Mobile phone vapor chamber

Abstract

The utility model belongs to the technical field of mobile phone heat dissipation, and particularly discloses a mobile phone vapor chamber which comprises a vapor chamber body, a mounting groove is formed in the rear end of the vapor chamber body, a positioning magnetic block is arranged in the mounting groove, and a heat conduction anti-skid protection pad is fixedly mounted at the rear end of the vapor chamber body and the rear end of the positioning magnetic block. A containing groove is formed in the front end of the vapor chamber body, and an adsorption magnetic ring is arranged in the containing groove. When the vapor chamber is used, a refrigerator is fixed at the rear end of the vapor chamber body, then the front end of the vapor chamber body is attached to the back face of a mobile phone through magnetic adsorption of the adsorption magnetic ring and the positioning magnetic block, the heat-conducting anti-skid protection pad can be tightly attached to the surface of the mobile phone, and then the semiconductor refrigerator is driven to cool the mobile phone. When the mobile phone is in use, the refrigerator and the heat dissipation fins can conduct heat on the mobile phone at the same time, so that the heat dissipation effect of the mobile phone is improved, the mobile phone can keep stable performance in various use scenes, and meanwhile, the mobile phone can still keep low temperature during continuous high-load operation.

Description

Technical Field

[0001] The utility model belongs to the technical field of mobile phone heat dissipation, in particular to a mobile phone heat spreader. Background Art

[0002] With the rapid advancement of technology, smartphones, as an indispensable part of our daily lives, are constantly iterating and upgrading their core components, the processors. Every upgrade of the processor means a significant increase in its processing speed, which can bring users a smoother and more efficient operating experience. However, at the same time, high-speed processors also bring a problem that cannot be ignored: increased power consumption and increased thermal power.

[0003] When users are immersed in exciting mobile games, high-definition videos or complex applications, the processor inside the phone is running at an astonishing speed, generating a large amount of heat. If this heat cannot be dissipated promptly and effectively, the surface temperature of the phone will rise rapidly. Many users will find that their phones become abnormally hot after using them for a period of time. This heating phenomenon will not only make users feel uncomfortable and affect the user experience, but more importantly, it will cause the system to reduce the performance of the processor to achieve the purpose of controlling the temperature, thereby causing the phone application to freeze, the screen brightness to decrease and other problems that seriously affect the practicality and operation of the phone. Long-term high temperature will also damage various precision components inside the phone, accelerate their aging and shorten the service life of the phone.

[0004] In order to solve this problem, mobile phone manufacturers are constantly exploring and trying various heat dissipation solutions. At present, the common heat dissipation method on the market is mainly to use heat dissipation film or heat sink to conduct the heat generated by the mobile phone motherboard and battery. These heat dissipation materials can effectively conduct the heat inside the mobile phone to the mobile phone case, and then dissipate the heat into the surrounding air through the heat dissipation surface of the mobile phone case.

[0005] However, the effectiveness of this method is limited by the material of the mobile phone shell; since the mobile phone shell needs to take into account many factors such as strength and durability, its material selection often cannot take into account thermal conductivity; this results in many mobile phone shells having relatively low thermal conductivity and are unable to effectively dissipate heat. Utility Model Content

[0006] In order to solve the problems raised in the above background technology, the utility model provides a mobile phone heat spreader.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a mobile phone heat spreader, including a heat spreader body, the heat spreader body is provided with a mounting groove, a positioning magnetic block is arranged inside the mounting groove, a thermal conductive anti-slip protection pad is fixedly installed at the rear end of the heat spreader body, and a placement groove is opened at the front end of the heat spreader body, and an adsorption magnetic ring is arranged inside the placement groove.

[0008] Preferably, the heat spreader body is integrally formed with heat dissipation fins.

[0009] Preferably, the surfaces of the heat spreader body and the heat dissipation fins are chamfered, and surface burrs are removed.

[0010] Preferably, the size of the thermally conductive anti-slip protection pad is compatible with the size of the heat spreader body.

[0011] Preferably, a wiring opening is provided on the heat spreader body.

[0012] Preferably, the heat spreader body is of contoured design and is adapted to the size and structure of the mobile phone.

[0013] Preferably, the heat spreader body is made of metal.

[0014] Preferably, a fixing groove is provided at the rear end of the heat spreader body, and the thermally conductive anti-skid protection pad is glued to the bottom of the fixing groove by glue, and the depth of the fixing groove is less than the thickness of the thermally conductive anti-skid protection pad.

[0015] Preferably, a through hole is opened at the center of the placement groove, and the diameter of the through hole is smaller than the diameter of the placement groove.

[0016] Preferably, the through hole is filled with a wave-transmitting material.

[0017] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0018] The utility model places a semiconductor cooler on the surface of the adsorption magnetic ring in the placement groove, fixes the cooler on the rear end of the heat spreader body, and then adheres the front end of the heat spreader body to the back of the mobile phone through the magnetic adsorption of the adsorption magnetic ring and the positioning magnetic block. The thermal conductive anti-skid protection pad will fit tightly with the surface of the mobile phone, and then the semiconductor cooler will be driven. The cooler and the cooling fins will conduct heat to the mobile phone at the same time, thereby improving the heat dissipation effect of the mobile phone, so that the mobile phone can maintain stable performance in a variety of usage scenarios, and can still maintain a low temperature during continuous high-load operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the first three-dimensional structure of the mobile phone heat sink of Example 1;

[0020] Figure 2 This is a schematic diagram of the main body of the heat sink in Example 1;

[0021] Figure 3 This is a schematic diagram of the second three-dimensional structure of the mobile phone heat sink of Example 1;

[0022] Figure 4 This is a schematic diagram of the structure of the thermally conductive anti-skid protection pad of Example 1;

[0023] Figure 5 It is a schematic structural diagram of a heat-conducting anti-skid protection pad of Example 1 after partial cross-section;

[0024] Figure 6 This is a schematic diagram of the three-dimensional structure of the heat sink of a mobile phone in Example 2;

[0025] Figure 7 Schematic diagram of the explosion structure of the mobile phone heat sink in Example 2.

[0026] In the figure: 1. Heat sink body; 2. Thermal conductive anti-skid protection pad; 3. Installation slot; 4. Positioning magnetic block; 5. Placement slot; 6. Adsorption magnetic ring; 7. Heat sink fins; 8. Fixing slot; 9. Wiring port. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example 1

[0029] like Figures 1 to 5 As shown, the utility model provides a mobile phone heat spreader, including a heat spreader body 1, a mounting groove 3 is opened at the rear end of the heat spreader body 1, a positioning magnetic block 4 is arranged inside the mounting groove 3, a thermal conductive anti-slip protection pad 2 is fixedly installed at the rear ends of the heat spreader body 1 and the positioning magnetic block 4, a placement groove 5 is opened at the rear end of the heat spreader body 1, and an adsorption magnetic ring 6 is arranged inside the placement groove 5.

[0030] The above scheme is adopted: the operator places the semiconductor cooler at the rear end of the heat spreader body 1, so that the cooler contacts the adsorption magnetic ring 6 and is adsorbed and fixed in the placement groove 5 of the heat spreader body 1; then the heat spreader body 1 is attached to the back of the mobile phone, the adsorption magnetic ring 6 will be adsorbed on the mobile phone with magnetic attraction function, and through the positioning effect of the positioning magnetic block 4, it is ensured that the adsorption position angle of the heat spreader body 1 on the mobile phone is centered to avoid the rotation deviation of the heat spreader body 1 on the mobile phone; then the semiconductor cooler can be started, and the cooler will evenly disperse the low temperature through the heat spreader to evenly dissipate the heat of the mobile phone.

[0031] like Figure 2 and Figure 5 As shown, a fixing groove 8 is provided at the rear end of the vapor chamber body 1, and the thermally conductive anti-skid protection pad 2 is glued to the bottom of the fixing groove 8, and the depth of the fixing groove 8 is less than the thickness of the thermally conductive anti-skid protection pad 2, so that the edge of the thermally conductive anti-skid protection pad 2 can fall into the fixing groove 8, and be slightly higher than the fixing groove 8, which can effectively prevent the edge of the thermally conductive anti-skid protection pad 2 from debonding and improve the installation stability of the thermally conductive anti-skid protection pad 2. The size of the thermally conductive anti-skid protection pad 2 is compatible with the size of the vapor chamber body 1.

[0032] A wiring opening 9 is formed on the surface of the vapor chamber body 1 , and the wiring opening 9 is designed to be longitudinally symmetrical with respect to the center of the vapor chamber body 1 .

[0033] By adopting the above scheme, through the design of the thermally conductive anti-skid protection pad 2, the thermally conductive anti-skid protection pad 2 can be made of rubber or thermally conductive silicone material, so that the heat spreader body 1 and the surface of the mobile phone can be separated, thereby avoiding damage to the mobile phone during the adsorption and bonding process. At the same time, the thermal conductivity of the thermally conductive anti-skid protection pad 2 is also very good, thereby ensuring the heat dissipation of the mobile phone, and the thermally conductive anti-skid protection pad 2 can increase the friction with the mobile phone, greatly improving the adsorption stability; through the design of the heat spreader body 1, in the process of producing the heat spreader body 1, the user can open one or two wiring openings as needed, or not to open wiring openings. After opening the wiring openings, and when the semiconductor refrigerator is out of power during operation, the wiring openings of the refrigerator can be aligned with the wiring openings, and then the charging head can be inserted into the wiring opening of the refrigerator to charge the refrigerator. In the process of producing the heat spreader body 1, the user can open wiring openings as needed, or not to open wiring openings.

[0034] like Figure 1 As shown, the vapor chamber body 1 is of contoured design and is adapted to the structure and size of a mobile phone.

[0035] By adopting the above scheme, through the design of the heat spreader body 1, since the heat spreader body 1 is a contoured design, and then the heat spreader body 1 fits the surface of the mobile phone, the heat spreader body 1 will not block the camera at the rear end of the mobile phone. Such a design not only ensures that the user will not encounter any obstacles when using the mobile phone to take pictures or record videos.

[0036] Example 2

[0037] like Figure 6 and Figure 7 As shown, the heat spreader body 1 and the heat dissipation fins 7 are integrally formed, and specifically, grooves are formed on the surface of the heat spreader body 1 to form the heat dissipation fins 7 .

[0038] The above solution is adopted: through the design of the heat dissipation fins 7, since the front end of the heat spreader body 1 is provided with the heat dissipation fins 7, during the process of the refrigerator cooling the mobile phone, the heat dissipation fins 7 themselves will also absorb the heat of the mobile phone, thereby increasing the heat dissipation effect of the mobile phone.

[0039] like Figure 6 As shown, the surfaces of the heat spreader body 1 and the heat dissipation fins 7 are both chamfered and deburred.

[0040] The chamfering design has undergone meticulous chamfering treatment; this design detail is not a simple aesthetic consideration, but stems from a high degree of concern for user safety; the chamfering treatment makes the edges of the heat sink and the heat sink fins 7 become rounded from their original sharp edges, greatly reducing the risk of scratching hands or other objects during daily operation or transportation.

[0041] The heat spreader body 1 is made of metal material, preferably aluminum or copper. This is because the thermal conductivity of aluminum and copper is much higher than that of many other metals, which enables aluminum to transfer heat energy faster.

[0042] The design of the heat dissipation fins 7 on the heat spreader body 1 can increase the contact area between the heat spreader body 1 and the air, thereby improving the heat dissipation efficiency.

[0043] The working principle and use process of this embodiment 2 are the same as those of embodiment 1.

[0044] In addition, in other embodiments of the utility model, in order to adapt to the semiconductor refrigerator with wireless charging function, on the basis of embodiment 1 or 2, a through hole is opened in the center of the placement groove 5, the diameter of the through hole is smaller than the diameter of the placement groove 5, and the through hole can be filled with no material or can be filled with wave-transparent material (rubber, plastic, nylon, etc.), ensuring that there is no metal conductor blocking the semiconductor refrigerator and the mobile phone, so that the mobile phone can be cooled and wirelessly charged at the same time, the function is more complete, and can meet more needs of consumers.

[0045] In addition, a blind groove can be opened in the lower half of the side of the heat spreader body 1 away from the thermally conductive anti-slip protection pad 2, and velvet cloth can be pasted and laid in the blind groove. The velvet cloth has good thermal insulation properties and does not feel overly cold compared to the heat spreader body 1, which can improve the user's feel.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mobile phone heat spreader, comprising a heat spreader body (1), characterized in that: The heat spreader body (1) is provided with a mounting groove (3), a positioning magnetic block (4) is arranged inside the mounting groove (3), a heat conductive anti-slip protection pad (2) is fixedly installed at the rear end of the heat spreader body (1), a placement groove (5) is opened at the front end of the heat spreader body (1), and an adsorption magnetic ring (6) is arranged inside the placement groove (5).

2. The cell phone heat spreader according to claim 1, characterized in that: The heat spreader body (1) is integrally formed with heat dissipation fins (7).

3. The cell phone heat spreader according to claim 2, characterized in that: The surfaces of the heat spreader body (1) and the heat dissipation fins (7) are both chamfered, and surface burrs are removed.

4. The cell phone heat spreader according to claim 1, characterized in that: The size of the heat-conducting anti-skid protection pad (2) is compatible with the size of the heat spreader body (1).

5. The cell phone heat spreader according to claim 1, characterized in that: The heat spreader body (1) is provided with a wiring opening (9).

6. The cell phone heat spreader according to claim 1, characterized in that: The heat spreader body (1) is of contoured design and is adapted to the size and structure of a mobile phone.

7. The cell phone heat spreader according to claim 1, characterized in that: The material of the heat spreader body is metal.

8. The cell phone heat spreader as claimed in claim 4, characterized in that: A fixing groove (8) is provided at the rear end of the heat spreader body (1); the heat conductive anti-skid protection pad (2) is glued to the bottom of the fixing groove (8); and the depth of the fixing groove (8) is less than the thickness of the heat conductive anti-skid protection pad (2).

9. The cell phone heat spreader as claimed in claim 1, characterized in that: A through hole is provided at the center of the placement groove (5), and the diameter of the through hole is smaller than the diameter of the placement groove (5).

10. The cell phone heat spreader as claimed in claim 9, characterized in that: The through hole is filled with a wave-transmitting material.

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