Testing device and testing machine

Abstract

The utility model provides a testing device and a testing machine, and relates to the field of chips. The testing device comprises a plurality of testing mechanisms, a flying shuttle mechanism and a first clamping mechanism, the plurality of testing mechanisms are divided into a plurality of groups, the plurality of groups of testing mechanisms are respectively arranged at different heights, the testing mechanisms in the same group are sequentially arranged along a first direction, and the testing mechanisms can receive and test chips; the flying shuttle mechanism is provided with at least one material carrying part, and the material carrying part can move in the first direction and can carry at least one chip; and the first clamping mechanism at least can transfer the chip between the testing mechanism and the material loading part. According to the testing device provided by the utility model, by changing the layout of the testing device, the size of the testing device can be reduced on the basis of increasing the number of the testing mechanisms, the moving range of the manipulator can be effectively reduced, and the production efficiency is further improved.

Description

Technical Field

[0001] The utility model relates to the field of chips, and particularly to a testing device and a testing machine. Background Art

[0002] At present, the testing device of a three-temperature chip testing machine uses a manipulator to separately clamp multiple chips to multiple testing mechanisms to simultaneously test multiple chips in three temperature ranges: low temperature (-55°C to 0°C), normal temperature (1°C to 24°C), and high temperature (25°C to 125°C). Among them, the testing mechanisms are arranged on the testing machine table in a tiled manner. To meet the growing demand for high-power chips such as automotive-grade chips and enterprise-grade chips in the above market, mostly by increasing the number of testing mechanisms of each testing machine, this will lead to a further increase in the floor area of the testing machine and increase the production site cost; and due to the increase in the number of testing mechanisms, the moving range of the manipulator from the self-feeding position to the testing mechanism will also become larger accordingly, thereby reducing production efficiency. Summary of the Utility Model

[0003] In view of this, the purpose of the utility model is to overcome the deficiencies in the prior art, and provide a testing device. By changing the layout of the testing device, on the basis of increasing the number of testing mechanisms, the volume of the testing device can be reduced, and the moving range of the manipulator can be effectively reduced, thereby improving production efficiency;

[0004] In addition, a testing machine applying the above testing device is provided.

[0005] The utility model provides the following technical solutions:

[0006] According to the first aspect disclosed by the utility model, a testing device is provided, and the testing device includes:

[0007] Multiple testing mechanisms, the multiple testing mechanisms are divided into multiple groups, the multiple groups of testing mechanisms are respectively arranged at different heights, the testing mechanisms in the same group are arranged in sequence along a first direction, and the testing mechanisms can receive and test chips; and

[0008] A shuttle mechanism, the shuttle mechanism has at least one loading part, the loading part can move along the first direction, and the loading part can carry at least one of the chips; and

[0009] A first clamping mechanism, the first clamping mechanism can at least transfer the chip between the testing mechanism and the loading part.

[0010] Further, the shuttle mechanism includes:

[0011] At least one loading member, the loading member forms the loading part;

[0012] A first driving member, which is connected to the material carrier, and the first driving member is capable of driving the material carrier to move along the first direction.

[0013] Furthermore, the number of the material carriers is not less than two; wherein, the first driving member is configured to be capable of driving at least any two of the material carriers to move in the same direction or in opposite directions along the first direction.

[0014] Furthermore, the testing mechanism includes:

[0015] A testing carrier having a component placing groove, and a probe assembly is provided at the bottom of the component placing groove corresponding to the position of the testing contact of the chip.

[0016] A testing press head and a second driving member, the second driving member is connected to the testing press head, and the second driving member is capable of driving the testing press head to move along a set path so that the testing press head presses or disengages from the chip located in the component placing groove.

[0017] Furthermore, the testing press head includes:

[0018] A press head body having a heat conducting end for abutting against the packaging surface of the chip, and the heat conducting end has a receiving cavity; and

[0019] A temperature detection part installed in the receiving cavity, and the temperature detection part has a detection end capable of abutting against the packaging surface.

[0020] Furthermore, the press head body further has a wire threading hole communicating with the receiving cavity; the temperature detection part includes a temperature sensor, and the wire of the temperature sensor is threaded through the wire threading hole; wherein, the wire threading hole communicates with the outside of the press head body;

[0021] And / or, a hole and groove structure is provided at the end of the heat conducting end for abutting against the packaging surface, and the hole and groove structure communicates with the outside of the press head body.

[0022] Furthermore, the testing press head further includes an elastic part, and the temperature detection part is connected to the inner wall of the receiving cavity through the elastic part; wherein, the elastic part is configured to be elastically deformable so that the detection end keeps abutting against the packaging surface.

[0023] Furthermore, the press head body includes:

[0024] A housing forming a heat insulation layer; and

[0025] A heat conducting part installed in the housing, and the heat conducting part has an extending end extending out of the housing, and the extending end forms the heat conducting end; and

[0026] A temperature adjustment unit, which is installed in the housing and can adjust the temperature of the heat conduction end.

[0027] Furthermore, the power commutator includes:

[0028] A DC power supply for providing DC current; and

[0029] A commutator, through which the DC power supply is electrically connected to the semiconductor cooler; and

[0030] A thermostat, which is electrically connected to the temperature detection unit and the commutator respectively. The thermostat can send an instruction to the commutator according to the temperature signal sent by the temperature detection unit to switch the transmission direction of the semiconductor cooler.

[0031] Furthermore, the temperature adjustment unit further includes a thermostat, which is electrically connected to the temperature detection unit and the commutator respectively. The thermostat can send an instruction to the commutator according to the temperature signal sent by the temperature detection unit to switch the transmission direction of the semiconductor cooler.

[0032] Furthermore, the first picking mechanism includes:

[0033] A picking member capable of sucking the chip by negative pressure;

[0034] A third driving member, which is connected to the picking member and can drive the picking member to move along a second set path.

[0035] Furthermore, the picking member includes at least one negative pressure suction nozzle, which is connected to the third driving member;

[0036] And / or, the third driving member includes a robotic arm, which is connected to the picking member.

[0037] According to the second aspect of the present invention, a testing machine is provided, which includes the testing device according to any one of the above.

[0038] Furthermore, the testing machine further includes a sorting device, which includes:

[0039] A plurality of storage areas for storing chips of different quality grades;

[0040] A second picking mechanism capable of picking the chips conveyed by the loading part and detected and clamping them into the corresponding storage areas of different quality grades.

[0041] Further, the sorting device further includes:

[0042] A plurality of empty material bins, which can store a plurality of trays;

[0043] A plurality of discharging bins, which form the storage area, can store a plurality of the trays, and the second clamping mechanism can clamp the chips conveyed by the material loading part and detected to the trays in the corresponding quality grade discharging bins;

[0044] A third clamping mechanism, which can at least clamp the trays in the empty material bins one by one to the discharging bins.

[0045] Further, the testing machine further includes a loading device, and the loading device includes:

[0046] A loading bin, which can store a plurality of trays with the chips placed therein, and the fourth clamping mechanism can clamp the chips in the trays to the material loading part;

[0047] Wherein, the third clamping mechanism can clamp the trays in the loading bin to the empty material bins.

[0048] The embodiments of the present utility model have the following advantages:

[0049] By using the testing device provided by the present utility model, by grouping a plurality of testing mechanisms and installing each group of testing mechanisms at different heights to vertically arrange the testing mechanisms, the floor area can be effectively saved and the production cost can be reduced on the basis of increasing the number of testing mechanisms; in addition, the chips to be detected are conveyed to the target position by the shuttle mechanism, and then the first clamping mechanism clamps the chips to be detected on the material loading part of the shuttle mechanism at the target position to the testing mechanism, or the material loading end is conveyed to the target position by the shuttle mechanism, and the first clamping mechanism clamps the chips after testing in the testing mechanism to the material loading part at the target position, and then the testing device can be output by the shuttle mechanism. Furthermore, the transfer efficiency of the chips is improved by the cooperation of the shuttle mechanism and the first clamping mechanism, so as to improve the production efficiency.

[0050] In addition, the present utility model also relates to a testing machine. Since the above-mentioned testing device has the above-mentioned technical effects, the testing machine including this testing device should have the same technical effects, which will not be elaborated here.

[0051] In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, makes the following detailed description. Description of the Drawings

[0052] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the attached drawings required for use in the embodiments. It should be understood that the following attached drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related attached drawings can also be obtained based on these attached drawings.

[0053] Figure 1 The structural schematic diagram of a perspective view of the testing machine provided by the embodiment of the present utility model is shown;

[0054] Figure 2 The structural schematic diagram of another perspective view of the testing machine provided by the embodiment of the present utility model is shown;

[0055] Figure 3 The structural schematic diagram of another perspective view of the testing machine provided by the embodiment of the present utility model is shown;

[0056] Figure 4 The structural schematic diagram of another perspective view of the testing machine provided by the embodiment of the present utility model is shown;

[0057] Figure 5 The structural schematic diagram of a perspective view of the second clamping mechanism and the fourth clamping mechanism of the testing machine provided by the embodiment of the present utility model is shown;

[0058] Figure 6 The structural schematic diagram of another perspective view of the second clamping mechanism and the fourth clamping mechanism of the testing machine provided by the embodiment of the present utility model is shown;

[0059] Figure 7 The structural schematic diagram of a perspective view of the third clamping mechanism, the empty material bin, the feeding bin, and the discharging bin of the testing machine provided by the embodiment of the present utility model is shown;

[0060] Figure 8 The structural schematic diagram of the shuttle mechanism of the testing device provided by the embodiment of the present utility model is shown;

[0061] Figure 9 The structural schematic diagram of the third clamping mechanism of the testing machine provided by the embodiment of the present utility model is shown;

[0062] Figure 10 The structural schematic diagram of the testing indenter provided by the embodiment of the present utility model is shown;

[0063] Figure 11 The exploded view of the testing indenter provided by the embodiment of the present utility model is shown;

[0064] Figure 12 The internal structural schematic diagram of the testing indenter provided by the embodiment of the present utility model is shown;

[0065] Figure 13 shows Figure 12 a partial enlarged view at position A in

[0066] Figure 14 a schematic diagram of the internal structure of the radiator of the test indenter provided by the embodiment of the present invention.

[0067] Description of main component symbols:

[0068] 100 - heat conduction part; 110 - heat conduction end; 111 - hole and groove structure; 200 - housing; 210 - outer shell; 220 - positioning frame; 230 - end cover; 231 - recessed area; 240 - annular clamping groove; 250 - limiting protrusion; 300 - radiator; 310 - water inlet end; 320 - water outlet end; 330 - annular flange; 400 - elastic sealing ring; 500 - locking part; 600 - first thermal grease layer; 700 - temperature adjustment part; 800 - second thermal grease layer; 900 - temperature sensor; 910 - cable; 920 - detection end; 1000 - test mechanism; 1100 - test carrier; 1200 - test indenter; 2000 - loading and unloading area; 3000 - shuttle mechanism; 3100 - loading part; 3200 - first driving part; 4000 - third clamping mechanism; 4100 - clamping part; 4200 - fourth driving part; 5000 - loading bin; 6000 - empty bin; 7000 - unloading bin; 8000 - second clamping mechanism; 8100 - picking part; 8200 - third driving part; 9000 - fourth clamping mechanism; 10000 - tray; 20000 - first clamping mechanism. Detailed implementation manners

[0069] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the drawings below are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0070] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0071] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral one; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0072] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0073] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0074] In the related art, the test device of a three-temperature chip tester uses a manipulator to separately pick up multiple chips and place them on multiple test mechanisms 1000 to simultaneously test multiple chips in three temperature ranges: low temperature (-55°C to 0°C), normal temperature (1°C to 24°C), and high temperature (25°C to 125°C). Among them, the test mechanisms 1000 are arranged on the test machine table in a tiled manner.

[0075] To meet the growing demand for high-power chips such as automotive-grade chips and enterprise-grade chips in the above-mentioned market, mostly by increasing the number of test mechanisms 1000 of each tester, this will lead to a further increase in the floor area of the tester and increase the production site cost; and due to the increase in the number of test mechanisms 1000, the moving range of the manipulator from the self-feeding position to the test mechanism 1000 will also become larger accordingly, thereby reducing the production efficiency.

[0076] Such as Figure 1 、 Figure 2 and Figure 3As shown in the figure, to solve the above technical problems, according to the first aspect disclosed by the present utility model, a testing device is provided. The testing device includes a plurality of testing mechanisms 1000, a shuttle mechanism 3000, and a first clamping mechanism 20000. The plurality of testing mechanisms 1000 are divided into multiple groups, and the multiple groups of testing mechanisms 1000 are respectively arranged at different heights. The testing mechanisms 1000 in the same group are arranged in sequence along the first direction, and the testing mechanism 1000 can receive and test the chips; the shuttle mechanism 3000 has at least one loading part, the loading part can move along the first direction, and the loading part can carry at least one of the chips; the first clamping mechanism 20000 can at least transfer the chips between the testing mechanism 1000 and the loading part.

[0077] That is to say, a material conveying channel is formed in the first direction. The shuttle mechanism 3000 conveys the chips placed on the loading part in the material conveying channel. Among them, the first clamping mechanism 20000 can clamp the chips on the loading part at any position in the material conveying channel and can place the clamped chips into the testing mechanism 1000 near the loading part. That is to say, the shuttle mechanism 3000 conveys the chips to be detected to near the empty testing mechanism 1000, and then the first clamping mechanism 20000 clamps the chips to be detected into the empty testing mechanism 1000, thereby completing the loading process of the testing mechanism 1000;

[0078] Of course, by moving the empty loading part (that is, without loading chips) and the testing mechanism 1000 to near the testing mechanism 1000 that needs to complete the test, and by using the first clamping mechanism 20000 to clamp the chips that have completed the test in the testing mechanism 1000 into the loading part, and then the shuttle mechanism 3000 conveys the chips that have completed the test to outside the testing device or the discharge port.

[0079] Optionally, the first clamping mechanism 20000 picks up the chips by negative pressure adsorption. The chips are placed on the loading part and the testing mechanism 1000 in a flat posture. This method is beneficial to picking up the chips.

[0080] Obviously, in order to improve production efficiency, multiple chips can be placed side by side on the loading part at one time, which is beneficial to quickly loading multiple testing mechanisms 1000. Exemplarily, a plurality of limiting grooves are provided at the upper end of the loading part, and each limiting groove can accommodate a chip; among them, the internal contour of the limiting groove is adapted to the outer shape of the chip, so as to limit the chip and prevent the chip from falling during the conveying process; and by limiting the position and posture of the chip, it is beneficial for the first clamping mechanism 20000 to quickly identify and clamp the chip, without spending time adjusting the position and posture of the identified chip.

[0081] Among them, multiple test mechanisms 1000 are arranged in the vertical space. That is to say, by installing multiple test mechanisms 1000 at different heights respectively, multi-layer placement of multiple test mechanisms 1000 is realized, and the first clamping mechanism 20000 picks and places chips from the side of the test mechanism 1000. Exemplarily, multiple test mechanisms 1000 are divided into two groups, and the two groups of test mechanisms 1000 are installed at different heights respectively to form a double-layer structure.

[0082] Optionally, the first clamping mechanism 20000 can be a six-axis robotic arm, and a negative pressure suction cup is arranged at the end of the six-axis robotic arm. After the chip is sucked by the negative pressure suction cup, it can move in the three-dimensional space.

[0083] Obviously, test mechanisms 1000 installed according to multi-layer layouts can also be respectively arranged on both sides of the feeding channel. That is to say, multi-layer test mechanisms 1000 are respectively arranged on both sides of the feeding channel. Then, through the shuttle mechanism 3000 and the first clamping mechanism 20000, the test mechanisms 1000 on both sides of the feeding channel can be loaded and unloaded simultaneously, which can further improve production efficiency. And more test mechanisms 1000 can be installed in a certain space, and thus the chip demand for industry development can be met.

[0084] Applying the test device provided by the present utility model, by grouping multiple test mechanisms 1000 and installing each group of test mechanisms 1000 at different heights to arrange the test mechanisms 1000 vertically, the floor area can be effectively saved and the production cost can be reduced on the basis of increasing the number of test mechanisms 1000. In addition, the shuttle mechanism 3000 transports the chips to be detected to the target position, and then the first clamping mechanism 20000 clamps the chips to be detected on the loading part of the shuttle mechanism 3000 at the target position to the test mechanism 1000, or the shuttle mechanism 3000 transports the loading end to the target position, and the first clamping mechanism 20000 clamps the chips after testing in the test mechanism 1000 to the loading part at the target position, and then the shuttle mechanism 3000 outputs the test device. Furthermore, the shuttle mechanism 3000 and the first clamping mechanism 20000 cooperate to improve the transfer efficiency of the chips, so as to improve the production efficiency.

[0085] As Figure 3 and Figure 8 shown, on the basis of the above embodiment, the shuttle mechanism 3000 includes at least one loading member 3100 and a first driving member 3200. The loading member 3100 forms the loading part; the first driving member 3200 is connected to the loading member 3100, and the first driving member 3200 can drive the loading member 3100 to move along the first direction.

[0086] The loading member 3100 can be a tray. The tray is provided with at least one limiting groove for placing chips. If multiple chips need to be conveyed at one time, multiple limiting grooves can be adaptively arranged in the tray. Optionally, for the chips to be arranged orderly in the tray, the limiting grooves can be arranged in an array, such as a circular array or a rectangular array. Of course, such an arrangement is also beneficial to improving the clamping efficiency of the first clamping mechanism 20000.

[0087] Exemplarily, the first driving member 3200 can be a linear motion module, and the linear motion module can be a lead screw transmission mechanism, a belt transmission mechanism, a chain transmission mechanism, etc., which are not specifically limited herein. Among them, if the first driving member 3200 is a belt transmission mechanism, the tray is fixed to the belt through a belt clamp block, and a slide rail extending in the first direction is provided. The slider of the slide rail is connected to the tray, thereby ensuring the stability during the movement of the tray and effectively avoiding shaking. It should be noted that the forward rotation and reverse rotation of the belt transmission mechanism can be used to achieve the reciprocating movement of the tray in the first direction.

[0088] Exemplarily, a loading and unloading area can be set in the first direction, and the tray can be moved to the loading and unloading area for loading or unloading.

[0089] As Figure 8 shown, on the basis of the above embodiments, the number of the loading members 3100 is not less than two; wherein, the first driving member 3200 is configured to: at least be able to drive any two loading members 3100 to move in the same direction and in the reverse direction in the first direction.

[0090] Such an arrangement enables one loading member 3100 to be used for feeding while another loading member 3100 is used for loading (that is, loading the chips to be tested onto the loading member 3100), forming continuous feeding and discharging, and the production efficiency is higher. In addition, when one loading member 3100 moves near the testing mechanism 1000, the first clamping mechanism 20000 clamps for feeding, and when there is an empty limiting groove on the loading member 3100, the first clamping mechanism 20000 clamps the tested chips to the loading member 3100. After all the chips to be tested on the loading member 3100 are taken out, the loading member 3100 is used to output the tested chips thereon.

[0091] Briefly speaking, the two trays of the shuttle mechanism 3000 adopt an independent drive design. When in the testing area (the position where the testing mechanism 1000 is installed), its tray moves to the corresponding position of the nearest empty testing mechanism 1000, so that the moving distance of the first clamping mechanism 20000 between the tray and the testing mechanism 1000 in the testing area is the shortest, improving the effective operation efficiency of the equipment.

[0092] As Figure 4As shown, based on the above embodiments, the test mechanism 1000 includes a drying box, a test carrier 1100, a test indenter 1200, and a second driving member. The test carrier 1100 has a component placement groove, and a probe assembly is provided at the bottom of the component placement groove corresponding to the positions of the test contacts of the chip. The second driving member is connected to the test indenter 1200, and the second driving member can drive the test indenter 1200 to move along a set path so that the test indenter 1200 presses or disengages from the chip located in the component placement groove.

[0093] The chip test circuit and the test carrier 1100 are both installed in the drying box. The drying box has an opening for loading and unloading the chip. An automatic door panel is installed at the opening and can close the opening during non-loading or non-unloading periods. The drying box can continuously provide dry air for the chip test circuit board and the chip test carrier 1100 to prevent condensation and frosting on the chip during low-temperature or low-temperature-rise high-temperature tests, which may cause short circuits in the test circuit. Exemplarily, a dehumidifier is installed in the drying box to remove moisture and prevent condensation and frosting.

[0094] The main function of the chip test circuit is to implement various performance test functions of the chip. The main function of the test carrier 1100 is to position the chip to be tested and conduct the power supply and signal transmission between the chip to be tested and the chip test circuit. The probes of the chip test circuit are installed at the bottom of the component placement groove. When the chip is placed flat in the component placement groove with the package surface of the chip away from the bottom of the groove, the chip test circuit can be connected to the chip.

[0095] When the chip is located in the component placement groove, the second driving member drives the test indenter 1200 to move along a set path until the test indenter 1200 presses the package surface of the chip, thereby clamping the chip to keep the chip stably positioned in the component placement groove and maintaining stable contact and conduction between the chip and the probes. Additionally, the temperature of the indenter can be adjusted to lower or raise the temperature of the chip through heat exchange, thereby performing high-temperature, low-temperature, or normal-temperature tests.

[0096] As Figure 10 and Figure 11 shown, based on the above embodiments, the test indenter 1200 includes an indenter body and a temperature detection portion. The indenter body has a heat-conducting end 110 for abutting against the package surface of the chip, and the heat-conducting end 110 has a receiving cavity. The temperature detection portion is installed in the receiving cavity, and the temperature detection portion has a detection end 920 that can abut against the package surface.

[0097] To ensure that the heat-conducting end 110 can efficiently transfer heat to the chip, the heat-conducting end 110 is set as a planar structure, and the heat-conducting end 110 and the package surface of the chip can be completely attached, and the heat-conducting end 110 can cover the package surface, then it can be achieved.

[0098] Optionally, the accommodation cavity can be opened at the edge of the heat-conducting end 110 or arranged in the middle of the heat-conducting end 110, without specific limitation here, and both can improve the accuracy of detecting the chip temperature; the difference is that since the edge of the chip is in an exposed state and has a high heat exchange efficiency with the environment, the middle of the chip can be completely covered and blocked by the heat-conducting end 110 and has a low heat exchange efficiency with the environment. Obviously, relatively speaking, by installing the temperature detection part in the middle of the heat-conducting end 110, the temperature of the middle of the chip can be measured more accurately.

[0099] Of course, setting the heat-conducting end 110 to be able to cover the encapsulation surface of the chip can make the chip be evenly heated everywhere, which is beneficial to improving the accuracy of the detection result. For example, the heat-conducting end 110 can be set in a square, circular, or polygonal shape, etc., without specific limitation here.

[0100] Among them, the detection end 920 of the temperature detection part is kept in contact with the encapsulation surface of the chip, so as to ensure directly obtaining the temperature of the chip. Exemplarily, the detection end 920 can be set to be flush with the heat-conducting end 110, so that the detection end 920 and the heat-conducting end 110 can contact the chip synchronously.

[0101] It should be noted that the temperature detection part is required to have high-temperature and low-temperature resistance characteristics to adapt to the high-temperature and low-temperature tests of the chip. Or, only the detection end 920 can be arranged in the accommodation groove, so as to avoid the influence of high temperature or low temperature on the body of the temperature detection part.

[0102] It is easy to understand that the indenter body exchanges heat with the chip through the heat-conducting end 110, so as to achieve the purpose of reducing or increasing the chip temperature. For example, during high-temperature tests, the temperature of the heat-conducting end 110 can be increased to heat the chip; during low-temperature tests, the temperature of the heat-conducting end 110 can be reduced to absorb the temperature of the chip and synchronously reduce the chip temperature. Generally, the temperature range of the chip is regulated to be in the interval of -55°C to 125°C.

[0103] That is to say, by arranging an accommodation cavity for installing the temperature detection part on the heat-conducting end 110 of the indenter body, the temperature detection part can be separated from the external environment when the heat-conducting end 110 fits and abuts against the encapsulation surface of the chip, so as to reduce the influence of the external environment on the temperature detection part; in addition, since the detection end 920 of the temperature detection part can keep in contact with the encapsulation surface, the accurate temperature of the chip can be obtained in time, and the temperature value deviation range of the chip is within ±1°C; of course, since the detection end 920 can detect the position in the middle of the chip, the situation of inaccurate temperature measurement at the edge of the chip can be avoided, which is caused by the heat exchange between the edge of the chip and the external environment; obviously, due to the temperature difference between the middle and the edge of the chip, the temperature in the middle of the chip is relatively higher than the temperature at the edge of the chip, so by detecting the temperature in the middle of the chip, the maximum temperature of the chip can be limited to avoid burning out the chip due to exceeding the temperature limit.

[0104] As Figure 12 shown, on the basis of the above embodiments, the indenter body further has a wire threading hole communicating with the accommodation cavity, and the cable 910 of the temperature detection part is threaded through the wire threading hole; wherein, the wire threading hole communicates with the outside of the indenter body.

[0105] That is to say, by setting the wire threading hole, the cable 910 connecting the temperature detection part and the external device can be installed, and the external device can be a control terminal, such as a controller, a computer, etc. In addition, since the wire threading hole communicates with the accommodation groove, the accommodation groove and the wire threading hole form an air channel, so that the accommodation groove can be connected to the external environment to realize gas circulation, and further the influence of the high-temperature environment formed by the gas in the accommodation groove on the detection end 920 can be reduced.

[0106] Obviously, since the accommodation groove can communicate with the outside, it can avoid the formation of a vacuum environment between the heat conduction end 110 and the chip packaging surface after the heat conduction end 110 contacts the chip packaging surface, which is similar to an adhesion effect and is not conducive to the separation between the heat conduction end 110 and the chip at the end of the detection.

[0107] It should be noted that when the temperature detection part is installed in the accommodation groove, an air channel is formed between the gap between the temperature detection part and the accommodation groove and the wire threading hole.

[0108] Of course, in other embodiments, a hole channel can be provided to communicate the outside with the middle part of the heat conduction end 110.

[0109] On the basis of the above embodiments, a hole groove structure 111 is provided at the end of the heat conduction end 110 for abutting against the packaging surface, and the hole groove structure 111 communicates with the outside of the indenter body.

[0110] Exemplarily, the hole groove structure 111 provided at the end of the heat conduction end 110 can be in the shape of a straight line, a T shape or a cross shape, etc., without specific limitation, as long as the middle part of the heat conduction end 110 can be communicated with the outside, so as to avoid the formation of a vacuum between the heat conduction end 110 and the chip.

[0111] On the basis of the above embodiments, the temperature detection part includes a temperature sensor 900, and the temperature sensor 900 is installed in the accommodation cavity. However, it is not limited to the temperature sensor 900, and other devices capable of realizing temperature detection can also be used, such as a contact thermometer, etc. Among them, the installation and principle of the temperature sensor 900 are common knowledge in the art and will not be elaborated here.

[0112] As Figure 13 shown, on the basis of the above embodiments, the test indenter 1200 further includes an elastic part, and the temperature detection part is connected to the inner wall of the accommodation cavity through the elastic part; wherein, the elastic part is configured to be elastically deformed so that the detection end 920 keeps abutting against the packaging surface.

[0113] That is to say, the elastic part can keep the detection end 920 in close contact with the packaging surface of the chip, thus ensuring the detection accuracy. Generally, due to installation errors, it is easy to cause that the detection end 920 cannot be accurately kept flush with the end of the heat conduction end 110, and a great deal of workload and time are required to adjust the position of the detection part. However, after long-term use, there are still use errors, resulting in the detection end 920 being unable to keep in close contact with the chip.

[0114] Furthermore, this problem can be eliminated through the elastic part. By utilizing the elastic deformation characteristic of the elastic part, the installation position of the temperature sensor 900 can be adjusted. In the initial state, the detection end 920 (i.e., the probe of the temperature sensor 900) slightly protrudes from the end face of the heat conduction end 110. Then, when the heat conduction end 110 contacts the packaging surface of the chip, the detection end 920 will be squeezed, and then the squeezing force will be transmitted to the elastic part, causing the elastic part to undergo elastic deformation, so that the detection end 920 and the heat conduction end 110 are flush and keep in close contact with the packaging surface of the chip. Thus, problems such as installation errors do not need to be considered, and the situation where the detection end 920 is damaged due to extrusion can be effectively avoided. In addition, the difficulty of later assembling the temperature sensor 900 can be reduced.

[0115] As Figure 13 shown, on the basis of the above embodiments, the elastic part includes an elastic glue layer, and the temperature detection part is bonded to the inner wall of the accommodation cavity through the elastic glue layer.

[0116] That is to say, the temperature detection part is fixed in the accommodation cavity by gluing. Among them, the applied glue forms an elastic glue layer after drying. The advantage of this method is that it can not only facilitate the quick installation and fixation of the temperature detection part, but also form an elastic part, reducing the space occupied by installing the elastic part. In other embodiments, the elastic part can also be formed by setting an elastic pad to enable the temperature detection part to move in the depth direction of the accommodation groove, such as a rubber elastic pad or a silica gel pad, etc.; of course, the elastic part can also be set as a spring, etc.

[0117] Exemplarily, the temperature sensor 900 is cured in the accommodation groove through heat-conducting silica gel, and the detection end 920 of the temperature sensor 900 protrudes 0.05 mm from the end face of the heat conduction end 110. Of course, it can also be set to protrude 0.04 mm, 0.06 mm, 0.07 mm, 0.08 mm, etc. from the end face of the heat conduction end 110.

[0118] As Figure 12As shown, based on the above embodiments, the indenter body includes a housing 200, a heat conduction part 100, and a temperature adjustment part 700. The housing 200 is formed with a heat insulation layer; the heat conduction part 100 is installed in the housing 200, and the heat conduction part 100 has an extending end extending out of the housing 200, and the extending end forms the heat conduction end 110; the temperature adjustment part 700 is installed in the housing 200, and the temperature adjustment part 700 can adjust the temperature of the heat conduction end 110.

[0119] Among them, the housing 200 has an inner cavity, and both the heat conduction part 100 and the temperature adjustment part 700 are installed in the inner cavity; by contacting the heat conduction part 100 and the temperature adjustment part 700, the temperature of the heat conduction part 100 can be adjusted through the temperature adjustment part 700. Obviously, to ensure that the heat conduction part 100 has excellent heat conduction performance, the heat conduction part 100 can be set to be made of heat-conducting metal, that is, a low thermal resistance medium material, such as iron, aluminum, copper, etc. Optionally, a coating layer, such as a nickel plating layer, is provided on the surface of the heat conduction part 100 to avoid oxidation. Exemplarily, the heat conduction part 100 can be made of nickel-plated red copper material.

[0120] Exemplarily, the heat conduction part 100 can be provided with a protruding end to form the heat conduction end 110, and the heat conduction end 110 is used to contact the chip so as to be able to form heat exchange with the chip. It should be noted that for those skilled in the art, a hole can be opened in the housing 200 so that the heat conduction end 110 can extend out of the housing 200 through the hole. The hole can be set to be circular, square, diamond-shaped or polygonal, etc. Obviously, setting the shape of the hole to be adapted to the shape of the heat conduction end 110 can reduce the gap between the heat conduction end 110 and the hole, so as to reduce the heat dissipation from the housing 200 to the air and cause heat loss.

[0121] Of course, through the heat insulation layer formed by the housing 200, the heat exchange efficiency between the housing 200 and the outside can be further blocked, heat loss can be reduced, and the temperature can be accurately controlled. Exemplarily, the housing 200 is set to be made of a low thermal resistance material; or, a heat insulation layer is provided in the housing 200, and the heat insulation layer has high temperature resistance and flame retardant properties to be able to adapt to high temperature environments.

[0122] It should be noted that the temperature adjustment part 700 can be a heat exchanger, such as a small plate heat exchanger, etc., and heat exchange is carried out using a gas medium or a liquid medium. But it is not limited to this one.

[0123] As Figure 12 shown, based on the above embodiments, the temperature adjustment part 700 includes a semiconductor refrigerator and a radiator 300. The semiconductor refrigerator has two working ends. Among them, one working end is in contact with the heat conduction part 100, and the other working end is connected to the radiator 300.

[0124] That is, by energizing the semiconductor refrigerator, the electric energy is used for cooling or heating, thereby adjusting the temperature of the heat-conducting part 100 in contact with the semiconductor refrigerator for heat conduction. Among them, in order to ensure the heat conduction efficiency between the heat-conducting part 100 and the semiconductor refrigerator, the heat-conducting part 100 and the semiconductor refrigerator can be set to be in surface contact, and the area size of one end of the heat-conducting part 100 contacting the semiconductor refrigerator is set to be not less than the area size of one end of the semiconductor refrigerator contacting the heat-conducting part 100, so as to ensure that the heat-conducting part 100 can cover the semiconductor refrigerator and improve the heat conduction efficiency. In addition, in order to ensure the fit between the semiconductor refrigerator and the heat-conducting part 100, a second thermally conductive silicone grease layer 800 can be set between the two to increase the contact area and further improve the thermal conductivity. The second thermally conductive silicone grease can avoid hard contact between the semiconductor refrigerator and the heat-conducting part 100, so as to protect the semiconductor refrigerator.

[0125] Of course, a first thermal grease layer 600 may also be provided between the heat sink 300 and the semiconductor refrigerator. The specific reasons are the same as above and will not be repeated here.

[0126] On the basis of the above embodiment, the pressure head body also includes a power commutator, which is electrically connected to the semiconductor cooler, and the power commutator is configured to at least provide a first current flowing in a forward direction and a second current flowing in a reverse direction to the semiconductor cooler.

[0127] It is easy to understand that a semiconductor cooler (Thermoelectric cooler) is a device that uses the thermal-electric effect of semiconductors to produce cooling, also known as a thermoelectric cooler. When two different metals are connected with a conductor and a direct current is connected, the temperature at one end decreases and the temperature at the other end increases.

[0128] That is to say, by changing the direction of the direct current of the semiconductor cooler, the end of the semiconductor cooler contacting the heat conducting part 100 can be selected to cool or heat, so as to adapt to the low temperature, normal temperature or high temperature test of the chip. It can be understood that if the power supply is reversed, the temperature of the end of the semiconductor cooler contacting the heat conducting part 100 changes in the opposite direction. This phenomenon is called the Peltier effect, also known as the thermo-electric effect.

[0129] Different from the traditional low-temperature refrigeration technology, when the pressure head is set at a temperature below zero, there is no need to circulate any low-temperature refrigerant or compressor inside it. It only needs to provide room temperature liquid water to supply the heat sink 300 built into the pressure head for heat exchange. By exchanging heat and cold with the working state TEC, the pressure head can reach any temperature value in the range of -℃. In other words, when cooling, the end of the semiconductor refrigerator in contact with the heat conducting part 100 cools, and the other end of the semiconductor refrigerator away from the heat conducting part 100 heats, and then the heat sink 300 cools the heating end of the semiconductor refrigerator.

[0130] Based on the above embodiments, the power commutator includes a DC power supply and a commutator. The DC power supply is used to provide a direct current; the DC power supply is electrically connected to the semiconductor cooler through the commutator.

[0131] That is to say, the commutator is used to change the DC transmission direction of the DC power supply flowing into the semiconductor cooler. For example, when the direct current flows forward, one end of the semiconductor cooler in contact with the heat conduction part 100 cools; when the direct current flows reversely, one end of the semiconductor cooler in contact with the heat conduction part 100 heats. Among them, the DC power supply can be set to be formed by converting alternating current into direct current, and the details are not described herein.

[0132] Based on the above embodiments, one end of the heat conduction part 100 opposite to the heat conduction end 110 abuts against the temperature adjustment part 700; wherein, a limiting part is arranged in the housing 200, and the limiting part can at least limit the movement of the heat conduction part 100 in the direction close to the temperature adjustment part 700, so that the limiting part can bear the extrusion force transmitted from the heat conduction part 100.

[0133] That is to say, by arranging a limiting part in the inner cavity of the housing 200 to limit the heat conduction part 100, a rigid contact is formed among the heat conduction part 100, the housing 200 and the limiting part, so that the limiting part can bear the reverse force generated by the chip on the heat conduction end 110 during the process of the heat conduction end 110 being pressed and contacted with the chip. Most of this reverse force is transmitted to the housing 200, avoiding the concentration of the reverse force on the TEC and causing damage to the TEC.

[0134] As Figure 12 shown, based on the above embodiments, the limiting part includes a limiting protrusion 250. The limiting protrusion 250 is connected to the heat conduction part 100, and the housing 200 has a limiting groove. The limiting protrusion 250 is inserted into the limiting groove; wherein, the limiting protrusion 250 can at least abut against the side wall of the limiting groove far from the heat conduction end 110.

[0135] Optionally, the limiting groove is arranged on the side wall of the housing 200, and the limiting protrusion 250 fixed to the heat conduction part 100 is inserted into the limiting groove to limit the heat conduction part 100 in the approaching or separating direction. Among them, the limiting groove can be set as a blind hole to reduce the heat loss in the housing 200.

[0136] Exemplarily, the limiting groove is set as a conical blind hole. Correspondingly, the limiting protrusion 250 is set as a cone, and the two are matched through a conical surface to enable precise limiting.

[0137] Of course, the limiting groove can also be formed by arranging an annular groove in the housing 200; the heat conduction part 100 is provided with an annular skirt to form the limiting protrusion 250, thereby increasing the contact area between the heat conduction part 100 and the limiting part and being able to withstand a greater reverse force.

[0138] As Figure 12 shown, on the basis of the above embodiments, a heat-conducting partition is provided inside the housing 200. The heat-conducting partition is used to divide the inner cavity of the housing 200 into two chambers, and the radiator 300 and the semiconductor refrigerator are respectively located in different chambers.

[0139] It is easy to understand that if the cooling medium of the radiator 300 is liquid, then the housing 200 is separated by the heat-conducting partition to respectively install the radiator 300 and the semiconductor refrigerator, so as to isolate the two and avoid short-circuit damage of the semiconductor refrigerator caused by water leakage of the radiator 300.

[0140] As Figure 12 shown, on the basis of the above embodiments, an annular card slot 240 is provided inside the housing 200. The base of the heat exchanger has an annular flange 330, and the annular flange 330 is inserted into the annular card slot 240; wherein, at least one side of the opposite sides of the annular flange 330 and the corresponding side wall on the annular card slot 240 are provided with an elastic sealing ring 400.

[0141] The annular flange 330 can increase the contact area between the radiator 300 and the heat-conducting part 100, improve the heat dissipation efficiency, and the annular flange 330 can be integrally arranged with the radiator 300.

[0142] Exemplarily, a groove for installing the elastic sealing ring 400 is opened on the upper side wall of the annular card slot 240. The elastic sealing ring 400 is pre-installed in the groove, and then the annular flange 330 is inserted into the annular card slot 240, and the elastic sealing ring 400 is kept in contact with the annular flange 330, thereby realizing sealing.

[0143] Of course, it is not limited to this sealing method only, and sealant can also be used for sealing. The difference is that the method of using the elastic sealing ring 400 for sealing is convenient for disassembly and assembly.

[0144] As Figure 11 and Figure 12 shown, on the basis of the above embodiments, the housing 200 is at least formed by enclosing an outer shell 210, a positioning frame 220 and an end cover 230; wherein, the end cover 230 is provided with a process hole, the heat-conducting end 110 passes through the process hole, and a concave area 231 is provided at one end of the end cover 230 in contact with the heat-conducting part 100.

[0145] It can be understood that by setting the concave area 231, the contact area between the heat-conducting part 100 and the end cover 230 can be reduced to reduce the heat transferred from the heat-conducting part 100 to the end cover 230. Of course, a number of protrusions can also be provided at one end of the heat-conducting part 100 in contact with the end cover 230, which can also reduce the contact area between the two.

[0146] On the basis of the above embodiments, an annular clamping groove 240 is formed between the outer shell 210 and the positioning frame 220; and / or, a limiting groove is formed between the positioning frame 220 and the cover plate.

[0147] By setting the housing 200 to be split-type, it is convenient to install internal components; in addition, by providing an annular clamping groove 240 between the outer shell 210 and the positioning frame 220, the heat exchanger can be pre-placed on the first annular sunk platform at the upper end of the positioning frame 220, and then the elastic sealing ring 400 can be installed in the groove on the second annular sunk platform at the lower end of the outer shell 210. Then, by installing the outer shell 210 on the upper end of the positioning frame 220, an annular clamping groove 240 is formed between the first annular sunk platform and the second annular sunk platform, which is convenient for assembly.

[0148] In addition, the same principle as that of the annular clamping groove 240 can also be adopted to form a limiting groove between the lower end of the positioning frame 220 and the upper end of the cover plate, which is also beneficial to pre-processing and post-assembly. Of course, the annular clamping groove 240 and the limiting groove can also be formed in other ways, which are not specifically limited herein.

[0149] On the basis of the above embodiments, the temperature adjustment unit 700 further includes a thermostat, which is electrically connected to the temperature detection unit and the commutator respectively. The thermostat can send an instruction to the commutator according to the temperature signal sent by the temperature detection unit to switch the transmission direction of the semiconductor refrigerator.

[0150] This thermostat is electrically connected to the temperature detection unit, and it is different from the traditional temperature controller. This thermostat is connected to the commutator using the PID algorithm to achieve high and low temperature control of one end of the TEC contact heat conduction part 100 by changing the transmission direction. That is to say, if the temperature of one end of the TEC contact heat conduction part 100 is too high, the current transmission direction is changed to make one end of the TEC contact heat conduction part 100 refrigerate, thereby reducing the temperature; if the temperature of one end of the TEC contact heat conduction part 100 is too low, the current transmission direction is changed to make one end of the TEC contact heat conduction part 100 heat, thereby increasing the temperature. The temperature control accuracy of the test head 1200 is achieved within ±0.1°C through the detection and control of the cooperation between the thermostat and the radiator 300.

[0151] As Figure 14 shown, on the basis of the above embodiments, the radiator 300 has a cooling channel for the cooling medium to flow through. The water inlet end 310 and the water outlet end 320 of the radiator 300 are respectively connected to the water inlet pipe and the water outlet pipe for conveying the cooling medium. The cooling medium can be a liquid, such as cooling water. A number of flow disturbing protrusions are provided in the cooling channel, and the number of flow disturbing protrusions are arranged at intervals along the extension direction of the cooling channel, so that a turbulent flow can be formed in the cooling channel, the flow rate can be reduced, and sufficient heat exchange can be carried out to avoid the formation of a boundary layer on the inner wall of the cooling channel and improve the heat dissipation efficiency.

[0152] On the basis of the above embodiment, a locking portion 500 may be provided at the upper end of the housing 210 to facilitate connection with the second driving member, and the second driving member drives the test pressure head 1200 to move to perform the pressing and releasing actions. The locking portion 500 is provided to facilitate later disassembly and maintenance. For example, the locking portion 500 may be a locking bolt or the like.

[0153] Based on the above embodiment, the first clamping mechanism 20000 includes a picking member 8100 and a third driving member 8200. The picking member 8100 can negatively adsorb the chip; the third driving member 8200 is connected to the picking member 8100, and the third driving member 8200 can drive the picking member 8100 to move in three-dimensional space.

[0154] That is, the chip is sucked by the pick-up member 8100 and driven to move in three-dimensional space by the third driving member 8200, so that the chip can be clamped to the target position, which can be the testing mechanism 1000 and the loading part.

[0155] For example, the pick-up member 8100 includes at least one negative pressure suction nozzle, which is connected to the third driving member 8200; that is, the vacuum environment can be formed by pumping negative pressure on the negative pressure suction nozzle, and then the chip can be sucked; for example, the negative pressure suction nozzle can be connected through a negative pressure system, or the negative pressure suction nozzle can be directly connected to a vacuum pump to perform vacuuming. When the chip needs to be placed, the vacuuming of the negative pressure suction nozzle can be stopped, and the inside of the negative pressure suction nozzle can be connected to the external environment, and then the chip will automatically detach from the negative pressure suction nozzle under the action of gravity.

[0156] Optionally, air may be blown in the reverse direction toward the negative pressure nozzle to form a positive pressure at the negative pressure nozzle, so as to ensure that the chip can be separated from the negative pressure nozzle and fall faster.

[0157] On the basis of the above embodiment, the third driving member 8200 includes a robotic arm, which is connected to the picking member 8100 .

[0158] For example, the robotic arm may be a six-axis robotic arm, a seven-axis robotic arm, etc., which is not specifically limited here.

[0159] On the basis of the above-mentioned embodiment, the number of negative pressure nozzles is set to be multiple, so that multiple chips can be taken and placed in batches to improve production efficiency.

[0160] For example, a plurality of negative pressure nozzles may be arranged in a straight line, and the limiting grooves on the tray may be arranged in a matrix, and the spacing between adjacent negative pressure nozzles may be kept equal to the spacing between the limiting grooves in the same row, so that a plurality of chips can be sucked at one time.

[0161] For example, if the number of a row of limiting grooves is the same as the number of negative pressure suction nozzles, then a row of chips can be picked up at one time. For example, if the number of a row of limiting grooves is set to 8, the number of negative pressure suction nozzles is also set to 8.

[0162] According to a second aspect disclosed by the present utility model, there is provided a testing machine, which includes a testing device.

[0163] Since the above-mentioned testing device has the above-mentioned technical effects, the testing machine including this testing device should have the same technical effects, which will not be elaborated here.

[0164] On the basis of the above embodiments, the testing machine further includes a sorting device, which includes a plurality of storage areas and a second clamping mechanism 8000. The plurality of storage areas are used to store chips of different quality grades; the second clamping mechanism 8000 can clamp the chips conveyed by the loading part and tested into the corresponding storage areas according to the quality grades.

[0165] It is easy to understand that by testing the chips through the testing mechanism 1000, it is correspondingly necessary to classify the chips according to the test results. For example, they can be classified into unqualified products, qualified products, defective products, etc.

[0166] That is to say, the sorting device can be used to classify the tested chips. Specifically, when the loading part conveys the tested chips to the loading and unloading area 2000, these chips can be classified by the sorting device.

[0167] The specific process is as follows: The testing mechanism 1000 is connected to a control system and transmits each test information to the control system. The control system controls the movement of the second clamping mechanism 8000 to clamp the chips into the corresponding categories. It should be noted that by memorizing the placement positions of each chip, the subsequent control of the second clamping mechanism 8000 can place the chips at the corresponding positions into the corresponding categories. Of course, since each chip has a label or code, it can be classified by identifying the code.

[0168] Exemplarily, the second clamping mechanism 8000 can be set to have the same structure as the first clamping mechanism 20000. That is to say, the second clamping mechanism 8000 includes a picking member 8100 and a third driving member 8200. The picking member 8100 can suck and hold the chips under negative pressure; the third driving member 8200 is connected to the picking member 8100, and the third driving member 8200 can drive the picking member 8100 to move in three-dimensional space.

[0169] Such as Figure 5As shown in the figure, on the basis of the above embodiments, the sorting device further includes a plurality of empty material bins 6000, a plurality of blanking bins 7000, and a third clamping mechanism 4000. The empty material bins 6000 can store a number of trays 10000; the blanking bins 7000 form a storage area, and the blanking bins 7000 can store a number of trays 10000. The second clamping mechanism 8000 can clamp the chips conveyed by the material loading part and detected to the trays 10000 in the corresponding quality grade blanking bins 7000; the third clamping mechanism 4000 can at least clamp the trays 10000 in the empty material bins 6000 one by one to the blanking bins 7000.

[0170] That is to say, the inner cavity of the blanking bin 7000 forms a storage area, and each blanking bin 7000 corresponds to a different type. At the same time, to protect and transport the chips, trays 10000 can be placed in the blanking bin 7000 to receive the chips clamped by the second clamping mechanism 8000, and the chips can be transported in batches by transporting the trays 10000 subsequently.

[0171] As Figure 7 shown, to protect the chips, positioning grooves can be provided in the trays 10000. The positioning grooves are used to accommodate the chips, and by setting the inner contour of the positioning grooves to be adapted to the outer shape of the chips, the chips can be prevented from shaking and falling.

[0172] And the third clamping mechanism 4000 replenishes the empty trays 10000 into the blanking bin 7000 to supplement the trays 10000, without manual handling.

[0173] As Figure 5 and Figure 7 shown, on the basis of the above embodiments, the testing machine further includes a loading device. The loading device includes a loading bin 5000. The loading bin 5000 can store a number of trays 10000 with chips placed therein. The fourth clamping mechanism 9000 can clamp the chips in the trays 10000 to the material loading part; wherein, the third clamping mechanism 4000 can clamp the trays 10000 in the loading bin 5000 to the empty material bin 6000.

[0174] That is to say, the chips are respectively placed in the trays 10000 in advance, the trays 10000 loaded with chips are placed in the loading bin 5000, and the fourth clamping mechanism 9000 clamps the chips on the trays 10000 in the loading bin 5000 to the material loading part.

[0175] As Figure 6As shown, exemplarily, the structure of the fourth clamping mechanism 9000 is the same as that of the second clamping mechanism 8000, or the fourth clamping mechanism 9000 is replaced by the second clamping mechanism 8000, so that the second clamping mechanism 8000 can both unload and load materials.

[0176] Among them, the empty tray 10000 can be clamped by the third clamping mechanism 4000 and placed into the empty tray bin 6000 for subsequent transfer to the unloading tray bin 7000.

[0177] Exemplarily, as Figure 9 shown, the third clamping mechanism 4000 includes a fourth driving member 4200 and a clamping member 4100. The clamping member 4100 can clamp the tray 10000 and keep the tray 10000 horizontal to prevent the chips in the tray 10000 from falling. In addition, since the clamping member 4100 is connected to the fourth driving member 4200, the fourth driving member 4200 can be used to drive the clamping member 4100 to move, so as to drive the tray 10000 to move, realizing the movement of the tray 10000 among the unloading tray bin 7000, the loading tray bin 5000 and the empty tray bin 6000. Exemplarily, the fourth driving member 4200 can be a six-axis robotic arm.

[0178] Based on the above embodiments, the trays 10000 in the loading tray bin 5000, the unloading tray bin 7000 and the empty tray bin 6000 are all placed in a stacked manner, which can reduce the occupied area.

[0179] During specific operation, after the chips on the uppermost tray 10000 in the loading tray bin 5000 are taken out, the uppermost empty tray 10000 in the loading tray bin 5000 can be clamped by the third clamping mechanism and placed into the empty tray bin 6000, and then the second clamping mechanism 8000 or the fourth clamping mechanism 9000 continues to clamp the chips on the lower-layer tray 10000.

[0180] When the uppermost tray 10000 in the unloading tray bin 7000 is filled with chips, the tray 10000 in the empty tray bin 6000 is clamped by the third clamping mechanism 4000 and placed on top of the uppermost tray 10000 in the unloading tray bin 7000 to form a stacked manner, and then the tested chips can be continuously placed.

[0181] Based on the above embodiments, a lifting mechanism is provided in each of the unloading tray bin 7000, the empty tray bin 6000 and the loading tray bin 5000. The lifting mechanism is used to lift the stacked trays 10000 so that the uppermost tray 10000 moves outside the tray bin, facilitating the clamping by the third clamping mechanism 4000. Exemplarily, the lifting mechanism includes a support plate and a fifth driving member. The fifth driving member can drive the support plate to lift and lower. The support plate is located at the bottom of the inner cavity of the tray bin, and the trays 10000 are stacked on the support plate.

[0182] In all examples shown and described herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0183] It should be noted that like reference numerals and letters refer to like items in the following figures. Thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

[0184] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model.

Claims

1. A testing device, characterized in that: The testing device comprises: A plurality of testing mechanisms, wherein the plurality of testing mechanisms are divided into a plurality of groups, the plurality of groups of testing mechanisms are respectively arranged at different heights, the testing mechanisms in the same group are arranged sequentially along a first direction, and the testing mechanisms are capable of receiving and testing chips; and A shuttle mechanism, wherein the shuttle mechanism has at least one loading portion, the loading portion is movable along the first direction, and the loading portion is capable of carrying at least one of the chips; and A first clamping mechanism, wherein the first clamping mechanism is at least capable of transferring the chip between the testing mechanism and the loading portion.

2. The testing device according to claim 1, characterized in that: The shuttle mechanism comprises: at least one material carrier, the material carrier forming the material carrier portion; A first driving member is connected to the material carrier, and the first driving member can drive the material carrier to move along the first direction.

3. The testing device according to claim 2, characterized in that: The number of the material carriers is not less than two; wherein the first driving member is configured to at least drive any two of the material carriers to move in the same direction or in opposite directions in the first direction.

4. The testing device according to claim 1, characterized in that: The testing organization includes: A test carrier, the test carrier having a component placement slot, a probe assembly being arranged at a position at the bottom of the component placement slot corresponding to a test contact of the chip; The test press head and the second driving member are connected to the test press head, and the second driving member can drive the test press head to move along a set path so that the test press head can press or disengage the chip located in the chip placement slot.

5. The testing device according to claim 4, characterized in that: The test pressure head comprises: A pressure head body, the pressure head body having a heat-conducting end, the heat-conducting end is used to abut against the packaging surface of the chip, and the heat-conducting end has a receiving cavity; and A temperature detection part is installed in the accommodating cavity, and the temperature detection part has a detection end, and the detection end can abut against the packaging surface.

6. The testing device according to claim 5, characterized in that: The pressure head body also has a threading hole connected to the accommodating cavity; the temperature detection part includes a temperature sensor, and the cable of the temperature sensor is passed through the threading hole; wherein the threading hole is connected to the outside of the pressure head body; And / or, a hole structure is provided at an end of one end of the heat-conducting end for abutting against the packaging surface, and the hole structure is communicated with the outside of the pressure head body.

7. The testing device according to claim 5, characterized in that: The test pressure head further includes an elastic portion, and the temperature detection portion is connected to the inner wall of the accommodating cavity through the elastic portion; wherein the elastic portion is configured to be elastically deformable so that the detection end remains in contact with the packaging surface.

8. The testing device according to claim 5, characterized in that: The pressure head body comprises: a housing formed with a heat-insulating layer; and a heat conducting portion, the heat conducting portion being installed in the housing and having an extended end extending out of the housing, the extended end forming the heat conducting end; and A temperature regulating part is installed in the shell and can regulate the temperature of the heat conducting end.

9. The testing device according to claim 8, characterized in that: The temperature regulating unit comprises: A semiconductor refrigerator and a heat sink, wherein the semiconductor refrigerator has two working ends, wherein one of the working ends abuts against the heat conducting portion, and the other working end is connected to the heat sink; A power commutator is electrically connected to the semiconductor refrigerator, and the power commutator is configured to at least adjust the transmission direction of the current connected to the semiconductor refrigerator.

10. The testing device according to claim 9, characterized in that: The power commutator comprises: a DC power supply for providing a DC current; and A commutator, wherein the DC power supply is electrically connected to the semiconductor refrigerator via the commutator; and A thermostat is electrically connected to the temperature detection unit and the commutator respectively, and the thermostat can send instructions to the commutator according to the temperature signal sent by the temperature detection unit to switch the transmission direction of the semiconductor refrigerator.

11. The testing device according to claim 1, characterized in that: The first clamping mechanism comprises: A pick-up piece, which can absorb the chip under negative pressure; A third driving member is connected to the picking member, and the third driving member can drive the picking member to move along a second set path.

12. The testing device according to claim 11, characterized in that: The picking member comprises at least one negative pressure suction nozzle, and the negative pressure suction nozzle is connected to the third driving member; And / or, the third driving member includes a mechanical arm, and the mechanical arm is connected to the picking member.

13. A testing machine, characterized in that: The testing machine comprises the testing device according to any one of claims 1 to 12.

14. The testing machine according to claim 13, characterized in that: The testing machine further comprises a sorting device, wherein the sorting device comprises: A plurality of storage areas, wherein the plurality of storage areas are used to store the chips of different quality levels; The second clamping mechanism can clamp the chips conveyed by the loading part and tested into the storage area of ​​the corresponding quality grade.

15. The testing machine according to claim 14, characterized in that: The sorting device also includes: A plurality of empty material bins, each of which can store a plurality of material trays; A plurality of unloading bins, the unloading bins forming the storage area, the unloading bins being capable of storing a plurality of the material trays, the second clamping mechanism being capable of clamping the chips conveyed by the loading part and tested to the material trays in the unloading bins of corresponding quality grades; The third clamping mechanism is capable of at least clamping the material trays in the empty material bin one by one to the unloading material bin.

16. The testing machine according to claim 15, characterized in that: The testing machine also includes a feeding device, and the feeding device includes: A loading bin and a fourth clamping mechanism, wherein the loading bin can store a plurality of trays on which the chips are placed, and the fourth clamping mechanism can clamp the chips in the trays to the loading part; Wherein, the third clamping mechanism can clamp the material tray in the loading silo to the empty material silo.

Images