Virtual testing device for metering intelligent function of intelligent sensor

Abstract

The utility model relates to a virtual test device for metering the intelligent function of an intelligent sensor. The virtual test device comprises a controller, a signal generation module, a signal acquisition module and a special sensor connector, the controller is respectively connected with the signal generation module and the signal acquisition module; a sensor mounting position is arranged in the center of the special sensor connector, a plurality of probe clamps are fixedly arranged on the periphery of the sensor mounting position, a rotatable rod piece is mounted on each probe clamp, and a virtual test probe is inserted and fixed on each rod piece; one of the virtual test probes is in contact with one end of the tested chip, and the other virtual test probe is in contact with the other end of the chip; correspondingly, one probe clamp is connected with the signal generation module, and the other probe clamp is connected with the signal acquisition module. According to the utility model, the virtual metering test for metering the intelligent function of the intelligent sensor is more convenient, the technical skill requirements on testers are reduced, and batch metering test can be realized.

Description

Technical Field

[0001] The utility model relates to a virtual test device for measuring the intelligent functions of intelligent sensors, belonging to the technical field of intelligent sensor measurement. Background Art

[0002] With the continuous development of MEMS technology, more and more intelligent sensors have emerged and have been deeply integrated and applied in various industries. Compared with traditional sensors, intelligent sensors usually have one or more intelligent functions such as self-adaptation, self-calibration, self-memory, self-diagnosis, self-organization, self-coordination, self-inference, self-decision-making, and self-learning in addition to measuring physical parameters.

[0003] At present, when measuring and evaluating the intelligent functions of intelligent sensors, there is no special measurement test device for their intelligent functions. Generally, the direct connection method of electronic components is used for measurement, which is not conducive to the popularization and promotion of the intelligent function measurement work of intelligent sensors, and also has too high technical skill requirements for testers. Summary of the Invention

[0004] The purpose of the utility model is to provide a virtual test device for measuring the intelligent functions of intelligent sensors, making the measurement test more convenient, reducing the technical skill requirements for testers, and realizing batch measurement tests.

[0005] The utility model adopts the following technical solutions:

[0006] A virtual test device for measuring the intelligent functions of intelligent sensors includes a controller 1, a signal generation module 2, a signal acquisition module 3, and a special sensor connector 5; the controller 1 is respectively connected to the signal generation module 2 and the signal acquisition module 3; a sensor installation position is provided at the central part of the special sensor connector 5, and a plurality of probe jigs are fixedly arranged around the sensor installation position. A rotatable rod 8 is installed on the probe jig, and a virtual test probe 6 is inserted and fixed on the rod 8; one of the virtual test probes 6 contacts one end of the chip under test, and the other contacts the other end of the chip 6; correspondingly, one of the probe jigs is connected to the signal generation module 2, and the other is connected to the signal acquisition module 3.

[0007] Preferably, it further includes a special chassis 4. A square groove is provided at the upper part of the special chassis 4, and a plurality of card slots for installing the signal generation module 2 and the signal acquisition module 4 are provided in the square groove; the inside of the special chassis 4 has connection lines with the signal generation module 2 and the signal acquisition module 3, and the controller 1 is electrically connected to the connection lines through the terminal posts of the special chassis 4.

[0008] Preferably, the chip under test is an intelligent chip 7 of the intelligent sensor under test.

[0009] Preferably, the sensor mounting position has a disc positioning pattern composed of a plurality of concentric circles.

[0010] Preferably, the depth at which the virtual test probe 6 is inserted into the rod member 8 is adjustable, thereby adjusting the length of the virtual test probe 6 protruding forward.

[0011] Preferably, there are three groups of probe clamps, two of which are on one side of the sensor mounting position and the third group is on the other side of the sensor mounting position.

[0012] Preferably, the probe clamp includes an L-shaped connecting plate, and the L-shaped connecting plate is fixed on the upper platform surface of the dedicated sensor connector 5 by bolts.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1) A testing device is provided, making the virtual metering test for measuring the intelligent functions of intelligent sensors more convenient, reducing the technical skill requirements for testers, and enabling batch metering tests.

[0015] 2) The angle of the virtual test probe can be adjusted by rotating the rod member, and the extension length of the virtual test probe can be finely adjusted by changing the depth of the probe inserted into the rod member. It has good adaptability and convenient adjustment. Description of the Drawings

[0016] Figure 1 is a perspective view of the virtual test device of the present utility model for measuring the intelligent functions of intelligent sensors.

[0017] Figure 2 is a schematic external view of the virtual test device of the present utility model for measuring the intelligent functions of intelligent sensors.

[0018] Figure 3 is Figure 2 a partial enlarged view of

[0019] In the figure, 1. Controller, 2. Signal generation module, 3. Signal acquisition module, 4. Dedicated chassis, 5. Dedicated sensor connector, 6. Virtual test probe, 7. Intelligent chip of the intelligent sensor under test, 8. Connection cable. Specific Embodiments

[0020] The present utility model will be further described below in conjunction with the drawings and specific embodiments.

[0021] See Figures 1 - 3, A virtual test device for measuring the intelligent functions of intelligent sensors, comprising a controller 1, a signal generation module 2, a signal acquisition module 3, and a dedicated sensor connector 5; the controller 1 is respectively connected to the signal generation module 2 and the signal acquisition module 3; the center of the dedicated sensor connector 5 is provided with a sensor installation position, and a plurality of probe jigs are fixedly arranged around the sensor installation position. A rotatable rod 8 is installed on the probe jig, and a virtual test probe 6 is inserted and fixed on the rod 8; one of the virtual test probes 6 contacts one end of the chip under test, and the other contacts the other end of the chip 6; correspondingly, one of the probe jigs is connected to the signal generation module 2, and the other is connected to the signal acquisition module 3. Through the dedicated sensor connector 5, the positioning of the chip under test and the installation and positioning of the virtual test probe 6 are realized.

[0022] In this embodiment, refer to Figure 2 , it further includes a dedicated chassis 4. The upper part of the dedicated chassis 4 is provided with a square groove, and a plurality of card slots for installing the signal generation module 2 and the signal acquisition module 4 are arranged in the square groove; the inside of the dedicated chassis 4 has connection lines with the signal generation module 2 and the signal acquisition module 3, and the controller 1 is electrically connected to the connection lines through the terminal posts of the dedicated chassis 4.

[0023] In this embodiment, refer to Figure 3 , the chip under test is the intelligent chip 7 of the intelligent sensor under test.

[0024] In this embodiment, refer to Figure 3 , the sensor installation position has a disc positioning pattern composed of a plurality of concentric circles to facilitate the positioning of the intelligent chip 7 of the intelligent sensor under test.

[0025] In this embodiment, refer to Figure 3 , the insertion depth of the virtual test probe 6 into the rod 8 is adjustable, thereby adjusting the length of the virtual test probe 6 extending forward.

[0026] In this embodiment, refer to Figures 2 - 3 , there are three groups of probe jigs, two of which are on one side of the sensor installation position (one of the two groups is selected), and the third group is on the other side of the sensor installation position (must be used). It should be noted that in practice, it is not necessarily three groups, which depends on the sensor chip under test. If some chips have only one signal input pin, only one group of probe jigs is required. If there are multiple signal input pins, multiple groups of probe jigs are required. The probe jigs can be flexibly increased or decreased according to needs.

[0027] In this embodiment, refer to Figure 3 , the probe jig includes an L-shaped connecting plate, and the L-shaped connecting plate is fixed on the upper platform surface of the dedicated sensor connector 5 by bolts.

[0028] The following is an introduction to each functional component. It should be noted that the basic functions of the functional components belong to the prior art and are not the contributions of the present utility model to the prior art. The present utility model mainly provides a mechanical device for measuring and testing the intelligent chips of intelligent sensors. As Figures 1 - 2 shown:

[0029] Controller 1: Controls the virtual test device to generate stimulus signals corresponding to various real-world environments to be measured to meet the virtual test requirements of various intelligent functions, and receives, processes, analyzes, and stores the collected output signals.

[0030] Signal generation module 2: Can output standard voltage / current / digital signals, etc. required for testing, and the generated signals can achieve controllable waveforms to meet the signal input requirements of different models of intelligent sensors.

[0031] Signal acquisition module 3: Can collect, read, and save standard voltage / current / digital signals, etc.

[0032] Special chassis 4: Used to integrate the signal generation module and the signal acquisition module, and achieve clock synchronization between the modules.

[0033] Special sensor connector 5: Realizes the effective connection between the intelligent chip of the sensor to be measured and the virtual test device.

[0034] Virtual test probe 6: Directly contacts the pads or bumps on the intelligent sensor chip to achieve accurate transmission of standard virtual stimulus signals and feedback signals.

[0035] Intelligent chip 7 of the intelligent sensor to be measured.

[0036] Special connection cable 8: Enables effective connection of each hardware in the virtual test device, and ensures stable signal transmission without being interfered by the external environment.

[0037] The test process based on this device is as follows: Before the test, the intelligent chip of the intelligent sensor to be measured is fixed on the special sensor connector of the virtual test device by means of clamping with a fixture or vacuum adsorption, and the key hardware such as the controller, signal generation device, and sensor connector are effectively connected using a special connection cable, and stable signal transmission is ensured.

[0038] During the test, the controller is used to make the signal generation module generate virtual stimulus signals of the "virtual scene" corresponding to the actual working conditions of the real world, and it is necessary to ensure that the virtual stimulus signals input by the virtual test device to the sensor to be measured are consistent with the output signals of the physical perception layer of the sensor under the same working conditions.

[0039] In a dedicated sensor connector, a standard virtual stimulus signal generated by a signal generation module is applied to a sensor under test through a virtual test probe, and a feedback signal in the sensor under test is transmitted back to a signal acquisition module through the virtual test probe. Finally, in a controller, by analyzing signal generation and signal acquisition in the virtual test device and performing subsequent data processing, the test of the intelligent functions of the intelligent sensor is completed. It should be noted that the analysis and processing by the controller and the principle of electrical signal transmission both belong to the prior art and are not related to the contributions made by the present utility model to the prior art.

[0040] The above are the preferred embodiments of the present utility model. Those of ordinary skill in the art can also make various transformations or improvements on this basis. Without departing from the general concept of the present utility model, these transformations or improvements should fall within the scope of protection required by the present utility model.

Claims

1. A virtual test device for measuring the intelligent functions of an intelligent sensor, characterized in that: It comprises a controller (1), a signal generating module (2), a signal collecting module (3), and a dedicated sensor connector (5); The controller (1) is connected to the signal generating module (2) and the signal collecting module (3) respectively; The dedicated sensor connector (5) is provided with a sensor installation position at the center, and a plurality of probe clamps are fixedly provided around the sensor installation position. A rotatable rod (8) is installed on the probe clamp, and a virtual test probe (6) is plugged and fixed on the rod (8); One of the virtual test probes (6) contacts one end of the chip under test, and the other contacts the other end of the chip; correspondingly, one of the probe fixtures is connected to the signal generation module (2), and the other is connected to the signal acquisition module (3).

2. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The invention also comprises a special case (4), wherein a square groove is provided on the upper part of the special case (4), and a plurality of card slots for installing the signal generating module (2) and the signal collecting module (3) are provided in the square groove; the special case (4) has connection lines for connecting to the signal generating module (2) and the signal collecting module (3), and the controller (1) is electrically connected to the connection lines via the terminal of the special case (4).

3. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The chip under test is a smart sensor smart chip (7) under test.

4. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The sensor installation position has a disk positioning pattern consisting of a plurality of concentric circles.

5. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The depth of the virtual test probe (6) inserted into the rod (8) is adjustable, thereby adjusting the length of the virtual test probe (6) extending forward.

6. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The probe fixtures are provided with three groups, two of which are located on one side of the sensor installation position, and the third group is located on the other side of the sensor installation position.

7. The virtual test device for measuring the intelligent function of an intelligent sensor according to claim 1, characterized in that: The probe fixture comprises an L-shaped connecting plate, and the L-shaped connecting plate is fixed on the upper platform surface of the dedicated sensor connector (5) by means of bolts.

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