Airtightness detection tool for microelectronic device

Abstract

The utility model discloses a microelectronic device airtightness detection tool comprising a chassis and a positioning disc, the upper surface of the chassis is provided with a sinking groove, the sinking groove is internally provided with an air exhaust hole downwards, the positioning disc comprises a positioning disc body and a boss, the upper surface of the positioning disc body is provided with a station groove, and the boss is provided with an air exhaust hole. A step counter bore unit comprising an upper counter bore and a lower counter bore is correspondingly formed in each station groove, a sealing gasket is installed in each lower counter bore, a sealing gasket air hole is formed in each sealing gasket, a positioning disc air hole is formed in the boss, and the air suction hole, the positioning disc air hole, the sealing gasket air holes and the upper counter bores are sequentially communicated. The microelectronic device airtightness detection tool is formed by assembling the base plate and the positioning plate, a plurality of station grooves can be conveniently arranged, the detection efficiency is improved, the microelectronic device airtightness detection accuracy is high, the microelectronic device does not need to be jacked from the position above the microelectronic device, the operation is convenient, and the detection efficiency is improved. And no harm is generated to microelectronic devices.

Description

Technical Field

[0001] The utility model relates to the technical field of airtightness detection of microelectronic packaging, in particular to an airtightness detection tooling for microelectronic devices. Background Technique

[0002] The tightness of the packaging shell determines the service life of microelectronic products. In the field of microelectronic packaging, the requirement for the airtightness of the packaging shell has always been a topic that never fades. Under ideal conditions, the hermetic packaging should be able to prevent the intrusion of pollutants (liquids, solids or gases) within an infinite time, but this is not realistic. In order to prevent the failure of components caused by air leakage in hermetic packaging, it is necessary to detect its airtightness.

[0003] With the continuous development and innovation of high-vacuum leak detection technology, the corresponding equipment and instruments have made epoch-making progress in terms of performance, reliability, accuracy, cost performance, etc., so that high-vacuum leak detection instruments have gradually been popularized and applied from high-end scientific research fields to industrial and civilian fields. Among them, the helium mass spectrometry leak detection technology is one of the most widely used in the field of vacuum leak detection. The advantages of this leak detection method are: high leak detection sensitivity, fast instrument response, simple operation, safe and efficient, low cost, wide application, etc.

[0004] When the existing helium mass spectrometry leak detection technology is used to detect the airtightness of microelectronic products, the tooling used is disclosed in the patent document with the Chinese patent application number 202321407740.8. In addition to single-station operation, this tooling often needs to cover the sealing surface with vacuum glue for sealing, and then use a pressure rod to apply pressure. The detection operation is complex and cumbersome, with low efficiency, and at the same time, it will cause many adverse effects, such as vacuum glue residue, and the pressure applied by the pressure rod causes cracking of the packaging porcelain body and other problems. In addition, the comprehensive and full-set airtightness detection of microelectronic products should include the airtightness detection of each packaging component of the microelectronic products. When detecting the airtightness of each packaging component, it is necessary to detect the airtightness of each packaging component before and after packaging respectively. For example, when detecting the airtightness of the cover, it is necessary to detect the airtightness of the cover before and after packaging respectively; however, the existing airtightness detection of microelectronic products mostly takes place after the packaging products are packaged, that is, traditional microelectronic products can only be subjected to airtightness detection after being completely covered, and the detection ability is extremely limited. Content of the Utility Model

[0005] The purpose of the utility model is to provide an airtightness detection tooling for microelectronic devices.

[0006] The technical solution for achieving the purpose of the present utility model is: a hermetic detection tooling for microelectronic devices, including a chassis and a positioning plate. A sunken groove is formed on the upper surface of the chassis, and an air extraction hole is opened downward in the sunken groove. The positioning plate includes a positioning plate body and a convex platform extending downward from the lower surface of the positioning plate body. The convex platform extends into the sunken groove and is buckled with the sunken groove. One or more station grooves for limiting the microelectronic devices are formed on the upper surface of the positioning plate body. A stepped sunken hole unit is correspondingly opened in each station groove. The stepped sunken hole unit includes an upper sunken hole and a lower sunken hole connected to each other. The aperture of the upper sunken hole is smaller than that of the lower sunken hole. A hole shoulder is formed between the upper sunken hole and the lower sunken hole. A sealing gasket is installed in the lower sunken hole. The upper surface of the sealing gasket is in close contact with the hole shoulder. A sealing gasket air hole is formed on the sealing gasket. A positioning plate air hole is formed on the convex platform. The air extraction hole, the positioning plate air hole, the sealing gasket air hole, and the upper sunken hole are sequentially communicated. A first sealing ring is installed between the chassis and the positioning plate. The first sealing ring is in close contact with the chassis and the positioning plate respectively. The positioning plate air hole is located within the first sealing ring.

[0007] Further, a circular first sealing edge extends from the hole shoulder to one side of the lower sunken hole. The upper sunken hole is located inside the first sealing edge. When the upper surface of the sealing gasket is in close contact with the hole shoulder, the first sealing edge presses the sealing gasket downward, and the sealing performance between the first sealing edge and the sealing gasket is better.

[0008] Further, the lower sunken hole is a through hole, and the lower end of the lower sunken hole is located on the convex platform. When the lower sunken hole is a through hole, it is convenient to install the first sealing ring.

[0009] Further, a sealing block and a compression spring are further arranged in the lower sunken hole. The sealing block is located below the sealing gasket. The compression spring is vertically arranged. The sealing gasket, the sealing block, and the compression spring are arranged in a top-pressing manner from top to bottom. A sealing block air hole is formed on the sealing block. The air extraction hole, the positioning plate air hole, the sealing block air hole, the sealing gasket air hole, and the upper sunken hole are sequentially communicated. During operation, the compression spring provides a pre-tightening force, so that under the action of the compression spring, the upper surface of the sealing gasket can always be in close contact with the hole shoulder, avoiding the gap between the sealing gasket and the hole shoulder caused by the downward pulling of the sealing gasket due to continuous vacuum extraction during the air leakage detection process. In this structure, the sealing block plays a role of support and pressure equalization, so that when installing the compression spring, the upper end of the compression spring can press against the sealing block, and the pressure is evenly transferred to the sealing gasket through the sealing block. When the lower sunken hole is a through hole with an open lower end, the upper end of the compression spring touches the sealing block, and the lower end of the compression spring can touch the chassis.

[0010] Further, a ring-shaped second sealing edge extends upward from the upper surface of the sealing block, and the sealing gasket air hole is located inside the second sealing edge. When the upper surface of the sealing block is in close contact with the sealing gasket, the second sealing edge presses the sealing gasket upward, and the sealing performance between the second sealing edge and the sealing gasket is better.

[0011] Further, an installation hole is provided at the bottom of the sealing block, and the compression spring is located inside the installation hole. The installation hole can limit and guide the compression spring to prevent the compression spring from bending.

[0012] Further, a guide post is provided on the bottom of the sink, and the bottom of the compression spring is sleeved on the guide post. The guide post can limit and guide the compression spring to prevent the compression spring from bending.

[0013] Further, a guide hole is provided on the sealing block, and a column is provided on the bottom of the sink. The columns and the guide holes correspond one by one and pass through the guide holes. The column and the guide hole form a limiting relationship, enabling the sealing block to move up and down along the column but not horizontally.

[0014] Further, the first sealing ring is located outside the wall of the boss. The first sealing ring can be located outside the wall of the boss or on the lower surface of the positioning disk body. Compared with the latter, the extrusion seal formed in the former structure is more reliable.

[0015] Further, the boss is ring-shaped. The ring-shaped boss facilitates the opening of the positioning disk air hole.

[0016] Further, the number of the station grooves is several.

[0017] Further, a connecting head extends downward from the bottom of the chassis. The setting of the connecting head facilitates the connection with the helium mass spectrometer.

[0018] Further, a third sealing ring is sleeved on the connecting head. The setting of the third sealing ring can make the sealed connection between the connecting head and the helium mass spectrometer more reliable.

[0019] Further, bolt holes are provided on the positioning disk and the chassis, and the positioning disk and the chassis are fixedly connected by bolts.

[0020] Further, a pressure ring is provided on the positioning disk. The bolt passes through the pressure ring, the positioning disk and the chassis in sequence to fix the pressure ring, the positioning disk and the chassis. The setting of the pressure ring can make the connection force between the positioning disk and the chassis more uniform.

[0021] The airtight detection tooling for microelectronic devices of the present utility model is configured such that a sink is provided on the chassis, and an air extraction hole is opened downward within the sink. Meanwhile, the positioning disk includes a positioning disk body and a boss. A working station groove is provided on the positioning disk body, and a stepped sink hole unit is correspondingly opened within each working station groove. Additionally, a positioning disk air hole is opened on the boss. After the boss extends into the sink, the chassis and the positioning disk can be buckled together as a whole, and the air extraction hole and the positioning disk air hole can also be communicated. Thus, after a microelectronic device is placed within the working station groove, vacuum can be extracted through the air extraction hole to detect the airtightness of the microelectronic device. The airtight detection tooling for microelectronic devices of the present utility model is assembled from the chassis and the positioning disk. With the assembled structure of the chassis and the positioning disk, the air holes are conveniently arranged, and a branched air path can be formed where multiple positioning disk air holes are commonly communicated to the same air extraction hole. In this way, it is convenient to provide multiple working station grooves on the positioning disk, and the airtightness of multiple microelectronic devices can be detected simultaneously at multiple working stations, with high detection efficiency.

[0022] For the airtight detection tooling for microelectronic devices of the present utility model, in addition to installing a first sealing ring between the chassis and the positioning disk and using the first sealing ring to seal the assembly of the chassis and the positioning disk, a stepped sink hole unit including an upper sink hole and a lower sink hole is also opened within the working station groove, and a sealing gasket is provided within the lower sink hole. Under the sealing effect of the sealing gasket, air leakage at the edge of the lower sink hole is prevented, and the gas pressure after vacuum extraction is concentrated above the sealing gasket air hole, directly facing the microelectronic device. Thus, under the all-round sealing of the first sealing ring and the sealing gasket, the gas pressure after vacuum extraction is uniquely concentrated on the microelectronic device, ensuring high accuracy in the airtightness detection of the microelectronic device. At the same time, precisely because of the good sealing performance, after vacuum extraction, the microelectronic device is directly adsorbed under pressure without the need to apply a top pressure to the microelectronic device from above. This makes the operation more convenient and causes no harm to the microelectronic device. Description of the Drawings

[0023] Figure 1 is a three-dimensional structural schematic diagram of the airtight detection tooling for microelectronic devices of the present utility model;

[0024] Figure 2 is a three-dimensional structural schematic diagram of the chassis of the airtight detection tooling for microelectronic devices of the present utility model from a first perspective;

[0025] Figure 3 is a three-dimensional structural schematic diagram of the chassis of the airtight detection tooling for microelectronic devices of the present utility model from a second perspective;

[0026] Figure 4This is a three-dimensional structure schematic diagram of the positioning disk in the airtight detection tooling for microelectronic devices of the present utility model from the first perspective;

[0027] Figure 5 This is a three-dimensional structure schematic diagram of the positioning disk in the airtight detection tooling for microelectronic devices of the present utility model from the second perspective;

[0028] Figure 6 This is a bottom view structure schematic diagram of the positioning disk in the airtight detection tooling for microelectronic devices of the present utility model;

[0029] Figure 7 This is a three-dimensional structure schematic diagram of the sealing block in the airtight detection tooling for microelectronic devices of the present utility model;

[0030] Figure 8 This is a three-dimensional structure schematic diagram of the chassis, sealing gasket and sealing block in the airtight detection tooling for microelectronic devices of the present utility model;

[0031] Figure 9 This is a three-dimensional structure schematic diagram of the pressure ring in the airtight detection tooling for microelectronic devices of the present utility model;

[0032] Figure 10 This is a three-dimensional structure schematic diagram when the airtight detection tooling for microelectronic devices of the present utility model detects microelectronic devices;

[0033] Figure 11 is Figure 10 A sectional structure schematic diagram along the A-A line. Detailed implementation manners

[0034] The following describes in detail the preferred embodiments of the airtight detection tooling for microelectronic devices of the present utility model in conjunction with the accompanying drawings.

[0035] Such as Figures 1 to 11As shown in the figure, a hermetic detection tooling for microelectronic devices includes a chassis 1 and a positioning plate 2. A sunken groove 11 is formed on the upper surface of the chassis 1, and an air extraction hole 12 is formed downward in the sunken groove 11. The positioning plate 2 includes a positioning plate body 20 and a convex platform 21 extending downward from the lower surface of the positioning plate body 20. The convex platform 21 extends into the sunken groove 11 and is buckled with the sunken groove 11. One or more working grooves 22 for limiting the microelectronic device 100 are formed on the upper surface of the positioning plate body 20. A stepped sunken hole unit 23 is correspondingly formed in each of the working grooves 22. The stepped sunken hole unit 23 includes an upper sunken hole 231 and a lower sunken hole 232 which are connected. The aperture D1 of the upper sunken hole 231 is smaller than the aperture D2 of the lower sunken hole 232. A hole shoulder 230 is formed between the upper sunken hole 231 and the lower sunken hole 232. A sealing gasket 3 is installed in the lower sunken hole 232. The upper surface of the sealing gasket 3 is in close contact with the hole shoulder 230. A sealing gasket air hole 31 is formed on the sealing gasket 3. A positioning plate air hole 24 is formed on the convex platform 21. The air extraction hole 12, the positioning plate air hole 24, the sealing gasket air hole 31 and the upper sunken hole 231 are communicated in sequence. A first sealing ring 4 is installed between the chassis 1 and the positioning plate 2. The first sealing ring 4 is in close contact with both the chassis 1 and the positioning plate 2. The positioning plate air hole 24 is located inside the first sealing ring 4.

[0036] For the hermetic detection tooling for microelectronic devices of the present utility model, the convex platform 21 of the positioning plate 2 extends into the sunken groove 11 of the chassis 1, and the chassis 1 and the positioning plate 2 are buckled and fixed. The working groove 22 on the positioning plate 2 is used for placing the microelectronic device 100. Both the sealing gasket 3 and the first sealing ring 4 play a sealing role.

[0037] For the hermetic detection tooling for microelectronic devices of the present utility model, during operation, the microelectronic device 100 is placed in the working groove 22, and vacuum is extracted through the air extraction hole 12 to form a pressure difference on both the upper and lower sides of the microelectronic device 100. The microelectronic device 100 is subjected to the air pressure of helium gas. Then, the leakage rate of the microelectronic device 100 can be read from a helium mass spectrometer leak detector.

[0038] The airtightness detection tooling for microelectronic devices of the present utility model is provided with the sunk groove 11 on the chassis 1, and the air extraction hole 12 is opened downward in the sunk groove 11. At the same time, the positioning plate 2 includes the positioning plate body 20 and the boss 21, the working position groove 22 is arranged on the positioning plate body 20, the stepped sunk hole unit 23 is correspondingly opened in the working position groove 22, and the positioning plate air hole 24 is opened on the boss 21. After the boss 21 extends into the sunk groove 11, the chassis 1 and the positioning plate 2 can be buckled into one body, and the air extraction hole 12 and the positioning plate air hole 24 can also be communicated. So that after the microelectronic device 100 is placed in the working position groove 22, the airtightness of the microelectronic device 100 can be detected by extracting vacuum through the air extraction hole 12. The airtightness detection tooling for microelectronic devices of the present utility model is assembled by the chassis 1 and the positioning plate 2. Under the assembled structure of the chassis 1 and the positioning plate 2, the air holes are conveniently arranged, and a branched air path can be formed in which multiple positioning plate air holes 24 are commonly communicated to the same air extraction hole 12. In this way, it is convenient to arrange multiple working position grooves 22 on the positioning plate 2, and the airtightness of multiple microelectronic devices 100 can be detected simultaneously at multiple working positions, and the detection efficiency is high.

[0039] The airtightness detection tooling for microelectronic devices of the present utility model, in addition to installing the first sealing ring 4 between the chassis 1 and the positioning plate 2 and using the first sealing ring 4 to seal the assembly of the chassis 1 and the positioning plate 2, also opens the stepped sunk hole unit 23 including the upper sunk hole 231 and the lower sunk hole 232 in the working position groove 22, and the sealing gasket 3 is arranged in the lower sunk hole 232. Under the sealing action of the sealing gasket 3, air leakage at the edge of the lower sunk hole 232 is prevented, and the gas pressure after vacuum extraction is concentrated above the sealing gasket air hole 31, directly facing the microelectronic device 100. In this way, under the all-round sealing of the first sealing ring 4 and the sealing gasket 3, the gas pressure after vacuum extraction is uniquely concentrated on the microelectronic device 100, and the accuracy of the airtightness detection of the microelectronic device 100 is high. At the same time, precisely because of the good sealing performance, after vacuum extraction, the microelectronic device 100 is directly adsorbed under pressure without being pressed from above the microelectronic device 100. Its operation is more convenient and it will not cause any harm to the microelectronic device 100.

[0040] The airtightness detection tooling for microelectronic devices of the present utility model can detect the airtightness of microelectronic devices 100 under various processes, and its detection ability is high.

[0041] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a ring-shaped first sealing edge 2301 extends from the hole shoulder 230 to one side of the sunken hole 232, and the upper sunken hole 231 is located inside the first sealing edge 2301. When the upper surface of the sealing gasket 3 is in close contact with the hole shoulder 230, the first sealing edge 2301 presses the sealing gasket 3 downward, and the sealing performance between the first sealing edge 2301 and the sealing gasket 3 is better.

[0042] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, the sunken hole 232 is a through hole, and the lower end of the sunken hole 232 is located on the boss 21. When the sunken hole 232 is a through hole, it is convenient to install the first sealing ring 4.

[0043] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a sealing block 5 and a compression spring 6 are further provided in the sunken hole 232. The sealing block 5 is located below the sealing gasket 3, the compression spring 6 is vertically arranged, the sealing gasket 3, the sealing block 5 and the compression spring 6 are arranged in a top-pressing manner from top to bottom. A sealing block air hole 51 is opened on the sealing block 5, and the air extraction hole 12, the positioning disc air hole 24, the sealing block air hole 51, the sealing gasket air hole 31 and the upper sunken hole 231 are sequentially communicated. During operation, the compression spring 6 provides a pre-tightening force, so that under the action of the compression spring 6, the upper surface of the sealing gasket 3 can always be in close contact with the hole shoulder 230, avoiding that during the process of detecting air leakage, due to continuous vacuum pumping, the sealing gasket 3 is pulled downward and a gap appears between the sealing gasket 3 and the hole shoulder 230, resulting in air leakage. In this structure, the sealing block 5 plays a role of support and pressure equalization, so that when installing the compression spring 6, the upper end of the compression spring 6 can press against the sealing block 5, and the pressure is evenly transferred to the sealing gasket 3 through the sealing block 5. When the sunken hole 232 is a through hole with an open lower end, the upper end of the compression spring 6 touches the sealing block 5, and the lower end of the compression spring 6 can touch the chassis 1.

[0044] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a ring-shaped second sealing edge 52 extends upward from the upper surface of the sealing block 5, and the sealing gasket air hole 31 is located inside the second sealing edge 52. When the upper surface of the sealing block 5 is in close contact with the sealing gasket 3, the second sealing edge 52 presses the sealing gasket 3 upward, and the sealing performance between the second sealing edge 52 and the sealing gasket 3 is better.

[0045] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, an installation hole 53 is provided at the bottom of the sealing block 5, and the compression spring 6 is located in the installation hole 53. The installation hole 53 can limit and guide the compression spring 6 to prevent the compression spring 6 from bending.

[0046] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a guide post 111 is provided on the bottom of the sink 11, and the bottom of the compression spring 6 is sleeved on the guide post 111. The guide post 111 can limit and guide the compression spring 6 to prevent the compression spring 6 from bending.

[0047] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a guide hole 54 is provided on the sealing block 5, and a column 112 is provided on the bottom of the sink 11. The column 112 corresponds to the guide hole 54 one by one and passes through the guide hole 54. The column 112 and the guide hole 54 form a limiting relationship, enabling the sealing block 5 to move up and down along the column 112 but not horizontally.

[0048] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, the first sealing ring 4 is located outside the wall of the boss 21. The first sealing ring 4 can be located outside the wall of the boss 21 or on the lower surface of the positioning disk body 20. Compared with the latter, the extrusion seal formed in the former structure is more reliable.

[0049] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, the boss 21 is annular. The annular boss 21 facilitates the opening of the positioning disk air holes 24.

[0050] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, the number of the station slots 22 is several. The multi-station detection has high efficiency.

[0051] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a connecting head 13 extends downward from the bottom of the chassis 1. The setting of the connecting head 13 facilitates the connection with the helium mass spectrometer.

[0052] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a third sealing ring 131 is sleeved on the connecting head 13. The setting of the third sealing ring 131 can make the sealed connection between the connecting head 13 and the helium mass spectrometer more reliable.

[0053] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, bolt holes 10 are provided on the positioning disk 2 and the chassis 1, and the positioning disk 2 and the chassis 1 are fixedly connected by bolts.

[0054] The airtight detection tooling for microelectronic devices of the present utility model. Preferably, a pressing ring 7 is provided on the positioning disk 2. Bolts sequentially pass through the pressing ring 7, the positioning disk 2 and the chassis 1 to fix the pressing ring 7, the positioning disk 2 and the chassis 1. The setting of the pressing ring 7 can make the connection force between the positioning disk 2 and the chassis 1 more uniform.

[0055] The above are only embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent process transformation made by using the content of the specification of the present utility model, or directly or indirectly applied in other related technical fields, shall similarly be included within the patent protection scope of the present utility model.

Claims

1. A microelectronic device airtightness detection tool, characterized in that: The invention comprises a bottom plate and a positioning plate, wherein a sink groove is provided on the upper surface of the bottom plate, an air extraction hole is provided downward in the sink groove, the positioning plate comprises a positioning plate body and a boss extending downward from the lower surface of the positioning plate body, the boss extends into the sink groove and engages with the sink groove, and the upper surface of the positioning plate body is provided with more than one station groove for limiting the position of the microelectronic device, each of the station grooves is provided with a stepped sink hole unit, the stepped sink hole unit comprises an upper sink hole and a lower sink hole connected to each other, the aperture of the upper sink hole is smaller than that of the lower sink hole The aperture of the countersunk hole, a hole shoulder is formed between the upper countersunk hole and the lower countersunk hole, a sealing gasket is installed in the lower countersunk hole, the upper surface of the sealing gasket is in close contact with the hole shoulder, a sealing gasket air hole is opened on the sealing gasket, a positioning plate air hole is opened on the boss, the exhaust hole, the positioning plate air hole, the sealing gasket air hole and the upper countersunk hole are connected in sequence, a first sealing ring is installed between the chassis and the positioning plate, the first sealing ring and the chassis, the first sealing ring and the positioning plate are all in close contact, and the positioning plate air hole is located in the first sealing ring.

2. The microelectronic device airtightness detection tooling according to claim 1, characterized in that: A first annular sealing edge is extended from the hole shoulder toward one side of the lower countersunk hole, and the upper countersunk hole is located on the inner side of the first sealing edge.

3. The microelectronic device airtightness detection tool according to claim 1, characterized in that: A sealing block and a compression spring are also provided in the sinking hole. The sealing block is located below the sealing gasket, and the compression spring is upright. The sealing gasket, the sealing block and the compression spring are pressed in sequence from top to bottom. A sealing block air hole is opened on the sealing block, and the air extraction hole, the positioning plate air hole, the sealing block air hole, the sealing gasket air hole and the upper sinking hole are connected in sequence.

4. The microelectronic device airtightness detection tool according to claim 3, characterized in that: A second annular sealing edge extends upward from the upper surface of the sealing block, and the air hole of the sealing gasket is located on the inner side of the second sealing edge.

5. The microelectronic device airtightness detection tool according to claim 3, characterized in that: A mounting hole is provided at the bottom of the sealing block, and the compression spring is located in the mounting hole.

6. The microelectronic device airtightness detection tool according to claim 3, characterized in that: A guide column is arranged on the bottom of the sink, and the bottom of the compression spring is sleeved on the guide column.

7. The microelectronic device airtightness detection tool according to claim 3, characterized in that: The sealing block is provided with a guide hole, and the bottom of the sink is provided with a column, and the column corresponds to the guide hole one by one and is penetrated in the guide hole.

8. The microelectronic device airtightness detection tool according to claim 1, characterized in that: A connector is extended downward from the bottom of the chassis; a third sealing ring is sleeved on the connector.

9. The microelectronic device airtightness detection tool according to claim 1, characterized in that: Bolt holes are provided on the positioning plate and the chassis, and the positioning plate and the chassis are fixedly connected by bolts.

10. The microelectronic device airtightness detection tool according to claim 1, characterized in that: A pressure ring is arranged on the positioning plate.

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