Chip mounter for PCB processing

Abstract

The utility model relates to the technical field of PCB processing, and more specifically relates to a chip mounter for PCB processing, comprising a fixing assembly used for fixing a PCB provided with a through hole for plugging an electronic component; the lifting mechanism is arranged on the fixing assembly and is arranged on the lower side of the PCB; the rotating mechanism is arranged on the lifting mechanism, and the lifting mechanism is used for driving the rotating mechanism to move up and down; the first adsorption mechanism is arranged on the rotating mechanism, the rotating mechanism is used for driving the first adsorption mechanism to rotate, and the first adsorption mechanism is used for adsorbing electronic elements; and the feeding mechanism is arranged on the fixing assembly, corresponds to the rotating mechanism and is used for conveying the electronic elements. The utility model relates to a chip mounter for PCB processing, and aims to solve the problems of low efficiency and uneven welding quality in the prior art.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, and more specifically, to a chip mounter for PCB board processing. Background Art

[0002] PCB (Printed Circuit Board), whose Chinese name is printed circuit board, also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] After the multi-layer circuit engraving of the PCB board is completed, electronic components need to be pasted at the through holes on it. In the prior art, electronic components are mostly manually clamped on the PCB board, and then the pins of the electronic components are soldered with a soldering bar. On the one hand, there is a problem of low efficiency, and on the other hand, there is a problem of uneven welding quality. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a chip mounter for PCB board processing, aiming to solve the problems of low efficiency and uneven welding quality in the prior art.

[0005] To solve the above technical problems, a chip mounter for PCB board processing is proposed, including: a fixing component for fixing the PCB board, and the PCB board is provided with through holes for inserting electronic components;

[0006] A lifting mechanism is arranged on the fixing component and is arranged on the lower side of the PCB board;

[0007] A rotating mechanism is arranged on the lifting mechanism, and the lifting mechanism is used to drive the rotating mechanism to move up and down;

[0008] A first adsorption mechanism is arranged on the rotating mechanism, the rotating mechanism is used to drive the first adsorption mechanism to rotate, and the first adsorption mechanism is used to adsorb electronic components;

[0009] A feeding mechanism is arranged on the fixing component, corresponding to the rotating mechanism, and is used to convey electronic components.

[0010] In any of the above technical solutions, further, the fixing component includes:

[0011] A base, on which the lifting mechanism and the feeding mechanism are arranged;

[0012] Two conveyor belts are symmetrically arranged on the base and are both used to support the PCB board;

[0013] A conveying mechanism, arranged on the base and connected to the two conveyor belts, is used to drive the conveyor belts to rotate;

[0014] Two cover pieces, slidably and symmetrically arranged on the base, respectively corresponding to the two conveyor belts, and having a gap with the conveyor belts.

[0015] In any of the above technical solutions, further, the fixing component further includes:

[0016] A support member, arranged on the base, corresponding to the two conveyor belts, hollow in the middle, and used to support the PCB board;

[0017] And / or, there are support ribs at the bottom.

[0018] In any of the above technical solutions, further, it further includes:

[0019] A second adsorption mechanism, arranged on the feeding mechanism, is used to adsorb electronic components;

[0020] A proximity detection mechanism, arranged on the feeding mechanism, is used to detect electronic components.

[0021] In any of the above technical solutions, further, the feeding mechanism includes:

[0022] A linear vibrator, arranged on the fixing component;

[0023] A guiding track, arranged on the linear vibrator, corresponding to the rotating mechanism, and a stop member is provided near the end of the rotating mechanism.

[0024] In any of the above technical solutions, further, the guiding track is provided with an inverted C-shaped groove, and a chamfer is provided at the corner of the inverted C-shaped groove.

[0025] In any of the above technical solutions, further, it further includes:

[0026] A moving mechanism, fixedly arranged relative to the fixing component;

[0027] A number of welding heads, arranged on the moving mechanism and on the upper side of the PCB board;

[0028] A number of wire feeding mechanisms, arranged on the moving mechanism, respectively corresponding to each of the welding heads, and used to respectively feed welding wires to each of the welding heads, and the moving mechanism is used to drive each of the welding heads and each of the wire feeding mechanisms to move;

[0029] A heating mechanism, connected to each of the welding heads, is used to heat each of the welding heads;

[0030] The liquid supply mechanism is respectively connected to each of the welding heads and is used to respectively supply welding auxiliary liquid to each of the welding heads.

[0031] In any of the above technical solutions, further, the moving mechanism includes:

[0032] The first sliding mechanism is vertically arranged on the fixed component;

[0033] The second sliding mechanism is horizontally arranged on the first sliding mechanism, and the first sliding mechanism is used to drive the second sliding mechanism to slide up and down;

[0034] The sliding member is horizontally slidably arranged on the second sliding mechanism, and the welding head and the wire feeding mechanism are arranged on the sliding member;

[0035] The telescopic mechanism is arranged on the second sliding mechanism and is connected to the sliding member, and is used to drive the sliding member to slide along the first direction. The second sliding mechanism is used to drive the sliding member and the telescopic mechanism to slide along the second direction, and the first direction and the second direction are intersecting or perpendicular.

[0036] In any of the above technical solutions, further, the wire feeding mechanism includes:

[0037] The driving motor is arranged on the moving mechanism;

[0038] The first rotating shaft is rotatably arranged on the moving mechanism;

[0039] A plurality of first rotating wheels are fixedly arranged on the first rotating shaft and are arranged corresponding to each of the welding heads;

[0040] The second rotating shaft is rotatably arranged on the moving mechanism;

[0041] A plurality of second rotating wheels are fixedly arranged on the second rotating shaft and are arranged corresponding to each of the first rotating wheels, and there is a distance between the second rotating wheels and the first rotating wheels;

[0042] The third rotating shaft is detachably arranged on the moving mechanism and is used for placing welding wire;

[0043] A plurality of guiding members are correspondingly arranged between each of the first rotating wheels and each of the welding heads.

[0044] In any of the above technical solutions, further, the welding head is inclined and the welding head is arranged in a C shape.

[0045] The beneficial effects are as follows:

[0046] 1. The pick-and-place machine for PCB board processing of the present utility model fixes, supports and conveys the PCB board through a fixing component, and automatically inserts electronic components onto the PCB board through a lifting mechanism, a rotating mechanism, a first adsorption mechanism and a feeding mechanism arranged on the lower side of the PCB board, accurately positions the relative positions of the electronic components and the PCB board, ensures the quality after welding, facilitates manual welding and automatic welding, and after welding is completed, outputs and inputs the PCB board through the fixing component, facilitating direct welding of other subsequent PCBs, and facilitating efficiency improvement.

[0047] 2. By setting a moving mechanism to adjust the welding head and the wire feeding mechanism, facilitating alignment of the welding head with the through holes on the PCB board, and under the action of a heating mechanism, heating the welding head to a suitable working temperature, and with the assistance of a liquid supply mechanism and the input of the wire feeding mechanism, enabling the melted part of the welding wire to flow uniformly into the through holes, making the electronic components and the through holes on the PCB board contact evenly, ensuring the normal progress of welding and the quality of welding, and facilitating use. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0049] Figure 1 is a three-dimensional structural schematic diagram of a pick-and-place machine for PCB board processing of the present utility model;

[0050] Figure 2 is a front view sectional structural schematic diagram of a pick-and-place machine for PCB board processing of the present utility model;

[0051] Figure 3 is Figure 2 a partial enlarged structural schematic diagram at A in

[0052] Figure 4 is a right view sectional structural schematic diagram of a pick-and-place machine for PCB board processing of the present utility model;

[0053] Figure 5 is Figure 4 a partial enlarged structural schematic diagram at B in

[0054] Figure 6 is a partial structural schematic diagram of a pick-and-place machine for PCB board processing of the present utility model.

[0055] The description of the reference numerals is as follows:

[0056] 1. Fixed component; 101. Base; 102. Conveyor belt; 103. Conveying mechanism; 104. Cover; 105. Support

[0057] 2. Lifting mechanism

[0058] 3. Rotating mechanism

[0059] 4. First adsorption mechanism

[0060] 5. Loading mechanism; 501. Linear vibrator; 502. Guide rail; 503. Stopper

[0061] 6. Moving mechanism; 601. First sliding mechanism; 602. Second sliding mechanism; 603. Sliding member; 604. Telescopic mechanism

[0062] 7. Welding head

[0063] 8. Wire feeding mechanism; 801. Driving motor; 802. First rotating shaft; 803. First rotating wheel; 804. Second rotating shaft; 805. Second rotating wheel; 806. Third rotating shaft; 807. Guide

[0064] 9. Liquid supply mechanism; 901. Liquid storage tank; 902. Connecting pipe; 903. Solenoid valve

[0065] 10. Second adsorption mechanism

[0066] 11. Proximity detection mechanism Detailed implementation

[0067] Next, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts fall within the scope of protection of the present invention.

[0068] It should be noted that, as shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one" and / or "the" are not specifically singular, but may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0069] If there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture (as shown in the attached drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0070] In the present utility model, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0071] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0072] The present utility model provides a chip mounter for PCB board processing. Mainly through the cooperation of a rotating mechanism and a lifting mechanism, the pins of electronic components can be inserted into the PCB board in an upward form, which is convenient for soldering and also convenient for ensuring the position accuracy and quality uniformity of the electronic components and the PCB board after soldering.

[0073] The following will detail a chip mounter for PCB board processing of the present application through the following embodiments.

[0074] In this embodiment, as Figures 1 to 6 shown, the chip mounter for PCB board processing includes: a fixing component 1 for fixing the PCB board, and the PCB board is provided with through holes for inserting electronic components;

[0075] a lifting mechanism 2 disposed on the fixing component 1 and on the lower side of the PCB board;

[0076] The rotating mechanism 3 is disposed on the lifting mechanism 2, and the lifting mechanism 2 is used to drive the rotating mechanism 3 to move up and down;

[0077] The first adsorption mechanism 4 is disposed on the rotating mechanism 3. The rotating mechanism 3 is used to drive the first adsorption mechanism 4 to rotate, and the first adsorption mechanism 4 is used to adsorb electronic components;

[0078] The feeding mechanism 5 is disposed on the fixed component 1, corresponding to the rotating mechanism 3, and is used to convey electronic components.

[0079] In this embodiment, it further includes:

[0080] The moving mechanism 6 is fixedly arranged relative to the fixed component 1;

[0081] A plurality of welding heads 7 are disposed on the moving mechanism 6 and on the upper side of the PCB board;

[0082] A plurality of wire feeding mechanisms 8 are disposed on the moving mechanism 6, respectively corresponding to each welding head 7, and are used to convey welding wires to each welding head 7 respectively. The moving mechanism 6 is used to drive each welding head 7 and each wire feeding mechanism 8 to move;

[0083] A heating mechanism (not shown in the figure) is connected to each welding head 7 and is used to heat each welding head 7;

[0084] The liquid supply mechanism 9 is respectively connected to each welding head 7 and is used to convey welding auxiliary liquid to each welding head 7 respectively

[0085] In this technical solution, the fixed component 1 is horizontally arranged front and back, and the PCB board is slidably arranged on the fixed component 1 front and back, which is convenient for the fixed component 1 to be docked with other conveyor lines and automatically convey the PCB boards before and after processing.

[0086] The lifting mechanism 2 is a cylinder vertically arranged and fixed on the base 101 of the fixed component 1. The rotating mechanism 3 is a stepping motor. The first adsorption mechanism 4 includes a fixing plate and a plurality of air valves. The air valves are connected to a negative pressure machine through hoses. The first adsorption mechanism 4 is fixed on the rotating shaft of the rotating mechanism 3, and the rotating mechanism 3 is fixed on the telescopic shaft of the lifting mechanism 2. The feeding mechanism 5 is horizontally fixed on the base 101 front and back, and the feeding mechanism 5 can convey electronic components to the side where the rotating mechanism 3 is located.

[0087] During use, the feeding mechanism 5 conveys the electronic components to the designated position. Then, the lifting mechanism 2 drives the first adsorption mechanism 4 to adsorb the next pair of electronic components. After adsorption, the lifting mechanism 2 drives the first adsorption mechanism 4 to move upward, and while moving upward, the rotating mechanism 3 drives the first adsorption mechanism 4 to rotate 180 degrees. After rotation, the lifting mechanism 2 continues to drive the first adsorption mechanism 4 to move upward to insert the electronic components into the through holes of the PCB board on the fixed component 1.

[0088] In the technical solution, an electronic component with six pins on one side and a total of twelve pins on both sides is described. There are corresponding twelve through holes on the PCB board. At the same time, both the soldering head 7 and the wire feeding mechanism 8 are correspondingly set to six. The liquid supply mechanism 9 can be set to one, and is respectively connected to the six soldering heads 7 through six pipelines. The liquid supply mechanism 9 can also be set to six, and is arranged in one-to-one correspondence with the soldering heads 7.

[0089] The soldering head 7 is an electric soldering iron, and the heating mechanism (not shown in the figure) is electric heating and is electrically connected to the soldering head 7. Turning on the heating mechanism can heat the soldering head 7 to the corresponding temperature, usually 320°C - 420°C. The welding wire is tin wire, and the welding auxiliary liquid is rosin liquid. The moving mechanism 6 is fixed on the upper side of the base 101 of the fixing component 1, and can drive the soldering head 7 and the wire feeding mechanism 8 to move up and down, left and right, and back and forth, which is convenient for the soldering head 7 to dock with the through holes on the PCB board and also convenient for the melted tin liquid to flow into the through holes.

[0090] The liquid supply mechanism 9 is arranged in six in the front and back. The liquid supply mechanism 9 includes a liquid storage tank 901, a connecting pipe 902, and a solenoid valve 903. The liquid storage tank 901 is a piston-type pressure tank, and the liquid storage tank 901 stores rosin liquid. The solenoid valve 903 is vertically fixed on the sliding block of the moving mechanism 6, and the soldering head 7 is inclined and fixed under the solenoid valve 903. When the solenoid valve is opened, the rosin liquid in the liquid storage tank 901 flows along the connecting pipe 902 and the soldering head 7 to the through holes of the PCB board.

[0091] In this embodiment, the fixing component 1 includes:

[0092] A base 101, on which the lifting mechanism 2 and the feeding mechanism 5 are arranged;

[0093] Two conveyor belts 102, symmetrically arranged on the base 101, and both are used to support the PCB board;

[0094] A conveying mechanism 103, arranged on the base 101 and connected to the two conveyor belts 102, is used to drive the conveyor belts 102 to rotate;

[0095] Two cover parts 104, slidably and symmetrically arranged on the base 101, and respectively corresponding to the two conveyor belts 102, and there is a gap between them and the conveyor belts 102.

[0096] In this technical solution, the base 101 is arranged in a C-shaped frame, and the lifting mechanism 2 and the feeding mechanism 5 are fixed on the inner bottom surface of the base 101. The conveyor belt 102 is a belt. The conveying mechanism 103 includes a driving motor 801, a driving wheel, a driven wheel and a tensioning wheel. The three wheels are connected by the conveyor belt 102. The driving motor 801 is connected to the driving wheel. The PCB boards are symmetrically arranged on the two conveyor belts 102 left and right. The cover 104 is in an L shape and is arranged symmetrically left and right and slidable up and down on both sides of the base 101. The top of the cover 104 is parallel to the upper part of the conveyor belt 102, both are horizontally arranged, and there is a gap between them. The PCB board is clamped in this gap.

[0097] In this embodiment, the fixing assembly 1 further includes:

[0098] A support member 105, arranged on the base 101, corresponding to the two conveyor belts 102, hollow in the middle, for supporting the PCB board;

[0099] And / or, there are support ribs (not shown in the figure) at the bottom.

[0100] In this technical solution, the support member 105 is fixed in the base 101 in a rectangular frame shape. Step surfaces are provided at positions on the left and right sides of the support member 105 close to the conveyor belt 102, so that the top surface of the support member 105 is flush with the top surface of the conveyor belt 102, providing horizontal support for the PCB board. There are two vertically arranged support ribs (not shown in the figure) at the bottom inside the support frame to enhance the structural strength of the support member 105.

[0101] In some technical solutions, the support member 105 is provided with a notch for avoiding local structures on the PCB board.

[0102] In this embodiment, it further includes:

[0103] A second adsorption mechanism 10, arranged on the feeding mechanism 5, for adsorbing electronic components;

[0104] A proximity detection mechanism 11, arranged on the feeding mechanism 5, for detecting electronic components.

[0105] In this technical solution, the structure of the second adsorption mechanism 10 is the same as that of the first adsorption mechanism 4, and it is horizontally fixed at the front end of the guiding track 502 of the feeding mechanism 5 front and back. The proximity detection mechanism 11 is a proximity sensor. When the feeding mechanism 5 conveys the electronic components forward and approaches the proximity detection mechanism 11, the proximity detection mechanism 11 sends a control signal, the controller in the device controls the feeding mechanism 5 to close, and controls the second adsorption mechanism 10 to open, so that the electronic components are accurately fixed at the front end of the guiding track 502, facilitating the subsequent rotation mechanism 3 and the first adsorption mechanism 4 to accurately adsorb the electronic components.

[0106] In this embodiment, the feeding mechanism 5 includes:

[0107] A linear vibrator 501 is arranged on the fixed component 1;

[0108] A guiding track 502 is arranged on the linear vibrator 501, corresponding to the rotating mechanism 3, and a stop member 503 is arranged near the end of the rotating mechanism 3.

[0109] In this technical solution, the linear vibrator 501 is fixedly arranged on the base 101, the guiding track 502 is horizontally arranged on the linear vibrator 501 in the front and back directions, the stop member 503 is a baffle plate, and is vertically fixed at the front end of the guiding track 502. When in use, turning on the linear vibrator 501 can drive the electronic components to move forward along the guiding groove on the guiding track 502.

[0110] In some technical solutions, the guiding track 502 is provided with an inverted C-shaped groove, and a chamfer is arranged at the corner of the inverted C-shaped groove.

[0111] In this embodiment, the moving mechanism 6 includes:

[0112] A first sliding mechanism 601 is vertically arranged on the fixed component 1;

[0113] A second sliding mechanism 602 is horizontally arranged on the first sliding mechanism 601, and the first sliding mechanism 601 is used to drive the second sliding mechanism 602 to slide up and down;

[0114] A sliding member 603 is horizontally slidably arranged on the second sliding mechanism 602, and the welding head 7 and the wire feeding mechanism 8 are arranged on the sliding member 603;

[0115] A telescopic mechanism 604 is arranged on the second sliding mechanism 602, and is connected to the sliding member 603, and is used to drive the sliding member 603 to slide along the first direction. The second sliding mechanism 602 is used to drive the sliding member 603 and the telescopic mechanism 604 to slide along the second direction, and the first direction and the second direction are intersecting or perpendicular.

[0116] In this technical solution, both the first sliding mechanism 601 and the second sliding mechanism 602 are screw rod slider moving mechanisms 6 driven by motors. The first sliding mechanism 601 is vertically arranged, and the second sliding mechanism 602 is horizontally arranged on the slider of the first sliding mechanism 601 from left to right. The sliding member 603 is slidably arranged on the lower side of the slider of the second sliding mechanism 602 through two guiding shafts. The telescopic mechanism 604 is a cylinder and is horizontally fixed at the rear side of the slider of the second sliding mechanism 602, and the welding head 7 and the wire feeding mechanism 8 are fixed on the sliding member 603.

[0117] In this embodiment, the wire feeding mechanism 8 includes:

[0118] A driving motor 801 is arranged on the moving mechanism 6;

[0119] The first rotating shaft 802 is rotatably arranged on the moving mechanism 6;

[0120] A plurality of first rotating wheels 803 are fixedly arranged on the first rotating shaft 802 and are provided corresponding to each welding head 7;

[0121] The second rotating shaft 804 is rotatably arranged on the moving mechanism 6;

[0122] A plurality of second rotating wheels 805 are fixedly arranged on the second rotating shaft 804 and are provided corresponding to each first rotating wheel 803, and there is a spacing between the second rotating wheels 805 and the first rotating wheels 803;

[0123] The third rotating shaft 806 is detachably arranged on the moving mechanism 6 and is used for placing welding wire;

[0124] A plurality of guiding members 807 are correspondingly arranged between each first rotating wheel 803 and each welding head 7.

[0125] In this technical solution, the first rotating shaft 802 and the second rotating shaft 804 are both rotatably arranged horizontally front and back on the sliding member 603. There are six first rotating wheels 803 and six second rotating wheels 805 correspondingly arranged. The third rotating shaft 806 is fixedly or rotatably arranged at the upper side position of the sliding member 603. Six wire spools are correspondingly arranged on the third rotating shaft 806. The open end of the wire spool passes between the first rotating wheel 803 and the second rotating wheel 805 and extends to the bottom end of the welding head 7 through the guiding member 807.

[0126] In some technical solutions, the third rotating shaft 806 is detachably arranged on the sliding member 603 through bolts, so as to facilitate the replacement of the wire spool.

[0127] In other technical solutions, the guiding member 807 is a hollow tubular structure, and the diameter of the end of the guiding member 807 close to the first rotating wheel 803 and the second rotating wheel 805 is larger, and the hollow part is also larger. The diameter of the end of the guiding member 807 close to the welding head 7 is smaller.

[0128] In still other technical solutions, the driving motor 801 is connected to the first rotating shaft 802 or the second rotating shaft 804. Further, two meshing gears are also arranged on the first rotating shaft 802 and the second rotating shaft 804, so that the driving motor 801 can synchronously drive the first rotating shaft 802 and the second rotating shaft 804 to move towards each other.

[0129] In other technical solutions, an arc-shaped groove is arranged in the middle of the first rotating wheel 803 and the second rotating wheel 805, so as to increase the contact area with the welding wire and improve the stability of conveying.

[0130] In this technical solution, the welding head 7 is inclined and the welding head 7 is arranged in a C shape.

[0131] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of technologies in the market, or to enable other ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A chip mounter for PCB board processing, characterized in that: include: A fixing component (1) is used to fix a PCB board, and the PCB board is provided with through holes for plugging in electronic components; A lifting mechanism (2) is arranged on the fixing component (1) and is arranged on the lower side of the PCB board; A rotating mechanism (3) is arranged on the lifting mechanism (2), and the lifting mechanism (2) is used to drive the rotating mechanism (3) to move up and down; A first adsorption mechanism (4) is arranged on the rotating mechanism (3), the rotating mechanism (3) is used to drive the first adsorption mechanism (4) to rotate, and the first adsorption mechanism (4) is used to adsorb electronic components; A feeding mechanism (5) is arranged on the fixed component (1), corresponding to the rotating mechanism (3), and is used for conveying electronic components.

2. The PCB board processing chip mounter according to claim 1, characterized in that: The fixing assembly (1) comprises: A base (101), the lifting mechanism (2) and the loading mechanism (5) being arranged on the base (101); Two conveyor belts (102) are symmetrically arranged on the base (101) and are both used to support the PCB board; A conveying mechanism (103), disposed on the base (101), connected to the two conveying belts (102), and used for driving the conveying belts (102) to rotate; Two cover members (104) are slidably and symmetrically arranged on the base (101), and are respectively arranged corresponding to the two conveyor belts (102), with a gap being arranged between the cover members and the conveyor belts (102).

3. The PCB board processing chip mounter according to claim 2, characterized in that: The fixing assembly (1) further comprises: A support member (105) is arranged on the base (101), corresponding to the two conveyor belts (102), and is hollow in the middle, and is used to support the PCB board; And / or, the bottom is provided with supporting ribs.

4. The chip mounter for PCB board processing according to claim 1, characterized in that: Also includes: A second adsorption mechanism (10), arranged on the feeding mechanism (5), and used for adsorbing electronic components; A proximity detection mechanism (11) is arranged with the feeding mechanism (5) and is used for detecting electronic components.

5. The chip mounter for PCB board processing according to claim 1, characterized in that: The feeding mechanism (5) comprises: A linear vibrator (501), arranged on the fixing component (1); A guide rail (502) is arranged on the linear vibrator (501) and is arranged corresponding to the rotating mechanism (3), and a stopper (503) is provided near the end of the rotating mechanism (3).

6. The chip mounter for PCB board processing according to claim 5, characterized in that: The guide rail (502) is provided with an inverted C-shaped groove, and the corners of the inverted C-shaped groove are chamfered.

7. The chip mounter for PCB board processing according to claim 1, characterized in that: Also includes: A moving mechanism (6) is fixedly arranged relative to the fixed component (1); A plurality of welding heads (7) are arranged on the moving mechanism (6) and on the upper side of the PCB board; A plurality of wire feeding mechanisms (8) are arranged on the moving mechanism (6), respectively corresponding to each of the welding heads (7), and are used to respectively feed welding wire to each of the welding heads (7); the moving mechanism (6) is used to drive each of the welding heads (7) and each of the wire feeding mechanisms (8) to move; A heating mechanism, connected to each of the welding heads (7) and used for heating each of the welding heads (7); The liquid supply mechanism (9) is connected to each of the welding heads (7) respectively, and is used to supply welding auxiliary liquid to each of the welding heads (7) respectively.

8. The chip mounter for PCB board processing according to claim 7, characterized in that: The moving mechanism (6) comprises: A first sliding mechanism (601) is vertically arranged on the fixing assembly (1); A second sliding mechanism (602) is horizontally arranged on the first sliding mechanism (601), and the first sliding mechanism (601) is used to drive the second sliding mechanism (602) to slide up and down; A sliding member (603) is horizontally slidably arranged on the second sliding mechanism (602), and the welding head (7) and the wire feeding mechanism (8) are arranged on the sliding member (603); The telescopic mechanism (604) is arranged on the second sliding mechanism (602), connected to the sliding member (603), and is used to drive the sliding member (603) to slide along a first direction. The second sliding mechanism (602) is used to drive the sliding member (603) and the telescopic mechanism (604) to slide along a second direction. The first direction and the second direction are intersecting or perpendicular to each other.

9. The chip mounter for PCB board processing according to claim 7, characterized in that: The wire feeding mechanism (8) comprises: A driving motor (801) is arranged on the moving mechanism (6); A first rotating shaft (802) rotatably disposed on the moving mechanism (6); A plurality of first rotating wheels (803) are fixedly disposed on the first rotating shaft (802) and are disposed corresponding to each of the welding heads (7); A second rotating shaft (804) rotatably disposed on the moving mechanism (6); A plurality of second rotating wheels (805), fixedly disposed on the second rotating shaft (804), and disposed corresponding to each of the first rotating wheels (803), and having a spacing between the first rotating wheels (803); A third rotating shaft (806) is detachably arranged on the moving mechanism (6) and is used for placing the welding wire; A plurality of guide members (807) are correspondingly arranged between each of the first rotating wheels (803) and each of the welding heads (7).

10. The chip mounter for PCB board processing according to claim 7, characterized in that: The welding head (7) is arranged obliquely, and the welding head (7) is arranged in a C shape.

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