Liquid cooling heat dissipation device
By designing a compact liquid-cooled heat dissipation device, the combined structure of the coolant circulating flow and the liquid-cooled plate is solved, and the problem that traditional air-cooled radiators are difficult to dissipate heat at high power equipment is achieved, achieving more efficient heat dissipation effects and more stable equipment operation.
Patent Information
- Application Number
- CN202421767400.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-25
AI Technical Summary
Traditional air-cooled radiators are difficult to effectively dissipate high-power devices, especially in terms of heat dissipation of server memory sticks, which leads to excessive temperature of the equipment, affecting stability and security.
A liquid-cooled heat dissipation device is designed, through the inlet pipe and the return pipe, the coolant circulates and flows between the first liquid-cooled plate assembly and the second liquid-cooled plate assembly. Using the combined structure of the liquid-cooled plate and the shunt pipe, a compact cooling circuit design and brazed connection ensures efficient circulation and sealing of the coolant.
It achieves better heat dissipation effect, significantly reduces the memory stick temperature, enhances the stability and security of the equipment, and saves space, which is suitable for the heat dissipation needs of high-performance computer equipment.
Smart Images
Figure CN222927018U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat dissipation, and particularly relates to a liquid cooling heat dissipation device. Background Art
[0002] With the rapid development of information and communication, in order to meet the storage requirements of servers, the power consumption of memory modules has increased rapidly. During operation, a large amount of heat is generated, which affects the stability and security of server operation.
[0003] Traditional air cooling dissipates heat by the airflow generated by the rotation of a fan, accelerating air flow and increasing the air convection speed, thereby enhancing the heat dissipation effect of the radiator. However, the memory module has a small volume and a limited surface area. It is difficult for traditional air-cooled radiators to effectively take away the heat, resulting in a relatively high temperature of the memory module. When facing high-power devices, traditional air-cooled radiators may have insufficient heat dissipation capacity and cannot meet their heat dissipation requirements.
[0004] With the continuous increase in the power of computer devices, the limitations of traditional air cooling have become increasingly obvious, and it is difficult to meet the heat dissipation requirements of high-performance computer devices. Summary of the Utility Model
[0005] Aiming at the deficiencies of the existing technology, the utility model provides a liquid cooling heat dissipation device, aiming to provide a liquid cooling heat dissipation device suitable for the heat dissipation of server memory modules. Compared with traditional air-cooled heat dissipation devices, this liquid cooling heat dissipation device should be able to provide better heat dissipation effects.
[0006] The liquid cooling heat dissipation device provided by the utility model includes a liquid inlet pipe and a liquid return pipe, and a pair of relatively arranged first liquid cooling plate assemblies are connected in series between the liquid inlet pipe and the liquid return pipe. Each first liquid cooling plate assembly includes a pair of first shunt pipes arranged in parallel and a plurality of liquid cooling plates connected between the first shunt pipes. Each first shunt pipe is in a hollow columnar shape. In the same first liquid cooling plate assembly, one end of each first shunt pipe close to the other first liquid cooling plate assembly is provided with a confluence port for the circulation of the coolant, and the end far from the other first liquid cooling plate assembly is closed. A set of shunt ports arranged along the axial length direction of the first shunt pipe are opened on the side wall of each first shunt pipe for the circulation of the coolant. Both ends of each liquid cooling plate have flow ports, and a flow channel connecting the flow ports at both ends is provided inside. In each first liquid cooling plate assembly, a plurality of liquid cooling plates are arranged between the first shunt pipes on both sides along the axial direction of the first shunt pipe. The flow ports at both ends of each liquid cooling plate are respectively connected to the shunt ports of the first shunt pipes on both sides of the first liquid cooling plate assembly where it is located. In the same first liquid cooling plate assembly, a cooling gap is provided between two adjacent liquid cooling plates for accommodating heat-generating devices.
[0007] The liquid cooling heat dissipation device provided by the present utility model is applicable to the scenario where the memory module needs to be cooled during high-performance computing. Through the way of circulating liquid cooling heat dissipation, heat can be quickly removed, the temperature of the device can be effectively controlled, and the stability of the device can be enhanced.
[0008] Coolant enters the first first liquid cooling plate assembly from the liquid inlet pipe and the liquid return pipe, flows into the liquid cooling plate through the first shunt pipe on one side of the first liquid cooling plate assembly where it is located, and then flows out from the first shunt pipe on the other side of the first liquid cooling plate assembly where it is located. The coolant flows through the second first liquid cooling plate assembly in the same way and finally enters the liquid return pipe. The placement position of the memory module is limited between adjacent liquid cooling plates, so that the liquid cooling plates can quickly transfer the heat generated by the memory module to the coolant from the side, and through the circulating flow of the coolant, the heat is taken away, effectively reducing the temperature of the memory module and avoiding performance degradation or damage caused by excessive temperature.
[0009] A pair of relatively arranged first liquid cooling plate assemblies both use first shunt pipes with a confluence port opened at one end and closed at the other end, making the cooling circuit design of the coolant compact. The compact circuit design can reduce the length and bending degree of the coolant flow path, thereby reducing the coolant flow resistance, improving the coolant circulation efficiency, and enhancing the heat dissipation effect. At the same time, the compact circuit design can reduce the pipeline length and quantity, saving space.
[0010] Furthermore, the liquid cooling plate is brazed to the first shunt pipe. The brazing connection can form a seamless metal connection, ensuring that the coolant will not leak and guaranteeing the sealing performance between the liquid cooling plate and the first shunt pipe.
[0011] Preferably, the confluence port of one of the first liquid cooling plate assemblies is connected to the confluence port of one of the other first liquid cooling plate assemblies through a pipeline. The other two confluence ports in a pair of first liquid cooling plate assemblies are respectively connected to the liquid inlet pipe and the liquid return pipe. Connecting the two first liquid cooling plate assemblies with pipelines can flexibly adjust the relative positions of the two first liquid cooling plate assemblies according to the layout requirements to meet the heat dissipation requirements of different scenarios.
[0012] Preferably, at least one second liquid cooling plate assembly is connected in series between a pair of first liquid cooling plate assemblies. The second liquid cooling plate assembly includes a second shunt pipe and a third shunt pipe arranged in parallel, and further includes a plurality of liquid cooling plates connected between the second shunt pipe and the third shunt pipe. The second shunt pipe is in a hollow column shape, and both ends of the second shunt pipe are provided with confluence ports. A partition node is arranged in the center of the second shunt pipe, and the partition node divides the second shunt pipe into a first flow section and a second flow section. The first flow section is close to the liquid inlet pipe, and the second flow section is close to the liquid return pipe. A group of shunt ports arranged along the axial length direction of the second shunt pipe are opened on the side walls of the first flow section and the second flow section. The third shunt pipe is in a hollow column shape, and both ends of the third shunt pipe are closed. A group of shunt ports arranged along the axial length direction of the third shunt pipe are opened on the side wall of the third shunt pipe. The plurality of liquid cooling plates are arranged between the second shunt pipe and the third shunt pipe on both sides along the axial direction of the second shunt pipe. The flow ports at both ends of each liquid cooling plate are respectively connected to the shunt ports of the second shunt pipe and the shunt ports of the third shunt pipe on both sides of the second liquid cooling plate assembly where it is located. In the same second liquid cooling plate assembly, a cooling gap is provided between two adjacent liquid cooling plates for accommodating heat generating devices.
[0013] After the coolant flows into the second shunt pipe from the confluence port of the first flow section, it flows into the third shunt pipe through the liquid cooling plates on the side of the first flow section of the second liquid cooling plate assembly where it is located, then flows into the second flow section of the second shunt pipe through the liquid cooling plates on the side of the second flow section of the second liquid cooling plate assembly where it is located, and finally flows out from the confluence port of the second flow section. The placement position of the memory module is limited between adjacent liquid cooling plates, so that the liquid cooling plates can quickly transfer the heat generated by the memory module to the coolant from the side, and through the circulating flow of the coolant, the heat is taken away, effectively reducing the temperature of the memory module and avoiding performance degradation or damage caused by excessive temperature.
[0014] The second liquid cooling plate assembly adopts a structure such as the combination of the second shunt pipe and the third shunt pipe, enabling the coolant to flow evenly through each memory module in the second liquid cooling plate assembly. At the same time, the cooling circuit design of the second liquid cooling plate assembly is compact and the layout is reasonable. It not only ensures that the cooling circuit of the coolant can cover more memory modules to achieve liquid cooling heat dissipation over a larger area, but also can effectively save space and achieve a compact space layout. When more heat dissipation areas need to be covered, the second liquid cooling plate assembly can be conveniently connected in series to expand the heat dissipation capacity.
[0015] Furthermore, the liquid cooling plates are brazed to the second shunt pipe and the third shunt pipe. Brazing connection can form a seamless metal connection, ensuring that the coolant will not leak and guaranteeing the sealing performance between the liquid cooling plates and the second shunt pipe and the third shunt pipe.
[0016] Further, the liquid cooling plate includes a diversion frame with openings at both ends. Sealing plates are provided on both sides of the diversion frame. The gap between the diversion frame and the sealing plates forms a flow channel, and the openings at both ends of the diversion frame are overlapped by the sealing plates to form a flow port.
[0017] The flow port formed by the diversion frame and the sealing plates connects the liquid cooling plate to the first shunt pipe, the second shunt pipe, and the third shunt pipe. The flow channel formed by the diversion frame and the sealing plates guides the coolant to flow along a specific path, ensuring that the coolant can evenly flow through the entire liquid cooling plate.
[0018] Further, the diversion frame and the sealing plates are brazed together. Brazing is a reliable connection method that can seal the diversion frame and the sealing plates, ensuring that the liquid cooling plate maintains good sealing performance during long-term use and preventing liquid leakage.
[0019] Further, an avoidance groove is provided on the liquid cooling plate. The shape of the memory module is usually irregular, and the liquid cooling plate cannot fully fit the memory module. By opening a groove corresponding to the shape of the memory module on the liquid cooling plate, the liquid cooling plate can better fit the shape of the memory module, improve the heat transfer efficiency, and enhance the heat dissipation effect. The avoidance groove can be used as a position reference during installation, facilitating the placement of the memory module between the liquid cooling plates.
[0020] Further, at least one double-hole pipe clamp is provided between the liquid inlet pipe and the liquid return pipe. The double-hole pipe clamp can adjust the distance between the liquid inlet pipe and the liquid return pipe, facilitating the arrangement of the liquid inlet pipe and the liquid return pipe, avoiding the liquid inlet pipe and the liquid return pipe from contacting each other and affecting the heat dissipation efficiency. The double-hole pipe clamp is simple to disassemble and install, facilitating maintenance or replacement.
[0021] Further, connection parts are provided at both ends of the liquid inlet pipe and the liquid return pipe. The connection part at one end of the liquid inlet pipe is connected to a confluence port in one first liquid cooling plate assembly, and the connection part at one end of the liquid return pipe is connected to a confluence port in another first liquid cooling plate assembly. A seal is formed at the connection between the connection part and the confluence port to prevent coolant leakage.
[0022] Further, both the liquid inlet pipe and the liquid return pipe are made of polytetrafluoroethylene corrugated pipes. Polytetrafluoroethylene has extremely high chemical stability, enabling the polytetrafluoroethylene corrugated pipes to remain stable, avoiding being corroded by the coolant, and extending the service life. Polytetrafluoroethylene has an extremely low coefficient of friction, which can effectively reduce the internal frictional resistance, increase the flow velocity of the coolant, and enhance the heat dissipation efficiency. Polytetrafluoroethylene has good flexibility and can be bent and folded, facilitating installation and layout.
[0023] As can be seen from the above technical solution, the utility model has the following beneficial effects: The liquid cooling and heat dissipation device provided by the utility model uses a coolant for liquid cooling and heat dissipation. Through the circulating flow of the coolant, heat is absorbed, effectively reducing the temperature of the device. Compared with traditional air cooling and heat dissipation, the liquid cooling and heat dissipation has a significant improvement in the heat dissipation effect. The liquid cooling and heat dissipation device utilizes the different flow structures of the first shunt pipe, the second shunt pipe, and the third shunt pipe, and is flexibly combined with the liquid cooling plate to form a first liquid cooling plate assembly and a second liquid cooling plate assembly, optimizing the cooling circuit of the coolant, making the overall spatial layout of the liquid cooling and heat dissipation device more compact, and achieving a higher space utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 is a schematic structural diagram of the liquid cooling and heat dissipation device in Embodiment 1;
[0025] Figure 2 is a schematic structural diagram of the first liquid cooling plate assembly;
[0026] Figure 3 is an exploded view of the liquid cooling plate;
[0027] Figure 4 is a schematic structural diagram of the liquid cooling and heat dissipation device in Embodiment 2;
[0028] Figure 5 is a schematic structural diagram of the second liquid cooling plate assembly.
[0029] In the figure: 1. First liquid cooling plate assembly; 2. Second liquid cooling plate assembly; 4. Liquid cooling plate; 6. Cooling gap; 31. Liquid inlet pipe; 32. Liquid return pipe; 33. Double-hole pipe clamp; 34. Connection part; 42. Flow guide frame; 43. Sealing plate; 44. Avoidance groove; 51. First shunt pipe; 52. Second shunt pipe; 53. Third shunt pipe; 54. Confluence port; 521. Partition node; 522. First flow section; 523. Second flow section. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] Embodiment 1
[0031] As Figure 1 、 Figure 2As shown in the figure, the liquid cooling device provided in this embodiment includes an inlet pipe 31 and a return pipe 32, and a pair of relatively arranged first liquid cooling plate assemblies 1 are connected in series between the inlet pipe 31 and the return pipe 32. Each first liquid cooling plate assembly 1 includes a pair of first shunt pipes 51 arranged in parallel and several liquid cooling plates 4 connected between the first shunt pipes 51. Each first shunt pipe 51 is in the shape of a hollow column. In the same first liquid cooling plate assembly 1, a confluence port 54 is provided at one end of each first shunt pipe 51 close to the other first liquid cooling plate assembly 1 for the coolant to flow through, and the end far from the other first liquid cooling plate assembly 1 is closed. A set of shunt ports arranged along the axial length direction of the first shunt pipe 51 are opened on the side wall of each first shunt pipe 51 for the coolant to flow through. Both ends of each liquid cooling plate 4 have flow ports, and a flow channel connecting the two ends of the flow ports is provided inside. In each first liquid cooling plate assembly 1, several liquid cooling plates 4 are arranged between the first shunt pipes 51 on both sides along the axial direction of the first shunt pipe 51. The flow ports at both ends of each liquid cooling plate 4 are respectively connected to the shunt ports of the first shunt pipes 51 on both sides of the first liquid cooling plate assembly 1 where it is located. In the same first liquid cooling plate assembly 1, a cooling gap 6 is provided between two adjacent liquid cooling plates 4 for accommodating memory modules.
[0032] The liquid cooling device provided in this embodiment is applicable to scenarios where memory modules need to be cooled during high-performance computing. Through the way of circulating liquid cooling, heat can be quickly removed, the temperature of the device can be effectively controlled, and the stability of the device can be enhanced.
[0033] The coolant enters the first first liquid cooling plate assembly 1 from the inlet pipe 31 and the return pipe 32, flows into the liquid cooling plate 4 through the first shunt pipe 51 on one side of the first liquid cooling plate assembly 1 where it is located, and then flows out from the first shunt pipe 51 on the other side of the first liquid cooling plate assembly 1 where it is located. The coolant flows through the second first liquid cooling plate assembly 1 in the same way and finally enters the return pipe 32. The placement position of the memory modules is limited between adjacent liquid cooling plates 4, so that the liquid cooling plates 4 can quickly transfer the heat generated by the memory modules to the coolant from the side, and through the circulating flow of the coolant, the heat is taken away, effectively reducing the temperature of the memory modules and avoiding performance degradation or damage caused by excessive temperature.
[0034] A pair of relatively arranged first liquid cooling plate assemblies 1 both use first shunt pipes 51 with a confluence port 54 opened at one end and closed at the other end, making the cooling circuit design of the coolant compact. The compact circuit design can reduce the length and bending degree of the coolant flow path, thereby reducing the coolant flow resistance, improving the coolant circulation efficiency, and enhancing the heat dissipation effect. At the same time, the compact circuit design can reduce the pipeline length and quantity, saving space.
[0035] The first shunt pipe 51 in the first liquid cooling plate assembly 1 is made of T2 copper. The blank is obtained by squeeze casting, and then the blank is machined to finally obtain the first shunt pipe 51. The chemical properties of T2 copper are stable, enabling the first shunt pipe 51 to be used in the liquid cooling and heat dissipation device for a long time; T2 copper has good cold and hot working properties, facilitating the processing of the first shunt pipe 51.
[0036] In the first liquid cooling plate assembly 1, the liquid cooling plate 4 and the first shunt pipe 51 are connected by brazing. Brazing can form a seamless metal connection, ensuring that the coolant does not leak and guaranteeing the sealing performance between the liquid cooling plate 4 and the first shunt pipe 51.
[0037] As Figure 1 shown, the confluence port 54 of one first liquid cooling plate assembly 1 is connected to the confluence port 54 of another first liquid cooling plate assembly 1 through a pipeline. The other two confluence ports 54 of a pair of first liquid cooling plate assemblies 1 are respectively connected to the liquid inlet pipe 31 and the liquid return pipe 32. Connecting two first liquid cooling plate assemblies 1 with pipelines can flexibly adjust the relative positions of the two first liquid cooling plate assemblies 1 according to the layout requirements to meet the heat dissipation needs of different scenarios.
[0038] As Figure 3 shown, the liquid cooling plate 4 includes a diversion frame 42 with openings at both ends. Sealing plates 43 are arranged on both sides of the diversion frame 42. The gap between the diversion frame 42 and the sealing plates 43 is the flow channel. The openings at both ends of the diversion frame 42 are formed by overlapping the sealing plates 43 to form flow channel openings. The flow channel formed by the diversion frame 42 and the sealing plates 43 guides the coolant to flow along a specific path, ensuring that the coolant can evenly flow through the entire liquid cooling plate 4.
[0039] Both the diversion frame 42 and the sealing plates 43 are processed and formed by laser cutting of 304 stainless steel cold plates. 304 stainless steel has good corrosion resistance, enabling the liquid cooling plate 4 to be free from corrosion by the coolant and operate stably in the liquid cooling and heat dissipation device for a long time.
[0040] The diversion frame 42 and the sealing plates 43 are connected by brazing. Brazing is a reliable connection method that can seal the diversion frame 42 and the sealing plates 43, ensuring that the liquid cooling plate 4 maintains good sealing performance during long-term use and will not leak.
[0041] As Figure 3 shown, an avoidance groove 44 is provided on the liquid cooling plate 4. The shape of the memory module is usually irregular, and the liquid cooling plate 4 cannot fully fit the memory module. By opening a groove corresponding to the shape of the memory module on the liquid cooling plate 4, the liquid cooling plate 4 can better fit the shape of the memory module, improve the heat transfer efficiency, and enhance the heat dissipation effect. The avoidance groove 44 can be used as a position reference during installation, facilitating the placement of the memory module between the liquid cooling plates 4.
[0042] As Figure 1 shown, there is at least one double-hole pipe clamp 33 provided between the liquid inlet pipe 31 and the liquid return pipe 32. The double-hole pipe clamp 33 can adjust the distance between the liquid inlet pipe 31 and the liquid return pipe 32, which is beneficial to the layout of the liquid inlet pipe 31 and the liquid return pipe 32, avoiding the liquid inlet pipe 31 and the liquid return pipe 32 from contacting each other and affecting the heat dissipation efficiency. The double-hole pipe clamp 33 is simple to disassemble or install, facilitating maintenance or replacement.
[0043] As Figure 1 shown, connection parts 34 are provided at both ends of the liquid inlet pipe 31 and the liquid return pipe 32. The connection part 34 at one end of the liquid inlet pipe 31 is connected to a confluence port 54 in one of the first liquid cooling plate assemblies 1, and the connection part 34 at one end of the liquid return pipe 32 is connected to a confluence port 54 in another first liquid cooling plate assembly 1. A seal is formed at the connection between the connection part 34 and the confluence port 54 to prevent coolant leakage.
[0044] Both the liquid inlet pipe 31 and the liquid return pipe 32 are polytetrafluoroethylene bellows. Polytetrafluoroethylene has extremely high chemical stability, enabling the polytetrafluoroethylene bellows to remain stable, avoiding being corroded by the coolant, and extending the service life. Polytetrafluoroethylene has an extremely low coefficient of friction, which can effectively reduce the internal frictional resistance, increase the flow rate of the coolant, and enhance the heat dissipation efficiency. Polytetrafluoroethylene has good flexibility and can be bent and folded, facilitating installation and layout.
[0045] Embodiment 2
[0046] As Figure 4 shown, different from Embodiment 1, in this embodiment, a second liquid cooling plate assembly 2 is connected in series between a pair of first liquid cooling plate assemblies 1.
[0047] As Figure 5As shown in the figure, the second liquid cooling plate assembly 2 includes a second shunt pipe 52 and a third shunt pipe 53 arranged in parallel, and also includes a plurality of liquid cooling plates 4 connected between the second shunt pipe 52 and the third shunt pipe 53. The second shunt pipe 52 is in a hollow column shape, and both ends of the second shunt pipe 52 are provided with confluence ports 54. A partition node 521 is arranged in the center of the second shunt pipe 52, and the partition node 521 divides the second shunt pipe 52 into a first flow section 522 and a second flow section 523. The first flow section 522 is close to the liquid inlet pipe 31, and the second flow section 523 is close to the liquid return pipe 32. A group of shunt ports arranged along the axial length direction of the second shunt pipe 52 are opened on the side walls of the first flow section 522 and the second flow section 523. The third shunt pipe 53 is in a hollow column shape, and both ends of the third shunt pipe 53 are closed. A group of shunt ports arranged along the axial length direction of the third shunt pipe 53 are opened on the side wall of the third shunt pipe 53. The plurality of liquid cooling plates 4 are arranged between the second shunt pipe 52 and the third shunt pipe 53 on both sides along the axial direction of the second shunt pipe 52. The flow ports at both ends of each liquid cooling plate 4 are respectively connected to the shunt ports of the second shunt pipe 52 and the shunt ports of the third shunt pipe 53 on both sides of the second liquid cooling plate assembly 2 where it is located. In the same second liquid cooling plate assembly 2, there is a cooling gap 6 between two adjacent liquid cooling plates 4 for accommodating memory modules.
[0048] After the coolant flows into the second shunt pipe 52 from the confluence port 54 of the first flow section 522, it flows into the third shunt pipe 53 through the liquid cooling plates 4 on the side of the first flow section 522 of the second liquid cooling plate assembly 2 where it is located, and then flows into the second flow section 523 of the second shunt pipe 52 through the liquid cooling plates 4 on the side of the second flow section 523 of the second liquid cooling plate 4 where it is located, and finally flows out from the confluence port 54 of the second flow section 523. The placement position of the memory modules is limited between adjacent liquid cooling plates 4, so that the liquid cooling plates 4 can quickly transfer the heat generated by the memory modules to the coolant from the side, and through the circulating flow of the coolant, the heat is taken away, effectively reducing the temperature of the memory modules and avoiding performance degradation or damage caused by excessive temperature.
[0049] The second liquid cooling plate assembly 2 adopts a structure such as the combination of the second shunt pipe 52 and the third shunt pipe 53, so that the coolant can flow evenly through each memory module in the second liquid cooling plate assembly 2, and at the same time, the cooling circuit design of the second liquid cooling plate assembly 2 is compact and the layout is reasonable. It not only ensures that the cooling circuit of the coolant can cover more memory modules to achieve liquid cooling heat dissipation with a larger area, but also can effectively save space and achieve a compact space layout. When it is necessary to cover more heat dissipation areas, the second liquid cooling plate assembly 2 can be conveniently connected in series to expand the heat dissipation capacity.
[0050] The materials of the second shunt pipe 52 and the third shunt pipe 53 in the second liquid cooling plate assembly 2 are both T2 copper. The blanks are obtained by squeeze casting, and then the blanks are machined to finally obtain the second shunt pipe 52 and the third shunt pipe 53. The chemical properties of T2 copper are stable, enabling the second shunt pipe 52 and the third shunt pipe 53 to be used in the liquid cooling and heat dissipation device for a long time; T2 copper has good cold and hot working properties, facilitating the machining of the second shunt pipe 52 and the third shunt pipe 53.
[0051] In the second liquid cooling plate assembly 2, the liquid cooling plate 4 is brazed to the second shunt pipe 52 and the third shunt pipe 53. Brazing can form a seamless metal connection, ensuring that the coolant will not leak and guaranteeing the sealing performance between the liquid cooling plate 4 and the second shunt pipe 52 and the third shunt pipe 53.
[0052] The above embodiments are exemplary, aiming to illustrate the technical concept and characteristics of this embodiment, so that those skilled in this field can understand the content of this embodiment and implement it accordingly. It should not be used to limit the protection scope of this embodiment. Any equivalent changes or modifications made according to the spirit and essence of this embodiment should be covered within the protection scope of this embodiment.
Claims
1. A liquid cooling device, characterized in that: It comprises a liquid inlet pipe (31) and a liquid return pipe (32), and a pair of first liquid cooling plate assemblies (1) arranged opposite to each other are connected in series between the liquid inlet pipe (31) and the liquid return pipe (32); Each of the first liquid cooling plate assemblies (1) comprises a pair of first flow diverters (51) arranged in parallel and a plurality of liquid cooling plates (4) connected between the first flow diverters (51); each of the first flow diverters (51) is in the shape of a hollow column; in the same first liquid cooling plate assembly (1), each of the first flow diverters (51) is provided with a confluence port (54) at one end close to another first liquid cooling plate assembly (1) for circulation of cooling liquid, while the end away from the other first liquid cooling plate assembly (1) is closed; a group of flow diverters arranged along the length direction of the axis of the first flow diverter (51) are provided on the side wall of each of the first flow diverters (51) for circulation of cooling liquid; Both ends of each of the liquid cooling plates (4) have flow passages, and flow passages are provided inside the liquid cooling plates to connect the flow passages at both ends. In each of the first liquid cooling plate assemblies (1), a plurality of the liquid cooling plates (4) are arranged between the first flow diversion tubes (51) on both sides along the axial direction of the first flow diversion tube (51). The flow passages at both ends of each of the liquid cooling plates (4) are respectively connected to the flow diversion passages of the first flow diversion tubes (51) on both sides of the first liquid cooling plate assembly (1). In the same first liquid cooling plate assembly (1), a cooling gap (6) is provided between two adjacent liquid cooling plates (4) to accommodate a heating device.
2. The liquid cooling device according to claim 1, characterized in that: A confluence port (54) in one first liquid cooling plate assembly (1) is connected to a confluence port (54) in another first liquid cooling plate assembly (1) through a pipeline; and the other two confluence ports (54) in a pair of first liquid cooling plate assemblies (1) are connected to a liquid inlet pipe (31) and a liquid return pipe (32), respectively.
3. The liquid cooling device according to claim 1, characterized in that: At least one second liquid cooling plate assembly (2) is connected in series between a pair of first liquid cooling plate assemblies (1); the second liquid cooling plate assembly (2) comprises a second shunt pipe (52) and a third shunt pipe (53) arranged in parallel, and also comprises a plurality of the liquid cooling plates (4) connected between the second shunt pipe (52) and the third shunt pipe (53); The second flow dividing pipe (52) is in the shape of a hollow column, and both ends of the second flow dividing pipe (52) are provided with confluence ports (54); a partition node (521) is provided in the center of the second flow dividing pipe (52), and the partition node (521) divides the second flow dividing pipe (52) into a first flow section (522) and a second flow section (523), wherein the first flow section (522) is close to the liquid inlet pipe (31), and the second flow section (523) is close to the liquid return pipe (32); a group of flow dividing ports arranged along the axial direction of the second flow dividing pipe (52) are provided on the side walls of the first flow section (522) and the second flow section (523); The third flow diversion pipe (53) is in the shape of a hollow column, and both ends of the third flow diversion pipe (53) are closed; a group of flow diversion ports arranged along the axial direction of the third flow diversion pipe (53) are provided on the side wall of the third flow diversion pipe (53); The plurality of liquid cooling plates (4) are arranged along the axis direction of the second flow diversion tube (52) between the second flow diversion tube (52) and the third flow diversion tube (53) on both sides, and the flow channel openings at both ends of each of the liquid cooling plates (4) are respectively connected to the flow diversion openings of the second flow diversion tube (52) and the flow diversion openings of the third flow diversion tube (53) on both sides of the second liquid cooling plate assembly (2); in the same second liquid cooling plate assembly (2), a cooling gap (6) is provided between two adjacent liquid cooling plates (4) for accommodating a heating device.
4. The liquid cooling device according to claim 3, characterized in that: The liquid cooling plate (4) is brazed to the first shunt pipe (51), the second shunt pipe (52), and the third shunt pipe (53).
5. The liquid cooling device according to claim 1 or 3, characterized in that: The liquid cooling plate (4) comprises a flow guide frame (42), and openings are provided at both ends of the flow guide frame (42); sealing plates (43) are provided on both sides of the flow guide frame (42); the gap between the flow guide frame (42) and the sealing plate (43) is a flow channel, and the openings at both ends of the flow guide frame (42) are overlapped by the sealing plates (43) to form a flow channel opening.
6. The liquid cooling device according to claim 5, characterized in that: The guide frame (42) is connected to the sealing plate (43) by brazing.
7. The liquid cooling device according to claim 1 or 3, characterized in that: The liquid cooling plate (4) is provided with an avoidance groove (44).
8. The liquid cooling device according to claim 1 or 3, characterized in that: At least one double-hole pipe clamp (33) is provided between the liquid inlet pipe (31) and the liquid return pipe (32).
9. The liquid cooling device according to claim 1 or 3, characterized in that: Connecting portions (34) are provided at both ends of the liquid inlet pipe (31) and the liquid return pipe (32); the connecting portion (34) at one end of the liquid inlet pipe (31) is connected to a confluence port (54) in a first liquid cooling plate assembly (1), and the connecting portion (34) at one end of the liquid return pipe (32) is connected to a confluence port (54) in another first liquid cooling plate assembly (1).
10. The liquid cooling device according to claim 1 or 3, characterized in that: The liquid inlet pipe (31) and the liquid return pipe (32) are both polytetrafluoroethylene bellows.