310.

[0053] In specific implementation, according to the actual layout of the first element 320 and the second element 330 on the circuit board 310, at least one of the full via 312a, the half via 312b, the full blind via 313a, and the half blind via 313b can be selected for setting to achieve the purpose of optimizing the circuit layout.

[0054] In this embodiment, the circuit support structure 400 cooperates with the base 200 and the circuit unit 300 to form a circuit trimming and tin-penetrating structure, so that when the circuit support structure 400 is assembled and connected to the circuit unit 300, a ventilation channel can be formed between the circuit support structure 400 and the circuit board 310, ensuring the tin-penetrating rate when the circuit support structure 400 and the circuit board 310 are soldered, thereby improving the soldering quality and strength between the circuit support structure 400 and the circuit board 310. At the same time, the ventilation channel also helps to visually inspect the connection between the circuit support structure 400 and the circuit board 310 after soldering is completed, quickly judge the tin-penetrating situation, which is convenient and fast.

[0055] Please refer to Figure 6 , the first end of the circuit support structure 400 is preformed integrally with the base 200, and the second end of the circuit support structure 400 supports the circuit unit 300. The circuit support structure 400 includes a support unit 410 disposed on the base 200 and cooperating with the support hole group 311 to support the circuit unit 300. The support unit 410 is correspondingly disposed with the support hole group 311. The first end of the support unit 410 is preformed integrally with the base 200 or is preformed integrally with the base 200 in an integrally formed manner. The second end of the support unit 410 penetrates into the support hole group 311 and is fixed to the support hole group 311 to support the circuit board 310, and the circuit unit 300 is suspended above the base 200.

[0056] The support unit 410 includes a support seat body 411 formed integrally with the base 200, a support tin-penetrating portion 412 integrally extending from the support seat body 411, and a welding portion 413 integrally extending from the support tin-penetrating portion 412. In this embodiment, the support unit 410 is preformed on the base 200 in an integrally formed manner to fix the support unit 410 to the base 200. The corresponding surface of the support tin-penetrating portion 412 (the surface away from the support base 411) abuts against the corresponding side surface of the circuit unit 300 (i.e., the second side surface of the circuit board 310) to support the circuit board 310. The welding portion 413 penetrates into the support hole group 311 and is welded and fixed in the support hole group 311 to fix the support unit 410 to the circuit board 310.

[0057] In this embodiment, the diameter of the support solder-penetrating portion 412 is greater than the diameter of the welding portion 413, such that a support step surface 414 is formed at one end of the support solder-penetrating portion 412 adjacent to the welding portion 413. At the same time, the diameter of the support solder-penetrating portion 412 is also greater than the inner diameter of the support hole group 311, so that after the support unit 410 and the circuit unit 300 are assembled in place, the support step surface 414 can support on the corresponding side surface of the circuit unit 300 (i.e., the second side surface of the circuit board 310), thereby playing a role in supporting the circuit board 310. The diameter of the welding portion 413 is less than the diameter of the support hole group 311, so that when the welding portion 413 and the support hole group 311 are assembled, the welding portion 413 can be spaced and inserted into the support hole group 311, and then a welding space is formed between the outer peripheral surface of the welding portion 413 and the inner peripheral surface of the support hole group 311, facilitating welding of the welding portion 413 and the support hole group 311; preferably, the inner diameter of the support hole group 311 is 1.1 to 1.5 times the diameter of the welding portion 413, to facilitate welding between the outer peripheral surface of the welding portion 413 and the inner peripheral surface of the support hole group 311.

[0058] The first support projection of the support solder-penetrating portion 412 on the horizontal plane partially coincides with the second support projection of the support hole group 311 on the horizontal plane. With such a setting, the support hole group 311 is not completely blocked by the support solder-penetrating portion 412, which can not only meet the support function of the support unit 410 for the circuit board 310, but also form a ventilation channel between the support solder-penetrating portion 412 and the support hole group 311 to ensure the solder-penetrating rate when the support unit 410 and the circuit board 310 are welded. Specifically, an axially extending support solder-penetrating cut surface 415 is formed on the outer peripheral surface of the support solder-penetrating portion 412. The first axial end of the support solder-penetrating cut surface 415 is connected to the support step surface 414, and the radial dimension from the axis of the support solder-penetrating portion 412 to the support solder-penetrating cut surface 415 is less than the inner diameter of the support hole group 311, such that the first support projection of the support solder-penetrating portion 412 on the horizontal plane and the second support projection of the support hole group 311 on the horizontal plane can partially coincide. In this embodiment, the second end of the support solder-penetrating cut surface 415 does not axially penetrate the support solder-penetrating portion 412, so as to form a solder-penetrating stop step at the position corresponding to the second end of the support solder-penetrating cut surface 415 on the support solder-penetrating portion 412. The solder-penetrating stop step can play a role in blocking the molten solder during the welding process to save solder.

[0059] In the specific implementation of this embodiment, the welding part 413 can also be connected to the circuit board 310 by riveting, that is, the welding part 413 is set to extend out of the first side of the circuit board 310, and then the excess part of the welding part 413 on the first side of the circuit board 310 is riveted, so as to realize the fixation of the entire support unit 410 to the circuit board 310. In this way, the welding process can be omitted, the generation of welding waste slag can be reduced, and the risk of circuit failure caused by welding waste slag during use can be reduced, thereby improving the reliability of the circuit module.

[0060] In this embodiment, the electrical interconnection structure 500 cooperates with the base 200 and the circuit unit 300 to form a metal hexahedron circuit interconnection and welding structure, so that when the electrical interconnection structure 500 and the circuit unit 300 are assembled, a stable connection can be formed between the electrical interconnection structure 500 and the circuit board 310, and the layout requirements of the circuit board 310 can also be met.

[0061] Please refer to Figure 7 、 Figure 8 and Figure 9 ., the first end of the electrical interconnection structure 500 extends outside the base 200 for connection to an external circuit, and the electrical interconnection structure 500 is insulated from the base 200; the second end of the electrical interconnection structure 500 penetrates into the circuit unit 300 and is in electrical contact with the circuit unit 300, so as to connect the circuit unit 300 to the external circuit through the electrical interconnection structure 500 and realize signal transmission. The electrical interconnection structure 500 includes a first interconnection unit 510 in electrical contact with the first interconnection hole group 312 and / or a second interconnection unit 520 in electrical contact with the second interconnection hole group 313. The first end of the first interconnection unit 510 is correspondingly and insulatingly connected to the base 200. When connecting, the first end of the first interconnection unit 510 can be preformed into one body with the base 200 through the third interconnection hole group 210 provided on the base 200 to reduce the welding process after assembly. The second end of the first interconnection unit 510 penetrates through the first interconnection hole group 312 and is in electrical contact with the circuit unit 300 to transmit the electrical signals of the first component 320 and the second component 330 on the circuit board 310. The first end of the second interconnection unit 520 is correspondingly and insulatingly connected to the base 200. Similarly, when connecting, the first end of the second interconnection unit 520 can be preformed into one body with the base 200 through the third interconnection hole group 210 provided on the base 200 to reduce the welding process after assembly. The second end of the second interconnection unit 520 abuts against the inside of the first interconnection hole group 312 and is in electrical contact with the circuit unit 300 to transmit the electrical signals of the second component 330 on the second side of the circuit board 310.

[0062] In specific implementation, the first interconnection unit 510 is correspondingly arranged with the first interconnection hole group 312, and the second interconnection unit 520 is correspondingly arranged with the second interconnection hole group 313. When arranging the first interconnection unit 510 and the second interconnection unit 520, according to the layout requirements, the first interconnection unit 510 can be arranged alone, or the second interconnection unit 520 can be arranged alone, or the first interconnection unit 510 and the second interconnection unit 520 can be arranged simultaneously to realize the connection between the circuit unit 300 and the external circuit.

[0063] The first interconnection unit 510 includes a first pin part 511 that is in electrical contact with the first interconnection hole group 312, a first fixing part 512 that integrally extends from the first pin part 511 and is pre-formed as a whole with the base 200, and a first pin part 513 that integrally extends from the first fixing part 512 to the outside of the base 200. The first pin part 511 penetrates through the first interconnection hole group 312 and is in electrical contact with the circuit unit 300. When the first pin part 511 is assembled with the first interconnection hole group 312, the first pin part 511 can penetrate into the full through-hole 312a or into the half through-hole 312b at the corresponding position, so as to facilitate welding and fixing the first pin part 511 with the corresponding full through-hole 312a or half through-hole 312b, and realize the electrical contact between the first pin part 511 and the full through-hole 312a and / or half through-hole 312b. The first fixing part 512 is inserted into the third interconnection hole group 210 at the corresponding position on the base 200, and is fixed with the corresponding third interconnection hole group 210 through a sintering process and insulated from the base 200 to pre-fix the first interconnection unit 510 on the base 200. The first pin part 513 extends to the outside of the base 200 through the third interconnection hole group 210 to form the pins of the entire circuit module to be connected with the external circuit and realize signal transmission.

[0064] In this embodiment, the diameter of the first pin part 511 is smaller than the inner diameters of the full through-hole 312a and the half through-hole 312b of the first interconnection hole group 312, so that when the first pin part 511 is assembled with the corresponding full through-hole 312a or half through-hole 312b, the first pin part 511 can be spacedly inserted into the full through-hole 312a or half through-hole 312b, and then a welding space is formed between the outer peripheral surface of the first pin part 511 and the inner peripheral surface of the full through-hole 312a or half through-hole 312b, which is convenient for welding the first pin part 511 with the full through-hole 312a or half through-hole 312b; preferably, the inner diameter of the full through-hole 312a or half through-hole 312b is 1.1 to 1.5 times the diameter of the first pin part 511, so as to facilitate welding between the outer peripheral surface of the first pin part 511 and the inner peripheral surface of the full through-hole 312a or half through-hole 312b and realize the electrical contact between the first pin part 511 and the circuit unit 300.

[0065] As a preferred embodiment of this example, the first interconnection unit 510 further includes a first interconnection tin-penetrating portion 514 disposed between the first pin portion 511 and the first fixing portion 512. The diameter of the first interconnection tin-penetrating portion 514 is greater than the diameter of the first pin portion 511. At the same time, the diameter of the first interconnection tin-penetrating portion 514 is also greater than the inner diameter of the first interconnection hole group 312. After the first interconnection unit 510 is assembled in place with the circuit board 310, the corresponding surface of the first interconnection tin-penetrating portion 514 can abut against the second side surface of the circuit unit 300 (i.e., the circuit board 310) to assist in supporting the circuit board 310.

[0066] An axially extending first interconnection tin-penetrating cut surface 515 is formed on the outer peripheral surface of the first interconnection tin-penetrating portion 514, and the radial dimension from the axis of the first interconnection tin-penetrating portion 514 to the first interconnection tin-penetrating cut surface 515 is less than the inner diameter of the first interconnection hole group 312, so that the first interconnection projection of the first interconnection tin-penetrating portion 514 on the horizontal plane partially coincides with the second interconnection projection of the first interconnection hole group 312 on the horizontal plane. With such a setting, the full through-holes 312a or half through-holes 312b of the first interconnection hole group 312 are not completely blocked by the first interconnection tin-penetrating portion 514, so as to form a ventilation channel between the first interconnection hole group 312 and the first interconnection tin-penetrating portion 514, which can ensure the tin-penetrating rate when the first interconnection unit 510 and the circuit board 310 are welded.

[0067] The second interconnection unit 520 includes a second pin portion 521 in electrical contact with the second interconnection hole group 313, a second fixing portion 522 integrally extending from the second pin portion 521 and pre-formed integrally with the base 200, and a second pin portion 523 integrally extending from the second fixing portion 522 to the outside of the base 200. The second pin portion 521 abuts against the second interconnection hole group 313 and is in electrical contact with the circuit unit 300. When the second pin portion 521 is assembled with the second interconnection hole group 313, the second pin portion 521 can abut against the bottom of the full blind hole 313a or the bottom of the corresponding half blind hole 313b, so as to facilitate welding and fixing the second pin portion 521 with the corresponding full blind hole 313a or half blind hole 313b to achieve electrical contact between the second pin portion 521 and the full blind hole 313a and / or the half blind hole 313b. The second fixing portion 522 is inserted into the third interconnection hole group 210 at the corresponding position on the base 200 and is similarly fixed to the corresponding third interconnection hole group 210 by a sintering process and insulated from the base 200 to pre-fix the second interconnection unit 520 on the base 200. The second pin portion 523 extends to the outside of the base 200 through the corresponding third interconnection hole group 210 to form the pins of the entire circuit module to be connected to an external circuit to achieve signal transmission.

[0068] In this embodiment, the diameter of the second lead pin portion 521 is smaller than the inner diameters of the full blind holes 313a and the half blind holes 313b of the second interconnecting hole group 313. When the second lead pin portion 521 is assembled with the corresponding full blind hole 313a or half blind hole 313b, the second lead pin portion 521 can be spaced and inserted into the full blind hole 313a or half blind hole 313b. Furthermore, a soldering space is formed between the outer peripheral surface of the second lead pin portion 521 and the inner peripheral surface of the full blind hole 313a or half blind hole 313b, which facilitates soldering the second lead pin portion 521 to the full blind hole 313a or half blind hole 313b. Preferably, the inner diameter of the full blind hole 313a or half blind hole 313b is 1.1 to 1.5 times the diameter of the second lead pin portion 521, which facilitates soldering between the outer peripheral surface of the second lead pin portion 521 and the inner peripheral surface of the full blind hole 313a or half blind hole 313b, and realizes the electrical contact between the second lead pin portion 521 and the circuit unit 300.

[0069] As a preferred embodiment of this embodiment, the second interconnecting unit 520 further includes a second interconnecting solder-penetrating portion 524 disposed between the second lead pin portion 521 and the second fixing portion 522. The inner diameter of the second interconnecting hole group 313 is larger than the diameter of the second lead pin portion 521 and smaller than the diameter of the second interconnecting solder-penetrating portion 524. After the second interconnecting unit 520 is assembled with the circuit board 310 in place, the corresponding surface of the second interconnecting solder-penetrating portion 524 can abut against the corresponding side surface of the circuit unit 300 (i.e., the second side surface of the circuit board 310) to further assist in supporting the circuit board 310.

[0070] An axially extending second interconnecting solder-penetrating cut surface 525 is formed on the outer peripheral surface of the second interconnecting solder-penetrating portion 524, and the radial dimension from the axis of the second interconnecting solder-penetrating portion 524 to the second interconnecting solder-penetrating cut surface 525 is smaller than the inner diameter of the second interconnecting hole group 313, such that the third interconnecting projection of the second interconnecting solder-penetrating portion 524 on the horizontal plane and the fourth interconnecting projection of the second interconnecting hole group 313 on the horizontal plane partially overlap. With such a setting, the full blind hole 313a or half blind hole 313b of the second interconnecting hole group 313 is not completely blocked by the second interconnecting solder-penetrating portion 524, so as to form a gap between the second interconnecting hole group 313 and the second interconnecting solder-penetrating portion 524, which facilitates soldering.

[0071] In this embodiment, the first interconnecting unit 510 and the second interconnecting unit 520 are configured to have a structure with interconnecting solder-penetrating cut surfaces. On the one hand, it can facilitate solder penetration and ensure the solder penetration rate. On the other hand, it can also realize the rapid visual inspection of the welding quality. It can be understood that in some other embodiments, the first interconnecting unit 510 and the second interconnecting unit 520 can also adopt a structure of straight lead pins to achieve the purpose of rapid processing and assembly, and is beneficial to reducing the process cost.

[0072] As a preferred embodiment of this example, to fix the entire circuit module during use and increase the stability of the connection between the circuit module and the external structure, a first fixing post 710 is provided on the housing 100( Figure 10 ), and / or a second fixing post 720 is provided on the base 200( Figure 11 shown) for fixing the circuit module to the external structure; or a welding post (not shown in the figure) is integrally extended on one side of the housing 100 corresponding to the encapsulation opening 120 (i.e., on the encapsulation step 130) for fixing the circuit module to the external structure; or a connecting flange 730 extending outward is integrally provided on the outer periphery of the housing 100 and / or the base 200( Figure 12 shown) to fix the circuit module to the external structure. In specific implementation, the first fixing post 710, the second fixing post 720, the welding post, and the connecting flange 730 can be selectively provided, or multiple or even all of them can be selected and combined to achieve the stable fixation of the entire circuit module to the external structure.

[0073] In specific implementation, the first fixing post 710, the second fixing post 720, and the connecting flange 730 are integrally formed with the same metal material as the housing 100 and / or the base 200, which can not only achieve the purpose of rapid prototyping but also increase the connection strength between the first fixing post 710, the second fixing post 720, and the connecting flange 730 and the housing 100 and / or the base 200 to ensure the structural strength of the entire circuit module.

[0074] In the present utility model, a tin-penetrating part is provided at the corresponding position of the support unit 410, and a corresponding tin-penetrating cutting surface is provided on the tin-penetrating part to form a ventilation channel between the support unit 410 and the corresponding support hole group 312, which is convenient for soldering and tin penetration during the welding process, so that the tin penetration rate of the circuit meets the requirements, and the welding quality can be quickly visually inspected after welding to ensure the encapsulation quality of the circuit module, thereby meeting the development requirements of high density, high reliability, and high performance of integrated circuits. In addition, in the present utility model, the circuit support structure 400 is preformed on the base 200, then the circuit board 310 is assembled and welded with the circuit support structure 400, and finally the assembled base 200 and the circuit unit 300 are encapsulated with the housing 100. The circuit unit 300 is supported and fixed by the circuit support structure 400, and the circuit unit 300 does not need to be welded to the housing 100, which can effectively reduce the assembly and welding difficulty between the circuit unit 300 and the housing 100, is beneficial to improving the encapsulation efficiency, and at the same time, can also avoid the problem that the welding slag falls into the bottom space and is difficult to remove, ensuring that the circuit will not fail due to the short circuit of the welding slag, thereby improving the safety and reliability of the circuit module during use.

Claims

1. A circuit edge cutting and tin penetration structure, characterized in that: It includes a base, a circuit unit provided with a support hole group, and a circuit support structure provided on the base and supporting the circuit unit to be suspended above the base, the circuit support structure includes a support unit that cooperates with the support hole group to support the circuit unit, the first end of the support unit is preformed as a whole with the base, the second end of the support unit supports the circuit unit and is provided with a supporting tin-through portion, and the first supporting projection of the supporting tin-through portion on the horizontal plane partially overlaps with the second supporting projection of the supporting hole group on the horizontal plane.

2. The circuit edge cutting and tin penetration structure according to claim 1, characterized in that: The support unit further includes a support seat body preformed on the base and integrally arranged with the support tin-through portion, and a welding portion integrally extending from one end of the support tin-through portion away from the support seat body, wherein the welding portion is welded and fixed in the support hole group.

3. The circuit edge cutting and tin penetration structure according to claim 2, characterized in that: The support hole group is defined as a through hole that passes through the circuit unit along the thickness direction of the circuit unit, the inner diameter of the support hole group is larger than the diameter of the welding portion and smaller than the diameter of the support tin-through portion, and a support step surface is formed at one end of the support tin-through portion adjacent to the welding portion. When the support unit and the circuit unit are assembled in place, the welding portions are arranged at intervals in the support hole group, and the support step surface is supported on the corresponding side surface of the circuit unit to support the circuit unit.

4. The circuit edge cutting and tin penetration structure according to claim 3, characterized in that: The outer peripheral surface of the support tin-through portion is formed with a support tin-through section extending in the axial direction, the axial first end of the support tin-through section is connected to the support step surface, and the radial dimension from the axis of the support tin-through portion to the support tin-through section is smaller than the inner diameter of the support hole group, so that the first support projection of the support tin-through portion on the horizontal plane partially overlaps with the second support projection of the support hole group on the horizontal plane.

5. A circuit module, comprising a tube shell having a mounting cavity and a packaging opening communicating with the mounting cavity, characterized in that: It also includes the circuit cutting and tin-penetrating structure as described in any one of claims 1 to 4, the base cover is arranged on the packaging opening and closes the installation cavity, and the circuit support structure supports the circuit unit to be suspended in the installation cavity and corresponds to the top of the base.

6. The circuit module according to claim 5, characterized in that: The circuit unit includes a circuit unit suspended in the installation cavity and having a first side surface and a second side surface arranged opposite to each other, a first component mounted on the first side surface of the circuit unit, and a second component mounted on the second side surface of the circuit unit. The support hole group is formed on the circuit board and passes through the first side surface and the second side surface of the circuit board.

7. The circuit module according to claim 5, characterized in that: The outer surface of the tube shell is also provided with screw mounting holes for connecting and fixing with the outside.

8. The circuit module according to claim 5, characterized in that: A packaging step is formed on the edge of one end of the tube shell corresponding to the packaging opening, and a matching step complementary to the packaging step is provided on the edge of the base corresponding to the side of the packaging opening. When the base covers the packaging opening, the matching step abuts against the packaging step.

9. The circuit module according to claim 8, characterized in that: It also includes a plastic package body filled in the installation cavity and covering the circuit unit, and a potting colloid is arranged on the base to form a potting hole of the plastic package body.

10. The circuit module according to any one of claims 5 to 9, characterized in that: It also includes an electrical interconnection structure arranged on the base and connected to the circuit unit, the electrical interconnection structure includes a first interconnection unit and / or a second interconnection unit, and the circuit unit is also provided with a first interconnection hole group that is in electrical contact with the first interconnection unit and / or a second interconnection hole group that is in electrical contact with the second interconnection unit, the first ends of the first interconnection unit and the second interconnection unit are correspondingly connected to the base, the second end of the first interconnection unit passes through the first interconnection hole group and is in electrical contact with the circuit unit, and the second end of the second interconnection unit is against the first interconnection hole group and is in electrical contact with the circuit unit.

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