Automatic tin adding buffer device

Abstract

The utility model provides an automatic tin adding buffer device, which relates to the technical field of automatic tin adding buffer devices and comprises a shell and an automatic tin adding machine, a wave soldering machine is arranged at the bottom of the shell, a tin adding port is arranged at the upper end of the wave soldering machine, a second guide plate is arranged at the upper end of the tin adding port, and a buffer component is arranged at the upper end of the second guide plate. A feeding port is formed in the upper end of the shell, an automatic tin adding machine is arranged at the upper end of the shell, and a discharging port is formed in the lower end of the automatic tin adding machine. According to the device, the impact force generated in the process that the tin bar is guided to fall along the guide structure can be avoided, the spatial position change of the tin bar in the falling process can be limited, the probability that the tin bar is clamped in the guide structure is reduced, the frequency of maintaining the buffer device by workers is reduced, and therefore the production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of an automatic tin adding buffer device, and more specifically, particularly relates to an automatic tin adding buffer device. Background Art

[0002] Wave soldering is to directly contact the soldering surface of the plug-in board with high-temperature liquid tin to achieve the soldering purpose. The high-temperature liquid tin maintains an inclined plane, and a special device makes the liquid tin form a phenomenon similar to waves, so it is called "wave soldering". Its main material is solder bar.

[0003] The wave soldering tin bath normally works at a temperature of 240 °C. During the soldering process, the tin in the tin bath will be consumed, so continuous tin addition is required to supplement it to reach the normal tin liquid level. The space in the tin bath part of the machine is limited and there is not much space to place tin, so only manual tin addition can be used. The working conditions in the high-temperature environment are harsh, resulting in a relatively high probability of personnel injury, and manual tin addition will also increase labor costs.

[0004] Therefore, an automatic tin adding machine is generally used to add solder bars. The existing mechanism of the wave soldering automatic tin adding machine is a straight cylinder. The automatic tin adding machine is placed on the machine, and the solder bar is added from the top of the machine. The solder bar falls vertically under the action of gravity and falls into the tin bath, thus reducing labor and realizing automatic tin addition. However, the height between the automatic tin adding machine and the tin bath is about 750 mm. After the solder bar falls under the action of gravity, there is no reasonable buffer structure, and the free-falling height is too large, resulting in a large impact force. When the solder bar falls into the tin bath, the tin liquid splashes, which is extremely likely to injure the staff. Among them, Chinese Patent No.: CN202120931489.X provides an automatic tin adding buffer device to solve the problem of large impact force during the falling process of the solder bar from the top of the machine to the tin bath, including a guiding structure, a buffer structure and a pushing structure; the guiding structure is a hollow structure, and the solder bar enters and falls along the guiding direction of the guiding structure; the buffer structure is arranged on one side of the lower end inside the guiding structure; the solder bar falls on the buffer structure under the guidance of the guiding structure; the buffer structure is used to slow down the solder bar; the pushing structure is arranged inside the guiding structure, above the buffer structure, and is used to push and make the solder bar move from the buffer structure and fall out of the guiding structure. The automatic tin adding buffer device provided by the utility model can effectively reduce the impact force when the solder bar of the automatic tin adding machine naturally falls into the tin bath, avoid the splashing of the tin liquid, thus avoiding injury to the staff and ensuring the normal operation of the equipment; and can be applied to other equipment that requires automatic falling feeding, making the feeding more stable and safe.

[0005] Based on the above, the inventor found the following problems:

[0006] The above-mentioned automatic tin adding buffer device has a certain buffering effect and can avoid the splashing of molten tin. However, during the process of the tin bar falling along the guiding structure, there is still a relatively large impact force, which will also damage the buffer structure after long-term use. Moreover, during the falling process of the tin bar between the tin bar and the buffer structure, the position of the tin bar will change, and it may get stuck in the guiding structure, affecting the normal operation of the equipment.

[0007] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and an automatic tin adding buffer device is provided with the aim of achieving a more practical value. Utility Model Content

[0008] The purpose and effect of an automatic tin adding buffer device of the present utility model are achieved by the following specific technical means:

[0009] An automatic tin adding buffer device includes a housing and an automatic tin adding machine. A wave soldering machine is provided at the bottom of the housing. A tin adding port is provided at the upper end of the wave soldering machine. A second guiding plate is provided at the upper end of the tin adding port. A buffer assembly is provided at the upper end of the second guiding plate. A feeding port is opened at the upper end of the housing, and an automatic tin adding machine is provided at the upper end of the housing. A discharge port is opened at the lower end of the automatic tin adding machine.

[0010] Further, the buffer assembly includes rollers, a pushing mechanism, a pulley group, and an L-shaped mounting substrate. The bottom of the L-shaped mounting substrate is connected to the tin adding port. A plurality of rollers are provided at a position above the tin adding port, and the rollers are located at the bottom end of the L-shaped mounting substrate. A pushing mechanism is provided above the rollers, and the pushing mechanism is located on the side wall of the L-shaped mounting substrate. A pulley group is provided at the upper end of the pushing mechanism.

[0011] Further, the pulley group includes a pair of pulley bases, a fixing component, and a support rod. The pair of pulley bases are connected by an electric bidirectional threaded rod, and a plurality of sliding rollers are provided on the opposite sides of the pair of pulley bases. The sliding rollers are fixedly connected to the side walls of the pulley bases through the fixing component, and the pulley bases are connected to the side walls of the L-shaped mounting substrate through the support rod.

[0012] Further, the fixing component includes a housing. The bottom end of the housing is fixedly connected to the pulley base. A groove is provided on the side of the bottom end of the housing away from the pulley base. A spring is fixedly provided on the groove. The other end of the spring is fixedly provided with a slider. A clamping member is fixedly provided at the end of the slider away from the spring. A convex block is provided on the side of the slider, and a sliding groove is provided on a set of opposite side walls inside the housing. The convex block and the sliding groove are matched, and a roller groove is provided on another set of opposite side walls of the housing.

[0013] Furthermore, both ends of the sliding roller are movably installed in the roller groove, and the set of pulley bases are respectively installed at opposite threaded positions of the electric bidirectional threaded rod.

[0014] Furthermore, the electric bidirectional threaded rod is installed on the side of the pulley base, and the electric bidirectional threaded rod is installed on the L-shaped mounting substrate.

[0015] Furthermore, the support rod is movably connected to the pulley base, and the discharge port and the feeding port correspond to each other in the vertical direction.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] Through the pulley group in the buffer assembly, the tin bar can slowly fall in the L-shaped mounting substrate and the change in the position of the tin bar during the falling process can be restricted, so as to achieve the effect of alleviating the impact force of the falling of the tin bar and avoiding the tin bar from getting stuck in the guiding structure.

[0018] Through the action of the electric bidirectional threaded rod, the buffer device can adapt to tin bars of different widths, expanding the application range of this buffer device.

[0019] Through the cooperation of the spring and the clamping part in the fixing assembly, when the tin bar passes through the sliding roller, there can be a corresponding buffering effect in the horizontal direction, so as to avoid damage to the surface of the tin bar and the sliding roller, and further reduce the loss of the tin bar.

[0020] Through the design of the roller, the tin bar can enter the tin adding port more smoothly after passing through the pushing mechanism, achieving the effect of further avoiding the tin bar from getting stuck in the guiding structure, reducing the maintenance frequency of the staff, and thus improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic plan view of an automatic tin adding buffer device of the utility model.

[0022] Figure 2 is a schematic diagram of the buffer assembly of an automatic tin adding buffer device of the utility model.

[0023] Figure 3 is a schematic cross-sectional view of the fixing assembly of an automatic tin adding buffer device of the utility model.

[0024] Figure 4 is a schematic three-dimensional view of the fixing assembly of an automatic tin adding buffer device of the utility model.

[0025] In the figure, the corresponding relationship between the component names and the drawing reference numerals is as follows:

[0026] 1. Outer shell; 2. Automatic tin adding machine; 3. Wave soldering machine; 4. Tin adding port; 5. Second guiding plate; 6. Buffer assembly; 601. Roller; 602. Pushing mechanism; 603. Pulley set; 604. L-shaped mounting substrate; 606. Pulley base; 607. Fixing assembly; 608. Electric bidirectional threaded rod; 609. Sliding roller; 610. Housing; 611. Groove; 612. Spring; 613. Slide block; 614. Bump; 615. Slide groove; 616. Roller groove; 617. Clamping part; 7. Feeding port; 8. Discharging port; 9. Support rod. Detailed implementation mode

[0027] The following further describes in detail the implementation mode of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0028] In the description of the present utility model, unless otherwise stated, "a plurality of" means two or more; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0029] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] Embodiment:

[0031] As shown in the attached Figure 1 to the attached Figure 4 figure:

[0032] The present utility model provides an automatic tin adding buffer device, including an outer shell 1 and an automatic tin adding machine 2. A wave soldering machine 3 is provided at the bottom of the outer shell 1. A tin adding port 4 is provided at the upper end of the wave soldering machine 3. A second guiding plate 5 is provided at the upper end of the tin adding port 4. A buffer assembly 6 is provided at the upper end of the second guiding plate 5. A feeding port 7 is opened at the upper end of the outer shell 1, and an automatic tin adding machine 2 is provided at the upper end of the outer shell 1. A discharging port 8 is opened at the lower end of the automatic tin adding machine 2.

[0033] Among them, the buffer assembly 6 includes a roller 601, a pushing mechanism 602, a pulley set 603, and an L-shaped mounting substrate 604. The bottom of the L-shaped mounting substrate 604 is connected to the solder adding port 4. A plurality of rollers 601 are provided at a position above the solder adding port 4, and the rollers 601 are located at the bottom end of the L-shaped mounting substrate 604. A pushing mechanism 602 is provided above the rollers 601, and the pushing mechanism 602 is located on the side wall of the L-shaped mounting substrate 604. A pulley set 603 is provided at the upper end of the pushing mechanism 602. The design of the pulley set 603 can make the solder strip enter the solder adding port 4 more smoothly after passing through the pushing mechanism 602.

[0034] Among them, the pulley set 603 includes a pair of pulley bases 606, a fixing component 607, and a support rod 9. The pair of pulley bases 606 are connected by an electric bidirectional threaded rod 608. The design of the electric bidirectional threaded rod 608 can make the pulley bases 606 move towards each other, so that the buffer device can adapt to solder strips of different sizes. A plurality of sliding rollers 609 are provided on the opposite sides of the pair of pulley bases 606 facing each other. The design of the sliding rollers 609 can make the solder strip fall smoothly and slowly to the bottom end of the L-shaped mounting substrate 604 under the action of gravity, and at the same time limit the spatial position of the solder strip when it falls. The sliding rollers 609 are fixedly connected to the side walls of the pulley bases 606 through the fixing component 607, and the pulley bases 606 are connected to the side wall of the L-shaped mounting substrate 604 through the support rod 9. The support rod 9 can support the pulley bases 606 and limit the movement track of the pulley bases 606.

[0035] Among them, the fixing component 607 includes a housing 610. The bottom end of the housing 610 is fixedly connected to the pulley base 606. A groove 611 is provided on one side of the bottom end of the housing 610 away from the pulley base 606. A spring 612 is fixedly provided on the groove 611. The other end of the spring 612 is fixedly provided with a slider 613. The spring 612 can buffer the slider 613. A clamping member 617 is fixedly provided at the end of the slider 613 away from the spring 612. The clamping member 617 can limit and fix the sliding roller 609. A convex block 614 is provided on the side of the slider 613, and a pair of opposite side edges inside the housing 610 are provided with sliding grooves 615. The convex block 614 and the sliding grooves 615 are matched. The sliding grooves 615 and the convex block 614 can drive the clamping member 617 to move along a specified movement track, and a roller groove 616 is provided on the other pair of opposite side edges of the housing 610.

[0036] Among them, both ends of the sliding roller 609 are movably installed in the roller groove 616, and the pair of pulley bases 606 are respectively installed at opposite threaded positions of the electric bidirectional threaded rod 608.

[0037] Among them, the electric bidirectional threaded rod 608 is installed on the side of the pulley base 606. The electric bidirectional threaded rod 608 is installed on the L-shaped mounting substrate 604, and the installation of the electric bidirectional threaded rod 608 will not interfere with the falling position of the solder bar.

[0038] Among them, the support rod 9 is movably connected to the pulley base 606, and the discharge port 8 and the feeding port 7 correspond to each other in the vertical direction.

[0039] Specific usage and functions of this embodiment:

[0040] When using this device, first start the electric bidirectional threaded rod 608 to drive the pulley base 606 to move towards each other on the support rod 9. At this time, adjust the distance between the pulley bases 606 to an appropriate position, and start the automatic tin feeder 2 to drive the solder bar to the position of the discharge port 8. Because the discharge port 8 and the feeding port 7 correspond to each other in the vertical direction, the solder bar can smoothly pass through the discharge port 8 and the feeding port 7 and reach between the pulley sets 603 in the buffer assembly 6. Under the action of the sliding roller 609, the spring 612, and the clamping member 617, the solder bar is slightly attached to the sliding roller 609. At this time, a part of the downward gravity on the solder bar will be shared by the sliding roller 609, reducing the force in the vertical downward direction of the solder bar. Coupled with the attachment of the sliding roller 609 and the solder bar, the spatial position of the solder bar during the falling process is limited, thereby achieving the effects of buffering the solder bar and preventing the solder bar from getting stuck in the guiding structure. Among them, the clamping member 617, the spring 612, and the roller groove 616 can adapt to solder bars of different widths. When the solder bar slowly falls into the area of the pushing mechanism 602, combined with the action of the pushing mechanism 602 and the roller 601, the solder bar smoothly slides into the wave soldering machine 3, preventing the solder bar from getting stuck in the guiding structure and the L-shaped mounting substrate 604.

[0041] The embodiments of the present invention are given for the purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thus design various embodiments with various modifications suitable for specific purposes.

Claims

1. An automatic tinning buffer device, comprising a housing (1) and an automatic tinning machine (2), characterized in that: A wave soldering machine (3) is provided at the bottom of the shell (1), a tinning port (4) is provided at the upper end of the wave soldering machine (3), a second guide plate (5) is provided at the upper end of the tinning port (4), a buffer component (6) is provided at the upper end of the second guide plate (5), a feeding port (7) is provided at the upper end of the shell (1), and an automatic tinning machine (2) is provided at the upper end of the shell (1), and a discharge port (8) is provided at the lower end of the automatic tinning machine (2).

2. An automatic tinning buffer device as claimed in claim 1, characterized in that: The buffer assembly (6) comprises a roller (601), an ejection mechanism (602), a pulley block (603) and an L-shaped mounting base plate (604); the bottom of the L-shaped mounting base plate (604) is connected to the tin adding port (4); a plurality of rollers (601) are arranged above the tin adding port (4); the rollers (601) are located at the bottom end of the L-shaped mounting base plate (604); an ejection mechanism (602) is arranged above the rollers (601); the ejection mechanism (602) is located on the side wall of the L-shaped mounting base plate (604); and a pulley block (603) is arranged at the upper end of the ejection mechanism (602).

3. An automatic tinning buffer device as claimed in claim 2, characterized in that: The pulley assembly (603) comprises a pair of pulley bases (606), a fixing assembly (607) and a support rod (9); the pair of pulley bases (606) are connected via an electric bidirectional threaded rod (608); and a plurality of sliding rollers (609) are provided on opposite sides of the pair of pulley bases (606); the sliding rollers (609) are fixedly connected to the side walls of the pulley bases (606) via the fixing assembly (607); and the pulley bases (606) are connected to the side walls of the L-shaped mounting base (604) via the support rod (9).

4. An automatic tinning buffer device as claimed in claim 3, characterized in that: The fixing assembly (607) comprises a shell (610), the bottom end of the shell (610) is fixedly connected to the pulley base (606), a groove (611) is provided on the side of the bottom end of the shell (610) away from the pulley base (606), a spring (612) is fixedly provided on the groove (611), a slider (613) is fixedly provided on the other end of the spring (612), a clamp (617) is fixedly provided on the end of the slider (613) away from the spring (612), a convex block (614) is provided on the side of the slider (613), a set of opposite side edges on the inner side of the shell (610) are provided with a slide groove (615), the convex block (614) and the slide groove (615) match each other, and another set of opposite side edges of the shell (610) are provided with a roller groove (616).

5. An automatic tinning buffer device as claimed in claim 4, characterized in that: The two ends of the sliding roller (609) are movably installed in the roller groove (616), and the group of pulley bases (606) are respectively installed on the relative threaded positions of the electric bidirectional threaded rod (608).

6. An automatic tinning buffer device as claimed in claim 3, characterized in that: The electric bidirectional threaded rod (608) is installed on the side of the pulley base (606), and the electric bidirectional threaded rod (608) is installed on the L-shaped installation base plate (604).

7. An automatic tinning buffer device as claimed in claim 3, characterized in that: The support rod (9) is movably connected to the pulley base (606), and the discharge port (8) and the feeding port (7) correspond to each other in the vertical direction.

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