Integrated cell lysis device
By designing an integrated cell lysis device, the semiconductor module and temperature control module are used to achieve repeated quick freezing/thawing cycles, the existing high-temperature and cryolysis methods are solved, and the existing high-temperature and cryolysis methods are cumbersome to operate and slow temperature transfer efficiency are achieved, and efficient cell lysis and extraction effects are achieved.
Patent Information
- Application Number
- CN202421649423.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The existing high-temperature and frozen lysis methods are complicated to operate and slow temperature transfer efficiency, resulting in low cell lysis efficiency and serious damage to cell contents.
An integrated cell lysis device is designed, using the combination of semiconductor modules and temperature control modules. Through repeated quick freezing/thawing cycles, ice crystals are used to destroy cell membranes and cell structures, achieving efficient lysis.
The device is compact in structure and easy to operate. It can effectively reduce the degradation and degeneration of biological macromolecules in cells and improve extraction efficiency. It is suitable for a variety of cell types and is widely used in scientific research and medical diagnosis.
Smart Images

Figure CN222923142U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of cell biotechnology and relates to an integrated cell lysis device. Background Art
[0002] Cell lysis is a method of destroying cell membranes and cell organelles to release intracellular substances, which helps to extract biological macromolecules such as proteins and nucleic acids in cells and provides a necessary material basis for subsequent molecular biology experiments. It is an important step in biological research.
[0003] Traditional cell lysis methods mainly include mechanical lysis, chemical lysis, high temperature and freeze lysis. Among them, mechanical lysis applies pressures such as stirring, oscillation, and ultrasonic waves to cells through physical forces to destroy cell membranes and cell organelles. Chemical lysis uses chemical substances to destroy the integrity of cell membranes and cell organelles. However, mechanical lysis and chemical lysis have problems such as complex operations, low lysis efficiency, and serious damage to cell contents. Moreover, the ultrasonic method also has the problem of local high temperature destroying the activity of proteins and nucleic acids. High temperature and freeze lysis expose cells to extreme temperature environments and use ice crystal formation to destroy cell membranes and cell organelles through cycles between quick freezing and thawing. However, this method requires repeatedly moving samples between a deep low-temperature refrigerator and a water bath, with cumbersome operations, increasing the labor workload and having the problem of slow temperature transfer efficiency. Therefore, it is of important practical significance to develop a new type of and efficient cell lysis device. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an integrated cell lysis device to solve the problems of cumbersome operations and slow temperature transfer efficiency in existing high temperature and freeze lysis.
[0005] To achieve the above purpose, the utility model adopts the following technical solutions:
[0006] The utility model provides an integrated cell lysis device, including a housing and a temperature control chamber cover arranged on the surface of the housing. A test tube hole is arranged inside the temperature control chamber cover; a temperature control module, semiconductor modules on both sides of the temperature control module, and a heat dissipation water row are arranged inside the housing; the temperature control module is located below the test tube hole and is in close contact; a heat dissipation cavity is also arranged outside the semiconductor module, and the heat dissipation cavity is communicated with the heat dissipation water row through a pipeline.
[0007] Preferably, the semiconductor module includes a semiconductor plate and thermal conductive silicone grease smeared on both sides of the semiconductor plate.
[0008] Preferably, the temperature control module is surrounded by a foam heat insulation layer, the semiconductor module is located inside the foam heat insulation layer, and the heat dissipation cavity is located outside the foam heat insulation layer.
[0009] Preferably, a temperature sensor and a controller are provided inside the temperature control module.
[0010] Preferably, a cooling fan is further provided inside the housing, and the cooling water radiator and the cooling fan are arranged adjacent to each other.
[0011] Preferably, a water pump and a defoamer which are connected are further provided inside the housing, and the water pump is connected to the pipeline.
[0012] Preferably, a touch display screen is further provided on the surface of the housing, and the touch display screen is electrically connected to the temperature control module and the semiconductor module.
[0013] Preferably, a power supply and a main circuit board which are electrically connected are further provided inside the housing, and the main circuit board is further electrically connected to the touch display screen, the temperature control module and the semiconductor module respectively.
[0014] Preferably, a heat dissipation grid is further provided on the surface of the housing, and the heat dissipation grid and the touch display screen are located on different sides.
[0015] The utility model has the following beneficial effects:
[0016] (1) In this device, the temperature of the temperature control module is controlled by controlling the temperature of the semiconductor module, so as to realize the repeated quick-freezing / thawing cycle of the sample, form ice crystals inside and outside the cells, thereby destroying the cell membrane and cell structure, realizing efficient lysis and extracting cell contents, and providing strong support for fields such as biological research and medical diagnosis.
[0017] (2) During the quick-freezing process of this device, the degradation and denaturation of biological macromolecules inside the cells can be effectively reduced, and the thawing process helps to release cell contents and improve the extraction efficiency.
[0018] (3) This device has a compact structure, is easy to operate, and has high lysis efficiency. Only need to put the sample into the container and set the program to automatically carry out lysis.
[0019] (4) This device has a wide range of applications, can be applied to various cell types, and can be used in fields such as scientific research experiments, biotechnology, and medical diagnosis. Description of the Drawings
[0020] Figure 1 is an external three-dimensional structure schematic diagram of the integrated cell lysis device provided by the embodiment of the present application;
[0021] Figure 2 is an internal three-dimensional structure schematic diagram of the integrated cell lysis device provided by the embodiment of the present application;
[0022] Figure 3The internal top view of the integrated cell lysis device provided by the embodiment of the present application after removing the foam insulation layer;
[0023] Figure 4 The internal top view of the integrated cell lysis device provided by the embodiment of the present application;
[0024] Figure 5 The external three-dimensional structure schematic diagram of the integrated cell lysis device provided by the embodiment of the present application from another orientation;
[0025] Symbol representation:
[0026] 1 - housing, 2 - temperature control chamber cover, 3 - test tube hole, 4 - temperature control module, 5 - semiconductor module, 6 - heat dissipation water drain, 7 - heat dissipation cavity, 8 - pipeline, 9 - foam insulation layer, 10 - heat dissipation fan, 11 - water pump, 12 - defoamer, 13 - touch display screen, 14 - power supply, 15 - main circuit board, 16 - heat dissipation grid. Detailed implementation manners
[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0028] Please refer to the attached Figure 1 , 2 , the attached Figure 1 , 2 respectively show the external three-dimensional structure schematic diagram and the internal three-dimensional structure schematic diagram of the integrated cell lysis device provided by the embodiment of the present application. From the attached Figure 1 , 2 it can be seen that the integrated cell lysis device provided by the embodiment of the present application includes a housing 1 and a temperature control chamber cover 2 provided on the surface of the housing 1. A test tube hole 3 is provided inside the temperature control chamber cover 2. The housing 1 is an external component of the integrated cell lysis device, mainly playing the roles of protecting internal components and heat insulation. The temperature control chamber cover 2 is pivotally connected to the housing 1 and can be opened to protect the internal test tube hole 3. The test tube hole 3 is a component for placing the test tubes of cell samples to be lysed, and it can be provided in multiple numbers.
[0029] In the embodiment of the present application, a temperature control module 4, a semiconductor module 5, a heat dissipation water drain 6, a heat dissipation fan 10, a water pump 11 and a defoamer 12 are provided inside the housing 1, as shown in the attached Figure 3 , 4As shown. The temperature control module 4 is located below the test tube hole 3 and in close contact with it to ensure that heat can be quickly transferred to the test tube hole 3 through the temperature control module 4, and then transferred to the cell sample to be lysed. In order to facilitate monitoring and regulating the temperature at the test tube hole 3, a temperature sensor and a controller (not shown in the figure) are provided inside the temperature control module 4. Thus, the temperature at the test tube hole 3 is detected by the temperature sensor, and a signal for regulating the temperature is given to the temperature control module 4 through the controller.
[0030] The semiconductor module 5 is made of high-performance semiconductor materials and can achieve rapid cooling and heating through current control. Specifically, the semiconductor module 5 includes a semiconductor board and thermal grease applied on both sides of the semiconductor board. After applying thermal grease on one side of the semiconductor board, it is closely attached to one side of the temperature control module 4, and after applying thermal grease on the other side of the semiconductor board, it is closely attached to the heat dissipation cavity 7. In addition, semiconductor modules 5 and heat dissipation cavities 7 are provided on both sides of the temperature control module 4.
[0031] When the semiconductor module 5 is cooling, the semiconductor board transfers the heat from the test tube hole 3 in the powered state to achieve rapid freezing of the sample. When the semiconductor module 5 is heating, the semiconductor board releases the heat to the test tube hole 3 in the powered state to achieve rapid thawing of the sample.
[0032] The heat sink 6 and the heat sink cavity 7 are components for achieving heat dissipation of the semiconductor module 5, wherein the heat sink cavity 7 is arranged on the outside of the semiconductor module 5, and the heat sink cavity 7 is connected to the heat sink 6 through the pipe 8. A heat-conducting liquid is arranged inside the heat sink cavity 7, and the heat-conducting liquid can achieve the transfer of heat or cold. When the semiconductor module 5 generates heat, the semiconductor board releases heat to the test tube hole 3 when powered on, and the excess heat is transferred to the pipe 8 through the heat-conducting liquid in the heat sink cavity 7, and then transferred to the heat sink 6. A heat sink grid 16 is also provided on the surface of the housing 1, and the heat sink grid 16 and the touch screen 13 are located on different sides, as shown in the attached figure. Figure 5 The heat conducted to the heat dissipation water row 6 is dissipated through the heat dissipation grid 16. In addition, the heat dissipation fan 10 disposed adjacent to the heat dissipation water row 6 can further accelerate the heat dissipation.
[0033] The interconnected water pump 11 and defoamer 12 disposed inside the housing 1 are used to provide a cold source when cooling the semiconductor module 5. When the semiconductor module 5 is cooling, the cold water after the defoamer 12 eliminates the broken bubbles transfers the cold energy to the pipe 8 through the water pump 11, and then transfers it to the heat dissipation cavity 7 through the pipe 8, and finally transfers it to the cell sample to be frozen through the semiconductor module 5, so as to achieve rapid freezing.
[0034] In addition, the temperature control module 4 is surrounded by a foam insulation layer 9. The semiconductor module 5 is located inside the foam insulation layer 9, and the heat dissipation cavity 7 is outside the foam insulation layer 9. Thus, the temperature of the temperature control module 4 is maintained stable through the foam insulation layer 9. The foam insulation layer 9 in this application is prepared from polyurethane polymer foam.
[0035] In the embodiment of the present application, a touch display screen 13 is further provided on the surface of the housing 1. The touch display screen 13 is electrically connected to the temperature control module 4 and the semiconductor module 5, so as to control the temperature, duration, and number of cycles of refrigeration / heating through the touch display screen 13.
[0036] In the embodiment of the present application, a power supply 14 and a main circuit board 15 which are electrically connected are further provided inside the housing 1. The main circuit board 15 is also electrically connected to the touch display screen 13, the temperature control module 4, and the semiconductor module 5 respectively, so as to control the touch display screen 13, the temperature control module 4, and the semiconductor module 5 through the main circuit board 15.
[0037] When the integrated cell lysis device provided in the embodiment of the present application is in use, the cell sample to be lysed is placed in the test tube hole 3, and parameters such as the number of cycles and temperature range of quick freezing and thawing are set through the touch display screen 13. After starting the device, the semiconductor module 5 works according to the preset program and controls the temperature of the temperature control module 4 to realize the repeated quick freezing and thawing cycles of the sample. During the cycle, the cells are affected by the formation and melting of ice crystals, and the cell membrane and cell structure are damaged, thereby realizing cell lysis. After the lysis is completed, the sample can be taken out through the temperature control chamber cover 2 for subsequent processing.
[0038] Specific examples of program settings are as follows:
[0039] Step 1: Temperature 37°C, maintain for 5 min;
[0040] Step 2: Temperature -30°C, maintain for 15 min;
[0041] Step 3: Return to Step 1, cycle 6 times;
[0042] Step 4: End.
[0043] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An integrated cell lysis device, characterized in that: The invention comprises a shell (1) and a temperature control chamber cover (2) arranged on the surface of the shell (1), wherein a test tube hole (3) is arranged inside the temperature control chamber cover (2); a temperature control module (4), semiconductor modules (5) located on both sides of the temperature control module (4), and a heat dissipation water row (6) are arranged inside the shell (1); the temperature control module (4) is located below the test tube hole (3) and is in close contact with the test tube hole (3); a heat dissipation cavity (7) is also arranged on the outside of the semiconductor module (5), and the heat dissipation cavity (7) is connected to the heat dissipation water row (6) through a pipe (8).
2. The integrated cell lysis device according to claim 1, characterized in that: The semiconductor module (5) comprises a semiconductor board and thermally conductive silicone grease applied on both sides of the semiconductor board.
3. The integrated cell lysis device according to claim 1, characterized in that: The temperature control module (4) is wrapped with a foam insulation layer (9), the semiconductor module (5) is located inside the foam insulation layer (9), and the heat dissipation cavity (7) is located outside the foam insulation layer (9).
4. The integrated cell lysis device according to claim 1, characterized in that: The temperature control module (4) is internally provided with a temperature sensor and a controller.
5. The integrated cell lysis device according to claim 1, characterized in that: A heat dissipation fan (10) is also provided inside the housing (1), and the heat dissipation water drain (6) and the heat dissipation fan (10) are arranged adjacent to each other.
6. The integrated cell lysis device according to claim 1, characterized in that: A water pump (11) and a defoamer (12) which are connected to each other are also provided inside the housing (1), and the water pump (11) is connected to the pipeline (8).
7. The integrated cell lysis device according to claim 1, characterized in that: A touch screen (13) is also provided on the surface of the housing (1), and the touch screen (13) is electrically connected to the temperature control module (4) and the semiconductor module (5).
8. The integrated cell lysis device according to claim 7, characterized in that: An electrically connected power source (14) and a main circuit board (15) are also provided inside the housing (1), and the main circuit board (15) is also electrically connected to the touch display screen (13), the temperature control module (4), and the semiconductor module (5), respectively.
9. The integrated cell lysis device according to claim 7, characterized in that: A heat dissipation grid (16) is also provided on the surface of the housing (1), and the heat dissipation grid (16) and the touch display screen (13) are located on different sides.