End packaging structure of integrated temperature sensor
By using components such as ceramic seats and vacuum columns in the end package structure of the temperature sensor, the melting and short-circuiting of the insulating layer caused by the naked signal transmission line of the contact temperature sensor in a high-temperature environment is solved, and the normal operation of the sensor is achieved.
Patent Information
- Application Number
- CN202422006768.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In a high-temperature environment, the internal signal transmission line is exposed, resulting in problems such as melting the insulation layer and short circuit.
An end package structure of an integrated temperature sensor is designed, using components such as ceramic seats and vacuum columns. The electrical conductors are connected through the hollow area of the ceramic seats and penetrate through the vacuum columns to reduce the impact of high temperatures.
It effectively reduces the faults caused by short circuit in high-temperature environments, ensuring the normal operation of the sensor.
Smart Images
Figure CN222926306U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of temperature sensors, and specifically to an end encapsulation structure of an integrated temperature sensor. Background Art
[0002] A temperature sensor refers to a sensor that can sense temperature and convert it into an available output signal. The temperature sensor is the core part of a temperature measuring instrument and comes in a wide variety. It can be divided into two major categories: contact type and non-contact type according to the measurement method, and into two categories: thermal resistance and thermocouple according to the sensor material and electronic component characteristics.
[0003] Temperature sensors are divided into contact temperature sensors and non-contact temperature sensors. In the case of non-contact temperature sensors affected by high-temperature environments, components such as internal signal transmission lines are exposed inside the housing, and due to the influence of high temperature, the insulating layer on their surface is prone to melting and falling off, making short circuits and other risks likely to occur. Content of the Utility Model
[0004] (1) Technical Problems to be Solved
[0005] Aiming at the deficiencies of the prior art, the utility model provides an end encapsulation structure of an integrated temperature sensor, which solves the problem that in the case of contact temperature sensors affected by high-temperature environments, components such as internal signal transmission lines are exposed, and due to the influence of high temperature, the insulating layer on their surface is prone to melting and falling off, making short circuits and other risks likely to occur.
[0006] (2) Technical Solutions
[0007] To achieve the above objectives, the utility model is realized through the following technical solutions: An end encapsulation structure of an integrated temperature sensor includes a housing and a temperature sensing chip disposed inside the housing. A heat conducting head is installed at the end of the housing. The pins of the temperature sensing chip inside the housing are fixed to electric wires. A sealing ring is fixedly screwed at the bottom of the housing, and the bottom of the sealing ring is fixed to a base. Fixing holes are provided on the base. A vacuum column is disposed inside the housing, and the electric wires pass through the vacuum column and extend to the inside of a bottom terminal. The bottom of the terminal is threadedly connected to a bottom cover, and a ceramic seat is disposed inside the terminal.
[0008] Preferably, both the housing and the heat conducting head are made of copper.
[0009] Preferably, the inside of the vacuum column is hollow and the inside of the vacuum column is vacuum.
[0010] Preferably, two ceramic seats with a semi-circular cross-section are disposed inside the terminal, and the inside of the ceramic seats is hollow.
[0011] Preferably, the electric wires pass through the hollow area of the ceramic seat and are electrically connected to a transmission line disposed at the tail end.
[0012] Preferably, the ceramic base is made of ceramic material.
[0013] (III) Beneficial effects
[0014] The present utility model provides an end encapsulation structure of an integrated temperature sensor, having the following beneficial effects:
[0015] 1. For the end encapsulation structure of the integrated temperature sensor, two ceramic bases with semi-circular cross-sections are arranged inside the terminal head. The electric wire passes through the hollow area of the ceramic base and is electrically connected to the transmission line arranged at the tail end. The ceramic base has an insulating function, and the electric wires are separated by the ceramic base, effectively reducing the normal operation of the temperature sensor affected by high temperature during the transmission of the sensor.
[0016] 2. For the end encapsulation structure of the integrated temperature sensor, the inside of the vacuum column is vacuum, and the vacuum column is made of high-temperature resistant ceramic material. The electric wire penetrates through the vacuum column and extends to the inside of the bottom terminal head. Due to the vacuum setting inside the vacuum column, the electric wires pass through the inside of the vacuum column in parallel, effectively reducing the short-circuit situation between the lines caused by the external high temperature affecting the electric wires. Description of the drawings
[0017] Figure 1 It is a schematic structural diagram of the present utility model;
[0018] Figure 2 It is a schematic structural diagram of the temperature sensing chip, vacuum column and ceramic base of the present utility model;
[0019] Figure 3 It is a schematic structural diagram of the temperature sensing chip, vacuum column and base of the present utility model;
[0020] Figure 4 It is a schematic partial structural diagram of the present utility model.
[0021] Wherein, 1. Housing; 2. Heat conducting head; 3. Sealing ring; 4. Base; 5. Terminal head; 6. Bottom cover; 7. Temperature sensing chip; 8. Vacuum column; 9. Electric wire; 10. Ceramic base; 11. Fixing hole; 12. Transmission line. Specific implementation manners
[0022] The following further describes the present utility model in conjunction with the drawings and embodiments.
[0023] The embodiment of the present utility model provides an end encapsulation structure of an integrated temperature sensor, as Figures 1-4As shown in the figure, it includes a housing 1 and a temperature sensor chip 7 arranged inside the housing 1. A heat conducting head 2 is installed at the end of the housing 1. The heat conducting head 2 uses an infrared sensing element. The pins of the temperature sensor chip 7 inside the housing 1 are fixed to an electric wire 9. The electric wire 9 is used for power supply and transmission of temperature data. A sealing ring 3 is fixed to the bottom end of the housing 1 by threads. The bottom of the sealing ring 3 is fixed to a base 4. Fixing holes 11 are provided on the base 4. The fixing holes 11 are used to fix to the machine body by bolts. A vacuum column 8 is arranged inside the housing 1. The inside of the vacuum column 8 is vacuum. The vacuum column 8 is made of high-temperature resistant ceramic material. The electric wire 9 passes through the vacuum column 8 and extends to the inside of the bottom terminal 5. By setting the inside of the vacuum column 8 to be vacuum, the electric wire 9 passing through the inside of the vacuum column 8 in parallel effectively reduces the situation of short circuit of the electric wire 9 caused by the influence of external high temperature. The bottom end of the terminal 5 is connected to a bottom cover 6 by threads. A ceramic seat 10 is arranged inside the terminal 5.
[0024] The ceramic seat 10 is made of ceramic material. Two ceramic seats 10 with a semicircular cross-section are arranged inside the terminal 5. The inside of the ceramic seat 10 is hollow. The electric wire 9 passes through the hollow area of the ceramic seat 10 and is electrically connected to a transmission line 12 arranged at the tail end. The ceramic seat 10 has an insulating function. By separating the electric wire 9 through the ceramic seat 10, it effectively reduces the normal operation of the temperature sensor affected by high temperature during the transmission of the sensor.
[0025] Both the housing 1 and the heat conducting head 2 are made of copper, reducing the occurrence of rust and other situations of the housing 1.
[0026] The inside of the vacuum column 8 is hollow. The vacuum column 8 can reduce heat conductivity in a vacuum state, avoiding short circuit situations caused by high temperature. The connection parts between the vacuum column 8 and the electric wire 9 are all sealed by high-temperature resistant glue.
[0027] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.
Claims
1. An end packaging structure of an integrated temperature sensor, comprising a housing (1) and a temperature sensing chip (7) arranged inside the housing (1), characterized in that: A heat conducting head (2) is installed at the end of the shell (1), the pins of the temperature sensing chip (7) inside the shell (1) are fixed to the electric wire (9), the bottom end of the shell (1) is threadedly fixed with a sealing ring (3), the bottom of the sealing ring (3) is fixed to the base (4), and the base (4) is provided with a fixing hole (11), the inside of the shell (1) is provided with a vacuum column (8), the electric wire (9) passes through the vacuum column (8) and extends to the inside of the bottom terminal head (5), the bottom end of the terminal head (5) is threadedly connected with a bottom cover (6), and the inside of the terminal head (5) is provided with a ceramic seat (10).
2. The end packaging structure of an integrated temperature sensor according to claim 1, characterized in that: The shell (1) and the heat conducting head (2) are both made of copper.
3. The end packaging structure of an integrated temperature sensor according to claim 1, characterized in that: The interior of the vacuum column (8) is hollow, and the interior of the vacuum column (8) is vacuum.
4. The end packaging structure of an integrated temperature sensor according to claim 1, characterized in that: Two ceramic seats (10) with semicircular cross-sections are arranged inside the terminal head (5), and the interior of the ceramic seats (10) is hollow.
5. The end packaging structure of an integrated temperature sensor according to claim 1, characterized in that: The electric conductor (9) passes through the hollow area of the ceramic base (10) and is electrically connected to the transmission line (12) arranged at the tail end.
6. The end packaging structure of an integrated temperature sensor according to claim 1, characterized in that: The ceramic seat (10) is made of ceramic material.